CN2814669Y - Radiating device - Google Patents
Radiating device Download PDFInfo
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- CN2814669Y CN2814669Y CN 200520118211 CN200520118211U CN2814669Y CN 2814669 Y CN2814669 Y CN 2814669Y CN 200520118211 CN200520118211 CN 200520118211 CN 200520118211 U CN200520118211 U CN 200520118211U CN 2814669 Y CN2814669 Y CN 2814669Y
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- heat
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- generating component
- radiating
- heat abstractor
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Abstract
The utility model relates to a radiating device arranged in an electronic device provided with a heating assembly. The radiating device at least comprises a base and a radiating component, wherein the base is arranged on the heating assembly, a cavity chamber is arranged in the base, a liquid sucking core and working fluid are filled in the cavity chamber, and the radiating component is arranged at the outer surface of the base. The utility model is provided with the cavity chamber in the base of the radiating device, the inner wall of the cavity chamber is provided with the liquid sucking core, the working liquid is filled in the liquid sucking core, the working liquid circularly runs in the cavity chamber, heat of the heating assembly is rapidly and efficiently transferred to the radiating component of the radiating device, and the radiating component effectively dissipates the heat to the outside. The heat resistance of the radiating device is lowered, and the radiating capability of the radiating device is improved. Simultaneously, because the heat of the heating assembly is effectively dissipated, the service life of the heating assembly is extended, and the reliability of the heating assembly is improved.
Description
Technical field
The utility model is about a kind of heat abstractor, particularly has for example CPU (Central Processing Unit, the heat abstractor in electronic installation CPU) of heat generating component about a kind of being arranged on.
Background technology
Flourish along with electronic industry, electronic product also progresses into multi-functional, high performance R﹠D direction.For satisfying the package requirements of electronic product microminiaturization, the heat that electronic component on the electron product circuit plate produces when operation increases significantly, CPU (Central Processing Unit especially wherein, the heat that produces when CPU) working is the most surprising, too high heat not only can influence the useful life of CPU, also can influence the normal operation of electronic installation simultaneously.The heat radiation of electronic component research in the relevant electronic installation, existing so far many technology are open already and well-known.
As shown in Figure 1, existing heat abstractor 1 comprises heat sink 10 and base 12, and this heat sink 10 is made up of a plurality of regularly arranged fins, and this base 12 is to contact with heat generating component 3.The computational methods of the thermal resistance of this base 12 (1) are as follows:
θ1＝Δt1÷TDP
Δ t1=tc-t1 (t1 is the temperature of base and heat sink contact surface, and tc is the surface temperature of heat generating component).
This TDP (Thermal Design Power) is the hot rated output of this heat generating component, and from the above, this tc and this TDP are fixed values, if this Δ t1 value is big more, then the thermal resistance of this base 12 is big more, represents that promptly the radiating effect of this heat abstractor 1 is poor more.Yet because the heat dissipation path of present most of heat abstractors only is to carry out the conduction of heat by air, the heat that produces when making these heat generating component 3 operations can't be delivered to the external world effectively and rapidly, make the difference DELTA t1 between the temperature t 1 of the temperature t c of this heat generating component 3 and this base and heat sink contact surface relatively large, thereby the thermal resistance θ 1 of base 12 is bigger, and then cause the radiating effect of this heat abstractor 1 undesirable, thereby the useful life of this heat generating component 3 shorten, and reduced the reliability of this heat generating component 3.
In order to improve the heat-sinking capability of heat abstractor, the common practice of industry is that construction for heat radiating device is optimized design at present, for example, distance between number, sheet and the sheet of fin, the parameters such as thickness of base plate are optimized, yet because after the heat abstractor machine-shaping, its thermal resistance is also fixing, though can be by changing the thermal resistance that heat abstractor or adjustment are installed in the rotation speed of the fan change heat abstractor in the heat abstractor, but above-mentioned all measures are limited all the time to the raising of the heat-sinking capability of heat abstractor.
In order further to improve the heat-sinking capability of above-mentioned heat abstractor, No. 00228269.0 patent case of China provides a kind of heat abstractor of CPU, this device comprises the heat sink body of being made up of regularly arranged a plurality of fin, and the closed container that is connected with this heat sink body below, state and be marked with liquid is evacuated in this closed container.When this CPU work, temperature raises, the position that heat contacts with this CPU via this heat abstractor is transmitted in the liquid in this closed container, vaporization evaporation behind the heated liquid, bottom attached to this fin, the heat that produces when therefore this CPU is moved can outwards distribute by this fin, the temperature of this fin bottom is reduced, and the steam of this fin bottom changes into liquid phase because temperature descends, be subjected to the force of gravity effect to fall into the interior liquid of this closed container again after being condensed into drop, circulation can realize this CPU is dispelled the heat so repeatedly.
Yet above-mentioned existing heat abstractor is to utilize the action of gravity of liquid that the liquid that changes into liquid phase after the evaporation is again dropped in this closed container, yet because the first half does not have liquid in this closed container, thereby it is not fine causing radiating effect, makes its heat radiation inhomogeneous.
Therefore, how to develop a kind of heat abstractor that can solve the various shortcomings of above-mentioned prior art, reduce the thermal resistance of heat abstractor base, improve the heat-sinking capability of heat abstractor, and can prolong the useful life of heat generating component and the reliability of raising heat generating component, real problem for needing to be resolved hurrily at present.
The utility model content
For overcoming the shortcoming of above-mentioned prior art, main purpose of the present utility model is to provide a kind of heat abstractor, reduces the thermal resistance of heat abstractor, improves the heat-sinking capability of heat abstractor.
Another purpose of the present utility model is to provide a kind of heat abstractor, prolongs the useful life of heat generating component and improves the reliability of this heat generating component.
Take off purpose on reaching, the utility model provides a kind of heat abstractor, is used for being arranged at the electronic installation of a tool heat generating component, this heat abstractor comprises: base, be arranged on this heat generating component, and be formed with a chamber in this base, wherein be filled with wick and hydraulic fluid in this chamber; And heat sink, be arranged on the outer surface of this base.
Above-mentioned base is arranged on this heat generating component, and closely contacts with this heat generating component.
This wick be tight distribution at this chamber inner wall, this hydraulic fluid is to be filled in this wick, this wick is a porous material, this hydraulic fluid can be water or alcohol, and this hydraulic fluid boiling point is lower, and with this wick favorable compatibility is arranged.
This heat sink is arranged on the outer surface of this base, and this heat sink comprises a plurality of radiating fins, and this radiating fin extends from this base outer surface, is integrated structure with this base.
Compared with prior art, heat abstractor of the present utility model mainly is to be formed with a chamber in the base of this heat abstractor, and be provided with a wick at this chamber inner wall, in this wick, be filled with hydraulic fluid, by of the circular flow of this hydraulic fluid at this chamber, the heat of this heat generating component fast and effeciently is delivered to the heat sink of this heat abstractor, this heat sink effectively is emitted to the external world with heat, owing to reduced the thermal resistance of heat abstractor, improve the heat-sinking capability of heat abstractor, simultaneously, since the heat of this heat generating component, prolong the useful life of heat generating component by effectively dissipation and improve the reliability of this heat generating component.
Description of drawings
Fig. 1 is the structural representation of existing heat abstractor;
Fig. 2 is the structural representation of heat abstractor embodiment of the present utility model; And
Fig. 3 is the structural representation that heat abstractor of the present utility model combines with the heat generating component of an electronic installation.
Embodiment
Embodiment
Shown in Figure 2 is the structural representation of heat abstractor embodiment of the present utility model.As shown in the figure, this heat abstractor 2 comprises a base 20 and heat sink 21, is formed with a plenum chamber 200 in this base 20, is filled with wick a and hydraulic fluid b in this plenum chamber 200, by cooperatively interacting of this wick a and hydraulic fluid b, reduced the thermal resistance of this base 20.In the present embodiment, this wick a for example is made up of porous masses such as wire netting, foamed material, felt, fibers, and this wick a is the inwall of tight distribution at this chamber 200, this hydraulic fluid b is filled among this wick a, and this hydraulic fluid b can be that pure water, alcohol etc. have favorable compatibility and the lower liquid medium of boiling point with this wick a.
This heat sink 21 is arranged on the outer surface of this base 20.This heat sink 21 is to be made of a plurality of radiating fins.In the present embodiment, this radiating fin is from the direct extended structure of the outer surface of this base 20, is one-body molded with this base 20.And this radiating fin is the good conductor of heat, the surface of fully expanding by this radiating fin strengthens the radiation of heat area greatly, and need not by any media during the outside radiations heat energy of this radiating fin,, reach the purpose of heat radiation by the direct space release heat towards periphery in this radiating fin surface.
See also Fig. 3 again, it shows that above-mentioned heat abstractor 2 is applied in the electronic installation with heat generating component 3, the heat that is produced when effectively this heat generating component 3 moves in this electronic installation of dissipation.In the present embodiment, this electronic installation is a computer, and this heat generating component 3 for example is a CPU, and the base of this heat abstractor 2 is to connect to put on this heat generating component 3, and closely contacts with this heat generating component 3.When moving, this heat generating component 3 (being CPU) produces heat, this chamber 200 is heated near a side (being defined as evaporation ends here) of this heat generating component 3, and then make hydraulic fluid b among this wick a absorb carburation by evaporation behind certain heat, the hydraulic fluid b of this carburation by evaporation rises and arrives the side (here be defined as condensation end) of this chamber 200 near heat sink 21, the hydraulic fluid b of this carburation by evaporation emits heat in this side (being condensation end) near heat sink 21, and the hydraulic fluid b liberated heat of this carburation by evaporation is radiated surrounding space by this heat sink 21, so the heat of the hydraulic fluid b of this carburation by evaporation can be delivered to the external world by this heat sink 21, make the hydraulic fluid b of this carburation by evaporation be condensed into liquid hydraulic fluid b, and this hydraulic fluid b can be back to the side (be evaporation ends) of this chamber 200 near this heat generating component 3 again by the capillarity of this wick a, therefore, the heat that this hydraulic fluid b produces when a side draught of these chamber 200 close these heat generating components 3 is received heat generating component 3 operations of this electronic installation, and run to the side of this chamber 200 after evaporating gasification by this heat sink 21, discharge heat at this chamber 200 near a side of these heat sinks 21 and change into liquid state again, capillarity via this wick a is back to the side of this chamber 200 by this heat generating component 3, and borrow this hydraulic fluid b circulation to operate, a large amount of heats that this heat generating component 3 can be produced when moving pass to an other end from an end of this chamber 20, and by this heat sink 21 that heat transferred is extremely extraneous.
Heat abstractor of the present utility model can be by the shuttling movement of hydraulic fluid b, the heat that produces during with these heat generating component 3 operations is delivered to this heat sink 21 fast and continuously, by this heat sink 21 heat that this heat generating component 3 produces is delivered to the external world effectively and rapidly, the difference DELTA t2 (Δ t2=tc-t2) between the surface temperature tc of the base 20 that just can make this heat sink device 2 and the temperature t 2 of these heat sink 21 contact surfaces and this heat generating component 3 is relative less.The computational methods of the thermal resistance (Q2) of the base 20 of this heat abstractor 2 are as follows:
Q2＝Δt2÷TDP
Because this Δ t2 (Δ t2=tc-t2) is less relatively, reduce the thermal resistance Q2 of this heat abstractor 2, the heat-sinking capability of this heat abstractor 2 is significantly strengthened.
Compared with prior art, heat abstractor of the present utility model, mainly be in the base of this heat abstractor, to be formed with a chamber, and be filled with a wick at this chamber inner wall, and in this wick, be filled with hydraulic fluid, by of the circulation running of this hydraulic fluid at this chamber, the heat of heat generating component fast and effeciently is delivered to the heat sink of this heat abstractor, by this heat sink heat is effectively dissipated to the external world, simultaneously, because the heat of heat generating component is by effectively dissipation, thereby can improve the useful life and the reliability of this heat generating component.Avoid in the prior art radiating effect not good, heat generating component shortens and shortcoming such as reliability reduction useful life.
Claims (7)
1. a heat abstractor is applied in the electronic installation with heat generating component, it is characterized in that, this heat abstractor comprises at least:
Base is arranged on this heat generating component, and is formed with a chamber in this base, wherein is filled with wick and hydraulic fluid in this chamber; And
Heat sink is arranged on the outer surface of this base.
2. heat abstractor as claimed in claim 1 is characterized in that, this wick is the inwall that is distributed in this chamber.
3. heat abstractor as claimed in claim 1 is characterized in that, this hydraulic fluid is to be filled in this wick.
4. heat abstractor as claimed in claim 1 is characterized in that, this hydraulic fluid is water or alcohol.
5. heat abstractor as claimed in claim 1 is characterized in that this base is arranged on the heat generating component of this electronic installation, and contacts with this heat generating component.
6. heat abstractor as claimed in claim 1 is characterized in that this heat sink has a plurality of radiating fins.
7. heat abstractor as claimed in claim 6 is characterized in that, this radiating fin is that the outer surface from this base extends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520118211 CN2814669Y (en) | 2005-08-31 | 2005-08-31 | Radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520118211 CN2814669Y (en) | 2005-08-31 | 2005-08-31 | Radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2814669Y true CN2814669Y (en) | 2006-09-06 |
Family
ID=36949755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520118211 Expired - Fee Related CN2814669Y (en) | 2005-08-31 | 2005-08-31 | Radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2814669Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104914946A (en) * | 2015-05-19 | 2015-09-16 | 铜陵宏正网络科技有限公司 | Liquid cooling and fan heat mode spiral radiating structure of computer CPU |
| CN106104409A (en) * | 2014-03-20 | 2016-11-09 | 惠普发展公司，有限责任合伙企业 | The weight of reallocation computing device |
| CN107403976A (en) * | 2017-09-13 | 2017-11-28 | 华霆（合肥）动力技术有限公司 | Power-supply device and system |
| CN114153092A (en) * | 2021-12-09 | 2022-03-08 | 武汉华星光电技术有限公司 | Backlight module and display device |
-
2005
- 2005-08-31 CN CN 200520118211 patent/CN2814669Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106104409A (en) * | 2014-03-20 | 2016-11-09 | 惠普发展公司，有限责任合伙企业 | The weight of reallocation computing device |
| CN104914946A (en) * | 2015-05-19 | 2015-09-16 | 铜陵宏正网络科技有限公司 | Liquid cooling and fan heat mode spiral radiating structure of computer CPU |
| CN107403976A (en) * | 2017-09-13 | 2017-11-28 | 华霆（合肥）动力技术有限公司 | Power-supply device and system |
| CN114153092A (en) * | 2021-12-09 | 2022-03-08 | 武汉华星光电技术有限公司 | Backlight module and display device |
| CN114153092B (en) * | 2021-12-09 | 2024-02-09 | 武汉华星光电技术有限公司 | Backlight module and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060906 Termination date: 20110831 |