CN105374767B - A kind of high-performance micro-channel radiator structure - Google Patents
A kind of high-performance micro-channel radiator structure Download PDFInfo
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- CN105374767B CN105374767B CN201510616362.8A CN201510616362A CN105374767B CN 105374767 B CN105374767 B CN 105374767B CN 201510616362 A CN201510616362 A CN 201510616362A CN 105374767 B CN105374767 B CN 105374767B
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- exchanging fluid
- heat exchanging
- channel
- micro
- heat sink
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Abstract
The invention discloses a kind of high-performance micro-channel radiator structures, it includes heater element, microchannel heat sink and cover board, the microchannel heat sink is tightly attached to the heater element setting, the cover plate for sealing is set in the microchannel heat sink, at least one heat exchanging fluid inlet channel and at least two heat exchanging fluid outlet flows are offered on the cover board, several micro-channels being connected with the heat exchanging fluid inlet channel and the heat exchanging fluid outlet flow are offered in the microchannel heat sink, and each heat exchanging fluid inlet channel is corresponded in the microchannel heat sink and offers a transition groove.Above-mentioned high-performance micro-channel radiator structure has the higher coefficient of heat transfer and heat exchange efficiency.Fluid reduces flow resistance by shunting simultaneously.The design of transition groove can increase flow area, and realize that side shunts, under the premise of not influencing the coefficient of heat transfer, hence it is evident that reduce the pressure loss, have better running efficiency of system.
Description
Technical field
The present invention relates to the high property on a kind of radiator structure more particularly to a kind of radiating element suitable for high heat flux density
It can micro-channel radiator structure.
Background technique
High-performance electronic chip, power device, high-energy LED light emitting diode in operation, can distribute a large amount of heat
Amount, partial power can be significantly more than 100W/cm2, cooling requirements are not achieved in conventional cooling means performance.Minitype radiator
Part comes into being, and reduces characteristic size by the manufacture processing of micro-structure, and promote changing for cooling fluid especially liquid
Hot coefficient, achievees the purpose that high power radiation.Structure mainly has micro-channel, microfoam metal, silicon substrate radiator structure etc..However,
As size declines, pressure difference is consequently increased, and is unfavorable for the realization of minitype radiator part.Tuckerman and Pease etc.
People demonstrates 0.09 DEG C of cm of low thermal resistance on silicon substrate microchannel heat sink part2/ W, however pressure difference reaches 2.1bar, in the implementation
It is relatively difficult.
Currently, as shown in FIG. 1, FIG. 1 is the structures of traditional micro-channel radiator structure to show for traditional micro-channel radiator structure
It is intended to；Existing micro-channel radiator structure uses serial single flow structure, haves the shortcomings that the coefficient of heat transfer is low low with heat exchange efficiency,
Simultaneously because heat exchanging fluid strikes micro-structure from import, flow area sudden contraction, flow direction changes, will lead to part compared with
Big reflux and pressure difference, generates higher pressure drag, influences the operational efficiency of total system, and if heating device temperature
Height generates boiling at narrow entrance openings, can further deteriorate heat transfer and flowing.
Summary of the invention
The purpose of the present invention is to provide a kind of high-performance micro-channel radiator structure, heat exchange effect high with the coefficient of heat transfer
Rate height and the high feature of running efficiency of system, to solve the above problem existing for micro-channel radiator structure in the prior art.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of high-performance micro-channel radiator structure comprising heater element, microchannel heat sink and cover board, the micro-channel
Radiator is tightly attached to the heater element setting, and the cover plate for sealing is set in the microchannel heat sink, wherein the lid
At least one heat exchanging fluid inlet channel and at least two heat exchanging fluid outlet flows, the microchannel heat sink are offered on plate
On offer several micro-channels being connected with the heat exchanging fluid inlet channel and the heat exchanging fluid outlet flow, and institute
It states and corresponds to each heat exchanging fluid inlet channel in microchannel heat sink and offer a transition groove.
Particularly, each heat exchanging fluid outlet flow is corresponded on the cover board is provided with heat exchanging fluid outlet.
Particularly, heat exchanging fluid outlet is provided only on the cover board, each heat exchanging fluid outlet flow is in the lid
It exports and flows out through the heat exchanging fluid after summarizing in plate.
Particularly, the heat exchanging fluid inlet channel is set as one, is opened at the center of the cover board, cooperates institute
It states heat exchanging fluid inlet channel and offers a transition groove at the center of the microchannel heat sink.
Particularly, the microchannel heat sink is micro metal conduit radiator, foam metal radiator, silicon-base miniature slot
Road radiator and porous ceramics radiator it is any, the size of the microchannel heat sink is in the ㎜ of 0.05 ㎜~1.
Particularly, the transition groove section is any of polygon, U-shaped or V-arrangement grooving.
Particularly, the cover board is sealingly fastened in institute by any mode of " O " type groove, soldering, argon arc welding or bonding
It states in microchannel heat sink.
Particularly, the heat exchanging fluid is water, conduction oil, ethylene glycol, nano-fluid or any of heat exchanging fluid.
Particularly, the heater element is high power electronic chip, LED light emitting diode and laser chip it is any high
The heating device of heat flow density.
Particularly, the transition groove section is rectangle, trapezoidal or regular polygon any.
Beneficial effects of the present invention are that the high-performance micro-channel radiator structure has following excellent compared with prior art
Point:
1) cold fluid enters from the middle part of microchannel heat sink, the center of direct cooling heating element, and cold fluid enters
Direction is opposite with heat transfer direction, compares conventional serial formula structure, reduces viscous boundary layer, has the higher coefficient of heat transfer and heat exchange
Efficiency.Meanwhile fluid flows through the flow-reduction of microchannel heat sink, further decreases flow resistance by shunting.
2) design of transition groove can then increase flow area, and realize that side shunts, and not influence the coefficient of heat transfer
Under the premise of, hence it is evident that the pressure loss is reduced, there is better running efficiency of system.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of traditional micro-channel radiator structure；
Fig. 2 is the structural schematic diagram for the high-performance micro-channel radiator structure that the specific embodiment of the invention 1 provides；
Fig. 3 is the structural schematic diagram for the high-performance micro-channel radiator structure that the specific embodiment of the invention 2 provides；
Fig. 4 is the computer simulation chart of the heat exchanging fluid flowing velocity of traditional micro-channel radiator structure；
Fig. 5 is the computer simulation chart of the heat exchanging fluid flowing pressure of traditional micro-channel radiator structure；
Temperature cloud picture when Fig. 6 is traditional micro-channel radiator structure operation；
Fig. 7 is the Computer Simulation of the heat exchanging fluid flowing velocity of high-performance micro-channel radiator structure provided by the invention
Figure；
Fig. 8 is the Computer Simulation of the heat exchanging fluid flowing pressure of high-performance micro-channel radiator structure provided by the invention
Figure；
Temperature cloud picture when Fig. 9 is the operation of high-performance micro-channel radiator structure provided by the invention.
In figure:
1, heater element；2, microchannel heat sink；3, cover board；4, heat exchanging fluid inlet channel；5, heat exchanging fluid outlet stream
Road；6, heat exchanging fluid exports；7, micro-channel；8, transition groove.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
Embodiment one:
It please refers to shown in Fig. 2, Fig. 2 is the knot for the high-performance micro-channel radiator structure that the specific embodiment of the invention 1 provides
Structure schematic diagram；
In the present embodiment, a kind of high-performance micro-channel radiator structure includes heater element 1, microchannel heat sink 2 and cover board
3, the microchannel heat sink 2 is tightly attached to the heater element 1 and is arranged, and the heater element 1 is either high power electronic core
Piece, LED light emitting diode are also possible to the radiating element of the high heat flux densities such as laser.The cover board 3 passes through " O " type groove, pricker
Any mode of weldering, argon arc welding or bonding is sealingly fastened in the microchannel heat sink 2, it is ensured that heat exchanging fluid will not be outside
It reveals, offers a heat exchanging fluid inlet channel 4 and two heat exchanging fluid outlet flows 5 at the center of the cover board 3, it is described
Each heat exchanging fluid outlet flow 5 is corresponded on cover board 3 is provided with heat exchanging fluid outlet 6.
Several and the heat exchanging fluid inlet channel 4 and the heat exchanging fluid are offered in the microchannel heat sink 2
The micro-channel 7 that outlet flow 5 is connected, and at the center of the microchannel heat sink 2 on correspond to the heat exchanging fluid inlet flow
Road 4 offers the transition groove 8 of a rectangular cross-section structure, and the microchannel heat sink 2 is micro metal conduit radiator, bubble
Foam metal heat sink, silicon-base miniature conduit radiator and porous ceramics radiator it is any, and be passed through heat exchanging fluid in it and be
Water or conduction oil it is any.
When work, heat exchanging fluid enters in microchannel heat sink 2 through micro-channel 7 from heat exchanging fluid inlet channel 4 by changing
Hot fluid outlet ports runner 5 flows out, and radiates to the heater element 1 of bottom.
Embodiment two:
It please refers to shown in Fig. 3, Fig. 3 is the knot for the high-performance micro-channel radiator structure that the specific embodiment of the invention 2 provides
Structure schematic diagram, the difference between this embodiment and the first embodiment lies in: each heat exchanging fluid outlet flow 5 in the present embodiment cover plate 3
Arrangement it is different, heat exchanging fluid outlet 6, each heat exchanging fluid outlet are provided only on cover board 3 described in the present embodiment
Runner 5 is reduced through 6 outflow of heat exchanging fluid outlet to form single-entry single-out frame mode after summarizing in the cover board 3
The complexity of structure.
When test, using Aluminium Radiator, miniature conduit group is formed by miniature cutting, miniature conduit 0.2mm, and 21,
High 2mm, long 15mm, heat source 100W are directly placed at radiator bottom.Deionized water is set as working medium, flow 1L/min.It please refers to
Shown in fig. 4 to fig. 6, according to a traditional structure i.e. import one outlet, the maximum speed Vmax=of heat exchanging fluid
2.77m/s；Maximum pressure Pmax=14.9e3Pa in radiator；Tmax=36.5 DEG C of heater element maximum temperature, the heat source temperature difference
Tj=5.27 DEG C of Δ.It please refers to shown in Fig. 7 to Fig. 9, according to high-performance micro-channel radiator structure provided by the invention, heat exchange stream
The maximum speed Vmax=1.78m/s of body；Maximum pressure Pmax=4.09e3Pa in radiator；Heater element maximum temperature Tmax
=35.9 DEG C, Tj=3.25 DEG C of heat source temperature difference.Obviously heat exchanging fluid is from the miniature conduit group of middle part shock in the present invention, through miniature
Conduit exchanges heat and is divided into the both ends that two approximately equivalent stocks do not flow to radiator.The structure can substantially reduce the pressure of water flow
Difference, and being significantly improved to hot property, the non-uniform temperature degree and thermal and mechanical stress that junction temperature can be reduced, and reduce heat source itself.
The above embodiments only describe the basic principles and characteristics of the invention, and the invention is not restricted by the above cases,
Without departing from the spirit and scope, the invention also has various changes and changes, and these changes and changes are both fallen within
In scope of the claimed invention.The scope of the present invention is defined by the appended claims and its equivalents.
Claims (7)
1. a kind of high-performance micro-channel radiator structure comprising heater element, microchannel heat sink and cover board, the micro-channel dissipate
Hot device is tightly attached to the heater element setting, and the cover plate for sealing is set in the microchannel heat sink, which is characterized in that institute
It states and offers at least one heat exchanging fluid inlet channel and at least two heat exchanging fluid outlet flows on cover board, the micro-channel dissipates
Several micro-channels being connected with the heat exchanging fluid inlet channel and the heat exchanging fluid outlet flow are offered on hot device,
And each heat exchanging fluid inlet channel is corresponded in the microchannel heat sink and offers a transition groove；
The heat exchanging fluid inlet channel is set as one, is opened at the center of the cover board, cooperates the heat exchanging fluid
Inlet channel offers a transition groove at the center of the microchannel heat sink；
The transition groove section is any of U-shaped or V-arrangement grooving.
2. high-performance micro-channel radiator structure according to claim 1, which is characterized in that correspondence is each changed on the cover board
Hot fluid outlet ports runner is provided with heat exchanging fluid outlet.
3. high-performance micro-channel radiator structure according to claim 1, which is characterized in that be provided only with one on the cover board
Heat exchanging fluid outlet, each heat exchanging fluid outlet flow, which exports after summarizing in the cover board through the heat exchanging fluid, to flow out.
4. high-performance micro-channel radiator structure according to claim 1, which is characterized in that the microchannel heat sink is micro-
Type metal channels radiator, foam metal radiator, silicon-base miniature conduit radiator and porous ceramics radiator it is any, it is micro-
The size of conduit radiator is in the ㎜ of 0.05 ㎜~1.
5. high-performance micro-channel radiator structure according to claim 1, which is characterized in that the cover board by " O " type groove,
Any mode of soldering, argon arc welding or bonding is sealingly fastened in the microchannel heat sink.
6. high-performance micro-channel radiator structure according to claim 1, which is characterized in that the heat exchanging fluid is water, leads
Hot oil, ethylene glycol or nano-fluid it is any.
7. high-performance micro-channel radiator structure according to claim 1, which is characterized in that the heater element is LED hair
Optical diode and laser chip it is any.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510616362.8A CN105374767B (en) | 2015-09-24 | 2015-09-24 | A kind of high-performance micro-channel radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510616362.8A CN105374767B (en) | 2015-09-24 | 2015-09-24 | A kind of high-performance micro-channel radiator structure |
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| Publication Number | Publication Date |
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| CN105374767A CN105374767A (en) | 2016-03-02 |
| CN105374767B true CN105374767B (en) | 2019-05-17 |
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| CN201510616362.8A Expired - Fee Related CN105374767B (en) | 2015-09-24 | 2015-09-24 | A kind of high-performance micro-channel radiator structure |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CH713250B1 (en) | 2016-12-16 | 2021-01-29 | Rubattel Et Weyermann S A | A method of manufacturing a covering element, in particular a dial, timepiece or jewelry, in a non-conductive material and comprising metallized and / or colored engraved decorations. |
| CN107293496B (en) * | 2017-05-09 | 2019-09-27 | 中国电子科技集团公司第五十五研究所 | Chip-scale integrated microfluidic radiating module and preparation method |
| CN110010572B (en) * | 2018-12-29 | 2021-04-06 | 浙江集迈科微电子有限公司 | Large-flow liquid cooling radiator for system-level high-power module and manufacturing method thereof |
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| CN1968596A (en) * | 2006-11-24 | 2007-05-23 | 北京工业大学 | Array jetting micro heat exchanger |
| CN200983739Y (en) * | 2006-11-24 | 2007-11-28 | 北京工业大学 | Array radiation flow micro heat exchanger |
| CN201226636Y (en) * | 2008-07-04 | 2009-04-22 | 北京奇宏科技研发中心有限公司 | Liquid cooling radiating device with evaporation cavity |
| CN202816913U (en) * | 2012-10-24 | 2013-03-20 | 中国电子科技集团公司第三十八研究所 | Microchannel liquid-cooled heat sink device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1707785A (en) * | 2004-06-11 | 2005-12-14 | 鸿富锦精密工业（深圳）有限公司 | Liquid-cooled radiator |
| US20060011326A1 (en) * | 2004-07-15 | 2006-01-19 | Yassour Yuval | Heat-exchanger device and cooling system |
| CN101894812A (en) * | 2010-06-13 | 2010-11-24 | 华东理工大学 | Evaporator for cooling chip and manufacture method thereof |
| CN204375724U (en) * | 2015-02-05 | 2015-06-03 | 杭州沈氏节能科技股份有限公司 | A kind of microchannel cooling |
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2015
- 2015-09-24 CN CN201510616362.8A patent/CN105374767B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1968596A (en) * | 2006-11-24 | 2007-05-23 | 北京工业大学 | Array jetting micro heat exchanger |
| CN200983739Y (en) * | 2006-11-24 | 2007-11-28 | 北京工业大学 | Array radiation flow micro heat exchanger |
| CN201226636Y (en) * | 2008-07-04 | 2009-04-22 | 北京奇宏科技研发中心有限公司 | Liquid cooling radiating device with evaporation cavity |
| CN202816913U (en) * | 2012-10-24 | 2013-03-20 | 中国电子科技集团公司第三十八研究所 | Microchannel liquid-cooled heat sink device |
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