CN108919922A - Microchannel phase-change heat sink - Google Patents
Microchannel phase-change heat sink Download PDFInfo
- Publication number
- CN108919922A CN108919922A CN201810755274.XA CN201810755274A CN108919922A CN 108919922 A CN108919922 A CN 108919922A CN 201810755274 A CN201810755274 A CN 201810755274A CN 108919922 A CN108919922 A CN 108919922A
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- heat
- microchannel
- working medium
- phase
- radiator
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Microchannel phase-change heat sink is related to field of radiating, to solve electronic device and system power is increasing generates high heat flow density therewith, thus brings the contradiction between system heat production and heat dissipation.Using microchannel phase-change heat principle, a kind of radiator is designed.The radiator is big using the working medium latent heat of vaporization, and a large amount of heat can be siphoned away rapidly by undergoing phase transition when flowing through heat radiation chip, has very strong exchange capability of heat.Have volume small with the radiator that the principle designs, heat-sinking capability is strong, and for microminiature and the high electronic device of heat flow density has good heat dissipation effect, complies with contemporary electronic systems high-performance, micromation, integrated developing direction.
Description
Technical field
The invention belongs to field of radiating, it is related to the microchannel phase-change heat sink for high heat flux density equipment, for volume
Small but big heat flow density equipment has heat dissipation effect well.
Background technique
As electronic system develops to high-performance, micromation, three integrated general orientation, electronic system complete machine heat dissipation problem
It is becoming increasingly acute, such as number of transistors then up to 11.7 hundred million of integrated chip of some Electronic Accounting Machine Units, heat dissipation speed
Rate is up to 100W/cm2, the heat flow density of present computer CPU has reached 60-100W/cm2, traditional heat-dissipating technology is for example air-cooled, liquid
It is cold etc. to meet the requirements.Need to find new and effective heat dissipation technology to meet needs.
The appearance of techniques for microchannel cooling provides new solution for effective thermal control problem of electronic equipment, heat dissipation
It has excellent performance, is integrated convenient for High Level, can quickly and efficiently take away heat caused by heating module.Techniques for microchannel cooling
It is found earliest by American scholar T uckerman and Pease and proposes the concept of minute yardstick radiator, they theoretically demonstrate
The heat-sinking capability of water-cooled microchannel cold plates can achieve 1000W/cm2, because its efficient heat-sinking capability is by more and more
The concern of person.
By the way that traditional microchannel heat sink, the study found that working medium absorbs heat in flow process, temperature can be rapid
Rise, when the temperature difference of wall surface and fluid reduces, heat exchange efficiency can also be reduced, furthermore heat sink inlet and outlet temperature gradient
Greatly, it is unfavorable for device safe and reliable use for a long time.The heat flow density of electronic equipment is higher and higher with the development of technology, tradition
Microchannel heat sink can not the more and more high radiating requirements of meet demand.
Summary of the invention
In view of the drawbacks of the prior art, the present invention provides that a kind of small heat-sinking capability of volume is strong, manufacturing process is simple, temperature
Gradient is small, using Working fluid phase changing when the huge latent heat of vaporization microchannel phase-change heat sink.
Radiator of the invention, by cover board, heat radiation chip, outline border composition：Heat radiation chip is embedded in outline border, in radiating core
There are the rectangle frames of storage working medium for piece the right and left, and process conduit plus gasket rear cover upper cover plate on outline border, make to radiate
Device forms confined space.Opening enters working medium in the slot of storage working medium on the cover board, then passes through the square on heat radiation chip
Shape microchannel absorbs the heat of heat source by phase transformation, then converges to then to export by cover board in the slot in exit and flow out, inhales
The heat for receiving heat source, completes the transfer of heat.
The radiating principle of the radiator is that working medium comes into full contact in small channel with radiator, can quickly absorb heat
Amount, and be heated and rapidly develop as nucleate boiling.Working medium has the latent heat of very high vaporization, and becoming gaseous state from liquid can absorb
A large amount of heat, therefore microchannel phase-change heat sink has very high heat-sinking capability.And after working medium is undergone phase transition, energy conversion
It can occur under the conditions of uniform temperature, therefore radiator has the temperature gradient of very little, is conducive to long-term by heat dissipation equipment
Safety sees reliable use.
In order to improve the performance of microchannel phase-change heat sink, which uses the microchannel of rectangle, using the channel shape
It is that controlled porosity is good, thermal conductivity is high, flow resistance is small because straight flute channel has, it is not easy to the advantages of blocking.
The further design enters working medium from cover board, initially enter stored in outline border working medium slot flow into again it is each micro- logical
Road can make each microchannel working medium flow be evenly distributed using the structure, improve radiator uniform temperature.
The copper of high thermal conductivity can be used in further radiator, and the production of the metals such as aluminium is conducive to the transmitting of heat.
Further radiator can be different according to application device operating condition and selection has different boiling and the latent heat of vaporization
Heat radiation working medium, such as ethyl alcohol, distilled water, the liquid working substances such as methanol have a wide range of application
For ethyl alcohol：
H/a=2.5-2.6, h/b=5-5.8
For water：
H/a=2.5-2.8, h/b=5-5.3
Wherein Rectangular Microchannel groove width is b, slot a height of h, separation a.
Further the outer frame bottom of the radiator opens frame, contacts heat source directly with cooling fin, reduces thermal contact resistance, be conducive to
The transmitting of heat.
The radiator has microchannel heat sink heat-sinking capability very big using the huge latent heat of vaporization possessed by working medium
It improves, and energy conversion can occur under the conditions of uniform temperature when phase transformation, reduce the temperature gradient of radiator, with processing
The progress of technology, the radiator also can batch processing and manufacturing.
Detailed description of the invention
Fig. 1 is a kind of schematic perspective view of the cover board of microchannel phase-change heat sink provided in an embodiment of the present invention；
Fig. 2 is a kind of radiating core of microchannel phase-change heat sink provided in an embodiment of the present invention and the stereochemical structure of microchannel
Schematic diagram；
Fig. 3 is a kind of schematic perspective view of the outline border of microchannel phase-change heat sink provided in an embodiment of the present invention；
Fig. 4 is a kind of schematic perspective view of the inside of microchannel phase-change heat sink provided in an embodiment of the present invention
Fig. 5 is a kind of schematic perspective view of microchannel phase-change heat sink provided in an embodiment of the present invention.
In attached drawing, parts list represented by the reference numerals are as follows：
1 working medium import, 2 sender property outlets, 3 Rectangular Microchannels, frame where 4 radiating cores, 5 sealing conduits, 6 working medium entrances square types
Slot, 7 sender property outlet square type slots.
Specific embodiment
The principle and features of the present invention will be described below with reference to the accompanying drawings, and the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the invention.
A kind of microchannel phase-change heat sink, it is characterised in that：In the tiny channels using working medium, heat can be absorbed rapidly,
Become gaseous state from liquid, working medium has the very big latent heat of vaporization when undergoing phase transition, and can absorb a large amount of heat.
The radiator includes top blind flange, the working medium makeup of the imports and export structure, heat radiation chip and outline border.In heat radiation chip
On process Rectangular Microchannel for Working fluid flow, heat radiation chip is embedded into outline border, there are storage working medium on outline border both sides
Rectangle frame.And conduit is processed on outline border, it places gasket and then adds cover board for heat radiation sealed.
Selected Rectangular Microchannel hydraulic diameter is between 1~1 000um.
The cutting road on outline border in addition adding cover board after gasket, and is screwed on outline border.This structure disassembly
Convenient and good leak tightness.
Frame is outputed in outer frame bottom, heat source is directly contacted with heat radiation chip after embedding heat radiating fin chip, reduce thermal contact resistance,
Accelerate heat transfer.
Present example provides a kind of microchannel phase-change heat radiating device.As shown in Figures 1 to 3, which includes cover board figure
1, cooling fin Fig. 2, outline border Fig. 3,.There are microchannel, the wide 0.4mm in the microchannel processed in this example, high 2mm, outline border on radiating core
For structure as shown in figure 3,4 for placing radiating core in Fig. 3, lower hollow in Fig. 3 contacts heat source directly newly with heat dissipation.In Fig. 3
Structure 5 is for placing gasket, the sealing for radiator.Fig. 1 is cover board, and 1,2 be working medium inlet and outlet in Fig. 1.
In specific implementation, first by the 4 of radiating core insertion outline border, resulting structures are as shown in figure 4, in cooling fin bottom
It is sealed with glue.6 in Fig. 4,7 be working medium entrances and outlet rectangle frame, plus gasket rear cover upper cover plate for dissipating in the 5 of Fig. 3
The sealing of hot device has working medium inlet and outlet 1,2 on the cover board.
When radiator works, contact heat source with radiating core, heat is constantly transmitted to radiator from heat source.In external drive
Under the action of power, working medium enters from cover board upper inlet, flows into import rectangle frame, then passes through micro-channel, and working medium is led in small
It is come into full contact in road with radiator, can quickly absorb heat, and be heated and rapidly develop as nucleate boiling, liquid is at this time
One height non-equilibrium state has very big exchange capability of heat.Working medium has the latent heat of very high vaporization, becomes gaseous state from liquid
A large amount of heat can be absorbed, working medium converges to outlet rectangle frame after absorbing heat, is then exported and is flowed out by cover board, cold by one
Solidifying device releases heat.Working medium constantly circulates, and takes away heat from heat source.
The microchannel phase-change heat sink using the huge latent heat of vaporization of working medium, while also utilizing heat-transfer capability under minute yardstick
Raising, not only volume is small, it is three-dimensional having a size of L x W x H 96mm x 56mm x 6mm and its heat-sinking capability it is strong, it is right
The heat source of high heat flux density has good heat dissipation effect.
Microchannel structure selection
Micro-channel heat transfer mainly realizes heat exchange using the convection current and phase transformation on fluid and solid contact surface.Therefore, high
Performance micro-channel augmentation of heat transfer structure should have high-specific surface area, high heat conductance, strong flow-disturbing effect, and in phase-change heat transfer field
It closes, it is also necessary to which channel table face has boiling nucleation cave abundant.The flowing in channel is required to hinder on the basis of meeting conditions above
The amount of overcoming is low.
Include the hole being largely connected to, these irregular and curved holes in powder sintered porous micro-channel heat exchange core
Gap constitutes complicated channel design, has very strong flow-disturbing effect, but the flow resistance of the structure is larger, spent pump work
It is relatively high, and the structure is also easy to produce vent plug in high heat flux density and makes heat transfer deterioration.And the porosity in straight flute channel
Controllability is good, thermal conductivity is high, flow resistance is small, is a kind of channel for heat exchange cored structure universal at present, so this micro-channel knot
Structure selects microlitic quartz.
Micro-channel size selection
Since phase-change heat transfer results in very big friction pressure loss in a large amount of steam bubbles that violent phase transition process generates and adds
Velocity pressure loss pressure loss in the design of two flow heat dissipation equipment is all that a very important parameter pressure loss is
The function of flow channel cross-section geometric dimension, mass flowrate and physical properties of fluids.It is high wide with microchannel by literature to pressure drop
Depth-width ratio biggish microchannel is selected than increase reduces to reduce pressure drop.
Channel size, which has a significant impact to radiator, to be selected suitably sized heat dissipation capacity and device performance to can be improved.It is old
Gift, Xin Daoming etc. have carried out experimental study to the pool Boiling Heat Transfer of Horizontal Rectangular Grooved Surfaces, seek the influence of geometrical factor, seek
Seek optimal slot road size.
Test size range a：0.5~1.0 (mm), b：0.3~3.0 (mm), c：0.5~9.0 (mm).They analyze presence
One best conduit surface.This surface can give full play to the effect of microlayer evaporation, to obtain best heat-transfer effect.Due to boiling
Steam bubble size can all be influenced by rising liquid and heat flow density q, thus also will affect best surface size.Various conduit surface geometries because
Plain applicable shapes coefficient h/a, h/b characterization.There is a heat transfer coefficient α on each surface under a certain q value.If h/b is flat with h/a
Areal coordinate, α are ordinate, then each α value of all experiment surfaces under same q value constitutes a curved surface.Change q value it is available with
Q is the curved surface beam of parameter.The corresponding plane coordinates of each curved surface maximum value is optimum shape coefficient.Author is asked using surface fitting
The means such as extreme value are taken to obtain optimum value curve in scope of experiment.As engineering calculation, can recommend in scope of experiment
Such as lower approximate value：
For ethyl alcohol：
H/a=2.5-2.6, h/b=5-5.8
For water：
H/a=2.5-2.8, h/b=5-5.3
Heat dissipation capacity on the smaller unit area of microchannel size is bigger, comprehensively considers various factors influence and this subtask
It is 0.4mm that the performance of required cooling system, which determines that this tests microchannel groove width b used, and the high h of slot is 2mm, and separation a is
0.8mm。
Material, technique and working medium selection
Microchannel heat sink is made using the red copper of high thermal conductivity, is conducive to the conduction of heat.Rectangular Microchannel passes through electricity
Spark wire-cutting machine tool machine-shaping.Wire-cut Electrical Discharge Machining is the opposite fortune by linear tool-electrode and piece pole
It is dynamic, a kind of special precision processing technology of pulsed discharge is carried out to workpiece, takes repeatedly cutting, low-speed wire cutting in process
Etc. techniques ensure processing quality.Device, at 80 DEG C or so, uses ethyl alcohol as working medium, the boiling point of ethyl alcohol is on 78 DEG C of left sides using temperature
The right side, working medium generates phase transformation upon reaching that temperature, and device has very strong exchange capability of heat at this time, can conduct more heat, from
And the temperature of control device is at 80 DEG C or so.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (6)
1. a kind of microchannel phase-change heat sink, it is characterised in that：In the tiny channels using working medium, heat is absorbed, is become from liquid
For gaseous state, when undergoing phase transition, working medium has the latent heat of vaporization, can absorb a large amount of heat；
The radiator includes top blind flange, the working medium makeup of the imports and export structure, heat radiation chip and outline border；Add on heat radiation chip
Work goes out the Rectangular Microchannel for Working fluid flow, and heat radiation chip is embedded into outline border, and there are the rectangles of storage working medium on outline border both sides
Frame；And conduit is processed on outline border, it places gasket and then adds cover board for heat radiation sealed；
Selected Rectangular Microchannel hydraulic diameter is between 1~1 000um.
2. a kind of microchannel phase-change heat sink according to claim 1, it is characterised in that：, it is characterised in that：On outline border
Cutting road in addition adding cover board after gasket, and is screwed on outline border.
3. a kind of microchannel phase-change heat sink according to claim 1, it is characterised in that：Frame is outputed in outer frame bottom, it is embedding
Heat source is directly contacted with heat radiation chip after entering cooling fin chip.
4. a kind of microchannel phase-change heat sink according to claim 1, it is characterised in that：Radiator is by copper or aluminum material system
It does.
5. a kind of microchannel phase-change heat sink according to claim 1, it is characterised in that：The radiator working medium is according to being dissipated
The difference of hot equipment operating condition and select the working medium with different boiling.
6. a kind of microchannel phase-change heat sink according to claim 1, it is characterised in that：For ethyl alcohol：
H/a=2.5-2.6, h/b=5-5.8
For water：
H/a=2.5-2.8, h/b=5-5.3
Wherein Rectangular Microchannel groove width is b, slot a height of h, separation a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810755274.XA CN108919922A (en) | 2018-07-11 | 2018-07-11 | Microchannel phase-change heat sink |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810755274.XA CN108919922A (en) | 2018-07-11 | 2018-07-11 | Microchannel phase-change heat sink |
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| CN108919922A true CN108919922A (en) | 2018-11-30 |
Family
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| CN201810755274.XA Pending CN108919922A (en) | 2018-07-11 | 2018-07-11 | Microchannel phase-change heat sink |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112797827A (en) * | 2020-12-28 | 2021-05-14 | 广东省科学院半导体研究所 | Phase change heat exchanger |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112797827A (en) * | 2020-12-28 | 2021-05-14 | 广东省科学院半导体研究所 | Phase change heat exchanger |
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Inventor after: Xie Xuesong Inventor after: Qi Shuaibing Inventor after: Wang Qun Inventor after: Zhang Xiaoling Inventor after: Hu Dongdong Inventor before: Xie Xuesong Inventor before: Qi Shuaibing Inventor before: Zhang Xiaoling Inventor before: Hu Dongdong |
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