CN201383909Y - Micro-channel cold plate device for liquid cooling radiator - Google Patents
Micro-channel cold plate device for liquid cooling radiator Download PDFInfo
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- CN201383909Y CN201383909Y CN200920106318U CN200920106318U CN201383909Y CN 201383909 Y CN201383909 Y CN 201383909Y CN 200920106318 U CN200920106318 U CN 200920106318U CN 200920106318 U CN200920106318 U CN 200920106318U CN 201383909 Y CN201383909 Y CN 201383909Y
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- loam cake
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- liquid cooling
- lower shoe
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Abstract
A micro-channel cold plate device for a liquid cooling radiator comprises an upper cover and a bottom plate, wherein one side of the upper cover is equipped with an inlet for working media to enter a cold plate while the other side is equipped with an outlet for the working media to exit the cold plate, the inlet for the working media to enter the cold plate is an gradually expanded inlet, and the outlet for the working media to exit the cold plate is a gradually reduced outlet. Through the micro-channel cold plate device, the cold plate for liquid cooling radiating is uniform in temperature distribution, has lower thermal resistance and better radiating performance, and increases flow stability of two-phase flow working media in the micro-channel cold plate, thereby being more practical and adaptable to radiating devices in the electronic field.
Description
Technical field
The utility model relates to the heat abstractor in a kind of electronic product field, especially a kind of liquid-cooling heat radiator that relates to liquid-gas phase transition.
Background technology
One of the founder of Intel height is stepped on mole and is proposed prophesy in nineteen sixty-five: the transistorized quantity on the semiconductor chip approximately every 18 months will be double, Moore's Law that Here it is.The nearly 40 years development course of Intel has been verified the prophesy of mole, and by 2010, transistorized quantity will reach 1,000,000,000, and along with the maturation of 32 nanometer technologies, microprocessor of future generation is with integrated 2,000,000,000 transistors.Increase along with the computer chip number of transistors, circuit on the unit are is more and more closeer, the heat that is produced also will be more than 10 times of present chip, its equivalent heat generation density can reach every square centimeter more than 1000 watts, especially the high power components and parts of chip internal, its core temperature can be near 6000 ℃, and this high temperature dot is called hot spot, if there is not suitable radiating mode, the performance and the life-span of chip will be had a strong impact on.
The main radiating mode of present high-end electronic product is liquid cooling heat radiation, sees also shown in Figure 1ly, and existing liquid cooling product commonly used mainly comprises cold drawing 1, pump 2, fin slices radiator 3 and the flexible pipe that is connected said modules.It (is electronic chip that cold drawing 1 is close to thermal source, CPU for example), flow of liquid under pump 2 drives is after cold drawing 1 absorbs heat, at fin slices radiator 3 places to the external environment condition release heat, the liquid that the is cooled cold drawing 1 of flowing through once more, moving in circles continuously is delivered to heat the environment from euthermic chip.Fin slices radiator can adopt natural wind or fan to force cooling.Cooling liquid can be pure water or other liquid and the mixture that deionized pure water, admixture have anti-icing fluid, for example HFC-134a R134a.
Present commercial liquid cooling heat radiator internal working medium does not produce phase transformation at circulation time, promptly no matter heated or cooled off in radiator inside, though all keep liquid. above-mentioned liquid cooling mode has the advantage that thermal resistance is low, transmission thermal capacity is big, transmission range is far away, but, because the limitation of cold drawing material, and the liquid endothermic temperature raises, make that the thermal resistance of cold drawing can not further be reduced, and there is high temperature gradient in cold drawing inside, it also is uneven causing the temperature with its contacting electronic chip, thereby produces thermal stress.In addition, under certain liquid driven power, its thermal resistance value is certain, and this thermal resistance value is difficult to satisfy the radiating requirements of following electronic chip, especially be difficult to hot spot is effectively cooled off, and the high heat flux condition also makes the life-span of fan noise and liquor pump face huge challenge.
This shows that above-mentioned existing liquid-cooling heat radiator obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that liquid-cooling heat radiator exists, relevant manufacturer seeks solution invariably painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found the new structure liquid-cooling heat radiator of a kind of low thermal resistance, high heat dispersion, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.Long-term experimental study confirms can show land reduction working medium flow rate or the required pump merit (Pumping Power) of driving working medium by the stream-liquid two-phase flow after the liquid generation phase transformation of microchannel is moving, and more even in working medium and cold drawing (Heat Sink) internal temperature.Because the microchannel stream-liquid two-phase flow is moving and heat transfer has all above-mentioned advantages, with and potential application prospect, comprise the cooling of microelectronic chip and high-energy laser, with the application in microminiature dynamic power machine and energy resource system, make the microchannel two phase flow become a research focus of academia over nearly 10 years.But it is found that and have strong two phase flow unsteadiness in the microchannel cold plates.Unsteadiness can reduce the Performance And Reliability of system, can cause mechanical breakdown, even damage.Therefore, the cold drawing that has a Working fluid phase changing does not have report as yet in commercialization liquid cooling heat dissipation technology.
The utility model content
In order to overcome the defective that existing liquid-cooling heat radiator exists, the purpose of this utility model is: the microchannel cold plates device that provides a kind of liquid cooling heat radiator to use, this device can make the cold drawing of liquid cooling heat radiation have the even temperature distribution, have lower thermal resistance and better heat dispersion, strengthen the flow stability of the two phase flow working media in little channel cold drawing, thereby be suitable for practicality more.
The technical scheme that its technical problem that solves the utility model adopts is as follows:
The microchannel cold plates device that a kind of liquid cooling heat radiator is used, it comprises a loam cake and a lower shoe, loam cake and lower shoe bind and are integrated, have the import that a working media enters cold drawing in one of loam cake side, opposite side then has the outlet that a working media leaves cold drawing, working media enters the import of import for enlarging gradually of cold drawing, and the outlet that working media leaves cold drawing is diminishing outlet.
The import department of aforementioned lower shoe is provided with liquid storage area, the exit of this lower shoe then is provided with the discharge of steam district, be provided with the microchannel district between this liquid storage area and discharge of steam district, the two ends system in this microchannel district is connected with liquid storage area and discharge of steam district respectively; This discharge of steam district and liquid storage area all respectively are a cavity body in addition, and the grating type passage of microchannel district for being communicated with; The space structure of liquid storage area and microchannel district UNICOM meets nozzle structure, and the space structure of discharge of steam district and microchannel district UNICOM is a bypass structure.
Owing to adopt technique scheme, make the utility model compared with prior art have following beneficial effect:
(1) cold drawing that the utility model proposes, the import and export runner of working medium adopts flaring and convergent shape, can reduce the working medium flow resistance;
(2) cold drawing that the utility model proposes, the working medium inducer adopt big liquid storage district gradually contraction structure (being nozzle structure) carry out the transition to the microchannel district, the phenomenon of ubiquitous flow distribution inequality in the traditional cold of can the drawing up plate structure;
(3) owing to take nozzle structure, rate of flow of fluid porch, microchannel district toward downstream side near flow velocity reach maximum, thereby the auxiliary opposing steam flow phenomenon of drawing up when Working fluid phase changing takes place in the microchannel that plays;
(4) cold drawing that the utility model proposes, there is little channel region of one section very long in its inner Micro Channel Architecture at the upstream and downstream of the chip thermal treatment zone, the length that is little channel region is greater than chip length, the zone, microchannel that has one section lengthening in chip thermal treatment zone upstream and downstream, this zone is little to the chip cooling contribution, the unsteadiness phenomenon that opposing steam flow causes but can draw up well in this lengthening zone, in case its principle is phase transformation in the microchannel, because the opposing steam flow phenomenon that the working medium volumetric expansion is produced, because the Micro Channel Architecture of lengthening, therefore steam can't be back to the front end of the microchannel of lengthening, inevitable like this at inside microchannels generation liquid-vaqor interface-meniscus, according to Laplace's equation, can produce capillary force at this meniscus place, the size of capillary force depends on surface tension and meniscus radius, and meniscus radius depends on the microchannel sectional dimension, more little cross section water conservancy radius has big more capillary force, this capillary force can produce very strong swabbing action, thereby promoting liquid flows to the microchannel port of export, reach the effect of the opposing steam flow of drawing up, the Micro Channel Architecture of the lengthening of the downstream of the chip thermal treatment zone can be stablized flow of steam (realizing full-blown flowing) simultaneously, thereby the entrance end in the microchannel plays the purpose of steady flow;
(5) owing to liquid-gas phase transition, heat transferred is finished by the latent heat of vaporization, and the working medium temperature increases limited, and the thermal resistance of whole cold drawing is obviously descended, and the electronic chip temperature is more even.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the structural representation of existing liquid-cooling heat radiator.
Fig. 2 is the structural representation of the microchannel cold plates device used of the utility model liquid cooling heat radiator.
Fig. 3 A is first embodiment perspective view of the cold drawing structure in the utility model.
Fig. 3 B is the vertical view of Fig. 3 A.
Fig. 3 C is the A-A cutaway view of Fig. 3 B.
Fig. 3 D is the B-B cutaway view Amplified image of Fig. 3 B.
Fig. 4 A is the perspective view of the lower shoe among Fig. 3 A.
Fig. 4 B is the vertical view of Fig. 4 A.
Fig. 4 C is the A-A cutaway view of Fig. 4 B and the enlarged drawing in microchannel district.
Fig. 5 A is the perspective view of second embodiment of the cold drawing structure in the utility model.
Fig. 5 B is the vertical view of Fig. 5 A.
Fig. 5 C is the A-A cutaway view of Fig. 5 B.
Fig. 5 D is the B-B cutaway view Amplified image of Fig. 5 B.
Fig. 6 is the lower shoe structural representation among Fig. 5 A.
Fig. 7 A is the perspective view of the 3rd embodiment of cold drawing structure in the utility model.
Fig. 7 B is the vertical view of Fig. 7 A.
Fig. 7 C is the A-A cutaway view of Fig. 7 B.
Fig. 7 D is the B-B cutaway view Amplified image of Fig. 7 B.
Fig. 8 is the lower shoe structural representation among Fig. 7 A.
Fig. 9 is the schematic diagram of the utility model course of work.
Among the figure, 1. cold drawing, 2. pump, 3. fin slices radiator, 5. Heat Conduction Material, 6. electronic chip, 11. loam cake, 12. lower shoes, 111. imports, 112. outlets, 113. grooves, 121. liquid storage areas, 122. the microchannel district, 123. discharge of steam districts, 124. through holes, 13. screws, 14. sealing O type circles.
Embodiment
See also shown in Figure 2, the microchannel cold plates 1 that a kind of liquid cooling heat radiator of the utility model is used, this cold drawing system is combined by a loam cake 11 and a lower shoe 12.Wherein one of this loam cake 11 side offers the import 111 that a working media enters cold drawing 1, opposite side then offers the outlet 112 that a working media leaves cold drawing 1, working media enters the import of cold drawing for enlarging the import 111 of kenel gradually, and working media leaves the outlet of cold drawing for dwindling the outlet 112 of kenel gradually.
The material of loam cake 11 and lower shoe 12 can be metals such as copper or aluminium, also can be that silicon etc. is nonmetal.Working medium can be water, also can be acetone, methyl alcohol, and ammoniacal liquor or freon class, for example other working medium such as R134a is selected according to the condition of using.
See also first embodiment of the cold drawing structure of the utility model liquid cooling heat radiator shown in Fig. 3 A, Fig. 3 B, Fig. 3 C, Fig. 3 D, its lower shoe 12 materials are Semiconducting Silicon Materials, loam cake 11 materials can be that silicon can be quartz glass etc., and lower shoe 12 is combined as a whole with the mode of loam cake 11 by bonding (Bonding).Its loam cake 11 can process the import 111 and the outlet 112 of flaring and convergent by pass through isotropic etching (a kind of-isotropic wet etching of microelectronic processing technology) on silicon or silica glass material.The top of the import 111 of the flaring of first embodiment and the outlet 112 of convergent is all concordant with the end face of loam cake 11.Import department at lower shoe 12 is provided with the liquid storage area 121 that has nozzle structure, be provided with discharge of steam district 123 in the exit of lower shoe 12, between liquid storage area 121 and discharge of steam district 123, be provided with microchannel district 122, one end in this microchannel district 122 is connected with liquid storage area 121, and the other end is connected with discharge of steam district 123; Discharge of steam district 123 and fluid storage 121 districts all respectively are a cavity body, and microchannel district 122 is the grating type passage of the connection shown in Fig. 4 C.The space structure of liquid storage area and microchannel district UNICOM meets nozzle structure, so-called nozzle structure, it is a kind of pipeline transition structure, because flow rate of liquid is less than local velocity of sound, therefore nozzle structure herein is for being retracted to the structure of a small size pipeline by a large scale pipeline slyness, and the space structure of discharge of steam district and microchannel district UNICOM is a bypass structure.
Fig. 4 A, Fig. 4 B, Fig. 4 C, Fig. 4 D are lower shoe 12 schematic diagrames of the cold drawing structure shown in Fig. 3 A, it can be by on silicon materials, adopting dark dry ecthing method (microelectronic processing technology a kind of-DRIE), process the liquid storage area 121 that has nozzle structure simultaneously, microchannel district 122 and discharge of steam district 123.
See also second embodiment of the cold drawing structure of the utility model liquid cooling heat radiator shown in Fig. 5 A, Fig. 5 B, Fig. 5 C, Fig. 5 D, its lower shoe 12 materials are metal, for example copper or aluminium, loam cake 11 materials can be the metals identical with lower shoe, also can be different. lower shoe 12 is combined as a whole with the mode of loam cake 11 by welding, if with a kind of metal material, by hard solder combination (brazing), if be different metal material, can adopt soft soldering to meet (soldering).The import 111 of the flaring of second embodiment and the outlet 112 of convergent all stretch out in outside the end face of loam cake 11.The loam cake 11 of second embodiment can pass through metal machine work (CNC) or compression casting (die casting), perhaps metal penetrates the mode of (metalinjection module), process the import 111 and the outlet 112 of flaring and convergent and have nozzle structure liquid storage area 121 and with lower shoe 12 schematic diagrames of straight-through discharge of steam district 123. Fig. 6 in microchannel district for the cold drawing structure shown in Fig. 5 A, can produce microchannel district 122 by the mode that on metal material, adopts flaking (skived fin).
See also the 3rd embodiment of the cold drawing structure of the utility model liquid cooling heat radiator shown in Fig. 7 A, Fig. 7 B, Fig. 7 C, Fig. 7 D, its lower shoe 12 materials are metal, for example copper or aluminium, loam cake 11 materials can be metals, also can be plastics. lower shoe 12 and loam cake 11 are combined as a whole by screw 13 fastening modes, consider seal request, fastening for screw 13, need between lower shoe 12 and loam cake 11, can install the O type circle 14 of sealing again additional.The import 111 of the flaring of the 3rd embodiment and the outlet 112 of convergent all stretch out in outside the end face of loam cake 11.The loam cake 11 of this embodiment can penetrate by plastics, perhaps metal penetrates the mode of (metal injection module), process the import 111 and the outlet 112 of flaring and convergent, have the liquid storage area 121 of nozzle structure and the discharge of steam district 123 straight-through with the microchannel district, and groove 113. Fig. 8 that place O RunddichtringO 14 are lower shoe 12 schematic diagrames of the cold drawing structure shown in Fig. 7 A, can produce microchannel district 122 by the mode that on metal material, adopts flaking (skived fin), produce the through hole 124. that is used for passing screw 13 by machine work then
The course of work example schematic when microchannel cold plates device that Fig. 9 uses for a kind of liquid cooling heat radiator that the utility model proposed is specifically used, this liquid cooling apparatus that has Working fluid phase changing comprises fin slices radiator, pump and flexible pipe (all not drawing among the figure), cold drawing 1 links to each other with electronic chip 6 by a bed boundary Heat Conduction Material 5, the heat that electronic chip 6 is produced is delivered to the lower surface of the lower shoe 12 of cold drawing 1 by interface Heat Conduction Material 5, this heat is delivered to microchannel district 122 by heat conduction, working medium flows through heat absorption back, the chip thermal treatment zone, microchannel and becomes steam by liquid, the stream-liquid two-phase flow working medium that (comprises the effect of forenamed capillary force) under the driving of pump flows along direction shown in the arrow, lower shoe 12 is transmitted the heat that comes up to be taken away, during through air-cooled fin slices radiator the heat transferred natural environment, steam liquefaction, come back to again in the cold drawing 1, move in circles.In Fig. 9 application example, the structure of cold drawing 1 is the embodiment three that the utility model proposed.
The utility model is applicable to the heat abstractor of electronic applications.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art, in not breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (7)
1, the microchannel cold plates device used of a kind of liquid cooling heat radiator, it comprises a loam cake and a lower shoe, offer the import that a working media enters cold drawing in loam cake one side, opposite side then offers the outlet that a working media leaves cold drawing, it is characterized in that: described working media enters the import of import for enlarging gradually of cold drawing, and the outlet that described working media leaves cold drawing is diminishing outlet.
2, the microchannel cold plates device used of liquid cooling heat radiator according to claim 1, it is characterized in that: wherein the import department of lower shoe is provided with liquid storage area, be provided with the discharge of steam district in the exit of lower shoe, between liquid storage area and discharge of steam district, be provided with the microchannel district.
3, the microchannel cold plates device used of liquid cooling heat radiator according to claim 2, it is characterized in that: wherein discharge of steam district and liquid storage area all respectively are a cavity body, the grating type passage of described microchannel district for being communicated with; The space structure of liquid storage area and microchannel district UNICOM meets nozzle structure, and the space structure of discharge of steam district and microchannel district UNICOM is a bypass structure.
4, the microchannel cold plates device used of liquid cooling heat radiator according to claim 1 and 2, it is characterized in that: the cold drawing device that is semi-conducting material and is integrated by bonding junction for lower shoe and loam cake, the top of the import of the flaring that is processed by microelectronic technique and the outlet of convergent is all concordant with the end face of loam cake.
5, the microchannel cold plates device used of liquid cooling heat radiator according to claim 1 and 2, it is characterized in that: for lower shoe with loam cake is metal material and be the cold drawing device of one by solder bond, the import of the flaring of being produced by machining and the outlet of convergent all stretch out in outside the end face of loam cake.
6, the microchannel cold plates device used of liquid cooling heat radiator according to claim 1 and 2, it is characterized in that: for lower shoe is metal, loam cake is metal or plastics, and the cold drawing device that connects as one by screw threads for fastening, the import of the flaring of being produced by injection moulding or machine work and the outlet of convergent all stretch out in outside the end face of loam cake.
7, the microchannel cold plates device used of liquid cooling heat radiator according to claim 6 is characterized in that: install sealing O type circle between loam cake and lower shoe additional.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN200920106318U CN201383909Y (en) | 2009-03-03 | 2009-03-03 | Micro-channel cold plate device for liquid cooling radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920106318U CN201383909Y (en) | 2009-03-03 | 2009-03-03 | Micro-channel cold plate device for liquid cooling radiator |
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| CN201383909Y true CN201383909Y (en) | 2010-01-13 |
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| CN200920106318U Expired - Fee Related CN201383909Y (en) | 2009-03-03 | 2009-03-03 | Micro-channel cold plate device for liquid cooling radiator |
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| CN103116677A (en) * | 2013-02-22 | 2013-05-22 | 西安电子科技大学 | Micro-channel cold-drawn plate designing method for active phase-control array antennas |
| CN103179846A (en) * | 2013-03-11 | 2013-06-26 | 中国电子科技集团公司第十四研究所 | Cooling device assorted with to-be-cooled modules |
| CN104576573A (en) * | 2014-12-21 | 2015-04-29 | 北京工业大学 | Micro-channel heat exchanger for drop-shaped pin fins |
| CN105555105A (en) * | 2016-02-24 | 2016-05-04 | 新乡市特美特换热设备有限公司 | Evaporator temperature equalizing and cooling plate |
| US9345169B1 (en) | 2014-11-18 | 2016-05-17 | International Business Machines Corporation | Liquid-cooled heat sink assemblies |
| US9761508B2 (en) | 2014-11-18 | 2017-09-12 | International Business Machines Corporation | Composite heat sink structures |
| CN108026829A (en) * | 2016-01-11 | 2018-05-11 | 翰昂汽车零部件有限公司 | Device for pressurized air cooling |
| CN108919922A (en) * | 2018-07-11 | 2018-11-30 | 北京工业大学 | Microchannel phase-change heat sink |
| US10160072B2 (en) | 2015-08-12 | 2018-12-25 | International Business Machines Corporation | Liquid-cooled, composite heat sink assemblies |
| CN109378352A (en) * | 2018-09-06 | 2019-02-22 | 山东航天电子技术研究所 | A kind of photocell microchannel radiator |
| CN109921144A (en) * | 2019-03-29 | 2019-06-21 | 潍柴动力股份有限公司 | The coldplate and electric car of battery |
| CN110351980A (en) * | 2019-06-21 | 2019-10-18 | 加弘科技咨询(上海)有限公司 | A kind of liquid cold plate device |
| TWI802996B (en) * | 2021-07-13 | 2023-05-21 | 黃崇賢 | Liquid-cooled radiator and liquid-cooled radiator system for improving heat exchange efficiency |
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| CN103116677B (en) * | 2013-02-22 | 2015-08-12 | 西安电子科技大学 | A kind of microchannel cold plates method for designing towards active phase array antenna |
| CN103116677A (en) * | 2013-02-22 | 2013-05-22 | 西安电子科技大学 | Micro-channel cold-drawn plate designing method for active phase-control array antennas |
| CN103179846A (en) * | 2013-03-11 | 2013-06-26 | 中国电子科技集团公司第十四研究所 | Cooling device assorted with to-be-cooled modules |
| US10249555B2 (en) | 2014-11-18 | 2019-04-02 | International Business Machines Corporation | Composite heat sink structures |
| US10734307B2 (en) | 2014-11-18 | 2020-08-04 | International Business Machines Corporation | Composite heat sink structures |
| US9345169B1 (en) | 2014-11-18 | 2016-05-17 | International Business Machines Corporation | Liquid-cooled heat sink assemblies |
| US9420721B2 (en) | 2014-11-18 | 2016-08-16 | International Business Machines Corporation | Liquid-cooled heat sink assemblies |
| US9761508B2 (en) | 2014-11-18 | 2017-09-12 | International Business Machines Corporation | Composite heat sink structures |
| US9865522B2 (en) | 2014-11-18 | 2018-01-09 | International Business Machines Corporation | Composite heat sink structures |
| CN104576573A (en) * | 2014-12-21 | 2015-04-29 | 北京工业大学 | Micro-channel heat exchanger for drop-shaped pin fins |
| US10265812B2 (en) | 2015-08-12 | 2019-04-23 | International Business Machines Corporation | Liquid-cooled, composite heat sink assemblies |
| US10160072B2 (en) | 2015-08-12 | 2018-12-25 | International Business Machines Corporation | Liquid-cooled, composite heat sink assemblies |
| CN108026829A (en) * | 2016-01-11 | 2018-05-11 | 翰昂汽车零部件有限公司 | Device for pressurized air cooling |
| US10955196B2 (en) | 2016-01-11 | 2021-03-23 | Hanon Systems | Supercharged air cooling apparatus |
| CN105555105B (en) * | 2016-02-24 | 2018-08-03 | 新乡市特美特热控技术股份有限公司 | A kind of evaporator samming cold plate |
| CN105555105A (en) * | 2016-02-24 | 2016-05-04 | 新乡市特美特换热设备有限公司 | Evaporator temperature equalizing and cooling plate |
| CN108919922A (en) * | 2018-07-11 | 2018-11-30 | 北京工业大学 | Microchannel phase-change heat sink |
| CN109378352A (en) * | 2018-09-06 | 2019-02-22 | 山东航天电子技术研究所 | A kind of photocell microchannel radiator |
| CN109921144A (en) * | 2019-03-29 | 2019-06-21 | 潍柴动力股份有限公司 | The coldplate and electric car of battery |
| CN110351980A (en) * | 2019-06-21 | 2019-10-18 | 加弘科技咨询(上海)有限公司 | A kind of liquid cold plate device |
| TWI802996B (en) * | 2021-07-13 | 2023-05-21 | 黃崇賢 | Liquid-cooled radiator and liquid-cooled radiator system for improving heat exchange efficiency |
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