CN205176774U - Take fin of graphite alkene bed course - Google Patents
Take fin of graphite alkene bed course Download PDFInfo
- Publication number
- CN205176774U CN205176774U CN201520823897.8U CN201520823897U CN205176774U CN 205176774 U CN205176774 U CN 205176774U CN 201520823897 U CN201520823897 U CN 201520823897U CN 205176774 U CN205176774 U CN 205176774U
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- substrate
- graphene
- bed course
- heat
- alloy layer
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Abstract
The utility model provides a take fin of graphite alkene bed course, is including fixing substrate and the heat dissipation support of shaping on the substrate on south, north bridge frame, the cross section of heat dissipation support is the I shape, evenly is provided with a plurality of heat dissipation muscle on it, and the substrate is the three -layer composite structure, be in proper order with the copper -aluminium alloy layer of the copper base of north -south bridge laminating, shaping graphene film layer and the shaping on copper base on the graphene film layer, and the shaping has one deck dispel the heat silicone grease or tin cream between graphene film layer and copper -aluminium alloy layer. The utility model discloses compact structure, reasonable, the assembly is easy, and can effectively make things convenient for the shaping to come to dispel the heat to it at notebook south, north bridge position.
Description
Technical field
The utility model relates to computer to dissipate heat technical field, is specially a kind of heat radiator that can be used for the band Graphene bed course of notebook computer north and south bridge heat radiation.
Background technology
Computer equipment is due to the demand of function and processing speed; the heat of high temperature produced during the work of its inner member is quite large; and these heat of high temperature cannot shed and easily cause related elements because autoprotection and forced shutdown is restarted in the small space of computer casing; affect normal use and the serviceable life of equipment, this point shows particularly evident on notebook computer.
And in notebook computer, main heater element mainly concentrates on north and south bridge portion, for elements such as CPU, GPU, its integrated level and frequency of operation higher, also higher to the requirement of heat radiator, heat abstractor in existing notebook computer is formed primarily of fan and some heat radiator, wherein, the heat produced when heat radiator is for absorbing the work of computer equipment inner member, heat abstractor needs to distribute heat in surrounding enviroment as early as possible to go after absorbing heat, thus requires higher to the heat exchange performance of heat radiator.In prior art, the heat radiation of high-power south, north bridge heater element is improved usually to the radiating effect of heating radiator by the number of the heat radiator increasing computer radiator, and the inner space of notebook computer is limited, easily like this have influence on the integrally-built integrated of notebook.
Utility model content
The technical matters that the utility model solves is to provide a kind of heat radiator with Graphene bed course, to solve the shortcoming in above-mentioned background technology.
The technical matters that the utility model solves realizes by the following technical solutions:
A kind of heat radiator with Graphene bed course, comprise the substrate that is fixed on south, north bridge frame and be molded over on-chip cooling stand, the square section of described cooling stand is I shape, it is evenly provided with some radiating ribs, and described substrate is three-layer composite structure, be followed successively by the base copper of fitting with north and south bridge, the X alloy layer being molded over the Graphene rete on base copper and being molded on Graphene rete, and form one deck heat dissipating silicone grease or tin cream between Graphene rete and X alloy layer.
In the utility model, described cooling stand and substrate are threaded connection part at the corner location of substrate and are connected, and scribble one deck heat dissipating silicone grease or tin cream on the joint face of cooling stand and substrate.
In the utility model, the X alloy layer upper surface of described substrate forms some concentric annular burrs, this burr tangent plane is triangle or trapezoidal.
In the utility model, the thickness of described base copper is 8 ~ 15mm, and the thickness of X alloy layer is 5 ~ 8mm.
In the utility model, described radiating ribs is sheet or strip.
In the utility model, described cooling stand has in advance radiator fan and threaded hole is installed.
Beneficial effect: the utility model utilizes radiating ribs to increase the area of dissipation of heat radiator, improve the radiating effect of computer radiator, simultaneously, utilize Graphene rete as heat-conducting medium, coordinate the different Heat Conduction Material in both sides can effective notebook internal heat energy is derived while the size of heat radiator is controlled in a rational scope, carry out inner space with computer equipment be equipped with to facilitate, and the radiator fan installation threaded hole be arranged on cooling stand can dispel the temperature on heat radiator fast by fan, realize the double-radiation function function to notebook.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the utility model preferred embodiment.
Fig. 2 is the A-A cross-sectional detail enlarged drawing of Fig. 1.
Wherein: 1, substrate; 2, annular rib; 3, cooling stand; 4, radiating ribs; 5, integrated installation hole; 6, outer thermal conductive silicon lipid layer; 101, X alloy layer; 102, internal layer thermal conductive silicon lipid layer; 103, Graphene rete; 104, base copper.
Embodiment
The technological means realized to make the utility model, creation characteristic, reaching object and effect is easy to understand, below in conjunction with concrete diagram, setting forth the utility model further.
See the preferred embodiment of a kind of heat radiator with Graphene bed course of Fig. 1, Fig. 2, in the present embodiment, comprise substrate 1 and cooling stand 3, cooling stand 3 is provided with the radiating ribs 4 of some parallel strips, and on the corner of cooling stand 3, be respectively arranged with integrated installation hole 5, cooling stand 3 is connected on the substrate 1 by threaded connector by this bottom, integrated installation hole 5, and the radiator fan that top then can be used as radiator fan installation threaded hole same size is arranged on cooling stand 3.
Substrate 1 is three-layer composite structure, be respectively base copper 104, Graphene rete 103, internal layer thermal conductive silicon lipid layer 102 and X alloy layer 101 from bottom to top, wherein, the thickness of base copper 104 is 12mm, the thickness of X alloy layer 101 is 5mm, and Graphene rete 103 is monatomic Graphene rete, be molded directly within base copper 104, together with Graphene rete 103 to be molded over X alloy layer 101 by internal layer thermal conductive silicon lipid layer 102.
In the present embodiment, X alloy layer 101 upper surface forms some concentric annular burrs 2, the tangent plane of this annular rib 2 is triangle, for increasing heat-conducting area, then carry out dispelling the heat and assisting filling as medium by outer thermal conductive silicon lipid layer 6 bottom X alloy layer 101 with cooling stand 3.
More than show and describe ultimate principle of the present utility model, principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and instructions just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (5)
1. the heat radiator with Graphene bed course, comprise the substrate that is fixed on south, north bridge frame and be molded over on-chip cooling stand, it is characterized in that, the square section of described cooling stand is I shape, it is evenly provided with some radiating ribs, and described substrate is three-layer composite structure, be followed successively by the base copper of fitting with north and south bridge, the X alloy layer being molded over the Graphene rete on base copper and being molded on Graphene rete, and form one deck heat dissipating silicone grease or tin cream between Graphene rete and X alloy layer.
2. a kind of heat radiator with Graphene bed course according to claim 1, it is characterized in that, described cooling stand and substrate are threaded connection part at the corner location of substrate and are connected, and scribble one deck heat dissipating silicone grease or tin cream on the joint face of cooling stand and substrate.
3. a kind of heat radiator with Graphene bed course according to claim 1, is characterized in that, the X alloy layer upper surface of described substrate forms some concentric annular burrs, and this burr tangent plane is triangle or trapezoidal.
4. a kind of heat radiator with Graphene bed course according to claim 1, is characterized in that, the thickness of described base copper is 8 ~ 15mm.
5. a kind of heat radiator with Graphene bed course according to claim 1, is characterized in that, the thickness of described X alloy layer is 5 ~ 8mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520823897.8U CN205176774U (en) | 2015-10-23 | 2015-10-23 | Take fin of graphite alkene bed course |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520823897.8U CN205176774U (en) | 2015-10-23 | 2015-10-23 | Take fin of graphite alkene bed course |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205176774U true CN205176774U (en) | 2016-04-20 |
Family
ID=55740745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520823897.8U Expired - Fee Related CN205176774U (en) | 2015-10-23 | 2015-10-23 | Take fin of graphite alkene bed course |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205176774U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107070063A (en) * | 2017-05-25 | 2017-08-18 | 合肥皖化电泵有限公司 | A kind of boiler water circulating pump motor of high efficiency and heat radiation |
| CN113517491A (en) * | 2021-05-18 | 2021-10-19 | 深圳市黑金工业制造有限公司 | Superconductive heat dissipation device containing graphene copper |
-
2015
- 2015-10-23 CN CN201520823897.8U patent/CN205176774U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107070063A (en) * | 2017-05-25 | 2017-08-18 | 合肥皖化电泵有限公司 | A kind of boiler water circulating pump motor of high efficiency and heat radiation |
| CN113517491A (en) * | 2021-05-18 | 2021-10-19 | 深圳市黑金工业制造有限公司 | Superconductive heat dissipation device containing graphene copper |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 413100 Yuanjiang Port Road, Yiyang, Hunan, No. 99 Patentee after: Central South University of Forestry and Technology Address before: 410000 Shaoshan South Road, Hunan, No. 498, No. Patentee before: Central South University of Forestry and Technology |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160420 Termination date: 20161023 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |