CN104777887B - Micro-channel formula water cooling chip radiator - Google Patents

Micro-channel formula water cooling chip radiator Download PDF

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Publication number
CN104777887B
CN104777887B CN201510209577.8A CN201510209577A CN104777887B CN 104777887 B CN104777887 B CN 104777887B CN 201510209577 A CN201510209577 A CN 201510209577A CN 104777887 B CN104777887 B CN 104777887B
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China
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channel
micro
cover
collet
water
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CN201510209577.8A
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CN104777887A (en
Inventor
诸凯
王雅博
魏杰
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Pizhou tailiheng Trading Co., Ltd
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Tianjin University of Commerce
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Abstract

The invention discloses a kind of micro-channel formula water cooling chip radiator, radiator is made of upper cover and collet, and the upper surface of collet is equipped with raised rectangle micro-channel, and the arranged on left and right sides of rectangle micro-channel is equipped with storage cistern.Outside is equipped with seal groove in rectangle micro-channel and storage cistern area defined, and sealing ring is equipped with seal groove.Four side downward bendings of upper cover, upper cover are detained on the sealing ring of collet.Water inlet and water outlet are respectively equipped with the lower left corner of upper cover and the upper right corner, intaking can exchange with the position of water outlet, and slope is equipped with the edge of rectangle micro-channel disengaging water end (W.E.).The design of micro-channel and upper cover water stream channel, has stronger heat transfer effect, heat exchange efficiency can be significantly improved compared with traditional water-filled radiator.This kind of heat sink thickness is relatively thin, but heat exchange area is relatively large, therefore is highly suitable for the narrow space of computer server, and make it that the even temperature effect of cpu chip is more preferable.

Description

Micro-channel formula water cooling chip radiator
Technical field
The invention belongs to Thermal Power Engineering Field, and in particular to a kind of heat sink arrangement for Cooling calculation machine cpu chip.
Background technology
The cpu chip of computer can be usual as the Typical Representative of high heat flux density heating device, a large server It is close with the caloric value and hot-fluid of higher in the behind of powerful performance with tens pieces of even hundreds of pieces of multinuclear formula cpu chips Degree, it may be said that the efficient cooling problem of cpu chip further develops Zhi Ku as computer performance.It is applied to high fever at present The heat dissipation technology of current density device cooling is main or based on air-cooled, i.e., installs a heat dissipation additional on the surface of cooled device Device, the cold wind that heat is forced to flowing by the fin on radiator are taken away.It is well known that had using water cooling mode higher Heat transfer efficiency, but water cooled heat radiating has a two big difficult points, one be coolant leakage;Another is because in heat dissipation cavity The flow resistance of fluid is excessive to cause radiating efficiency to reduce.The former belongs to the problem of precision and installation of processing, and the latter will The theory and technology for being related to conducting heat and flowing.Currently used liquid cooling radiator, processes mostly in cooling chamber and (portrays Shape) go out a pin column matrix, the main function of pin column is to increase the heat exchange area in cooling water cavity to improve cooling effect.But The defects of the type radiator is that the structure of each pin column is not each independent, and pin column is short and small, cooling chamber bottom phase To thicker, the flow field of low-resistance can not be formed in pin column matrix.The defects of causing such heat spreader structures to design is heat transfer and stream The shortcoming of dynamic theoretical side.Therefore the efficiency and performance of liquid cooling radiator how are improved, it is high just to become research both at home and abroad Heat flow density device cools down the difficult point of problem.
The content of the invention
The object of the present invention is to propose a kind of micro-channel formula heat sink arrangement for Cooling calculation machine cpu chip, subtracting On the basis of small cooling fluid flow resistance, the heat dissipation performance of cpu chip can be effectively improved.
To realize that the invention purpose adopts the technical scheme that:Radiator is made of upper cover and collet, the upper table of collet Face is equipped with raised rectangle micro-channel, and the arranged on left and right sides of rectangle micro-channel is equipped with storage cistern.Rectangle micro-channel with And outside is equipped with seal groove in storage cistern area defined, and sealing ring is equipped with seal groove.Four side downward bendings of upper cover, on Cover buckle is given as security on the sealing ring of collet.Water inlet and water outlet are respectively equipped with the lower left corner of upper cover and the upper right corner, intakes and goes out The position of water can exchange, and slope is equipped with the edge of rectangle micro-channel disengaging water end (W.E.).
Except the structure of radiator, the contrast of the type of flow and prior art of cooling water:Cooling water is from upper cover top surface Water inlet turns quarter bend and enters hydrophobic channel, and then being scattered by storage cistern cools down the fin on collet, then another The storage cistern of side collects outflow.Because the direction of conduit is consistent with the flow direction of fluid, resistance is very small.Fin soaks Not among current, fluid can form highly uniform flow field, can make and (be contacted with radiator bottom surface) cpu chip to be filled The cooling divided, makes the heat transfer of its radiator be strengthened.
The temperature of coolant and flow are adjusted according to the thermic load (heat flow density) of CPU, reached by calculating good Good parameter matching.It is demonstrated experimentally that the pressure drop very little caused by the structure, according to the principle of thermal conduction study, the temperature of fin Gradient is high low under (root), and cooling water is laterally to skim over outflow, so the structure can have preferable heat dissipation effect. It is directly to radiate that the main function of fin, which is not, but the heat of collet is spread out of in a manner of high heat conduction, finally by cooling Water dissipates this heat.
The features of the present invention and the beneficial effect of generation are the designs of rectangle micro-channel and upper cover water stream channel, There is strong radiator heat transfer, especially miniature conduit is processed into similar to blocks of fin.Fin is flowed with cooling Body laterally exchanges heat, thus has stronger heat transfer effect, and heat exchange efficiency can be significantly improved compared with traditional water-filled radiator.This kind Heat sink thickness is relatively thin, but heat exchange area is relatively large, therefore is highly suitable for the narrow space of computer server, and makes It is more preferable to obtain the even temperature effect of cpu chip, can more effectively reduce operating temperature.
Brief description of the drawings
Fig. 1 is that collet and micro-channel set three-dimensional structure diagram in the present invention.
Fig. 2 is the three-dimensional structure diagram of upper cover in the present invention.
Embodiment
It is further described below in conjunction with attached drawing and by specific embodiment to the principle of the present invention and structure.Need Bright is that the present embodiment is narrative, rather than limited, does not limit protection scope of the present invention with this embodiment.
Micro-channel formula water cooling chip radiator is made of upper cover and collet, it is specifically:The upper surface of collet 1 is equipped with protrusion Rectangle micro-channel 1-1, the arranged on left and right sides of rectangle micro-channel is equipped with storage cistern 1-2.In rectangle micro-channel and storage Outside is equipped with seal groove 1-3 in the area defined of pond, and sealing ring is equipped with seal groove.Four side downward bendings of upper cover 2, on Cover buckle is given as security on the sealing ring of collet.Water inlet 2-1 and water outlet 2-2 are respectively equipped with the lower left corner of upper cover and the upper right corner, into The position of water and water outlet can exchange, and slope is equipped with the edge of rectangle micro-channel disengaging water end (W.E.).Upper cover water inlet is with going out The position at the mouth of a river is corresponding with the position of collet rectangle micro-channel arranged on left and right sides storage cistern.
The corner of upper cover is equipped with shoulder 2-3, and shoulder is equipped with screw hole, passes through screw and collet fit sealing.Upper cover into The mouth of a river and water outlet are equipped with joint chair and are connected with pipeline.Collet is made of red copper material.
As embodiment, the height of rectangle conduit is 3mm;Length is 75mm;Groove width is 0.3mm;Collet total height 6mm;Upper cover thickness is 6mm.
The collet that radiates during use is fixed with being in close contact by radiating element, collet and high heat conduction is equipped between radiating element The thermal bond material of rate.As embodiment, experiment detection and observation, Ke Yiming are carried out using the upper cover of transparent plastic material It is aobvious to see that fluid is flowed in lower resistance.

Claims (5)

1. micro-channel formula water cooling chip radiator, radiator are made of upper cover and collet, it is characterized in that:The upper surface of collet (1) Equipped with raised rectangle micro-channel (1-1), the arranged on left and right sides of rectangle micro-channel is equipped with storage cistern (1-2), in rectangle Outside is equipped with seal groove (1-3) in micro-channel and storage cistern area defined, and sealing ring, upper cover (2) are equipped with seal groove Four side downward bendings, upper cover detained on the sealing ring of collet, and water inlet is respectively equipped with the lower left corner of upper cover and the upper right corner (2-1) and water outlet (2-2), intaking can exchange with the position of water outlet, be set at the edge of rectangle micro-channel disengaging water end (W.E.) There is slope.
2. micro-channel formula water cooling chip radiator described in accordance with the claim 1, it is characterized in that:The upper cover water inlet and water outlet The position of mouth is corresponding with the position of the collet rectangle micro-channel arranged on left and right sides storage cistern.
3. micro-channel formula water cooling chip radiator described in accordance with the claim 1, it is characterized in that:The corner of the upper cover is equipped with Shoulder (2-3), shoulder are equipped with screw hole, pass through screw and collet fit sealing.
4. according to the micro-channel formula water cooling chip radiator described in claim 1 or 2, it is characterized in that:The water inlet of the upper cover Joint chair is equipped with water outlet to be connected with pipeline.
5. micro-channel formula water cooling chip radiator described in accordance with the claim 1, it is characterized in that:The height of the rectangle conduit For 3-4mm;Length is 75mm;Groove width is 0.3-0.4mm;Collet is made of red copper material.
CN201510209577.8A 2015-04-28 2015-04-28 Micro-channel formula water cooling chip radiator Active CN104777887B (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
CN201510209577.8A CN104777887B (en) 2015-04-28 2015-04-28 Micro-channel formula water cooling chip radiator

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CN104777887B true CN104777887B (en) 2018-05-11

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108895873B (en) * 2018-06-14 2020-04-28 中国电子科技集团公司第十四研究所 Metal micro-flow heat exchanger based on UV-LIGA technology and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1588267A (en) * 2004-09-08 2005-03-02 西安交通大学 Water cooling type CPU radiator
JP2008287733A (en) * 2008-06-19 2008-11-27 Hitachi Ltd Liquid cooling system
CN102566722A (en) * 2012-01-05 2012-07-11 南京佳力图空调机电有限公司 CPU (Central processing unit) water-cooled radiator and application method thereof
CN103066035A (en) * 2013-01-07 2013-04-24 深圳市欣普斯科技有限公司 Radiating block of liquid cooling type central processing unit (CPU) radiator and manufacturing method of the radiating block
CN204028796U (en) * 2014-06-06 2014-12-17 陈洁光 CPU water-filled radiator integrative-structure
CN204537036U (en) * 2015-04-28 2015-08-05 天津商业大学 Slot type fin liquid cooling heat radiator

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1588267A (en) * 2004-09-08 2005-03-02 西安交通大学 Water cooling type CPU radiator
JP2008287733A (en) * 2008-06-19 2008-11-27 Hitachi Ltd Liquid cooling system
CN102566722A (en) * 2012-01-05 2012-07-11 南京佳力图空调机电有限公司 CPU (Central processing unit) water-cooled radiator and application method thereof
CN103066035A (en) * 2013-01-07 2013-04-24 深圳市欣普斯科技有限公司 Radiating block of liquid cooling type central processing unit (CPU) radiator and manufacturing method of the radiating block
CN204028796U (en) * 2014-06-06 2014-12-17 陈洁光 CPU water-filled radiator integrative-structure
CN204537036U (en) * 2015-04-28 2015-08-05 天津商业大学 Slot type fin liquid cooling heat radiator

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Effective date of registration: 20201204

Address after: Room 107, 1 / F, Donghu sub district office, 168 Changjiang Road, Donghu street, Pizhou City, Xuzhou City, Jiangsu Province

Patentee after: Pizhou tailiheng Trading Co., Ltd

Address before: Tianjin highway 300134 East Tianjin District of Beichen City

Patentee before: TIANJIN University OF COMMERCE