CN1917193A - Heat sink - Google Patents
Heat sink Download PDFInfo
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- CN1917193A CN1917193A CN 200510036764 CN200510036764A CN1917193A CN 1917193 A CN1917193 A CN 1917193A CN 200510036764 CN200510036764 CN 200510036764 CN 200510036764 A CN200510036764 A CN 200510036764A CN 1917193 A CN1917193 A CN 1917193A
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- Prior art keywords
- heat abstractor
- container
- heat
- hollow reservoir
- phase
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Abstract
The heat sink includes a hollow closed container, and working fluid contained in the said container. Hollow containing cavity is formed inside wall of container. Phase-change material is filled in the hollow containing cavity. Through phase change of the phase-change material, the heat sink prevents wall of container and heat source from occurring hotspot or high temperature zone so as to be able to carry out heat conduction in high efficiency continuously.
Description
[technical field]
The invention relates to the heat conduction field, particularly a kind of heat abstractor that adopts the phase change heat radiation.
[background technology]
In recent years, electronic technology develops rapidly, and the high frequency of electronic device, high speed and integrated circuit intensive and microminiaturized makes unit volume electronic device caloric value increase severely.For the golf calorific value that electronic device is produced distributes, general radiating mode mainly contains three kinds, promptly air-cooled heat abstractor, liquid-cooling heat radiator and heat pipe-type heat abstractor at present.
Air-cooled heat abstractor is to use the heat dissipating method the most extensive, that technology is the most ripe at present, as fin heat abstractor, it is transmitted to radiating fin by metallic substrates with the heat that thermal source produces, utilize the big area of dissipation of radiating fin then, and cooperate a fan to rotate, strengthen air flows, the heat on the radiating fin is passed to surrounding environment by the forced convertion mode.But this kind heat abstractor have big thermal resistance between cooling base and radiating fin and between radiating fin and air, and rates of heat transfer is slower therebetween in heat biography process, and radiating efficiency is lower, only is applied to the little electronic device of caloric value usually.
With respect to air-cooled heat abstractor, liquid-cooling heat radiator can significantly reduce the heat of electronic device, has noiselessness, environment-friendly type, radiating efficiency advantages of higher simultaneously, thereby becomes another the main mode that is applied to dissipation from electronic devices.The cooler that liquid-cooling heat radiator generally includes an evaporator that contacts with thermal source and is connected with this evaporator.Yet, the flexibility of other accessory of this kind structural limitations, and increase the cooling system structure complexity, and also there is potential safety hazard in liquid to electronic device, makes that this liquid-cooling heat radiator fail safe is relatively poor.
Heat pipe is a kind of heat abstractor that utilizes the phase change heat radiation, it generally includes shell, near the capillary wick (capillary structure) of inner wall of tube shell and be sealed in working fluid in the shell, the one end is evaporation ends (heating end), the other end is condensation end (colling end), can arrange insulating segment between evaporation ends and condensation end according to application need.During work, heat pipe absorbs latent heat at evaporation ends by internal work fluid phase change, and promptly heat delivery is arrived the condensation end in stow away from heat district by steam flow, thereby causes the rear and front end to have a narrow range of temperature, and reaches the purpose of a large amount of heat energy of quick transmission again.This heat pipe-type heat abstractor is one of efficiently radiates heat mode the most at present, and is widely used in the samming and the heat radiation aspect of electronic products such as notebook computer, mobile electronic device.
Yet, no matter adopt above-mentioned which kind of radiating mode, in these heat abstractors, all there is hot issue, not only can influence its useful life, and make thermal source such as electronic device also have corresponding high-temperature region or focus, thereby be difficult to realize the homogeneous heat radiation corresponding to the position of this focus.
Prior art provides a kind of heat of plate heat pipe to pass reinforcement, it comprises an airtight vacuum container, the outside heater element that connects of container evaporation ends, the condensation end outside then connects heat abstractor, inner surface of container is provided with capillary structure, and be filled with an amount of working fluid, with evaporation, the condensation cycle of carrying out two-phase flow.In addition, be provided with a plurality of heating columns that are connected to upper and lower wall in this container, this heating column that is connected to upper and lower internal face distributes and is arranged at high-temperature region or focus place, and can have different size or shape, uses uniform temperature and the thermal diffusivity of realizing heat pipe.But, the big thermal resistance of the heating column two same existence of terminal contact position with container, and can increase other high-temperature region or focus in the hot biography process, thereby this heating column can not be eliminated hot issue fully.
In view of this, it is real in necessary to provide a kind of and do not have focus, can continue the heat abstractor of high efficiency and heat radiation.
[summary of the invention]
Below, will a kind of heat abstractor be described with embodiment.
For realizing foregoing, a kind of heat abstractor is provided, it comprises a hollow closed container, and is contained in the working fluid in the described container, is formed with at least one hollow reservoir in the chamber wall of described container, is filled with phase-change material in the described hollow reservoir.
Described phase-change material is selected from paraffin, polyolefin, low molecular weight polyester, low-molecular-weight epoxy resin or low molecular weight propylene acid.
Described at least one hollow reservoir comprises two and above hollow reservoir, and described two and above hollow reservoir are interconnected.
Described container has evaporation ends and condensation end, and described hollow reservoir is located at respectively in the chamber wall at evaporation ends and condensation end position.
The inner surface of described container is formed with capillary structure.
Described internal tank pressure is lower than the pressure of container peripheral environment.
Described internal tank pressure range is 1.3 * 10
-1～1.3 * 10
-4Pa (handkerchief).
Described working fluid is selected from one or more liquid in water, methyl alcohol, ammoniacal liquor, acetone, the heptane.
The material of described chamber wall is selected from aluminium, copper, silver, iron, nickel, titanium or its alloy.
Described heat abstractor adopts flat structure or cylinder structure.
With respect to prior art, the heat abstractor that present embodiment provides is formed with hollow reservoir in chamber wall, fill phase-change material then, utilize the phase change of phase-change material, can absorb the hotspot location of chamber wall and thermal source or high-temperature region too much and the heat that is difficult to distribute, thereby avoid chamber wall and thermal source focus or high-temperature region to occur, make heat abstractor can continue to carry out efficiently heat conduction.
[description of drawings]
Fig. 1 is the heat abstractor transverse cross-sectional view of first embodiment of the technical program.
Fig. 2 is the heat abstractor longitudinal sectional drawing of first embodiment of the technical program.
Fig. 3 is the heat abstractor axial section of second embodiment of the technical program.
[embodiment]
Below in conjunction with accompanying drawing the technical program is described in further detail.
Please consult Fig. 1 and Fig. 2 together, be heat abstractor 1 structural representation that first embodiment of the technical program provides, this heat abstractor 1 is a flat structure, and it comprises a hollow closed container 10, and is contained in the working fluid 20 in the described container 10.Wherein, this container 10 has chamber wall 11, and the cavity 12 that is surrounded by chamber wall 11, and these chamber wall 11 inside also are formed with at least one hollow reservoir 110, is filled with phase-change material 16 in this hollow reservoir 110.
These container 10 internal pressures are lower than the pressure of container 10 peripheral environments, remain on 1.3 * 10 in the generic container 10
-1～1.3 * 10
-4The low pressure of Pa.Usually, working fluid 20 easier volatilizations under the low pressure, and the flow of steam of working fluid 40 is faster, Gao Shike is up to velocity of sound, thereby can promote the heat conduction velocity of heat abstractor 1, uses and improves its radiating efficiency.
This chamber wall 11 comprises sidewall 13 and diapire 14 and the roof 15 adjacent with sidewall 13.Preferably, each hollow reservoir 110 of chamber wall 11 can be interconnected, being about to the hollow reservoir 110 of sidewall 13 and the hollow reservoir 110 of diapire 14 and roof 15 is interconnected, make the phase-change material 16 that wherein holds interconnect, when even chamber wall 11 parts of container 10 are accepted heat and are surpassed 16 of phase-change materials and can absorb heat, also can be by the interior phase-change material 16 of adjacent hollow reservoir 110 with too much heat absorption.
The inner surface of this container 10 is formed with capillary structure 30, and that this capillary structure 30 can adopt is groove-shaped, silk screen type or slug type capillary structure.By inner surface capillary structure 30 is set, can increases working fluid 20 backflow efficient, thereby improve the hot transfer efficiency of heat abstractor 1 at container 10.
The material of this chamber wall 11 generally adopts thermally conductive materials, for example metals such as aluminium, copper, silver, iron, nickel, titanium or its alloy.
This phase-change material 16 is selected from materials such as paraffin, polyolefin, low molecular weight polyester, low-molecular-weight epoxy resin or low molecular weight propylene acid, and present embodiment adopts paraffin.
This working fluid 20 can be selected from liquid such as water, ammoniacal liquor, methyl alcohol, acetone, heptane, also can in these liquid, add the Heat Conduction Material particulate, as copper powder, silver powder, nano-carbon material etc., to form a suspension, promptly increase the heat conductivility of working fluid 20 by this Heat Conduction Material, present embodiment adopts water to mix the suspension of formation with nano-carbon material as working fluid 20.The injection rate of working fluid 20 is according to the caloric value of thermal source 2 and container 10 volumes and set.
Usually, this container 10 can be divided into evaporation ends and condensation end according to the thermal change mode, can be as present embodiment with the evaporation ends of diapire 14 as container 10, and it contacts with thermal source 2, and roof 15 is as the condensation end of container 10, when allowing this condensation end position also can adopt other condensing units.Because the heat transfer process of heat abstractor 1 mainly takes place in this evaporation ends and condensation end, thereby present embodiment is not limited to said structure, other the various structures that can eliminate focus all can adopt.For example, for simple in structure, save cost, can only arrange a hollow reservoir 110 at these two ends respectively, and fill phase-change material 16 within it, this structure can be reached the elimination focus equally preferably, and increases the purpose of the hot transfer efficiency of heat abstractor 1.
See also Fig. 3, the heat abstractor 1 ' axial section that provides for second embodiment of the technical program.Identical with the structure of heat abstractor 1, heat abstractor 1 ' comprise a hollow closed container 10 ', be the airtight pipe of a hollow; Chamber wall 11 ', be tube wall; Be formed on the capillary structure 30 of container 10 ' inner surface '; By the cavity 12 of described chamber wall 11 ' surrounded ', i.e. hollow tube chamber; And be sealed in the working fluid 20 of container 10 ' interior '.The present embodiment and the first embodiment difference are heat abstractor 1 ' for cylinder structure, and only in heat pipe 1 ' evaporation ends A and the chamber wall 11 of condensation end B ' interior be formed with respectively hollow reservoir 110 ', this hollow reservoir 110 ' interior be filled with equally phase-change material 16 '.
The heat abstractor that the foregoing description provides all is formed with hollow reservoir in chamber wall, fill phase-change material then, utilize the phase change of phase-change material, can absorb the hotspot location of chamber wall and thermal source or high-temperature region too much and the heat that is difficult to distribute, thereby can avoid chamber wall and thermal source focus or high-temperature region to occur, make heat abstractor can continue to carry out efficiently heat conduction.
In addition, the technical program is not limited to the structure of the foregoing description, the parts that focus can occur for the cooling or the heat abstractor of other form, all can adopt the mode of avoiding focus to produce of the technical program, only need to arrange hollow reservoir, in this hollow reservoir, fill phase-change material then and get final product in hotspot location occurring.
The above only is the better embodiment of the technical program, and all personages who is familiar with this case skill modify or variation according to the equivalence that this case invention spirit is done, and all should be included in the claim protection range of the present invention.
Claims (10)
1. heat abstractor, it comprises a hollow closed container and is contained in working fluid in the described container, it is characterized in that being formed with at least one hollow reservoir in the chamber wall of described container, is filled with phase-change material in the described hollow reservoir.
2. heat abstractor as claimed in claim 1 is characterized in that described phase-change material is selected from paraffin, polyolefin, low molecular weight polyester, low-molecular-weight epoxy resin or low molecular weight propylene acid.
3. heat abstractor as claimed in claim 1 is characterized in that described at least one hollow reservoir comprises two and above hollow reservoir, and described two and above hollow reservoir are interconnected.
4. heat abstractor as claimed in claim 3 is characterized in that described container has evaporation ends and condensation end, and described hollow reservoir is located at respectively in the chamber wall at evaporation ends and condensation end position.
5. heat abstractor as claimed in claim 1 is characterized in that the inner surface of described container is formed with capillary structure.
6. heat abstractor as claimed in claim 1 is characterized in that described internal tank pressure is lower than the pressure of container peripheral environment.
7. heat abstractor as claimed in claim 6 is characterized in that described internal tank pressure range is 1.3 * 10
-1～1.3 * 10
-4Handkerchief.
8. heat abstractor as claimed in claim 1 is characterized in that described working fluid is selected from one or more liquid in water, methyl alcohol, ammoniacal liquor, acetone, the heptane.
9. heat abstractor as claimed in claim 1 is characterized in that described chamber wall material is selected from aluminium, copper, silver, iron, nickel, titanium or its alloy.
10. as each described heat abstractor of claim 1 to 9, it is characterized in that described heat abstractor adopts flat structure or cylinder structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510036764 CN1917193A (en) | 2005-08-19 | 2005-08-19 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510036764 CN1917193A (en) | 2005-08-19 | 2005-08-19 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1917193A true CN1917193A (en) | 2007-02-21 |
Family
ID=37738137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510036764 Pending CN1917193A (en) | 2005-08-19 | 2005-08-19 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1917193A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290476A (en) * | 2011-06-27 | 2011-12-21 | 南京大学 | Photovoltaic photo-thermal energy storage device |
| CN103547113A (en) * | 2012-07-10 | 2014-01-29 | 宏碁股份有限公司 | Heat radiation unit |
| CN104780736A (en) * | 2014-01-13 | 2015-07-15 | 潘晨曦 | Motor controller |
| CN107562153A (en) * | 2017-09-01 | 2018-01-09 | 合肥联宝信息技术有限公司 | Heat conduction tube assembly and radiating module |
| CN108990370A (en) * | 2017-06-05 | 2018-12-11 | 阿拉伯联合酋长国大学 | Radiator |
| CN109792013A (en) * | 2016-10-07 | 2019-05-21 | 美国肯联铝业汽车制造有限公司 | Battery case for automobile batteries temperature management |
| CN111651956A (en) * | 2020-05-25 | 2020-09-11 | 湖北三江航天万峰科技发展有限公司 | Board card assembly based on medium phase change heat transfer and electronic equipment comprising board card assembly |
| CN114967858A (en) * | 2021-12-27 | 2022-08-30 | 淮阴师范学院 | Device of making an uproar falls in main frame |
-
2005
- 2005-08-19 CN CN 200510036764 patent/CN1917193A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290476A (en) * | 2011-06-27 | 2011-12-21 | 南京大学 | Photovoltaic photo-thermal energy storage device |
| CN103547113A (en) * | 2012-07-10 | 2014-01-29 | 宏碁股份有限公司 | Heat radiation unit |
| CN103547113B (en) * | 2012-07-10 | 2017-01-18 | 宏碁股份有限公司 | Heat radiation unit |
| CN104780736A (en) * | 2014-01-13 | 2015-07-15 | 潘晨曦 | Motor controller |
| CN104780736B (en) * | 2014-01-13 | 2018-05-25 | 潘晨曦 | Electric machine controller |
| CN109792013A (en) * | 2016-10-07 | 2019-05-21 | 美国肯联铝业汽车制造有限公司 | Battery case for automobile batteries temperature management |
| CN108990370A (en) * | 2017-06-05 | 2018-12-11 | 阿拉伯联合酋长国大学 | Radiator |
| CN108990370B (en) * | 2017-06-05 | 2020-08-11 | 阿拉伯联合酋长国大学 | Heat radiator |
| CN107562153A (en) * | 2017-09-01 | 2018-01-09 | 合肥联宝信息技术有限公司 | Heat conduction tube assembly and radiating module |
| CN107562153B (en) * | 2017-09-01 | 2021-05-18 | 合肥联宝信息技术有限公司 | Heat conduction pipe assembly and heat dissipation module |
| CN111651956A (en) * | 2020-05-25 | 2020-09-11 | 湖北三江航天万峰科技发展有限公司 | Board card assembly based on medium phase change heat transfer and electronic equipment comprising board card assembly |
| CN114967858A (en) * | 2021-12-27 | 2022-08-30 | 淮阴师范学院 | Device of making an uproar falls in main frame |
| CN114967858B (en) * | 2021-12-27 | 2023-09-22 | 淮阴师范学院 | Noise reduction device for computer host |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |