CN104329870A - Cold transferring and heat dissipating modular component, assembling method thereof and semiconductor refrigerator - Google Patents
Cold transferring and heat dissipating modular component, assembling method thereof and semiconductor refrigerator Download PDFInfo
- Publication number
- CN104329870A CN104329870A CN201410124032.2A CN201410124032A CN104329870A CN 104329870 A CN104329870 A CN 104329870A CN 201410124032 A CN201410124032 A CN 201410124032A CN 104329870 A CN104329870 A CN 104329870A
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- Prior art keywords
- cold
- biography
- heat exchanger
- fin assembly
- modular component
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000009413 insulation Methods 0.000 claims abstract description 37
- 235000012149 noodles Nutrition 0.000 claims description 21
- 239000006260 foam Substances 0.000 claims description 8
- 238000005187 foaming Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- -1 silicon lipid Chemical class 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000013012 foaming technology Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
Abstract
The invention provides a cold transferring and heat dissipating modular component, an assembling method of the cold transferring and heat dissipating modular component and a semiconductor refrigerator. The cold transferring and heat dissipating modular component for the semiconductor refrigerator comprises a heat exchanger, a cold-end fin assembly, a semiconductor chilling plate and a cold transferring block; the semiconductor chilling plate and the cold transferring block are clamped between the heat exchanger and the cold-end fin assembly; the cold end of the semiconductor chilling plate abuts against the near side surface of the cold transferring block in a contact mode; the heat end of the semiconductor chilling plate abuts against the heat transferring face of the heat exchanger in a contact mode; the far side surface of the cold transferring block abuts against the cold transferring face of the cold-end fin assembly in a contact mode; the heat exchanger, the semiconductor chilling plate, the cold transferring block and the cold-end fin assembly which are assembled together are foamed through a foaming technology, and therefore a heat insulation layer between the cold transferring face of the cold-end fin assembly and the heat transferring face of the heat exchanger is formed. The semiconductor chilling plate and the cold transferring block are surrounded by the heat insulation layer in the circumferential direction. The invention further provides the assembling method of the cold transferring and heat dissipating modular component for the semiconductor refrigerator and the semiconductor refrigerator.
Description
Technical field
The present invention relates to Refrigeration Technique, particularly relate to a kind of biography cold radiating modular component, assemble method and semiconductor freezer.
Background technology
In prior art, cold junction fin assembly, cold transfer block, semiconductor chilling plate and hot side fin assembly design respectively and are assembled into respectively in refrigerator, and this technological process causing refrigerator to assemble is too complicated.Further, because the radiating effect of hot side fin is not ideal enough, cause the hot-side temperature of semiconductor chilling plate too high, affect the life-span of semiconductor chilling plate.
Summary of the invention
An object of the present invention is the technological process that will reduce refrigerator assembling.
The present invention's further object is the life-span will improving semiconductor chilling plate.
In order to realize at least one object above-mentioned, the invention provides the cold radiating modular component of a kind of biography for semiconductor freezer, comprise: the heat exchanger being in nearside, the cold junction fin assembly being in distally and the semiconductor chilling plate be interposed between described heat exchanger and described cold junction fin assembly and cold transfer block, the cold junction of wherein said semiconductor chilling plate and the proximal face of described cold transfer block contact against, the heat-transfer area of hot junction and described heat exchanger contacts against, and the distal surface of described cold transfer block and the biography huyashi-chuuka (cold chinese-style noodles) of described cold junction fin assembly contact against; And the cold radiating modular component of described biography is also comprised and to be foamed to the heat exchanger fitted together, semiconductor chilling plate, cold transfer block and cold junction fin assembly by foam process thus to be formed in the heat insulation layer between the biography huyashi-chuuka (cold chinese-style noodles) of described cold junction fin assembly and the heat-transfer area of described heat exchanger, described semiconductor chilling plate and described cold transfer block surround by described heat insulation layer in the circumferential.
Alternatively, there is at least one face in the distal surface of described biography huyashi-chuuka (cold chinese-style noodles) and described cold transfer block, at least one face of the proximal face of described cold junction and described cold transfer block and at least one face of described hot junction and described heat exchanger the thermal conductive silicon lipid layer that coated with thermally conductive silicone grease is formed.
Alternatively, described cold junction fin assembly is fixedly connected with by securing member with described heat exchanger.
Alternatively, described securing member is bolt; Described bolt is connected with described cold junction fin assembly through described heat exchanger, so that the described heat insulation layer that the part of described bolt between described biography huyashi-chuuka (cold chinese-style noodles) and described heat-transfer area is formed by foaming surrounds.
Alternatively, also comprise:
Cold junction fan, is arranged in distal surface relative with described biography huyashi-chuuka (cold chinese-style noodles) on described cold junction fin assembly.
Alternatively, also comprise:
Condenser, is communicated with described heat exchanger, and the heat that the hot junction of described semiconductor chilling plate produces, by being filled in the cold-producing medium in described heat exchanger and described condenser, dispels the heat by described condenser.
Alternatively, described cold junction fin assembly comprises cold junction fin, cool side heat pipes and passes cold base plate;
Wherein, the proximal face of the cold base plate of described biography is used as described biography huyashi-chuuka (cold chinese-style noodles), and proximal face and the described cold transfer block of the cold base plate of described biography contact against, the distal surface of the cold base plate of described biography and described cold junction fin contacts against; In the proximal face that described cool side heat pipes one end is arranged in the cold base plate of described biography and with the cold contacts baseplate of described biography against, the other end with to stretch in described cold junction fin and with described cold junction fin contacts against.
The present invention also provides the assemble method of the cold radiating modular component of a kind of biography for semiconductor freezer, comprising:
Steps A, is interconnected cold junction fin assembly, cold transfer block, semiconductor chilling plate and heat exchanger successively and fits together;
Step B, by foam process, the described cold junction fin assembly fitted together, described cold transfer block, described semiconductor chilling plate and described heat exchanger are foamed, thus heat insulation layer is formed between the biography huyashi-chuuka (cold chinese-style noodles) and the heat-transfer area of described heat exchanger of described cold junction fin assembly, described semiconductor chilling plate and described cold transfer block surround by described heat insulation layer in the circumferential, and described cold junction fin assembly, described cold transfer block, described semiconductor chilling plate, described heat exchanger and described heat insulation layer form the cold radiating modular component of biography being used for semiconductor freezer.
Alternatively, assemble method also comprises:
Step C, is welded to described heat exchanger by a condenser, thus makes the cold radiating modular component of described biography comprise described condenser further.
The present invention also provides a kind of semiconductor freezer, and described semiconductor freezer comprises the cold radiating modular component of biography of one of technique scheme.
The cold radiating modular component of biography of the present invention integrally manufactures and designs, when semiconductor freezer is assembled, the cold radiating modular component of biography comprising cold junction fin assembly, cold transfer block, semiconductor chilling plate, heat exchanger and heat insulation layer is integrally assembled in semiconductor freezer, compared in prior art, cold junction fin assembly, cold transfer block, semiconductor chilling plate and hot side fin are assembled into the mode in refrigerator respectively, and the cold radiating modular component of biography of the present invention can reduce the technological process of semiconductor freezer assembling.
Further, the present invention uses heat exchanger to replace hot side fin assembly, and condenser is communicated with heat exchanger, is dispelled the heat to the heat produced in the hot junction of semiconductor chilling plate by the cold-producing medium be filled in heat exchanger and condenser.Compared to the mode of hot side fin assembly heat radiation in prior art, the heat that the hot junction of semiconductor chilling plate can produce by the cold-producing medium in heat exchanger and condenser is delivered to rapidly in surrounding air, thus suitably can reduce the temperature in semiconductor chilling plate hot junction, improve the life-span of semiconductor chilling plate.
According to hereafter by reference to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present invention more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present invention with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the schematic, exploded passing cold radiating modular component according to an embodiment of the invention;
Fig. 2 is the schematic diagram of the inner side of inner container of icebox according to an embodiment of the invention;
Fig. 3 is semiconductor freezer schematic side elevation according to an embodiment of the invention;
Fig. 4 is the schematic connection diagram of cold junction fan, cold junction fin assembly and condenser according to an embodiment of the invention;
Fig. 5 is the cold radiating modular component schematic diagram of biography be made up of cold junction fin assembly, cold transfer block, semiconductor chilling plate, heat insulation layer, heat exchanger and condenser according to an embodiment of the invention;
Fig. 6 is the indicative flowchart passing cold radiating modular component assemble method according to an embodiment of the invention.
The Reference numeral used in accompanying drawing is as follows:
10 refrigerator U shells,
20 inner container of icebox,
30 back boards,
40 pass cold radiating modular component,
100 semiconductor chilling plates,
200 bolts hole,
300 cold junction fin assemblies,
301 cold junction fins,
302 cool side heat pipes,
303 pass cold base plate
400 cold transfer blocks,
500 cold junction fans,
600 heat insulation layers,
700 heat exchangers,
800 condensers.
Detailed description of the invention
Fig. 1 is the schematic, exploded passing cold radiating modular component 40 according to an embodiment of the invention.In Fig. 1 embodiment, pass cold radiating modular component 40 and comprise cold junction fin assembly 300, cold transfer block 400, semiconductor chilling plate 100, heat exchanger 700, cold junction fan 500, condenser 800 and heat insulation layer 600.The cold junction (not shown) of semiconductor chilling plate 100 connects cold transfer block 400, and cold transfer block 400 connects cold junction fin assembly 300, and cold junction fin assembly 300 connects cold junction fan 500.The hot junction (not shown) of semiconductor chilling plate 100 connects heat exchanger 700, connects heat exchanger 700 and connects condenser 800.In Fig. 1, Fig. 3 and Fig. 5, being nearside near the direction of condenser 800, is distally near the direction of cold junction fan 500.As shown in Figure 3 and Figure 5: heat exchanger 700 and condenser 800 are in nearside, cold junction fin assembly 300 and cold junction fan 500 are in distally, and semiconductor chilling plate 100 and cold transfer block 400 are interposed between heat exchanger 700 and cold junction fin assembly 300.Particularly, the cold junction of semiconductor chilling plate 100 and the proximal face of cold transfer block 400 contact against, the hot junction of semiconductor chilling plate 100 and the heat-transfer area of heat exchanger 700 contact against, and the distal surface of cold transfer block 400 and the biography huyashi-chuuka (cold chinese-style noodles) of cold junction fin assembly 300 contact against.Heat insulation layer 600 carries out to cold junction fin assembly 300, cold transfer block 400, semiconductor chilling plate 100 and the heat exchanger 700 fitted together formation of foaming by foam process.Heat insulation layer 600 is between the biography huyashi-chuuka (cold chinese-style noodles) and the heat-transfer area of heat exchanger 700 of cold junction fin assembly 300, and semiconductor chilling plate 100 and cold transfer block 400 surround by heat insulation layer 600 in the circumferential.
The cold radiating modular component 40 of biography of the present invention integrally manufactures and designs, when assembling, cold junction fin assembly 300, cold transfer block 400, semiconductor chilling plate 100, heat exchanger 700, condenser 800 and heat insulation layer 600 are integrally assembled in semiconductor freezer, compared to the mode be assembled into respectively in refrigerator, the cold radiating modular component 40 of biography of the present embodiment can reduce the technological process of semiconductor freezer assembling.In other embodiments, pass cold radiating modular component 40 and only can comprise cold junction fin assembly 300, cold transfer block 400, semiconductor chilling plate 100, heat exchanger 700 and heat insulation layer 600, or only comprise cold junction fin assembly 300, cold transfer block 400, semiconductor chilling plate 100, heat exchanger 700, cold junction fan 500 and heat insulation layer 600, the cold radiating modular component 40 of biography of these two kinds of forms integrally can manufacture and design equally and is assembled in semiconductor freezer, can play the effect reducing semiconductor freezer process flow for assembling equally.It should be noted that, as a kind of preferred embodiment, when passing cold radiating modular component 40 and only comprising cold junction fin assembly 300, cold transfer block 400, semiconductor chilling plate 100, heat exchanger 700 and heat insulation layer 600, pass cold radiating modular component 40 overall small and exquisite, convenient mobile and installation.
As shown in Figure 3 and Figure 5, in one embodiment, cold junction fan 500 is arranged in distal surface relative with passing huyashi-chuuka (cold chinese-style noodles) on cold junction fin assembly 300, and the cold being gathered in cold junction fin assembly 300 is dispersed in semiconductor freezer by cold junction fan 500.Condenser 800 is communicated with heat exchanger 700, and the heat that the hot junction of semiconductor chilling plate 100 produces, by being filled in heat exchanger 700 and the cold-producing medium in condenser 800, dispels the heat by condenser 800.As shown in Figure 4, condenser 800 has roomy radiating surface, cold-producing medium flow in condenser 800 when can move upward after heat exchanger 700 heats, when cold-producing medium reenters heat exchanger 700 after condenser 800 cools, thus cold-producing medium is at heat exchanger 700 and condenser 800 internal circulation flow, continue heat radiation.The present embodiment uses heat exchanger 700 to replace hot side fin assembly, dispels the heat with the cold-producing medium in condenser 800 by being filled in heat exchanger 700 to the heat produced in the hot junction of semiconductor chilling plate 100.Compared to the mode adopting the heat radiation of hot side fin assembly, refrigerant loses heat has stronger heat absorption capacity, and has stronger heat-sinking capability.After heat exchanger 700 is communicated with condenser 800, the hot junction of semiconductor chilling plate 100 can be produced heat with the cold-producing medium in condenser 800 and be delivered in surrounding air rapidly by heat exchanger 700, thus can reduce the temperature in the hot junction of semiconductor chilling plate 100.
As shown in Figure 1, in one embodiment, cold junction fin assembly 300 comprises cold junction fin 301, cool side heat pipes 302 and passes cold base plate 303, and the proximal face of the cold base plate 303 of described biography is used as to pass huyashi-chuuka (cold chinese-style noodles).Wherein, the both sides passing cold base plate 303 are connected with cold junction fin 301 and cold transfer block 400 respectively, cool side heat pipes 302 one end is arranged in and passes cold base plate 303 and contact with cold transfer block 400 with the cold base plate 303 of biography between cold transfer block 400 and respectively, and the other end is connected with cold junction fin 301.Particularly, the proximal face and the cold transfer block 400 that pass cold base plate 303 contact against, the distal surface and the cold junction fin 300 that pass cold base plate 303 contact against, cool side heat pipes 302 one end be arranged in pass cold base plate 303 proximal face on and contact against with the cold base plate 303 of biography, the other end with to stretch in cold junction fin 301 and to be in contact with it against carrying out biography cold.
As shown in Figure 1 and Figure 5, in one embodiment, between the heat insulation layer 600 biography huyashi-chuuka (cold chinese-style noodles) that is formed in cold junction fin assembly 300 and the heat-transfer area of heat exchanger 700.As shown in Figure 3 and Figure 5, semiconductor chilling plate 100 and cold transfer block 400 surround by heat insulation layer 600 in the circumferential.Heat insulation layer 600 mainly plays adiabatic and is connected and fixed effect.
As shown in Fig. 1, Fig. 3 and Fig. 5, in one embodiment, the both sides of cold transfer block 400 contact against with cold junction fin assembly 300 and semiconductor chilling plate 100 respectively.The both sides of semiconductor chilling plate 100 contact against with cold transfer block 400 and heat exchanger 700 respectively.Particularly, on at least one face in the biography huyashi-chuuka (cold chinese-style noodles) of cold junction fin assembly 300 and the distal surface of cold transfer block 400, at least one face of the cold junction of semiconductor chilling plate 100 and the proximal face of the cold transfer block 400 and hot junction of semiconductor chilling plate 100 and at least one face of heat exchanger 700 has the thermal conductive silicon lipid layer that coated with thermally conductive silicone grease formed, thermal conductive silicon lipid layer can play the effect of transferring heat on the one hand, also can play the effect of being adhesively fixed on the other hand.
As shown in Figure 1, in one embodiment, cold junction fin assembly 300 and heat exchanger 700 all have two bolts hole 200 and can offer more bolt hole according to the needs of bonding strength on cold junction fin assembly 300 and heat exchanger 700 in other embodiments.Cold junction fin assembly 300 and heat exchanger 700 are fixedly connected with through the bolt hole 200 of cold junction fin assembly 300 and heat exchanger 700 side by two bolt (not shown)s separately.The head of fixing rear bolt is resisted against heat exchanger 700 and conducts heat in the proximal face of base plate (not marking in figure), and the screw rod of bolt is threaded with cold junction fin assembly 300 and heat exchanger 700 respectively.Two bolts hole 200 in Fig. 1 on heat insulation layer 600 are formed when cold for biography radiating modular component 40 being carried out the described heat insulation layer 600 of foaming formation.In other embodiments, bolt can also be other securing member that fastening cold junction fin assembly 300 and heat exchanger 700 act on.Bolt hole 200 on heat exchanger 700 is arranged on heat transfer base plate, and the distal surface of heat transfer base plate is used as the heat-transfer area of hot junction heat exchanger 700 transferring heat of semiconductor chilling plate 100.As the optional means of one, the draw-in groove and projection that cooperatively interact between the contact surface of cold junction fin assembly 300 and heat exchanger 700, can also be offered, cold junction fin assembly 300 and heat exchanger 700 be kept the fixing of relative vertical direction.
The invention provides the assemble method of the cold radiating modular component 40 of a kind of biography for semiconductor freezer, as shown in Figure 6, this assemble method comprises the steps:
Step 101, is interconnected cold junction fin assembly 300, cold transfer block 400, semiconductor chilling plate 100 and heat exchanger 700 successively and fits together.
Step 102, forms heat insulation layer 600 by foam process.Particularly, by foam process, the cold junction fin assembly 300, cold transfer block 400, semiconductor chilling plate 100 and the heat exchanger 700 that fit together are foamed, thus form described heat insulation layer 600 between the biography huyashi-chuuka (cold chinese-style noodles) and the heat-transfer area of heat exchanger 700 of cold junction fin assembly 300.Semiconductor chilling plate 100 and cold transfer block 400 surround by described heat insulation layer 600 after formation in the circumferential.
Step 103, is welded to heat exchanger 700 by condenser 800.Particularly, after the foam box of semiconductor freezer completes, condenser 800 is fixed on back boards 30, then cold for the biography foamed radiating modular component 40 is fixed in the reserved passage of casing, then heat exchanger 700 is welded with condenser 800.
In above-mentioned assemble method embodiment, pass cold radiating modular component 40 and comprise cold junction fin assembly 300, cold transfer block 400, semiconductor chilling plate 100 and heat exchanger 700, heat insulation layer 600 and condenser 800.In a preferred embodiment, the assemble method passing cold radiating modular component 40 can not comprise step 103, namely pass cold radiating modular component 40 and can not comprise above-mentioned condenser 800, be fixed on by cold for this biography radiating modular component 40 in this embodiment in the reserved passage of semiconductor freezer, after-condenser 800 is fixed on back boards 30.
The present invention also provides a kind of semiconductor freezer, as shown in Figure 3, the semiconductor freezer cold radiating modular component 40 of biography that comprises refrigerator U shell 10, inner container of icebox 20, back boards 30 and be made up of cold junction fin assembly 300, cold transfer block 400, semiconductor chilling plate 100, heat exchanger 700, cold junction fan 500, condenser 800, heat insulation layer 600.As shown in Figure 2, cold junction fan 500 is arranged on inner container of icebox 20.In other embodiments, pass cold radiating modular component 40 and only comprise cold junction fin assembly 300, cold transfer block 400, semiconductor chilling plate 100, heat exchanger 700 and heat insulation layer 600, or only comprise cold junction fin assembly 300, cold transfer block 400, semiconductor chilling plate 100, heat exchanger 700, cold junction fan 500 and heat insulation layer 600.Comprise the semiconductor freezer that above-mentioned arbitrary form passes cold radiating modular component 40, integrally design owing to passing cold radiating modular component 40, thus the effect reducing semiconductor freezer process flow for assembling can both be played.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
Claims (10)
1. the cold radiating modular component of the biography for semiconductor freezer, comprise: the heat exchanger being in nearside, the cold junction fin assembly being in distally and the semiconductor chilling plate be interposed between described heat exchanger and described cold junction fin assembly and cold transfer block, wherein
The cold junction of described semiconductor chilling plate and the proximal face of described cold transfer block contact against, and the heat-transfer area of hot junction and described heat exchanger contacts against, and the distal surface of described cold transfer block and the biography huyashi-chuuka (cold chinese-style noodles) of described cold junction fin assembly contact against; And
The cold radiating modular component of described biography is also comprised and to be foamed to the heat exchanger fitted together, semiconductor chilling plate, cold transfer block and cold junction fin assembly by foam process thus to be formed in the heat insulation layer between the biography huyashi-chuuka (cold chinese-style noodles) of described cold junction fin assembly and the heat-transfer area of described heat exchanger, and described semiconductor chilling plate and described cold transfer block surround by described heat insulation layer in the circumferential.
2. the cold radiating modular component of biography according to claim 1, wherein,
There is at least one face in the distal surface of described biography huyashi-chuuka (cold chinese-style noodles) and described cold transfer block, at least one face of the proximal face of described cold junction and described cold transfer block and at least one face of described hot junction and described heat exchanger the thermal conductive silicon lipid layer that coated with thermally conductive silicone grease is formed.
3. the cold radiating modular component of biography according to claim 1, wherein,
Described cold junction fin assembly is fixedly connected with by securing member with described heat exchanger.
4. the cold radiating modular component of biography according to claim 3, wherein,
Described securing member is bolt;
Described bolt is connected with described cold junction fin assembly through described heat exchanger, so that the described heat insulation layer that the part of described bolt between described biography huyashi-chuuka (cold chinese-style noodles) and described heat-transfer area is formed by foaming surrounds.
5. the cold radiating modular component of biography according to claim 1, wherein, also comprises:
Cold junction fan, is arranged in distal surface relative with described biography huyashi-chuuka (cold chinese-style noodles) on described cold junction fin assembly.
6. the cold radiating modular component of biography according to claim 1, wherein, also comprises:
Condenser, is communicated with described heat exchanger, and the heat that the hot junction of described semiconductor chilling plate produces, by being filled in the cold-producing medium in described heat exchanger and described condenser, dispels the heat by described condenser.
7. the cold radiating modular component of biography according to claim 1, wherein, described cold junction fin assembly comprises cold junction fin, cool side heat pipes and passes cold base plate;
Wherein, the proximal face of the cold base plate of described biography is used as described biography huyashi-chuuka (cold chinese-style noodles), and proximal face and the described cold transfer block of the cold base plate of described biography contact against, the distal surface of the cold base plate of described biography and described cold junction fin contacts against; In the proximal face that described cool side heat pipes one end is arranged in the cold base plate of described biography and with the cold contacts baseplate of described biography against, the other end with to stretch in described cold junction fin and with described cold junction fin contacts against.
8., for an assemble method for the cold radiating modular component of biography of semiconductor freezer, comprising:
Steps A, is interconnected cold junction fin assembly, cold transfer block, semiconductor chilling plate and heat exchanger successively and fits together;
Step B, by foam process, the described cold junction fin assembly fitted together, described cold transfer block, described semiconductor chilling plate and described heat exchanger are foamed, thus heat insulation layer is formed between the biography huyashi-chuuka (cold chinese-style noodles) and the heat-transfer area of described heat exchanger of described cold junction fin assembly, described semiconductor chilling plate and described cold transfer block surround by described heat insulation layer in the circumferential, and described cold junction fin assembly, described cold transfer block, described semiconductor chilling plate, described heat exchanger and described heat insulation layer form the cold radiating modular component of biography being used for semiconductor freezer.
9. assemble method according to claim 8, also comprises:
Step C, is welded to described heat exchanger by a condenser, thus makes the cold radiating modular component of described biography comprise described condenser further.
10. a semiconductor freezer, is characterized in that, described semiconductor freezer comprises the described cold radiating modular component of biography of one of claim 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410124032.2A CN104329870B (en) | 2014-03-28 | 2014-03-28 | Cold transferring and heat dissipating modular component, assembling method thereof and semiconductor refrigerator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410124032.2A CN104329870B (en) | 2014-03-28 | 2014-03-28 | Cold transferring and heat dissipating modular component, assembling method thereof and semiconductor refrigerator |
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| Publication Number | Publication Date |
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| CN104329870A true CN104329870A (en) | 2015-02-04 |
| CN104329870B CN104329870B (en) | 2017-01-18 |
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| CN201410124032.2A Active CN104329870B (en) | 2014-03-28 | 2014-03-28 | Cold transferring and heat dissipating modular component, assembling method thereof and semiconductor refrigerator |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107131706A (en) * | 2017-05-31 | 2017-09-05 | 安徽金诚天骏汽车零部件制造有限公司 | The mounting structure of semiconductor chilling plate and radiating tube |
| CN108387025A (en) * | 2017-12-22 | 2018-08-10 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and semiconductor refrigerating equipment with the heat-exchanger rig |
| CN108679877A (en) * | 2017-04-28 | 2018-10-19 | 青岛海尔特种电冰柜有限公司 | Solid-state refrigerating plant |
| CN117254332A (en) * | 2023-11-17 | 2023-12-19 | 北京中石正旗技术有限公司 | Heat radiation structure and gas laser |
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| CN108709335A (en) * | 2017-04-28 | 2018-10-26 | 青岛海尔特种电冰柜有限公司 | Semiconductor cooling device |
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| CN108709335B (en) * | 2017-04-28 | 2022-03-22 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating device |
| CN108731298B (en) * | 2017-04-28 | 2022-03-22 | 青岛海尔特种电冰柜有限公司 | Solid-state refrigeration equipment |
| CN107131706A (en) * | 2017-05-31 | 2017-09-05 | 安徽金诚天骏汽车零部件制造有限公司 | The mounting structure of semiconductor chilling plate and radiating tube |
| CN108387025A (en) * | 2017-12-22 | 2018-08-10 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and semiconductor refrigerating equipment with the heat-exchanger rig |
| CN117254332A (en) * | 2023-11-17 | 2023-12-19 | 北京中石正旗技术有限公司 | Heat radiation structure and gas laser |
| CN117254332B (en) * | 2023-11-17 | 2024-02-02 | 北京中石正旗技术有限公司 | Heat radiation structure and gas laser |
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