CN204028796U - CPU water-filled radiator integrative-structure - Google Patents
CPU water-filled radiator integrative-structure Download PDFInfo
- Publication number
- CN204028796U CN204028796U CN201420298415.7U CN201420298415U CN204028796U CN 204028796 U CN204028796 U CN 204028796U CN 201420298415 U CN201420298415 U CN 201420298415U CN 204028796 U CN204028796 U CN 204028796U
- Authority
- CN
- China
- Prior art keywords
- heat
- dissipating frame
- annular groove
- integrative
- water tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 238000009434 installation Methods 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000741 silica gel Substances 0.000 claims abstract description 7
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 7
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002360 explosive Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of CPU water-filled radiator integrative-structure.It comprises the heat-dissipating frame that the cavity with annular groove and have installation base, the installation base of heat-dissipating frame can be made during installation to be positioned at annular groove, the heat dissipation water tank be made up of silica gel material is provided with in heat-dissipating frame, there is in heat dissipation water tank the intake-outlet of depression, the end face of heat-dissipating frame upper end has the sealing strip be wholely set with heat-dissipating frame, heat-dissipating frame is arranged on the cover plate capping be positioned at above heat-dissipating frame by cavity.After adopting above-mentioned structure, heat-dissipating frame and sealing strip are wholely set, and adopt novel silica gel material; There is in heat dissipation water tank the intake-outlet of depression, water circulation heat radiation can be realized, the temperature of CPU is reduced, be provided with convex strength inside installation base simultaneously, the side in annular groove be provided with the groove coordinated with convex strength.As long as withstand in groove by convex strength during installation and just solve seepy question, this efficiency easy to assembly is high, and cost have also been obtained control.
Description
Technical field
The utility model relates to the water-cooling part accessory of a kind of computer main board CPU, specifically a kind of CPU water-filled radiator integrative-structure.
Background technology
In prior art, the water-cooling radiating structure of computer main board CPU is all generally comprise the heat dissipation water tank of hard plastic material and be arranged on the rubber waterproof circle of heat dissipation water tank periphery, is then encapsulated in housing by heat dissipation water tank, traditional this structure, because vibrational power flow is unreasonable, on the one hand, the heat dissipation water tank due to hard plastic material is higher to tank material hardness requirement, easy damage, in addition on the one hand, water of radiation line structure arranges unreasonable, poor radiation, again on the one hand, it is unreliable to seal.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of rational in infrastructure, and thermal diffusivity is good, seals reliable CPU water-filled radiator integrative-structure.
In order to solve the problems of the technologies described above, CPU water-filled radiator integrative-structure of the present utility model, comprise the heat-dissipating frame that the cavity with annular groove and have installation base, the installation base of heat-dissipating frame can be made during installation to be positioned at annular groove, the heat dissipation water tank be made up of silica gel material is provided with in heat-dissipating frame, there is in heat dissipation water tank the intake-outlet of depression, the end face of heat-dissipating frame upper end has the sealing strip be wholely set with heat-dissipating frame, heat-dissipating frame is arranged on the cover plate capping be positioned at above heat-dissipating frame by cavity.
The top of described cavity is provided with step surface, and the edge of cover plate is positioned on step surface.
Be placed with bolt installation position in described annular groove, described heat-dissipating frame and cover plate are all placed with the bolt hole corresponding with bolt installation position, bolt can be tightened in bolt installation position through the bolt hole of heat-dissipating frame and cover plate.
Be provided with convex strength inside described installation base, the side in annular groove be provided with the groove coordinated with convex strength.
After adopting above-mentioned structure, owing to being provided with the heat dissipation water tank be made up of silica gel material in heat-dissipating frame, there is in heat dissipation water tank the intake-outlet of depression, the end face of heat-dissipating frame upper end has the sealing strip be wholely set with heat-dissipating frame, thus heat-dissipating frame and sealing strip are wholely set, and adopt novel silica gel material; There is in heat dissipation water tank the intake-outlet of depression, water circulation heat radiation can be realized, the temperature of CPU is reduced, be provided with convex strength inside installation base simultaneously, the side in annular groove be provided with the groove coordinated with convex strength.As long as withstand in groove by convex strength during installation and just solve seepy question, this efficiency easy to assembly is high, and cost have also been obtained control.
Accompanying drawing explanation
Fig. 1 is the explosive view of the utility model CPU water-filled radiator integrative-structure;
Fig. 2 is the sectional view of the utility model CPU water-filled radiator integrative-structure.
Embodiment
Below in conjunction with the drawings and specific embodiments, CPU water-filled radiator integrative-structure of the present utility model is described in further detail.
As shown in the figure, CPU water-filled radiator integrative-structure of the present utility model, comprise a cavity 2, the periphery of cavity 2 is provided with annular groove 1, forms the side of annular groove 1 between annular groove 1 and chamber central, also comprises a heat-dissipating frame 4, the periphery of heat-dissipating frame 4 is provided with an installation base 3, be provided with convex strength inside installation base 3, the installation base 3 of heat-dissipating frame 4 can be made during installation to be positioned at annular groove 1, and the convex strength inside installation base 3 can be pressed in the groove on annular groove 1 side.
The heat dissipation water tank 5 be made up of silica gel material is provided with in heat-dissipating frame 4, heat-dissipating frame 4 and heat dissipation water tank 5 are wholely set, there is in heat dissipation water tank 5 intake-outlet 6 of depression, the end face of heat-dissipating frame 5 upper end has the sealing strip 7 be wholely set with heat-dissipating frame 4, that is sealing strip is directly processed to form on heat-dissipating frame 5, and heat-dissipating frame 4 is arranged on after on cavity 1 and is positioned at cover plate 8 capping above heat-dissipating frame by one.
Further, the top of said cavity 2 is provided with step surface 9, the top of annular groove outer side edges is provided with step surface specifically, the edge of cover plate 8 is positioned on step surface 9, bolt installation position 11 is placed with in said annular groove 1, heat-dissipating frame 4 and cover plate 8 are all placed with the bolt hole corresponding with bolt installation position, and bolt 10 can be tightened in bolt installation position through the bolt hole of heat-dissipating frame 4 and cover plate 8.
Claims (4)
1. a CPU water-filled radiator integrative-structure, it is characterized in that: comprise the heat-dissipating frame (4) that a cavity (2) with annular groove (1) and have installation base (3), the installation base of heat-dissipating frame (4) (3) can be made during installation to be positioned at annular groove (1), the heat dissipation water tank (5) be made up of silica gel material is provided with in described heat-dissipating frame (4), there is in described heat dissipation water tank (5) intake-outlet (6) of depression, the end face of described heat-dissipating frame (5) upper end has the sealing strip (7) be wholely set with heat-dissipating frame (4), described heat-dissipating frame (4) is arranged on cover plate (8) capping be positioned at above heat-dissipating frame by after on cavity (1).
2. according to CPU water-filled radiator integrative-structure according to claim 1, it is characterized in that: the top of described cavity (2) is provided with step surface (9), the edge of cover plate (8) is positioned on step surface (9).
3. according to CPU water-filled radiator integrative-structure according to claim 1, it is characterized in that: in described annular groove (1), be placed with bolt installation position (11), described heat-dissipating frame (4) and cover plate (8) are all placed with the bolt hole corresponding with bolt installation position, and the bolt hole that bolt (10) can pass heat-dissipating frame (4) and cover plate (8) is tightened in bolt installation position.
4. according to CPU water-filled radiator integrative-structure according to claim 1, it is characterized in that: described installation base (3) inner side is provided with convex strength, the side in annular groove (1) is provided with the groove coordinated with convex strength.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420298415.7U CN204028796U (en) | 2014-06-06 | 2014-06-06 | CPU water-filled radiator integrative-structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420298415.7U CN204028796U (en) | 2014-06-06 | 2014-06-06 | CPU water-filled radiator integrative-structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204028796U true CN204028796U (en) | 2014-12-17 |
Family
ID=52068636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420298415.7U Expired - Lifetime CN204028796U (en) | 2014-06-06 | 2014-06-06 | CPU water-filled radiator integrative-structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204028796U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104777887A (en) * | 2015-04-28 | 2015-07-15 | 天津商业大学 | Micro-channel type water cooling chip heat radiator |
-
2014
- 2014-06-06 CN CN201420298415.7U patent/CN204028796U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104777887A (en) * | 2015-04-28 | 2015-07-15 | 天津商业大学 | Micro-channel type water cooling chip heat radiator |
| CN104777887B (en) * | 2015-04-28 | 2018-05-11 | 天津商业大学 | Micro-channel formula water cooling chip radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205249691U (en) | Coal -winning machine water cooling converter heat dissipation conduction device | |
| CN202475995U (en) | Split type outdoor LED power supply casing | |
| CN202887627U (en) | Light-emitting diode (LED) split joint screen module box | |
| CN204028796U (en) | CPU water-filled radiator integrative-structure | |
| CN207022368U (en) | A kind of underwater installation heat abstractor | |
| CN203942384U (en) | A kind of air pressure regulates sealed electrical casing automatically | |
| CN204044678U (en) | The reinforced notebook computer computer that a kind of heat radiator is flexible for installation | |
| CN203799328U (en) | CPU (central processing unit) radiator | |
| CN203934278U (en) | A kind of electromagnetic device erecting device | |
| CN205176774U (en) | Take fin of graphite alkene bed course | |
| CN204300773U (en) | Water-cooled LED lamp | |
| CN203309627U (en) | High-efficiency radiating waterproof type LED (Light-Emitting Diode) module | |
| CN204176395U (en) | A kind of bulb lamp modified node method | |
| CN203181088U (en) | Heat radiation structure for embedded television set | |
| CN203501124U (en) | LED spotlight | |
| CN202513812U (en) | Heat radiator for inverter | |
| CN202663691U (en) | Water-proof structure of case with external radiator | |
| CN205261245U (en) | High -efficient radiating LED module | |
| CN205945317U (en) | End cover with water -cooling function | |
| CN205669799U (en) | A kind of LED radiator structure | |
| CN203706118U (en) | Filling-sealing type water cooling radiator | |
| CN207262361U (en) | A kind of LED light | |
| CN203926045U (en) | Low power consumption cooling pump | |
| CN203706119U (en) | Water-cooling radiator long in service life | |
| CN103528036B (en) | Side-end waterproof structure of wall washer lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190116 Address after: 518116 Three Floors of Building A of Tongle Science Park, Tongle Community, Longgang District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Senjing Technology Co.,Ltd. Address before: Room 306, No. 11 Lucun Road, Xiashan District, Zhanjiang City, Guangdong Province Patentee before: Chen Jieguang |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141217 |