CN205176774U - Take fin of graphite alkene bed course - Google Patents

Abstract

The utility model provides a take fin of graphite alkene bed course, is including fixing substrate and the heat dissipation support of shaping on the substrate on south, north bridge frame, the cross section of heat dissipation support is the I shape, evenly is provided with a plurality of heat dissipation muscle on it, and the substrate is the three -layer composite structure, be in proper order with the copper -aluminium alloy layer of the copper base of north -south bridge laminating, shaping graphene film layer and the shaping on copper base on the graphene film layer, and the shaping has one deck dispel the heat silicone grease or tin cream between graphene film layer and copper -aluminium alloy layer. The utility model discloses compact structure, reasonable, the assembly is easy, and can effectively make things convenient for the shaping to come to dispel the heat to it at notebook south, north bridge position.

Description

A heat sink with a graphene cushion layer

technical field

The utility model relates to the technical field of computer heat dissipation, in particular to a heat dissipation sheet with a graphene cushion layer which can be used for heat dissipation in the north and south bridges of a notebook computer.

Background technique

Due to the requirements of functions and processing speed of computer equipment, the high-temperature heat generated by its internal components is quite large, and these high-temperature heat cannot be dissipated in the small space of the computer case, which may easily cause related components to be forced to shut down and restart due to self-protection, affecting The normal use and service life of the equipment, which is especially evident on the laptop.

In notebook computers, the main heating elements are mainly concentrated in the north and south bridges. For components such as CPU and GPU, their integration and operating frequency are relatively high, and the requirements for heat sinks are also relatively high. The heat dissipation device is mainly composed of a fan and a number of heat sinks. Among them, the heat sink is used to absorb the heat generated by the internal components of the computer equipment. After the heat sink absorbs the heat, it needs to dissipate the heat to the surrounding environment as soon as possible. High heat exchange performance requirements. In the prior art, the heat dissipation of the high-power south and north bridge heating elements is usually improved by increasing the number of cooling fins of the computer radiator, and the internal space of the notebook computer is limited, which easily affects the overall structure of the notebook. integrated.

Utility model content

The technical problem solved by the utility model is to provide a heat sink with a graphene cushion to solve the above-mentioned shortcomings in the background technology.

The technical problem solved by the utility model adopts the following technical solutions to realize:

A heat sink with a graphene cushion layer, comprising a substrate fixed on the south and north bridges and a heat dissipation support formed on the substrate, the cross section of the heat dissipation support is I-shaped, and a number of heat dissipation plates are evenly arranged on it. Ribs, and the substrate is a three-layer composite structure, which is the copper base layer bonded to the north-south bridge, the graphene film layer formed on the copper base layer, and the copper aluminum alloy layer formed on the graphene film layer, and in A layer of heat dissipation silicon grease or solder paste is formed between the graphene film layer and the copper-aluminum alloy layer.

In the utility model, the heat dissipation bracket and the substrate are fixedly connected at the four corners of the substrate through threaded connectors, and a layer of heat dissipation silicon grease or solder paste is coated on the connecting surface of the heat dissipation bracket and the substrate.

In the utility model, the upper surface of the copper-aluminum alloy layer of the substrate is formed with several concentric annular reliefs, and the cut surfaces of the reliefs are triangular or trapezoidal.

In the present invention, the thickness of the copper base layer is 8-15 mm, and the thickness of the copper-aluminum alloy layer is 5-8 mm.

In the present utility model, the heat dissipation ribs are sheet-like or strip-like.

In the utility model, the cooling fan mounting screw holes are pre-opened on the heat dissipation bracket.

Beneficial effects: the utility model uses the heat dissipation ribs to increase the heat dissipation area of the heat sink, and improves the heat dissipation effect of the computer radiator. While the internal heat energy is exported, the size of the heat sink is controlled within a reasonable range, so as to facilitate the setting of the internal space with the computer equipment. Rapid air blowing realizes double heat dissipation function for notebooks.

Description of drawings

Fig. 1 is a schematic diagram of a preferred embodiment of the present invention.

Fig. 2 is an enlarged view of the details of the section A-A of Fig. 1 .

Among them: 1. Substrate; 2. Annular relief; 3. Heat dissipation bracket; 4. Heat dissipation rib; 5. Integrated mounting hole; 6. Outer layer of thermal conductive silicone grease layer; 101. Copper-aluminum alloy layer; 102. Inner layer Thermally conductive silicone grease layer; 103, graphene film layer; 104, copper base layer.

detailed description

In order to make the technical means, creative features, goals and effects achieved by the utility model easy to understand, the utility model will be further elaborated below in conjunction with specific illustrations.

Referring to Fig. 1, the preferred embodiment of a kind of heat sink with graphene cushion layer of Fig. 2, in this embodiment, comprise substrate 1 and heat dissipation support 3, be provided with some parallel strips on the heat dissipation support 3 Heat dissipation ribs 4, and integrated installation holes 5 are respectively provided on the four corners of the heat dissipation support 3. The lower part of the integrated installation holes 5 can be used to fix the heat dissipation support 3 on the substrate 1 through threaded connectors, while the upper part can be used as a heat dissipation fan. Cooling fans with the same size as the threaded holes are installed on the cooling bracket 3 .

The substrate 1 is a three-layer composite structure, which respectively includes a copper base layer 104, a graphene film layer 103, an inner layer of thermally conductive silicone grease layer 102, and a copper-aluminum alloy layer 101 from bottom to top, wherein the thickness of the copper base layer 104 is 12mm, and the copper The thickness of the aluminum alloy layer 101 is 5 mm, and the graphene film layer 103 is a single-atom graphene film layer, which is directly formed on the copper base layer 104. Molded together.

In this embodiment, several concentric annular reliefs 2 are formed on the upper surface of the copper-aluminum alloy layer 101. At the bottom of the heat dissipation bracket 3, the outer layer of thermal conductive silicone grease layer 6 is used as a medium for heat dissipation and auxiliary filling.

The basic principles, main features and advantages of the present utility model have been shown and described above. Those skilled in the art should understand that the utility model is not limited by the above-mentioned embodiments. The above-mentioned embodiments and descriptions only illustrate the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model The new model also has various changes and improvements, and these changes and improvements all fall within the scope of the claimed utility model. The scope of protection required by the utility model is defined by the appended claims and their equivalents.

Claims (5)

1. the heat radiator with Graphene bed course, comprise the substrate that is fixed on south, north bridge frame and be molded over on-chip cooling stand, it is characterized in that, the square section of described cooling stand is I shape, it is evenly provided with some radiating ribs, and described substrate is three-layer composite structure, be followed successively by the base copper of fitting with north and south bridge, the X alloy layer being molded over the Graphene rete on base copper and being molded on Graphene rete, and form one deck heat dissipating silicone grease or tin cream between Graphene rete and X alloy layer.

2. a kind of heat radiator with Graphene bed course according to claim 1, it is characterized in that, described cooling stand and substrate are threaded connection part at the corner location of substrate and are connected, and scribble one deck heat dissipating silicone grease or tin cream on the joint face of cooling stand and substrate.

3. a kind of heat radiator with Graphene bed course according to claim 1, is characterized in that, the X alloy layer upper surface of described substrate forms some concentric annular burrs, and this burr tangent plane is triangle or trapezoidal.

4. a kind of heat radiator with Graphene bed course according to claim 1, is characterized in that, the thickness of described base copper is 8 ~ 15mm.

5. a kind of heat radiator with Graphene bed course according to claim 1, is characterized in that, the thickness of described X alloy layer is 5 ~ 8mm.