CN108387025A - Heat-exchanger rig and semiconductor refrigerating equipment with the heat-exchanger rig - Google Patents
Heat-exchanger rig and semiconductor refrigerating equipment with the heat-exchanger rig Download PDFInfo
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- CN108387025A CN108387025A CN201711405585.5A CN201711405585A CN108387025A CN 108387025 A CN108387025 A CN 108387025A CN 201711405585 A CN201711405585 A CN 201711405585A CN 108387025 A CN108387025 A CN 108387025A
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- heat
- exchanger rig
- air
- auxiliary
- refrigerating equipment
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a kind of heat-exchanger rig and with the semiconductor refrigerating equipment of the heat-exchanger rig, the heat-conducting substrate and/or heat conducting pipe group of heat-exchanger rig directly connect with semiconductor chilling plate and transfer heat to heat-conducting substrate, heat-conducting substrate is in direct contact with fin, the contact area of heat-conducting substrate and fin is far longer than the contact area of fin and heat conducting pipe in the prior art, heat conduction is more uniform, it is more conducive to the export of heat, improves radiating efficiency.The present invention can effectively reduce the thickness and volume of heat-exchanger rig, improve the radiating efficiency of the heat-exchanger rig of same volume.The present invention is since heat-exchanger rig radiating efficiency is high, the semiconductor refrigerating equipment especially suitable for the work of nearly wall.
Description
Technical field
The invention belongs to technical field of refrigeration equipment, especially a kind of heat-exchanger rig and the semiconductor with the heat-exchanger rig
Refrigeration equipment.
Background technology
Semiconductor refrigerating equipment becomes flow control using semiconductor chilling plate by heat pipe heat radiation and conduction technique and automatic pressure-transforming
Technology processed realizes refrigeration, is not necessarily to refrigeration working medium and mechanical moving element, solves the tradition machineries such as medium pollution and mechanical oscillation
The application problem of refrigerator.However, the cold end of semiconductor chilling plate while refrigeration, can generate a large amount of heat in its hot junction
Amount needs in time to radiate to hot junction to ensure that semiconductor chilling plate is reliably continued for work.In the prior art to heat
The heat-exchanger rig to radiate is held to generally comprise substrate, heat exchanger tube and fin, substrate is contacted with semiconductor chilling plate, and exchange heat pipe portion
Divide by substrate clamping, partly extends substrate, fin is arranged on the heat exchanger tube for extending substrate, contact of the fin with heat exchanger tube
Area only has pipe diameter size, and fin contacts that be bonded not close and contact area small with heat exchanger tube, is unfavorable for heat and sheds, there are heat
Amount conducts uneven and low radiating efficiency problem.
Semiconductor refrigerating equipment in actual use, when arranging house ornamentation mount board there are mounted against a wall, periphery, radiates
The limited problem in space.When high circumstance temperature, semiconductor chilling plate calorific value is big, needs to give out the heat of semiconductor chilling plate
It goes, to improve refrigeration effect.In order to strengthen heat dissipation, need to carry out forced convertion heat dissipation using fan.It generally adopts in the prior art
It is superimposed top axial-flow fan with aluminum fin-stock radiator to radiate, since the air inlet and the outlet of fan are more difficult, causes to radiate
Effect is bad, refrigeration effect is deteriorated, and further results in the fan noise after fan wind speed increases and become larger, and occupies semiconductor
The deep space of refrigeration equipment.And the air inlet and the outlet distance of fan is closer, be easy to cause air inlet/outlet short circuit, further decreases
Refrigeration effect.There are the following problems for existing heat-exchanger rig：Duct resistance is big, and radiator uniform temperature is poor, and heat dissipation thermal resistance is high, and hot wind returns
Stream is big.
Invention content
The purpose of the present invention is to provide a kind of heat-exchanger rigs for semiconductor refrigerating equipment, solve existing heat exchange dress
Setting volume greatly leads to the technical problem that installation space is big and radiating efficiency is poor.
In order to solve the above technical problems, the present invention is achieved by the following scheme：
A kind of heat-exchanger rig for semiconductor refrigerating equipment, including main heat exchange device and air-supply arrangement, the main heat exchange device
Including heat conducting pipe group, heat-conducting substrate and fins set；The heat conducting pipe group is inlaid on the heat-conducting substrate；The fins set is located at
The surface of the heat-conducting substrate, the fins set have the fin of multiple parallel intervals setting；The heat-conducting substrate and/or described
Heat conducting pipe group connects with semiconductor chilling plate, the heat generated for absorbing the semiconductor chilling plate；The air-supply arrangement is used
The air-flow of the fins set is flowed through in generation.
The heat-exchanger rig as described above for being used for semiconductor refrigerating equipment, the heat conducting pipe are distributed parallelly on the heat conduction base
On plate.
It is used for the heat-exchanger rig of semiconductor refrigerating equipment as described above, is provided on the first surface of the heat-conducting substrate
Embedded grooves arranged, the heat conducting pipe are inlaid in the embedded grooves arranged.
The heat-exchanger rig as described above for being used for semiconductor refrigerating equipment, the heat-exchanger rig includes ducting assembly, described
Ducting assembly includes air duct side plate and two air duct cover boards, the main heat exchange device and air-supply arrangement be located at the air duct side plate and
In the space that two air duct cover boards surround；The both ends of the air duct cover board offer air inlet and air outlet, alternatively, the air duct
It is offered on side plate and offers air inlet on air inlet and air outlet or the air duct cover board, opened up on the air duct side plate
There is air outlet.
The heat-exchanger rig as described above for being used for semiconductor refrigerating equipment, the heat-exchanger rig includes auxiliary heat exchanging device,
The auxiliary heat exchanging device includes auxiliary heat conduction pipe group, auxiliary heat conduction substrate and auxiliary fins group, and the auxiliary heat conduction pipe group is embedding
On the auxiliary heat conduction substrate, the auxiliary fins group is located on the auxiliary heat conduction substrate, the auxiliary heat conduction pipe group
Connect with the heat-conducting substrate.
The heat-exchanger rig as described above for being used for semiconductor refrigerating equipment, the auxiliary heat conduction pipe group are the heat conducting pipe group
Extension.
The heat-exchanger rig as described above for being used for semiconductor refrigerating equipment, the air-supply arrangement are located at auxiliary heat-exchanging dress
It sets between the main heat exchange device.
The heat-exchanger rig as described above for being used for semiconductor refrigerating equipment, the air inlet of the ducting assembly and the auxiliary
Fins set is opposite, and the air outlet of the ducting assembly is opposite with the fins set.
The fin density of the heat-exchanger rig as described above for being used for semiconductor refrigerating equipment, the auxiliary fins group is less than institute
State the fin density of fins set.
A kind of semiconductor refrigerating equipment, including shell, liner, semiconductor chilling plate and the insulating layer being set on liner,
The semiconductor refrigerating equipment includes above-mentioned heat-exchanger rig, and the shell defines installation space with the insulating layer, described
Heat-exchanger rig is located at the installation space, and air inlet and air outlet, the air inlet and the heat exchange are offered on the shell
The air inlet of device is connected, and the air outlet is connected with the air outlet of the heat-exchanger rig, the heat-conducting substrate and/or institute
Heat conducting pipe group is stated to connect with the hot junction of the semiconductor chilling plate.
Compared with prior art, the advantages and positive effects of the present invention are：The present invention is changed for semiconductor refrigerating equipment
The heat-conducting substrate and/or heat conducting pipe group of thermal directly connect with semiconductor chilling plate and transfer heat to heat-conducting substrate, lead
Hot substrate is in direct contact with fin, and the contact area of heat-conducting substrate and fin is far longer than fin in the prior art and heat conducting pipe
Contact area, heat conduction is more uniform, is more conducive to the export of heat, improves radiating efficiency.The present invention can effectively drop
The thickness and volume of low heat-exchanger rig, improve the radiating efficiency of the heat-exchanger rig of same volume.The present invention is dissipated due to heat-exchanger rig
The thermal efficiency is high, the semiconductor refrigerating equipment especially suitable for the work of nearly wall.
After the detailed description of embodiment of the present invention is read in conjunction with the figure, the other features and advantages of the invention will become more
Add clear.
Description of the drawings
Fig. 1 is the schematic diagram of the main heat exchange device of one embodiment of the invention.
Fig. 2 is the schematic rear view of Fig. 1.
Fig. 3 is the heat-exchanger rig and air-supply arrangement, the schematic diagram of ducting assembly of one embodiment of the invention.
Fig. 4 is the schematic rear view of the semiconductor refrigerating equipment of one embodiment of the invention.
Fig. 5 is the schematic diagram of the main heat exchange device of one embodiment of the invention, auxiliary heat exchanging device and air-supply arrangement.
Fig. 6 is the schematic diagram of one embodiment of the invention radiating fin.
Fig. 7 is that main heat exchange device, auxiliary heat exchanging device and the air-supply arrangement of one embodiment of the invention, ducting assembly show
It is intended to.
Fig. 8 is the schematic rear view of the semiconductor refrigerating equipment of one embodiment of the invention.
In figure, 1, heat conducting pipe；2, heat-conducting substrate；3, fins set；123, main heat exchange device；4, auxiliary heat exchanging device；41, auxiliary
Assistant director of a film or play's heat pipe；42, auxiliary heat conduction substrate；43, auxiliary fins group；5, coupling tube；61, air duct side plate；62, air duct cover board；
623, air inlet；624, air outlet；7, air-supply arrangement；101, shell；103, semiconductor chilling plate.
Specific implementation mode
The specific implementation mode of the present invention is described in detail below in conjunction with the accompanying drawings.
The present embodiment proposes a kind of heat-exchanger rig for semiconductor refrigerating equipment, using thermoelectric cooling mode system
It is cold, wherein the semiconductor chilling plate for providing cold is crucial, and semiconductor chilling plate is divided into cold and hot end, and cold end is responsible for partly leading
System cool equipment internal cooling, hot junction distribute the heat that cold end generates, and the hot-side temperature the low more is conducive to cold-side cooling,
Therefore to reach best cooling effect, hot junction needs in time to distribute heat, it is thereby achieved that the heat exchange to hot-side heat dissipation
Device determines the refrigeration effect of semiconductor refrigerating equipment.
Embodiment one
The present embodiment exchange thermal has carried out structure design, and as shown in Figs. 1-3, the heat-exchanger rig of the present embodiment includes：Master changes
Thermal 123, air-supply arrangement 7 and ducting assembly.The various pieces of exchange thermal are described in detail below：
As shown in Figure 1, 2, main heat exchange device 123 includes heat conducting pipe group, heat-conducting substrate 2 and fins set 3, and heat conducting pipe group, which is inlaid in, to be led
On hot substrate 2, heat conducting pipe group includes more heat conducting pipes 1, it is preferred that more 1 parallel intervals of heat conducting pipe are distributed in heat-conducting substrate 2
On.In order to improve heat exchange efficiency, heat-conducting substrate 2 is smaller than between the heat conducting pipe 1 contacted with 103 hot junction of semiconductor chilling plate
Spacing between the heat conducting pipe 1 at other upper positions.
Multiple heat conducting pipes 1 are in same plane, and the part heat conducting pipe contacted with 103 hot junction of semiconductor chilling plate absorbs half
The setting of the heat in 103 hot junction of conductor cooling piece, heat conducting pipe 1 can be by the heat Quick uniform in 103 hot junction of semiconductor chilling plate
Ground is transferred to heat-conducting substrate 2.The part heat conducting pipe contacted with heat-conducting substrate 2 absorbs the heat of heat-conducting substrate 2, for quickly equal
It is distributed the heat of heat-conducting substrate 2 evenly, fins set 3 is quickly and evenly transferred to conducive to heat.
Heat-conducting substrate 2, heat-conducting substrate 2 are used to absorb the heat in 103 hot junction of heat conducting pipe 1 and semiconductor chilling plate.Such as Fig. 2 institutes
Show, heat conducting pipe 1 is inlaid in heat-conducting substrate 2.The heat-conducting substrate 2 of the present embodiment is tabular, and the front of heat-conducting substrate 2 is provided with
Embedded grooves arranged, heat conducting pipe 1 are inlaid in embedded grooves arranged, and fins set 3 is provided on the back side of heat-conducting substrate 2.In heat-conducting substrate 2
Front setting embedded grooves arranged can facilitate the installation of heat conducting pipe 1.
Fins set 3, fins set 3 are located on heat-conducting substrate 2, the heat for absorbing heat-conducting substrate 2.Specifically, such as Fig. 3 institutes
Show, fins set 3 is located on the back side of heat-conducting substrate 2, and it is to insert wing that fins set 3, which has the fin of multiple parallel intervals setting, fin,
Or aluminium extruded fin configuration, to increase the heat dissipation area of heat-conducting substrate 2.Multiple fins are evenly distributed on heat-conducting substrate 2, fin
Increase with the contact area of heat-conducting substrate 2, heat conduction is more uniform, is more conducive to the export of heat, improves radiating efficiency.
As shown in fig. 6, fin surface there are multiple small protrusions, the heat exchange area of fin and the flow-disturbing of air are increased, is enhanced
The exchange capability of heat of heat-exchanger rig.
The main heat exchange device of the present embodiment is an entirety, and fin is closeer, and it is straight tube that heat-conducting substrate 2, which embeds heat conducting pipe 1,
Arrange that more heat conducting pipes 1, the heat in 103 hot junction of semiconductor chilling plate are transmitted on heat conducting pipe 1 in heat-conducting substrate 2, then by leading
Heat pipe 1 is rapidly transferred on heat-conducting substrate 2, and 1 layout area heat of heat conducting pipe can be more uniformly transferred on heat-conducting substrate 2,
Even heat is distributed on heat-conducting substrate 2, is transmitted on fin, is increased with the face way of contact by heat-conducting substrate 2 and fin
It is transmitted to the area of fin heat, more existing heat conducting pipe only has the mode side of conduction of the contact area of pipe diameter size across fin
Formula is more efficient more uniformly, and fin heat dissipation is more uniform, is more advantageous to heat and is pulled away.
In the present embodiment, heat-conducting substrate 2 and heat conducting pipe group are contacted with semiconductor chilling plate 103, certainly, also can heat conduction base
Plate 2 or heat conducting pipe group are contacted with semiconductor chilling plate 103.
The heat-conducting substrate 2 of the present embodiment is at least contacted with a semiconductor chilling plate 103, can according to actual demand with it is multiple
Semiconductor chilling plate 103 contacts, and realizes the cooling of semiconductor chilling plate 103.
Air-supply arrangement 7, for generating the air-flow for flowing through fins set 3, air current flow direction is parallel with fin setting direction, gas
Stream flow direction is parallel with finned length direction, and air-flow can flow through the gap between fin, take away the heat on fin.This reality
The air-supply arrangement 7 for applying example is aerofoil fan, and the shaft direction of aerofoil fan is vertical with 2 place plane of heat-conducting substrate.
As shown in figure 3, ducting assembly includes air duct side plate 61 and two air duct cover boards 62.Main heat exchange device and air-supply arrangement
In the space that air duct side plate 61 and two air duct cover boards 62 surround, the both ends of air duct cover board 62 offer 623 He of air inlet
Air outlet 624, air inlet 623 are located at air outlet 624 on same air duct cover board 62, and air inlet 623 is opposite with air-supply arrangement 7,
The air outlet of ducting assembly is opposite with fins set 3.
Certainly, air inlet 623 is located at position opposite with air-supply arrangement 7 on air duct cover board 62, and air outlet 624 may be alternatively located at
The position opposite with fins set 3 on air duct side plate 61.
The design of the present embodiment air-supply arrangement 7 and ducting assembly with low noise and can strengthen heat dissipation, pass through enhancing air stream
Dynamic increase heat exchange efficiency, meanwhile, substantially reduce the volume of heat-exchanger rig.
The Position Design of the present embodiment heat-exchanger rig air inlet 623 and air outlet 624, can make air inlet 623 and outlet air
There is certain distance between mouthfuls 624, can prevent the outlet air of air outlet 624 from being sucked by air inlet 623, solve refrigeration equipment away from
From wall when close radiating efficiency decline serious problem.
The present embodiment can share air-supply arrangement with multiple semiconductor chilling plates, substantially reduce the volume of heat-exchanger rig.
Based on the design of above-mentioned heat-exchanger rig, as shown in figure 4, the present embodiment also proposed a kind of semiconductor refrigerating equipment,
Including shell 101, liner, semiconductor chilling plate 103 and the insulating layer being set on liner 102.Semiconductor chilling plate 103 is located at
In insulating layer, the cold end of semiconductor chilling plate 103 transmits cold to liner, and heat is transmitted extremely in the hot junction of semiconductor chilling plate 103
Heat-exchanger rig.
Installation space is defined between shell 101 and insulating layer, and above-mentioned heat-exchanger rig is installed in installation space, is partly led
The hot junction of body cooling piece 103 is directly or indirectly contacted with the heat conducting pipe group and/or heat-conducting substrate of heat-exchanger rig.
When air inlet 623 and air outlet 624 are respectively positioned on air duct cover board 62, close to left side on the back side panel of shell 101
The position of plate offers air inlet, and the position close to right plate on the back side panel of shell 101 offers air outlet, air inlet with
The air inlet 623 of heat-exchanger rig is connected, and the two is opposite.Air outlet is connected with the air outlet 624 of heat-exchanger rig, and the two
Relatively.
Air inlet 623 is located on air duct cover board 62, when air outlet 624 is located on air duct side plate 61, in the rear side of shell 101
Position on plate close to left plate offers air inlet, and air outlet is offered on the right plate of shell 101.
When refrigeration equipment works, the cold end of semiconductor chilling plate 103 generates cold and freezes to liner, semiconductor refrigerating
The hot junction of piece 103 generates heat, and the hot junction that heat-exchanger rig absorbs semiconductor chilling plate 103 generates heat and discharges to refrigeration equipment
It is external.The course of work of heat-exchanger rig is：Air-supply arrangement 7 rotates, and air is driven to enter ducting assembly from the air inlet of shell 101
Air inlet 623, the gap between fin by fins set 3 takes away the heat of fin, and from the air outlet of ducting assembly
624, the outside of the air outlet outflow shell 101 of shell 101, the fin of fins set 3 are continuously available cooling, and semiconductor chilling plate
The heat in 103 hot junctions is constantly transferred to fins set 3 by heat-conducting substrate, is changed to the heat in 103 hot junction of semiconductor chilling plate
Thermal exports, and realizes the cooling in 103 hot junction of semiconductor chilling plate.
Semiconductor refrigerating equipment can be wine cabinet, ice, the products such as refrigerator, medical kit.
Embodiment two
As viewed in figures 5-8, the present embodiment includes the main heat exchange device 123 of auxiliary heat exchanging device 4, air-supply arrangement 7 and embodiment one,
Since main heat exchange device 123 has been described in detail in embodiment one, this embodiment is not repeated.
Auxiliary heat exchanging device 4 is illustrated below, auxiliary heat exchanging device 4 includes auxiliary heat conduction pipe group, auxiliary heat conduction base
Plate 42 and auxiliary fins group 43, auxiliary heat conduction pipe group are inlaid on auxiliary heat conduction substrate 42, and auxiliary fins group 43 is located at auxiliary and leads
On hot substrate 42, auxiliary heat conduction pipe group connects with the heat-conducting substrate 2 of main heat exchange device 123, to absorb the heat of heat-conducting substrate generation
Amount.
As shown in figure 5, auxiliary heat conduction pipe group includes several auxiliary heat conduction pipes 41, auxiliary heat conduction pipe group is prolonging for heat conducting pipe group
Long section, specifically, auxiliary heat conduction pipe 41 is the extension of heat conducting pipe 1, it is preferred that auxiliary heat conduction pipe 41 is and semiconductor chilling plate
The extension of 103 heat conducting pipes 1 to connect.Several auxiliary heat conduction pipes 41 are distributed parallelly on auxiliary heat conduction substrate 42, in favor of auxiliary
Heat is uniformly distributed on assistant director of a film or play's hot substrate 42, is conducive to heat dissipation.There is coupling tube 5, portion between auxiliary heat conduction pipe 41 and heat conducting pipe 1
It is bending to divide coupling tube 5.
Air-supply arrangement 7 is between auxiliary heat exchanging device 4 and main heat exchange device 123.Air-supply arrangement 7 is aerofoil fan, axis
The shaft direction of flow fan 7 is parallel with 42 place plane of heat-conducting substrate.
As shown in fig. 7, the ducting assembly of the present embodiment includes air duct side plate 61 and two air duct cover boards 62.Main heat exchange device
123, air-supply arrangement 7 and auxiliary heat exchanging device 4 are located in the space that air duct side plate 61 and two air duct cover boards 62 surround, air duct lid
The both ends of plate 62 offer air inlet 623 and air outlet 624, and air inlet 623 is located at same air duct cover board 62 with air outlet 624
On, the air inlet 623 of air duct cover board 62 is opposite with auxiliary fins group 43, air outlet 624 and 3 phase of fins set of air duct cover board 62
It is right.
Certainly, air inlet 623 may be alternatively located at position opposite with the fin of auxiliary fins group 43 on air duct side plate 61, outlet air
Mouth 624 may be alternatively located at position opposite with the fin of the fins set of main heat exchange device 123 3 on air duct side plate 61.
The fin density of auxiliary fins group 43 is less than the fin density of fins set 3.Auxiliary fins group 43 leaks through a part of cold
Wind is distributed to fins set 3 conducive to heat, is conducive to the heat dissipation in 103 hot junction of semiconductor chilling plate.
The present embodiment heat-exchanger rig includes main heat exchange device 123 and auxiliary heat exchanging device 4, and auxiliary heat exchanging device 4 is in air duct
At air inlet 623,43 spacing 7mm of auxiliary fins group, main heat exchange device is on semiconductor chilling plate 103,3 spacing 4mm of fins set,
Main heat exchange device 123 is connected with auxiliary heat exchanging device 4 by 1 pipe of heat conduction, and a part of heat that semiconductor chilling plate 103 generates is logical
The auxiliary heat conduction pipe 41 that heat conducting pipe 1 is transmitted at air inlet 623 is crossed, by auxiliary heat exchanging device 4 and air heat-exchange, another part heat
Amount is dredged by the main heat exchange device 123 and air heat-exchange above semiconductor chilling plate 103, the fin of auxiliary heat exchanging device 4, air
It is not completely warmed, still there is a large amount of cold air, the cold air leaked through is blown to main heat exchange device 123 and arranges closeer wing again
Piece fully heats, and realizes 103 temperature with high efficiency of semiconductor chilling plate.
As shown in fig. 6, fin surface there are multiple small protrusions, the heat exchange area of fin and the flow-disturbing of air are increased, is enhanced
The exchange capability of heat of heat-exchanger rig.
The present embodiment can share air-supply arrangement with multiple semiconductor chilling plates, substantially reduce the volume of heat-exchanger rig.
Based on the design of above-mentioned heat-exchanger rig, as shown in figure 8, the present embodiment also proposed a kind of semiconductor refrigerating equipment,
Including shell 101, liner, semiconductor chilling plate and the insulating layer being set on liner.Semiconductor chilling plate 103 is located at insulating layer
Interior, the cold end of semiconductor chilling plate 103 transmits cold to liner, and heat is transmitted to the dress that exchanges heat in the hot junction of semiconductor chilling plate 103
It sets.
Installation space is defined between shell 101 and insulating layer, and above-mentioned heat-exchanger rig is installed in installation space, is partly led
The hot junction of body cooling piece 103 is directly or indirectly contacted with the heat conducting pipe group and/or heat-conducting substrate of main heat exchange device 123.
When air inlet 623 and air outlet 624 are respectively positioned on air duct cover board 62, close to left side on the back side panel of shell 101
The position of plate offers air inlet, and the position close to right plate on the back side panel of shell 101 offers air outlet, air inlet with
The air inlet 623 of heat-exchanger rig is connected, and the two is connected with respect to air outlet with the air outlet 624 of heat-exchanger rig, and the two
Relatively.
Air inlet 623 is located on air duct side plate 61, when air outlet 624 is located on air duct side plate 61, in the left side of shell 101
Air inlet is offered on plate, and air outlet is offered on the right plate of shell 101.
Thus, on the left of back side panel（Left plate）To enter the wind direction, back side panel right side（Right plate）For air-out direction, by sending
Wind apparatus 7 is by cold air on the left of back side panel（Left plate）Ducting assembly is sucked, by the auxiliary fins of auxiliary heat exchanging device 42
After group 43, using the fins set 3 of main heat exchange device 123, the heat of auxiliary heat exchanging device 42 and main heat exchange device 123 is taken away,
On the right side of from back side panel（Right plate）Discharge, to realize the cooling to 103 hot junction of semiconductor chilling plate.Fin direction and air stream
Dynamic direction is parallel, and sucking cold air can smoothly flow through fin, take away the heat on substrate and fin, and an air duct left side goes out into the right side,
And inlet and outlet has a certain distance, to reduce hot air reflux.
When refrigeration equipment works, the cold end of semiconductor chilling plate 103 generates cold and freezes to liner, semiconductor refrigerating
The hot junction of piece 103 generates heat, and the hot junction that heat-exchanger rig absorbs semiconductor chilling plate 103 generates heat and discharges to refrigeration equipment
It is external.The course of work of heat-exchanger rig is：Air-supply arrangement 7 rotates, and air is driven to enter ducting assembly from the air inlet of shell 101
Air inlet 623 take away the heat of fin by the gap between auxiliary fins group 43 and the fin of fins set 3, and from pneumatic
The air outlet 624 of component, shell 101 air outlet outflow shell 101 outside, fin is continuously available cooling, and semiconductor system
The heat in cold 103 hot junctions is constantly transferred to fins set and auxiliary heat exchanging device by heat-conducting substrate 2, to semiconductor chilling plate
The heat in 103 hot junctions is exported by heat-exchanger rig, realizes the cooling in 103 hot junction of semiconductor chilling plate.
Semiconductor refrigerating equipment can be wine cabinet, ice, the products such as refrigerator, medical kit.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features；
And these modifications or replacements, various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (10)
1. a kind of heat-exchanger rig for semiconductor refrigerating equipment, which is characterized in that including main heat exchange device and air-supply arrangement, institute
It includes heat conducting pipe group, heat-conducting substrate and fins set to state main heat exchange device；The heat conducting pipe group is inlaid on the heat-conducting substrate；Institute
The surface that fins set is located at the heat-conducting substrate is stated, the fins set has the fin of multiple parallel intervals setting；The heat conduction
Substrate and/or the heat conducting pipe group connect with semiconductor chilling plate, the heat generated for absorbing the semiconductor chilling plate；Institute
Air-supply arrangement is stated for generating the air-flow for flowing through the fins set.
2. the heat-exchanger rig according to claim 1 for semiconductor refrigerating equipment, which is characterized in that the heat conducting pipe is flat
Row is distributed on the heat-conducting substrate.
3. the heat-exchanger rig according to claim 1 for semiconductor refrigerating equipment, which is characterized in that the heat-conducting substrate
First surface on be provided with embedded grooves arranged, the heat conducting pipe is inlaid in the embedded grooves arranged.
4. the heat-exchanger rig according to claim 1 for semiconductor refrigerating equipment, which is characterized in that the heat-exchanger rig
Including ducting assembly, the ducting assembly includes air duct side plate and two air duct cover boards, the main heat exchange device and air-supply arrangement
In the space that the air duct side plate and two air duct cover boards surround；The both ends of the air duct cover board offer air inlet and go out
Air port offers air inlet alternatively, being offered on the air duct side plate on air inlet and air outlet or the air duct cover board,
Air outlet is offered on the air duct side plate.
5. being used for the heat-exchanger rig of semiconductor refrigerating equipment according to any one of claims 1-4, which is characterized in that institute
It includes auxiliary heat exchanging device to state heat-exchanger rig, and the auxiliary heat exchanging device includes auxiliary heat conduction pipe group, auxiliary heat conduction substrate and auxiliary
Fins set, the auxiliary heat conduction pipe group is helped to be inlaid on the auxiliary heat conduction substrate, the auxiliary fins group is located at the auxiliary
On heat-conducting substrate, the auxiliary heat conduction pipe group connects with the heat-conducting substrate.
6. the heat-exchanger rig according to claim 5 for semiconductor refrigerating equipment, which is characterized in that the auxiliary heat conduction
The extension of heat conducting pipe group described in Guan Zuwei.
7. the heat-exchanger rig according to claim 5 for semiconductor refrigerating equipment, which is characterized in that the air-supply arrangement
Between the auxiliary heat exchanging device and the main heat exchange device.
8. the heat-exchanger rig according to claim 7 for semiconductor refrigerating equipment, which is characterized in that the ducting assembly
Air inlet it is opposite with the auxiliary fins group, the air outlet of the ducting assembly is opposite with the fins set.
9. the heat-exchanger rig according to claim 10 for semiconductor refrigerating equipment, which is characterized in that the auxiliary wing
The fin density of piece group is less than the fin density of the fins set.
10. a kind of semiconductor refrigerating equipment, including shell, liner, semiconductor chilling plate and the insulating layer being set on liner,
It is characterized in that, the semiconductor refrigerating equipment includes heat-exchanger rig described in any one of claim 1-9, the shell and institute
State insulating layer and define installation space, the heat-exchanger rig is located at the installation space, offered on the shell air inlet and
Air outlet, the air inlet are connected with the air inlet of the heat-exchanger rig, the outlet air of the air outlet and the heat-exchanger rig
Mouth is connected, and the heat-conducting substrate and/or the heat conducting pipe group are connect with the hot junction of the semiconductor chilling plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711405585.5A CN108387025A (en) | 2017-12-22 | 2017-12-22 | Heat-exchanger rig and semiconductor refrigerating equipment with the heat-exchanger rig |
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| CN201711405585.5A CN108387025A (en) | 2017-12-22 | 2017-12-22 | Heat-exchanger rig and semiconductor refrigerating equipment with the heat-exchanger rig |
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| CN108387025A true CN108387025A (en) | 2018-08-10 |
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| CN105258382A (en) * | 2015-09-29 | 2016-01-20 | 青岛海尔特种电冰箱有限公司 | Heat exchange device and semiconductor refrigerator provided with same |
| CN106288500A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | Heat abstractor and there is the semiconductor refrigerating box of this heat abstractor |
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| CN2315470Y (en) * | 1997-10-09 | 1999-04-21 | 海尔集团公司 | Wet removing and heat exchanging device |
| JP2000018853A (en) * | 1998-06-30 | 2000-01-18 | Furukawa Electric Co Ltd:The | Cooling structure using plate type heat pipe |
| CN201475752U (en) * | 2009-08-26 | 2010-05-19 | 东营泰克拓普光电科技有限公司 | Efficient heat radiating LED illuminating lamp with heat pipes |
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| CN104329870A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Cold transferring and heat dissipating modular component, assembling method thereof and semiconductor refrigerator |
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| CN105258382A (en) * | 2015-09-29 | 2016-01-20 | 青岛海尔特种电冰箱有限公司 | Heat exchange device and semiconductor refrigerator provided with same |
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Application publication date: 20180810 |