CN104914946A - Liquid cooling and fan heat mode spiral radiating structure of computer CPU - Google Patents
Liquid cooling and fan heat mode spiral radiating structure of computer CPU Download PDFInfo
- Publication number
- CN104914946A CN104914946A CN201510254119.6A CN201510254119A CN104914946A CN 104914946 A CN104914946 A CN 104914946A CN 201510254119 A CN201510254119 A CN 201510254119A CN 104914946 A CN104914946 A CN 104914946A
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- China
- Prior art keywords
- heat conduction
- liquid cooling
- bottom plate
- sole plate
- conductive sole
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a liquid cooling and fan heat mode spiral radiating structure of a computer CPU. The spiral radiating structure comprises a lower layer heat conduction bottom plate and an upper layer heat conduction bottom plate, the periphery of the lower layer heat conduction bottom plate and the periphery of the upper layer heat conduction bottom plate are correspondingly connected through a long screw, and a flat-ring-shaped spirally-coiled liquid cooling heat conduction pipe is installed between the lower layer heat conduction bottom plate and the upper layer heat conduction bottom plate. A plurality of arc embedded grooves are evenly distributed in the inner side face of the upper layer heat conduction bottom plate and the inner side face of the lower layer heat conduction bottom plate, and an installation shallow groove matched with a CPU module is formed in the middle of the bottom face of the lower layer heat conduction bottom plate. A plurality of cooling fins are evenly distributed on the upper layer heat conduction bottom plate. The liquid cooling and fan heat mode spiral radiating structure is simple and reasonable and convenient to install and use, the design that the double layers of heat conduction bottom plates are arranged, and the flat-ring-shaped spirally-coiled liquid cooling heat conduction pipe is arranged in an interlayer is adopted so that heat emitted by the CPU module can be conducted to the liquid cooling heat conduction pipe efficiently and rapidly from bottom to top along a heat conduction component, the heat is not prone to being accumulated, the heat conduction efficiency is effectively improved, and the heat dissipating effect of the CPU module is improved.
Description
Technical field
The present invention relates to computer fittings field, be specially a kind of spiral heat dissipation structure of computer CPU liquid cooling fan hot mode.
Background technology
The CPU of computing machine is the main heat-generating units of computer equipment, needs to carry out effective heat radiation auxiliary, to ensure the runnability of computing machine.Existing cpu heat radiating effect is not good, and between its heat conduction original paper and CPU module, heat transfer is comparatively slow, and heat of high temperature easily accumulates in conducting-heat elements, not easily to fin conductive, and then affect heat conduction rate, make the heat of CPU not easily conduct to heat conduction original paper fast, radiating efficiency is not high.
Summary of the invention
The object of this invention is to provide a kind of spiral heat dissipation structure of computer CPU liquid cooling fan hot mode, not good to solve cpu heat radiating effect traditional in prior art, between its heat conduction original paper and CPU module, heat transfer is slower, heat of high temperature easily accumulates in conducting-heat elements, not easily to fin conductive, and then affect heat conduction rate, make the heat of CPU not easily conduct to heat conduction original paper fast, the problem that radiating efficiency is not high.
For achieving the above object, the technical solution used in the present invention is:
A kind of spiral heat dissipation structure of computer CPU liquid cooling fan hot mode, it is characterized in that: include lower floor's conductive sole plate and upper strata conductive sole plate, described lower floor conductive sole plate is connected by long screw correspondence with upper strata conductive sole plate periphery, the liquid cooling heat pipe coiled in flat circular spiral is installed between described lower floor conductive sole plate and upper strata conductive sole plate, on described, the medial surface of lower floor's conductive sole plate is evenly distributed with some arc caulking grooves, the installation shallow slot matched with CPU module is provided with in the middle part of described lower floor's conductive sole plate bottom surface, described upper strata conductive sole plate is evenly distributed with some radiating fins.
The spiral heat dissipation structure of described a kind of computer CPU liquid cooling fan hot mode, is characterized in that: be filled with liquid coolant in described liquid cooling heat pipe.
The spiral heat dissipation structure of described a kind of computer CPU liquid cooling fan hot mode, is characterized in that: described lower floor conductive sole plate circumferential distribution has multiple mounting ear protruding laterally.
Beneficial effect of the present invention is:
The present invention is simple and reasonable, easy to install, adopt the design that the liquid cooling heat pipe in flat circular spiral coiling is set in double-deck conductive sole plate and in interlayer, the heat that CPU module is sent efficiently can conduct to liquid cooling heat pipe fast from bottom to top along conducting-heat elements, heat not easily gathers, effectively improve heat transfer efficiency, improve the radiating effect of CPU module.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
As shown in Figure 1, a kind of spiral heat dissipation structure of computer CPU liquid cooling fan hot mode, include lower floor's conductive sole plate 1 and upper strata conductive sole plate 2, lower floor's conductive sole plate 1 is connected by long screw correspondence with upper strata conductive sole plate 2 periphery, the liquid cooling heat pipe 3 coiled in flat circular spiral is installed between lower floor's conductive sole plate 1 and upper strata conductive sole plate 2, on, lower floor's conductive sole plate 2, the medial surface of 1 is evenly distributed with some arc caulking grooves 4, the installation shallow slot 5 matched with CPU module is provided with in the middle part of lower floor's conductive sole plate 1 bottom surface, upper strata conductive sole plate 2 is evenly distributed with some radiating fins 6.
Liquid coolant is filled with in liquid cooling heat pipe 3.
Lower floor's conductive sole plate 1 circumferential distribution has multiple mounting ear 7 protruding laterally.
Claims (3)
1. the spiral heat dissipation structure of a computer CPU liquid cooling fan hot mode, it is characterized in that: include lower floor's conductive sole plate and upper strata conductive sole plate, described lower floor conductive sole plate is connected by long screw correspondence with upper strata conductive sole plate periphery, the liquid cooling heat pipe coiled in flat circular spiral is installed between described lower floor conductive sole plate and upper strata conductive sole plate, on described, the medial surface of lower floor's conductive sole plate is evenly distributed with some arc caulking grooves, the installation shallow slot matched with CPU module is provided with in the middle part of described lower floor's conductive sole plate bottom surface, described upper strata conductive sole plate is evenly distributed with some radiating fins.
2. the spiral heat dissipation structure of a kind of computer CPU liquid cooling fan hot mode according to claim 1, is characterized in that: be filled with liquid coolant in described liquid cooling heat pipe.
3. the spiral heat dissipation structure of a kind of computer CPU liquid cooling fan hot mode according to claim 1, is characterized in that: described lower floor conductive sole plate circumferential distribution has multiple mounting ear protruding laterally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510254119.6A CN104914946A (en) | 2015-05-19 | 2015-05-19 | Liquid cooling and fan heat mode spiral radiating structure of computer CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510254119.6A CN104914946A (en) | 2015-05-19 | 2015-05-19 | Liquid cooling and fan heat mode spiral radiating structure of computer CPU |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104914946A true CN104914946A (en) | 2015-09-16 |
Family
ID=54084092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510254119.6A Withdrawn CN104914946A (en) | 2015-05-19 | 2015-05-19 | Liquid cooling and fan heat mode spiral radiating structure of computer CPU |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104914946A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108387025A (en) * | 2017-12-22 | 2018-08-10 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and semiconductor refrigerating equipment with the heat-exchanger rig |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2629219Y (en) * | 2003-06-05 | 2004-07-28 | 邵俊发 | Heat exchanging radiator |
| CN2814669Y (en) * | 2005-08-31 | 2006-09-06 | 英业达股份有限公司 | Radiating device |
-
2015
- 2015-05-19 CN CN201510254119.6A patent/CN104914946A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2629219Y (en) * | 2003-06-05 | 2004-07-28 | 邵俊发 | Heat exchanging radiator |
| CN2814669Y (en) * | 2005-08-31 | 2006-09-06 | 英业达股份有限公司 | Radiating device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108387025A (en) * | 2017-12-22 | 2018-08-10 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and semiconductor refrigerating equipment with the heat-exchanger rig |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20150916 |
|
| WW01 | Invention patent application withdrawn after publication |