CN113382615A - Self-circulation immersion jet power module - Google Patents
Self-circulation immersion jet power module Download PDFInfo
- Publication number
- CN113382615A CN113382615A CN202110748163.8A CN202110748163A CN113382615A CN 113382615 A CN113382615 A CN 113382615A CN 202110748163 A CN202110748163 A CN 202110748163A CN 113382615 A CN113382615 A CN 113382615A
- Authority
- CN
- China
- Prior art keywords
- jet
- jet pipe
- self
- shell
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Dc-Dc Converters (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a self-circulation immersion jet power supply module which comprises a shell and a circuit board positioned in the shell, wherein a refrigerant liquid inlet and a refrigerant liquid outlet are formed in the shell, an immersed pump and a jet pipe are arranged in the shell, one end of the jet pipe is connected with the immersed pump, jet holes are distributed in the jet pipe, and insulating cooling liquid is filled in the shell and is filled in the shell. Compared with the prior art, the circuit board is completely soaked in the insulating cooling liquid, so that the thermal resistance between a power device on the circuit board and a cooling medium can be reduced, the heat dissipation efficiency is improved, the power module can have smaller volume and higher power density, and the wind noise is avoided. Meanwhile, the immersed pump and the jet pipe can accelerate the flowing and circulation of the insulating cooling liquid, and the heat dissipation effect is improved.
Description
Technical Field
The invention relates to the field of power module heat dissipation, in particular to a self-circulation immersion jet power module.
Background
Along with the development of novel infrastructure construction, new energy automobile fills electric pile and data center building equipment and receives the attention, and both are the infrastructure construction who uses electricity as the basis, therefore its power module power demand that carries out power transformation is bigger and bigger, and the power density requirement is higher and higher. As the power density of the power supply module increases, the power density of heat generation accompanying it also increases. The existing power module has the following problems: firstly, its heating power density has reached the heat dissipation limit of traditional forced air cooling, and it is single to lean on forced air cooling can't solve higher heat, and huge fan and fin among the cooling system have basically occupied half the space of whole power module simultaneously, have violated power module's "light, thin, short, little" technical trend. Secondly, the service life of the power module is shortened to 1/3 compared with the service life of the power module without the influence of dust, high temperature and rainwater due to the influence of the external severe environment and the influence of dust, high temperature and rainwater on the traditional air cooling. Thirdly, the air cooling noise is huge, and the user bears huge noise pollution in the use process.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a self-circulation immersion jet power module, which effectively reduces the volume of the power module, improves the power density of the power module, improves the use reliability of the power module and reduces noise pollution.
The purpose of the invention can be realized by the following technical scheme:
the utility model provides a self-loopa submergence efflux power module, includes casing and the circuit board that is located the casing, be equipped with refrigerant inlet and refrigerant liquid outlet on the casing, be equipped with immersed pump and efflux pipe in the casing, the immersed pump is connected to the one end of efflux pipe, it has the efflux hole to distribute on the efflux pipe, the casing intussuseption is filled with insulating coolant liquid, and this insulating coolant liquid is full of inside the casing.
Further, an MOS tube switch device and a diode switch device are arranged on the circuit board, the MOS tube switch device and the diode switch device are arranged beside the jet pipe, and the jet hole faces the MOS tube switch device and the diode switch device.
Further, the distance between the jet pipe and the MOS pipe switch device and the distance between the jet pipe and the diode switch device are 3-10 mm.
Furthermore, two flow channel partition plates are arranged in the shell, a jet flow channel is formed between the two flow channel partition plates, and the jet flow tube, the MOS tube switch device and the diode switch device are arranged in the jet flow channel.
Furthermore, two rows of jet holes are arranged on the jet pipe, and the MOS pipe switch devices and the diode switch devices are distributed on two sides of the jet pipe in a matrix manner.
Further, the jet pipe is arranged along the inner side wall of one end of the shell, and an outlet at one end of the jet pipe points to the inner corner of the shell.
Furthermore, the refrigerant liquid inlet and the refrigerant liquid outlet are located on the same side of the shell, and the immersed pump is located beside the refrigerant liquid inlet.
Furthermore, an alternating current connector, a direct current connector and a control signal connector are arranged on the circuit board, and the alternating current connector, the direct current connector and the control signal connector penetrate through the side wall of the shell and are in sealed connection with the side wall of the shell.
Further, a jet pipe support is arranged on the shell, and the jet pipe is fixed with the shell through the jet pipe support.
Further, the insulating cooling liquid is electronic fluorinated liquid, insulating silicone oil or transformer oil.
Compared with the prior art, the invention has the following beneficial effects:
1. the circuit board of the power supply is completely soaked in the insulating cooling liquid, the traditional air cooling system is removed, the thermal resistance between a power device and a refrigerant on the circuit board can be reduced, the heat dissipation efficiency is improved, the power supply module can have smaller volume and higher power density, and the wind noise is avoided. Meanwhile, an immersed pump and a jet pipe are arranged in the shell, so that the flowing and the circulation of the insulating cooling liquid are accelerated, and the heat dissipation effect is improved.
2. All parts of the power module are sealed in the shell and are not affected by external environments such as dust, rainwater and the like, so that the service life of the power module is prolonged.
3. According to the invention, the MOS tube switch device and the diode switch device are arranged on one side of the jet pipe, so that the MOS tube switch device and the diode switch device with the largest calorific value are preferentially cooled, and the cooling effect is improved; and a flow passage partition plate can be further arranged to independently isolate and radiate the jet pipe, the MOS pipe switch device and the diode switch device, so that the radiating efficiency is improved, and the influence on the radiation of other elements is reduced.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an exploded view of the present invention.
Fig. 3 is a schematic structural diagram of the circuit board.
Fig. 4 is a partially enlarged view of the jet flow path.
FIG. 5 is a state diagram of the combined use of the present invention.
Reference numerals: 1. the device comprises a shell, 11, a refrigerant inlet, 12, a refrigerant outlet, 13, an alternating current connector, 14, a direct current connector, 15, a control signal connector, 16, a flow channel partition board, 2, a circuit board, 21, an MOS (metal oxide semiconductor) tube switch device, 22, a diode switch device, 3, an immersed pump, 4, a jet pipe, 41 and a jet hole.
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments. The present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.
As shown in fig. 1 to 3, the present embodiment provides a self-circulation immersion jet power module, which includes a housing 1 and a circuit board 2 located in the housing 1. The shell 1 is a rectangular aluminum alloy shell, and a refrigerant inlet 11 and a refrigerant outlet 12 are arranged on the shell 1 and both adopt common quick connectors. In this embodiment, the refrigerant inlet 11 and the refrigerant outlet 12 are respectively disposed at two ends of the same side of the housing 1. Low-temperature insulating cooling liquid enters the shell 1 from the lower refrigerant liquid inlet 11 to exchange heat with the internal circuit board 2, high-temperature insulating cooling liquid after heat exchange flows out from the upper refrigerant liquid outlet 12, and the insulating cooling liquid forms a U-shaped loop to complete heat exchange with the power module. The insulating cooling liquid can be electronic fluorinated liquid, insulating silicone oil, transformer oil, etc.
The back of the circuit board 2 is attached to one side of the shell 1, and the electrical components are arranged on the front of the circuit board 2. An alternating current connector 13, a direct current connector 14 and a control signal connector 15 are arranged on the circuit board 2, and the alternating current connector 13, the direct current connector 14 and the control signal connector 15 all penetrate through the side wall of the shell 1 and are in sealed connection with the side wall of the shell 1. An external alternating current power supply is connected with the circuit board 2 through an alternating current connector 13, and direct current is output through a direct current connector 14 after circuit conversion, so that power conversion is completed. The external control signal is connected with the circuit board 2 through the control signal connector 15 in a communication way.
An immersed pump 3 and a jet pipe 4 are arranged in the shell 1, one end of the jet pipe 4 is connected with the immersed pump 3, and jet holes 41 are distributed on the pipe wall of the jet pipe 4, as shown in fig. 4. The concrete structure is as follows: the jet pipe 4 is fixed with the shell 1 through a jet pipe bracket and is arranged along the inner side wall of the bottom end of the shell 1, and the left end of the jet pipe 4 points to the left lower inner corner of the shell 1 and is away from the left lower inner corner by a certain distance; the right end of the jet pipe 4 is provided with an L-shaped elbow connected with the immersed pump 3. The immersed pump 3 is fixed on the inner wall of the shell 1 and is positioned near the refrigerant liquid inlet 11, and a power line and a control line of the immersed pump penetrate out of a sealing hole of the shell 1. Therefore, under the action of the immersed pump 3 and the jet pipe 4, the insulating cooling liquid in the shell 1 can form quick internal circulation in the shell 1, and the convection is enhanced.
The electrical components on the circuit board 2 are arranged in the following forms: the MOS tube switch device 21 and the diode switch device 22 are arranged on two sides of the jet tube 4, and other elements such as a transformer 23, an inductor 24, a capacitor 25 and the like are sequentially distributed on the circuit board 2 according to the flow direction of the insulating cooling liquid, so that the insulating cooling liquid flows through electrical elements with high heat flow density.
Two rows of jet holes 41 pointing to the MOS transistor switch devices 21 and the diode switch devices 22 on two sides are distributed on the jet pipe 4, and each jet hole 41 corresponds to one MOS transistor switch device 21 or one diode switch device 22. The diameter of the jet hole 41 is generally 1mm to 3mm, preferably 2 mm. The distance between the jet hole 41 and the MOS tube switch device 21 or the diode switch device 22 is generally 3 mm-10 mm, preferably 5 mm. Under the action of the immersed pump 3, the speed of the insulating cooling liquid in the jet hole 41 is 5m/s, and the optimal jet effect is achieved. The immersed pump 3 located near the refrigerant inlet 11 can preferentially send low-temperature insulating cooling liquid into the jet pipe 4, and preferentially dissipate heat of the MOS transistor switch device 21 and the diode switch device 22 with the largest heat productivity.
In this embodiment, two flow channel partition plates 16 are further disposed in the housing 1, and a jet flow channel is formed between the two flow channel partition plates 16 and is located at the lower end of the housing 1. The right end of the jet flow channel is connected with the right end face of the shell 1, and the left end of the jet flow channel is spaced from the left end face of the shell 1. The jet pipe 4, the MOS pipe switch device 21 and the diode switch device 22 are arranged in the jet flow channel, and the L-shaped bent pipe of the jet pipe 4 penetrates through a flow channel partition plate 16 above to be connected with the immersed pump 3. The MOS transistor switching devices 21 and the diode switching devices 22 are distributed in a matrix on both sides of the jet pipe 4, which is convenient for reducing the space and performing concentrated heat dissipation.
As shown in fig. 5, the power module of this embodiment can be configured as a sheet structure because the conventional air cooling system is removed, and a plurality of power modules are combined, so that series and parallel connection of circuits can be realized, and applications in different scenes can be satisfied.
The foregoing detailed description of the preferred embodiments of the invention has been presented. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should be within the scope of protection defined by the claims.
Claims (10)
1. The utility model provides a self-loopa submergence efflux power module, its characterized in that includes casing (1) and circuit board (2) that are located casing (1), be equipped with refrigerant inlet (11) and refrigerant liquid outlet (12) on casing (1), be equipped with immersed pump (3) and jet pipe (4) in casing (1), immersed pump (3) is connected to the one end of jet pipe (4), it has jet hole (41) to distribute on jet pipe (4), casing (1) intussuseption is filled with insulating coolant liquid, and this insulating coolant liquid is full of inside casing (1).
2. A self-circulating immersion jet power supply module according to claim 1, characterized in that the circuit board (2) is provided with MOS transistor switching devices (21) and diode switching devices (22), the MOS transistor switching devices (21) and diode switching devices (22) being arranged beside the jet pipe (4), and the jet hole (41) is directed towards the MOS transistor switching devices (21) and diode switching devices (22).
3. A self-circulating immersion jet power supply module according to claim 2, characterized in that the distance of the jet pipe (4) from the MOS pipe switching device (21) and the diode switching device (22) is 3-10 mm.
4. A self-circulating immersion jet power supply module according to claim 2, characterized in that two flow channel separators (16) are provided in the housing (1), a jet flow channel is formed between the two flow channel separators (16), and the jet pipe (4), the MOS pipe switching device (21) and the diode switching device (22) are provided in the jet flow channel.
5. A self-circulating immersion jet power supply module according to claim 2, characterized in that two rows of jet holes (41) are provided on the jet pipe (4), and the MOS transistor switching devices (21) and the diode switching devices (22) are distributed in a matrix on both sides of the jet pipe (4).
6. A self-circulating immersion jet power supply module according to claim 1, characterized in that the jet pipe (4) is arranged along an inner side wall of one end of the housing (1), and an outlet of one end of the jet pipe (4) is directed to an inner corner of the housing (1).
7. A self-circulating immersion jet power supply module according to claim 1, wherein the coolant inlet (11) and the coolant outlet (12) are located on the same side of the housing (1), and the immersed pump (3) is located beside the coolant inlet (11).
8. A self-circulating immersion jet power supply module as claimed in claim 1, wherein the circuit board (2) is provided with an ac connector (13), a dc connector (14) and a control signal connector (15), the ac connector (13), the dc connector (14) and the control signal connector (15) all extend through the side wall of the housing (1) and are sealingly connected with the side wall of the housing (1).
9. A self-circulating immersion jet power supply module according to claim 1, characterized in that a jet pipe holder is provided on the housing (1), and the jet pipe (4) is fixed to the housing (1) by the jet pipe holder.
10. The self-circulating immersion jet power module of claim 1 wherein the insulating coolant is an electron fluoride liquid, an insulating silicone oil or a transformer oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110748163.8A CN113382615A (en) | 2021-07-02 | 2021-07-02 | Self-circulation immersion jet power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110748163.8A CN113382615A (en) | 2021-07-02 | 2021-07-02 | Self-circulation immersion jet power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113382615A true CN113382615A (en) | 2021-09-10 |
Family
ID=77580504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110748163.8A Pending CN113382615A (en) | 2021-07-02 | 2021-07-02 | Self-circulation immersion jet power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113382615A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023050893A1 (en) * | 2021-09-30 | 2023-04-06 | 华为数字能源技术有限公司 | Substrate structure and terminal device |
-
2021
- 2021-07-02 CN CN202110748163.8A patent/CN113382615A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023050893A1 (en) * | 2021-09-30 | 2023-04-06 | 华为数字能源技术有限公司 | Substrate structure and terminal device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209358435U (en) | A kind of compact SVG power cell | |
| CN108718509A (en) | A kind of controller for electric vehicle having high heat dispersion | |
| CN212629011U (en) | Heat radiation assembly based on semiconductor power generation | |
| CN112885798A (en) | Integrated phase change heat transfer element liquid cooling heat radiation module for server | |
| CN113382615A (en) | Self-circulation immersion jet power module | |
| CN215500257U (en) | Communication base station cabinet convenient to heat dissipation | |
| CN212778024U (en) | TEC refrigerator | |
| CN215500205U (en) | Self-circulation immersion jet power module | |
| CN109687054B (en) | Liquid cooling battery cooling system | |
| CN213125826U (en) | High-efficient heat dissipation type converter | |
| CN215500196U (en) | Liquid cooling inverter | |
| CN113253819A (en) | Waste heat recovery type submergence formula phase transition cooling system | |
| CN220528467U (en) | Converter, electrical equipment and energy storage system | |
| CN112398311A (en) | Multi-module series-parallel power converter device | |
| CN218451021U (en) | Liquid cooling charging device | |
| CN218125234U (en) | Frequency converter | |
| CN221228136U (en) | Power converter | |
| CN218828516U (en) | Frequency converter | |
| CN212135856U (en) | Liquid crystal display screen backshell heat abstractor | |
| CN220629163U (en) | Heat radiation structure of power module | |
| CN212850290U (en) | Multi-level converter | |
| CN210201699U (en) | Heat radiator for converter | |
| CN216749998U (en) | Solid oxide fuel cell with heat dissipation assembly | |
| CN220139587U (en) | Industrial switch for photovoltaic power generation | |
| CN217984838U (en) | Three-temperature-zone isolated frequency converter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230912 Address after: Room 118, building 20, No. 1-42, Lane 83, Hongxiang North Road, Lingang New Area, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Applicant after: Shanghai fenfenfen New Energy Technology Co.,Ltd. Address before: Room 118, building 20, no.1-42, Lane 83, Hongxiang North Road, Pudong New Area, Shanghai, 2013 13 Applicant before: Liku new energy technology (Shanghai) Co.,Ltd. |