CN108679877A - Solid-state refrigerating plant - Google Patents
Solid-state refrigerating plant Download PDFInfo
- Publication number
- CN108679877A CN108679877A CN201810392900.3A CN201810392900A CN108679877A CN 108679877 A CN108679877 A CN 108679877A CN 201810392900 A CN201810392900 A CN 201810392900A CN 108679877 A CN108679877 A CN 108679877A
- Authority
- CN
- China
- Prior art keywords
- heat
- cold end
- insulating bracket
- semiconductor refrigeration
- refrigeration chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 86
- 238000005057 refrigeration Methods 0.000 claims abstract description 79
- 238000009434 installation Methods 0.000 claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 44
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 239000006260 foam Substances 0.000 claims description 8
- 239000002937 thermal insulation foam Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 229920000742 Cotton Polymers 0.000 claims description 2
- 238000005265 energy consumption Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 6
- 238000007791 dehumidification Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000002360 explosive Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000001954 sterilising effect Effects 0.000 description 3
- 238000004659 sterilization and disinfection Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 208000005156 Dehydration Diseases 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003020 moisturizing effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/042—Air treating means within refrigerated spaces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/04—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with more than one refrigeration unit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/14—Collecting or removing condensed and defrost water; Drip trays
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D25/00—Charging, supporting, and discharging the articles to be cooled
- F25D25/02—Charging, supporting, and discharging the articles to be cooled by shelves
- F25D25/024—Slidable shelves
- F25D25/025—Drawers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
- F25D31/002—Liquid coolers, e.g. beverage cooler
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
- F25D2317/04—Treating air flowing to refrigeration compartments
- F25D2317/041—Treating air flowing to refrigeration compartments by purification
- F25D2317/0411—Treating air flowing to refrigeration compartments by purification by dehumidification
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
- F25D2317/04—Treating air flowing to refrigeration compartments
- F25D2317/041—Treating air flowing to refrigeration compartments by purification
- F25D2317/0413—Treating air flowing to refrigeration compartments by purification by humidification
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of solid-state refrigerating plants, including heat conduction liner, semiconductor refrigerating module and the wet component of control, semiconductor refrigerating module includes the first semiconductor refrigeration chip, heat pipe and assembling module, it includes the first heat-insulating bracket to assemble module, second heat-insulating bracket, hot junction heat-conducting seat and cold end heat-conducting seat, the first groove is provided on first heat-insulating bracket, the mounting hole through the first heat-insulating bracket is offered in first groove, second heat-insulating bracket is provided with the second groove, first heat-insulating bracket is fixed on the second heat-insulating bracket, installation cavity is formed between first groove and the second groove, first semiconductor refrigeration chip is located in mounting hole, cold end heat-conducting seat is contacted with the cold end face of the first semiconductor refrigeration chip, hot junction heat-conducting seat is contacted with the hot junction face of the first semiconductor refrigeration chip, heat pipe connects cold end heat-conducting seat.The loss of refrigeration capacity amount for reducing semiconductor refrigerating module is realized, to improve the refrigerating efficiency of refrigeration equipment and reduce energy consumption.
Description
Technical field
The present invention relates to refrigeration equipment more particularly to a kind of solid-state refrigerating plants.
Background technology
Currently, with the development of semiconductor refrigerating technology, the refrigeration freezed using the first semiconductor refrigeration chip is set
Standby to be widely used, China Patent No. 2014107111772 discloses a kind of semiconductor refrigerating equipment, using the first semiconductor system
The cold that cold core piece generates realizes refrigeration.And the first semiconductor refrigeration chip includes the heat of the cold end and release heat of released cold quantity
End, in the process of running, cold is discharged into refrigeration equipment by the cold end of the first semiconductor refrigeration chip by cold end radiator
In refrigeration compartment, and the hot junction of the first semiconductor refrigeration chip needs to distribute heat to outside by hot-side heat dissipation device.But
In actual use, since the cold and hot end of the first semiconductor refrigeration chip is oppositely arranged backwards, cold end radiator and
Hot-side heat dissipation device is mutually neighbour, and cold end radiator and hot-side heat dissipation device easy to produce heat exchange and lead to the loss of cold, to
So that the refrigerating efficiency of refrigeration equipment is relatively low and energy consumption increases.How a kind of high cooling efficiency is designed and the refrigeration equipment that low energy consumption
It is the technical problems to be solved by the invention.
Invention content
The present invention provides a kind of solid-state refrigerating plants, the loss of refrigeration capacity amount for reducing semiconductor refrigerating module are realized, to carry
The refrigerating efficiency of high refrigeration equipment simultaneously reduces energy consumption.
To reach above-mentioned technical purpose, the present invention is realized using following technical scheme：
A kind of solid-state refrigerating plant, including heat conduction liner further include semiconductor refrigerating module and dehumidifying module；The semiconductor
Refrigeration module includes the first semiconductor refrigeration chip and heat pipe, and first semiconductor refrigeration chip includes the cold end of released cold quantity
The hot junction face in face and release heat, further includes assembling module, and the assembling module includes the first heat-insulating bracket, the second heat-insulated branch
Frame, hot junction heat-conducting seat and cold end heat-conducting seat, first heat-insulating bracket are fixed on second heat-insulating bracket, described first every
Installation cavity is formed between hot holder and second heat-insulating bracket, first heat-insulating bracket offers the connection installation cavity
The mounting hole of body, first semiconductor refrigeration chip are located in the mounting hole, and the cold end heat-conducting seat is arranged in the peace
Behave affectedly in body and contacted with the cold end face of first semiconductor refrigeration chip, hot junction heat-conducting seat setting described first every
It is contacted on hot holder and with the hot junction face of first semiconductor refrigeration chip, the heat pipe connects the cold end heat-conducting seat, institute
The heat pipe for stating semiconductor refrigerating module is attached to the surface of the heat conduction liner；The dehumidifying module includes the second semiconductor refrigerating core
The cold end face of piece, second semiconductor refrigeration chip is provided with cold end radiator, the heat of second semiconductor refrigeration chip
End face is provided with hot-side heat dissipation device, and the cold end radiator is located in the heat conduction liner, and the hot-side heat dissipation device is located at described
Outside heat conduction liner, humidity sensor is additionally provided in the heat conduction liner.
Further, the dehumidifying module further includes trivet, and the trivet is provided with installation through-hole, and described the second half
Conductor refrigerating chip is arranged in the installation through-hole；Embedded mouth is offered on the heat conduction liner, the trivet sealing is embedding
In the embedded mouth.
Further, the dehumidifying module further includes fan housing and fan, be provided on the fan housing first circulation air port and
Second circulation air port, the fan housing are fixed on the heat conduction liner and cover in the cold end radiator, and the fan is located at
In the cavity body structure formed between the fan housing and the heat conduction liner.
Further, the humidification module includes that water box, humidification foam, upper cover and wind turbine, the humidification foam are located at institute
It states in water box, the upper cover covering is provided with air inlet and air outlet, the wind turbine on the top of the water box, the upper lid
The air inlet or the air outlet are covered in, the water box are arranged in the heat conduction liner.
Further, the bottom of the cold end radiator is provided with drip tray, the drip tray by drainpipe with it is described
Water box connect.
Further, the outer surface of first heat-insulating bracket is provided with heat dam, the heat dam around the mounting hole
In be provided with heat insulation foam；The hot junction of first semiconductor refrigeration chip faces out the appearance for protruding from first heat-insulating bracket
Face.
Further, it is provided with evacuation notch on the cold end heat-conducting seat, it is first heat-insulating bracket, described second heat-insulated
Through-hole is respectively arranged on holder and the hot junction heat-conducting seat, bolt is threaded through in the corresponding through-hole, and the bolt passes through
The evacuation notch is formed by region.
Further, the cold end heat-conducting seat includes the first heat-conducting plate and the second heat-conducting plate to link together, the heat
Pipe clamp is between first heat-conducting plate and second heat-conducting plate.
Further, the inner surface of first heat-conducting plate offers the first mounting groove being laterally arranged, and described second leads
The inner surface of hot plate offers the second longitudinally disposed mounting groove, and the heat pipe is divided into lateral flat hot pipe and longitudinally flattened heat
Pipe, the transverse direction flat hot pipe are arranged in first mounting groove, and the longitudinally flattened heat pipe setting is in second installation
In slot, also, the lateral flat hot pipe contacts with each other with the longitudinally flattened heat pipe.
Further, the inner surface of first heat-insulating bracket is provided with the first tube seat for installing the heat pipe, institute
The edge for stating the second heat-insulating bracket is provided with the notch passed through for the heat pipe or through hole or the second tube seat.
Compared with prior art, the advantages and positive effects of the present invention are：It is formed by using between two heat-insulating brackets
Installation cavity cold end heat-conducting seat is installed so that cold end heat-conducting seat and hot junction heat-conducting seat by heat-insulating bracket effective insulated room every
It opens, so as to substantially reduce the heat exchange amount generated between cold end heat-conducting seat and hot junction heat-conducting seat, effective reduction cold
It scatters and disappears, to improve the refrigerating efficiency of refrigeration equipment and reduce energy consumption.At the same time, the first semiconductor refrigeration chip embedded in first every
In the mounting hole of hot holder, while the cold end face for ensuring the first semiconductor refrigeration chip is well contacted with cold end heat-conducting seat,
Ensure that the hot junction face of the first semiconductor refrigeration chip is well contacted with hot junction heat-conducting seat, it is ensured that heat Quick diffusing is improved and used
Reliability.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Some bright embodiments for those of ordinary skill in the art without having to pay creative labor, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the assembling figure of heat conduction liner and semiconductor refrigerating module in refrigeration equipment of the present invention；
Fig. 2 is the assembling figure of heat conduction liner and humidification module in refrigeration equipment of the present invention；
Fig. 3 is the structural schematic diagram of semiconductor refrigerating module of the present invention;
Fig. 4 is the positive structure schematic of the first heat-insulating bracket in semiconductor refrigerating module of the present invention；
Fig. 5 is the reverse structure schematic of the first heat-insulating bracket in semiconductor refrigerating module of the present invention；
Fig. 6 is the positive structure schematic of the second heat-insulating bracket of semiconductor refrigerating module of the present invention；
Fig. 7 is the reverse structure schematic of the second heat-insulating bracket in semiconductor refrigerating module of the present invention；
Fig. 8 is the structural schematic diagram of the first heat-conducting plate in semiconductor refrigerating module of the present invention；
Fig. 9 is the structural schematic diagram of the second heat-conducting plate in semiconductor refrigerating module of the present invention；
Figure 10 is the explosive view of semiconductor refrigerating module of the present invention；
Figure 11 is the structural schematic diagram of present invention humidification module；
Figure 12 is the explosive view of present invention humidification module；
Figure 13 is the explosive view of present invention dehumidifying module.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
The every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As shown in Fig. 1-Figure 13, it can be configured as needed in the storing cavity of the liner formation of the present embodiment refrigeration equipment
There are humidification module 300 and/or dehumidifying module 400 to meet the storage of special article to adjust the humidity in storage chamber body as needed
Object requirement.Wherein, refrigeration equipment may be used solid-state Refrigeration Technique and freeze, wherein the liner of refrigeration equipment is in heat conduction
Courage 100, setting semiconductor refrigerating module 200 on heat conduction liner 100.How to be said for different innovative points in conjunction with attached drawing
It is bright.
One, the specific constructive form of semiconductor refrigerating module 200 is described below：
Semiconductor refrigerating module 200 includes the first semiconductor refrigeration chip 1 and heat pipe 2, and first semiconductor refrigeration chip 1 wraps
Include released cold quantity cold end face and release heat hot junction face, further include assembling module 3, the assembling module 3 including first every
Hot holder 31, the second heat-insulating bracket 32, hot junction heat-conducting seat 33 and cold end heat-conducting seat 34, first heat-insulating bracket 31 are fixed on institute
It states on the second heat-insulating bracket 32, being formed between first heat-insulating bracket 31 and second heat-insulating bracket 32 has the function of thermal insulation
Installation cavity in, between first groove 311 and second groove 321 formed installation cavity, first semiconductor
Refrigerating chip 1 is located in the mounting hole 312, and the cold end heat-conducting seat 34 is arranged in the installation cavity and with described first
The cold end face of semiconductor refrigeration chip 1 contacts, the hot junction heat-conducting seat 33 be arranged on first heat-insulating bracket 31 and with institute
The hot junction face contact of the first semiconductor refrigeration chip 1 is stated, the heat pipe 2 connects the cold end heat-conducting seat 34.
Specifically, the first semiconductor refrigeration chip 1 is embedded in the first heat-insulating bracket 31 by semiconductor refrigerating module 200
In mounting hole 312, the periphery of the first semiconductor refrigeration chip 1 is wrapped by the first heat-insulating bracket 31, also, heat-insulated by first
Hot junction heat-conducting seat 33 and cold end heat-conducting seat 34 are spaced apart by holder 31, can effectively reduce hot junction heat-conducting seat 33 and cold end heat conduction
The amount of heat transfer generated between seat 34, to reduce the loss of refrigeration capacity of cold end heat-conducting seat 34, at the same time, cold end heat-conducting seat 34 wraps
It is rolled in the installation cavity with thermal insulation function formed by the first heat-insulating bracket 31 and the second heat-insulating bracket 32, cold end heat-conducting seat
Needed for the cold that first semiconductor refrigeration chip 1 of 34 conduction generates can be quickly transmitted to by heat pipe 2 to greatest extent
The region wanted more effectively reduces energy consumption and improves refrigerating efficiency to reduce cold end heat-conducting seat 34 itself cold windage.Its
In, the inner surface setting of the inner surface of the first heat-insulating bracket 31 and/or the second heat-insulating bracket 32 is fluted, is formed by groove
Installation cavity is stated, such as：The first groove 311, first groove 311 are provided on the inner surface of first heat-insulating bracket 31
In offer the mounting hole 312 through first heat-insulating bracket 31, the inner surface of second heat-insulating bracket 32 is provided with
Two grooves 321 form installation cavity between first groove 311 and second groove 321.
Preferably, the outer surface of the first heat-insulating bracket 31 is provided with heat dam 313 around the mounting hole 312, described heat-insulated
It is provided with heat insulation foam in slot 313（It is unmarked）；The hot junction of first semiconductor refrigeration chip 1, which faces out, protrudes from described first
The outer surface of heat-insulating bracket 31.Specifically, by heat dam 313 can the first semiconductor refrigeration chip 1 periphery setting every
Hot cotton, the insulation ring to be formed by heat insulation foam further reduce the cold in the first semiconductor refrigeration chip 1 cold end face to
It is outer to scatter and disappear, it is also possible to the heat for reducing 1 hot junction face of the first semiconductor refrigeration chip enters in installation cavity, maximum limit
The loss of the reduction cold of degree；And 1 hot junction face of the first semiconductor refrigeration chip is slightly higher than the outer surface of the first heat-insulating bracket 31, one
Aspect enables 1 hot junction face of the first semiconductor refrigeration chip and 33 good transmission of heat by contact of hot junction heat-conducting seat, on the other hand, the
1 hot junction emaciated face of semiconductor refrigerating chip separates out mounting hole 312, can reduce heat and be passed to installation cavity from mounting hole 312
In, it is possibility to have the loss of the reduction cold of effect.Wherein, it is connected for the ease of wiring, the appearance of the first heat-insulating bracket 31
Face is additionally provided with wiring groove 314, and the wiring groove 314 is connected to the mounting hole 312.In addition, according to the refrigeration of refrigeration equipment
Amount need, semiconductor refrigerating module 200 include multiple first semiconductor refrigeration chips 1, the assembling module 3 configured with
The corresponding hot junction heat-conducting seat 33 of first semiconductor refrigeration chip 1 and the cold end heat-conducting seat 34, also, described first
Heat-insulating bracket 31 offers the mounting hole corresponding with first semiconductor refrigeration chip 1 312.
Further, it is generated between hot junction heat-conducting seat 33 and cold end heat-conducting seat 34 caused by assembling to more effectively reduce
Heat transmit, evacuation notch 340, first heat-insulating bracket 31, second heat-insulating bracket are provided on cold end heat-conducting seat 34
32 and the hot junction heat-conducting seat 33 on be respectively arranged with through-hole（It is unmarked）, bolt 35 is threaded through in the corresponding through-hole, institute
It states bolt 35 and is formed by region across the evacuation notch 340.Specifically, in an assembling process, by bolt 35 by hot junction
Heat-conducting seat 33, the first heat-insulating bracket 31, cold end heat-conducting seat 34 and second heat-insulating bracket 32 assemble be fixed together successively, and
Bolt 35 opens cold end heat-conducting seat 34 by avoiding the evacuation of notch 340, so as to avoid hot junction heat-conducting seat 33 and cold end heat-conducting seat
Heat exchange is generated by bolt 35 between 34.Wherein, the inner surface of first heat-insulating bracket 31 is provided with described for installing
The first tube seat 316 and the first tube seat 317 of heat pipe 2, the edge of second heat-insulating bracket 32 is provided with to be worn for the heat pipe 2
The notch or through hole 322 crossed or the second tube seat.Specifically, heat pipe 2 passes through the first tube seat 316 and the first tube seat 317 and perforation
The cooperation of hole 322 is pierced by assembling module 3, to facilitate heat pipe 2 to be arranged on the heat conduction liner 100 of refrigeration equipment.In addition, for the ease of
Quick location and installation hot junction heat-conducting seat 33, the outer surface of the first heat-insulating bracket 31 are provided with more around the outside of the mounting hole 312
Block positioning baffle 315, the hot junction heat-conducting seat 33 are arranged between the positioning baffle 315 described in polylith.In assembling, pass through positioning
Baffle 315 can convenient location and installation hot junction heat-conducting seat 33, and ensure that hot junction heat-conducting seat 33 can accurately be led with the first half
Body refrigerating chip 1 contacts well.
Further, the cold end heat-conducting seat 34 includes the first heat-conducting plate 341 and the second heat-conducting plate to link together
342, the heat pipe 2 is clipped between first heat-conducting plate 341 and second heat-conducting plate 342.Specifically, the first heat-conducting plate
341 inner surface offers the first mounting groove 3411 being laterally arranged, and the inner surface of second heat-conducting plate 342 offers longitudinal direction
The second mounting groove 3421 being arranged, the heat pipe 2 divide for lateral flat hot pipe and longitudinally flattened heat pipe, the transverse direction flat hot pipe
It is arranged in first mounting groove 3411, the longitudinally flattened heat pipe is arranged in second mounting groove 3421, also, institute
Lateral flat hot pipe is stated to contact with each other with the longitudinally flattened heat pipe.Specifically, can effectively increase heat using flat hot pipe
The contact area of pipe and cold end heat-conducting seat 34, meanwhile, flat hot pipe can also effectively increase connecing between heat conduction liner 100
Contacting surface is accumulated, and heat exchanger effectiveness is provided.Also, lateral flat hot pipe contacts with each other with the longitudinally flattened heat pipe so that different positions
The heat pipe temperature at the place of setting is evenly distributed, and reduces the temperature difference and improves uniform temperature.
Cold end heat-conducting seat is installed by using the installation cavity formed between two heat-insulating brackets so that cold end heat-conducting seat
With hot junction heat-conducting seat by heat-insulating bracket it is effective it is heat-insulated be spaced apart, so as to substantially reduce cold end heat-conducting seat and hot junction heat-conducting seat
Between the heat exchange amount that generates, it is effective to reduce scattering and disappearing for cold, to improve the refrigerating efficiency of refrigeration equipment and reduce energy consumption.With
This simultaneously, the first semiconductor refrigeration chip embedded in the first heat-insulating bracket mounting hole in, ensuring the first semiconductor refrigeration chip
Cold end face and cold end heat-conducting seat while well contact, it is ensured that the hot junction face of the first semiconductor refrigeration chip and hot junction heat-conducting seat
Good contact, it is ensured that heat Quick diffusing improves use reliability.
Two, it is described below for humidifying the specific constructive form of module 300：
Humidification module 300 includes that water box 4, humidification foam 41, upper cover 43 and wind turbine 42, the humidification foam 41 are located at the water box
In 4, the covering of the upper cover 43 is provided with air inlet 432 and air outlet 431, institute on the top of the water box 4, the upper cover 43
It states wind turbine 42 and covers in the air inlet 432 or the air outlet 431, the setting of the water box 4 is in the heat conduction liner 100 formation
Storing cavity in.Specifically, be contained with water in water box 4, wind turbine 42 can realize in water box 4 air draught or as needed to water
It dries outside box 4, so that the humid air in water box 4 can be flowed into the storing cavity of the formation of heat conduction liner 100, with realization pair
The storing cavity that heat conduction liner 100 is formed carries out humidification process, humidification foam 41 can increase enter air in water box 4 with
The contact area of water, to improve humidification efficiency.
Further, the humidification module 300 further includes wind guiding component, and the wind guiding component includes case 44, wind deflector
45 and motor 46, the top of the case 44 be provided with ventilation opening 441, the wind deflector 45 is located in the ventilation opening 441 simultaneously
It is rotatably mounted on the case 44, for driving the wind deflector 45 to rotate, the case 44 is arranged the motor 46
In the water box 4 and cover in the wind turbine 42.Specifically, in humidification, motor 46 can drive wind deflector 45 to put
It is dynamic, it is evenly distributed in the storing cavity of heat conduction liner 100 with the humid air of control output, it is ensured that the storage of heat conduction liner 100
Object cavity moisture distribution is uniform.Wherein, the one end part of humidification foam 41 is in the lower section of the air inlet 432, other end position
In the lower section of the air outlet 431, carried out in this way, the air entered in water box 4 from air inlet 432 will flow through humidification foam 41
It is discharged again from air outlet 431 after sufficient humidification process, improves humidification efficiency；And in order to avoid air inlet 432 and air outlet 431
It interferes with each other, the upper surface of upper cover 43 is additionally provided with the baffle 433 for being spaced apart air inlet 432 and air outlet 431.In addition,
Module 300 is humidified for the ease of assembling, the both sides of case 44 are provided with cutting 442, are provided in the water box 4 and are inserted with described
The slot 405 that item 442 coordinates, the cutting 442 are inserted in the slot 405.And for the ease of installation, the humidification module
300 further include the fixing bracket 402 being fixedly mounted in the heat conduction liner 100, and the water box 4 are detachably arranged in described
On fixing bracket 402.
Further, partition 401 is provided in the water box 4, the water box are divided by the partition 401 mutually to be interconnected
Logical main water chamber and secondary water chamber are provided with sterilization module 404 and/or water level sensor 403 in the pair water chamber.Specifically
, sterilization module 404 can be ultraviolet sterilizer or ozone sterilizer, and sterilization processing is carried out to the water storage in water box 4 to realize,
And water level sensor 403 can detect the water level in water box 4, to remind user's timely moisturizing under exsiccosis.
Three, the specific constructive form for the module 400 that dehumidifies is described below：
The module 400 that dehumidifies includes the second semiconductor refrigeration chip 5, trivet 51, hot-side heat dissipation device 52 and cold end radiator 53,
In, the cold end face of second semiconductor refrigeration chip 5 is provided with cold end radiator 53, second semiconductor refrigeration chip 5
Hot junction face be provided with hot-side heat dissipation device 52, the cold end radiator 53 is located in the storing cavity in the heat conduction liner 100,
The hot-side heat dissipation device 52 is located at 100 outside of the heat conduction liner, and humidity sensor is additionally provided in the heat conduction liner 100
（It is not shown）.Specifically, in dehumidification process, the second semiconductor refrigeration chip 5 is powered, 5 cold end of the second semiconductor refrigeration chip
For the cold that face generates by 53 released cold quantity of cold end radiator, the temperature of cold end radiator 53 is lower than the temperature in storage chamber body,
Therefore, the moisture in storage chamber body in air will condense on cold end radiator 53, to realize dehumidification operation.Wherein, it is
It is easily installed, dehumidifying module 400 further includes trivet 51, and trivet 51 is provided with installation through-hole, the second semiconductor system
Cold core piece 5 is arranged in the installation through-hole, and the sealing of the trivet 51 is embedded into the insertion mouth that heat conduction liner 100 opens up,
In this way, embedded mouth is on the one hand sealed by trivet 51, it on the other hand can be to avoid hot-side heat dissipation device 52 in heat conduction liner 100
The temperature in portion impacts.Preferably, the bottom of the cold end radiator 53 is provided with drip tray 54, specifically, cold end radiates
The condensed water formed on device 53 is flowed under the effect of gravity in the drip tray 54 of bottom, and the bottom of drip tray 54 is connected with draining
Pipe, the drainpipe extend out to the external of heat conduction liner 100 and realize discharge condensed water outside.Wherein, cold end radiator 53 is heat conduction
Plate, a surface of the heat-conducting plate stick on the cold end face of the second semiconductor refrigeration chip 5, on another surface on be provided with it is a plurality of
The radiating fin being vertically arranged（It is unmarked）, radiating fin on the one hand can increase and the contact area of air, improves dehumidification by condensation
Efficiency, on the other hand, radiating fin, which is vertically arranged, can facilitate condensed water trickling on earth in the drip tray 54 in portion.Radiating fin
Bottom be pyramidal structure, the point of pyramidal structure may insure that condensing drip is fallen in this way towards the drip tray 54 of bottom
It is collected in drip tray 54, and the surface of radiating fin is provided with hydrophobic membrane, to improve condensed water in cooling fin surfaces
Flowing velocity avoids condensed water icing or frosting on radiating fin for a long time.In addition, in order to improve dehumidification efficiency, dehumidifying
Module 400 further includes fan housing 61 and fan 6, and first circulation air port and second circulation air port are provided on the fan housing 61, described
Fan housing 61 is fixed on the heat conduction liner 100 and covers in the cold end radiator 53, and the fan 6 is located at the fan housing 61
In the cavity body structure formed between the heat conduction liner 100, the air and cold end in storing cavity can be humidified by fan
Radiator 53 contacts, and improves dehumidification efficiency.
Wherein, humidification module 300, dehumidifying module 400 can be independently operated, and can also be used cooperatively, humidify module
300 and dehumidifying module 400 operation controlled by the humidity sensor being arranged in storage chamber body.For simultaneously using humidification module
300 and dehumidifying module 400 in the case of, the condensed water in drip tray 54 can be drained into water box 4 by drainpipe into enforcement
With.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features；
And these modifications or replacements, the spirit for the present invention embodiment technical solution that it does not separate the essence of the corresponding technical solution and
Range.
Claims (10)
1. a kind of solid-state refrigerating plant, including heat conduction liner, which is characterized in that further include semiconductor refrigerating module and dehumidifying mould
Group；The semiconductor refrigerating module includes the first semiconductor refrigeration chip and heat pipe, and first semiconductor refrigeration chip includes
The hot junction face in the cold end face and release heat of released cold quantity, which is characterized in that further include assembling module, the assembling module includes
First heat-insulating bracket, the second heat-insulating bracket, hot junction heat-conducting seat and cold end heat-conducting seat, first heat-insulating bracket are fixed on described
Installation cavity is formed on two heat-insulating brackets, between first heat-insulating bracket and second heat-insulating bracket, described first is heat-insulated
Holder offers the mounting hole for being connected to the installation cavity, and first semiconductor refrigeration chip is located in the mounting hole, institute
Cold end heat-conducting seat is stated to be arranged in the installation cavity and contact with the cold end face of first semiconductor refrigeration chip, the heat
End heat-conducting seat is arranged on first heat-insulating bracket and is contacted with the hot junction face of first semiconductor refrigeration chip, the heat
Pipe connects the cold end heat-conducting seat, and the heat pipe of the semiconductor refrigerating module is attached to the surface of the heat conduction liner；The dehumidifying
Module includes the second semiconductor refrigeration chip, and the cold end face of second semiconductor refrigeration chip is provided with cold end radiator, institute
The hot junction face for stating the second semiconductor refrigeration chip is provided with hot-side heat dissipation device, and the cold end radiator is located at the heat conduction liner
In, the hot-side heat dissipation device is located at outside the heat conduction liner, and humidity sensor is additionally provided in the heat conduction liner.
2. solid-state refrigerating plant according to claim 1, which is characterized in that the dehumidifying module further includes trivet, institute
It states trivet and is provided with installation through-hole, second semiconductor refrigeration chip is arranged in the installation through-hole；In the heat conduction
Embedded mouth is offered on courage, the trivet sealing is in the embedded mouth.
3. solid-state refrigerating plant according to claim 1, which is characterized in that the dehumidifying module further includes fan housing and wind
It fans, is provided with first circulation air port and second circulation air port on the fan housing, the fan housing is fixed on the heat conduction liner simultaneously
The cold end radiator is covered in, in the cavity body structure that the fan is formed between the fan housing and the heat conduction liner.
4. solid-state refrigerating plant according to claim 1, which is characterized in that the humidification module includes water box, humidification bubble
Cotton, upper cover and wind turbine, the humidification foam are located in the water box, and the upper cover covers on the top of the water box, it is described on
It covers and is provided with air inlet and air outlet, the wind turbine covers in the air inlet or the air outlet, and the water box setting exists
In the heat conduction liner.
5. solid-state refrigerating plant according to claim 4, which is characterized in that the bottom of the cold end radiator, which is provided with, to be connect
Water pond, the drip tray are connect by drainpipe with the water box.
6. solid-state refrigerating plant according to claim 1, which is characterized in that the outer surface of first heat-insulating bracket is around institute
It states mounting hole and is provided with heat dam, heat insulation foam is provided in the heat dam；The hot junction face of first semiconductor refrigeration chip
It outwardly protrudes in the outer surface of first heat-insulating bracket.
7. solid-state refrigerating plant according to claim 1, which is characterized in that be provided with evacuation on the cold end heat-conducting seat and lack
Mouthful, it is respectively arranged with through-hole on first heat-insulating bracket, second heat-insulating bracket and the hot junction heat-conducting seat, bolt is worn
In the corresponding through-hole, the bolt is formed by region across the evacuation notch.
8. solid-state refrigerating plant according to claim 1, which is characterized in that the cold end heat-conducting seat includes linking together
The first heat-conducting plate and the second heat-conducting plate, the heat pipe is clipped between first heat-conducting plate and second heat-conducting plate.
9. solid-state refrigerating plant according to claim 8, which is characterized in that the inner surface of first heat-conducting plate offers
The inner surface of the first mounting groove being laterally arranged, second heat-conducting plate offers the second longitudinally disposed mounting groove, the heat
Pipe is divided into lateral flat hot pipe and longitudinally flattened heat pipe, and the transverse direction flat hot pipe is arranged in first mounting groove, described
Longitudinally flattened heat pipe is arranged in second mounting groove, also, the lateral flat hot pipe and the longitudinally flattened heat pipe phase
Mutually contact.
10. solid-state refrigerating plant according to claim 1, which is characterized in that the inner surface of first heat-insulating bracket is set
It is equipped with the first tube seat for installing the heat pipe, the edge of second heat-insulating bracket is provided with to be passed through for the heat pipe
Notch or through hole or the second tube seat.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710295280 | 2017-04-28 | ||
| CN2017102952807 | 2017-04-28 |
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| CN108679877A true CN108679877A (en) | 2018-10-19 |
| CN108679877B CN108679877B (en) | 2022-03-22 |
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|---|---|---|---|
| CN201711089391.9A Active CN108800656B (en) | 2017-04-28 | 2017-11-08 | Semiconductor refrigeration module and refrigeration equipment |
| CN201711459711.5A Active CN108375274B (en) | 2017-04-28 | 2017-12-28 | Mixed refrigeration type multifunctional wine cabinet |
| CN201711457945.6A Active CN108397959B (en) | 2017-04-28 | 2017-12-28 | Mixed refrigeration type refrigeration equipment |
| CN201711461857.3A Active CN108375276B (en) | 2017-04-28 | 2017-12-28 | Semiconductor refrigeration equipment |
| CN201810391986.8A Active CN108731298B (en) | 2017-04-28 | 2018-04-27 | Solid-state refrigeration equipment |
| CN201810393836.0A Active CN108917256B (en) | 2017-04-28 | 2018-04-27 | Semiconductor refrigeration equipment |
| CN201810391975.XA Active CN108895705B (en) | 2017-04-28 | 2018-04-27 | Refrigeration device |
| CN201810393866.1A Active CN108709335B (en) | 2017-04-28 | 2018-04-27 | Semiconductor refrigerating device |
| CN201810392900.3A Active CN108679877B (en) | 2017-04-28 | 2018-04-27 | Solid-state refrigerating device |
Family Applications Before (8)
| Application Number | Title | Priority Date | Filing Date |
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| CN201711089391.9A Active CN108800656B (en) | 2017-04-28 | 2017-11-08 | Semiconductor refrigeration module and refrigeration equipment |
| CN201711459711.5A Active CN108375274B (en) | 2017-04-28 | 2017-12-28 | Mixed refrigeration type multifunctional wine cabinet |
| CN201711457945.6A Active CN108397959B (en) | 2017-04-28 | 2017-12-28 | Mixed refrigeration type refrigeration equipment |
| CN201711461857.3A Active CN108375276B (en) | 2017-04-28 | 2017-12-28 | Semiconductor refrigeration equipment |
| CN201810391986.8A Active CN108731298B (en) | 2017-04-28 | 2018-04-27 | Solid-state refrigeration equipment |
| CN201810393836.0A Active CN108917256B (en) | 2017-04-28 | 2018-04-27 | Semiconductor refrigeration equipment |
| CN201810391975.XA Active CN108895705B (en) | 2017-04-28 | 2018-04-27 | Refrigeration device |
| CN201810393866.1A Active CN108709335B (en) | 2017-04-28 | 2018-04-27 | Semiconductor refrigerating device |
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| WO (1) | WO2018196679A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111197908A (en) * | 2018-11-19 | 2020-05-26 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigeration wine cabinet with dehumidification function and dehumidification method |
| CN111197907A (en) * | 2018-11-19 | 2020-05-26 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigeration wine cabinet with dehumidification function and dehumidification method |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111928520A (en) * | 2020-07-03 | 2020-11-13 | 中国计量大学 | Fixing structure for heat conducting block and cold conducting block of semiconductor refrigerating device |
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| CN114501935A (en) * | 2022-01-13 | 2022-05-13 | 深圳市迈科龙生物技术有限公司 | Temperature control device and dry-type fluorescence immunoassay appearance incubator |
| CN118089309B (en) * | 2024-04-23 | 2024-07-09 | 泉州市乐泉制冷设备有限公司 | Novel energy-saving refrigeration equipment |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09172203A (en) * | 1995-12-18 | 1997-06-30 | Aisin Seiki Co Ltd | Thermoelectric conversion equipment |
| US5865031A (en) * | 1996-05-29 | 1999-02-02 | Aisin Seiki Kabushiki Kaisha | Heat exchange device having thermoelectric device |
| CN2658653Y (en) * | 2003-07-31 | 2004-11-24 | 刘富林 | Semiconductor refrigerating adiabatic structure |
| US20060000221A1 (en) * | 2004-07-01 | 2006-01-05 | The Coleman Company, Inc. | Insulated container with thermoelectric unit |
| CN2783219Y (en) * | 2004-11-24 | 2006-05-24 | 温耀生 | Thermoelectric refrigerating module |
| CN2830989Y (en) * | 2005-07-15 | 2006-10-25 | 佛山市顺德区富信制冷设备有限公司 | Novel thermoelectric refrigerating modular structure |
| CN201014879Y (en) * | 2007-03-29 | 2008-01-30 | 黄龙 | Wine chest with humidity control device |
| CN101158521A (en) * | 2007-11-11 | 2008-04-09 | 海南瑞尔电子科技有限公司 | semi-conductor temperature and moisture controlling device |
| CN203163332U (en) * | 2013-01-19 | 2013-08-28 | 广东科荣电器有限公司 | Novel heat transfer device for electronic refrigerator or wine cabinet |
| CN104329853A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329870A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Cold transferring and heat dissipating modular component, assembling method thereof and semiconductor refrigerator |
| CN104501498A (en) * | 2014-12-18 | 2015-04-08 | 合肥华凌股份有限公司 | Refrigerator |
| CN204373262U (en) * | 2014-12-01 | 2015-06-03 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment |
| CN106123659A (en) * | 2016-08-12 | 2016-11-16 | 中山市凯得电器有限公司 | The heat pipe of a kind of Electronic Wine Cabinet and cold and hot generating means |
| CN106403356A (en) * | 2016-10-09 | 2017-02-15 | 珠海格力电器股份有限公司 | Semiconductor refrigeration heat dissipation assembly, assembly method thereof and refrigeration equipment |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2141662Y (en) * | 1992-09-28 | 1993-09-08 | 王焕年 | Multipurpose cabinet |
| CN2206427Y (en) * | 1994-06-22 | 1995-08-30 | 马泽民 | Multifunctional refrigerator and freezing cabinet |
| CN2359640Y (en) * | 1999-02-01 | 2000-01-19 | 广东科龙电器股份有限公司 | Combined rifrigerator |
| US6430936B1 (en) * | 2001-12-06 | 2002-08-13 | International Business Machines Corporation | Photonic microheatpipes |
| CN2722146Y (en) * | 2004-06-29 | 2005-08-31 | 河南新飞电器有限公司 | Assembled refrigerator with multiple doors and internal linings |
| JP2006032754A (en) * | 2004-07-20 | 2006-02-02 | Nitto Electric Works Ltd | Board cooler |
| US7337620B2 (en) * | 2005-05-18 | 2008-03-04 | Whirlpool Corporation | Insulated ice compartment for bottom mount refrigerator |
| CN2937955Y (en) * | 2006-08-01 | 2007-08-22 | 陈尊山 | Multifunction multi-temp zone semiconductor refrigeration (heating) themal insulation cabinet |
| CN1996631B (en) * | 2006-12-26 | 2010-09-08 | 广东富信电子科技有限公司 | Heat radiation system |
| JP5533074B2 (en) * | 2010-03-16 | 2014-06-25 | パナソニック株式会社 | refrigerator |
| CN201731713U (en) * | 2010-05-24 | 2011-02-02 | 合肥美的荣事达电冰箱有限公司 | Multiple temperature zone air duct system and refrigerator with same |
| CN102538283B (en) * | 2012-02-07 | 2014-11-26 | 合肥美的电冰箱有限公司 | Refrigerating equipment, refrigerating device for refrigerating equipment and control method |
| CN202452788U (en) * | 2012-02-28 | 2012-09-26 | 汪贤勇 | Semiconductor refrigeration wine cabinet with multiple temperature zones |
| CN102682963B (en) * | 2012-05-23 | 2016-04-27 | 国家电网公司 | A kind of semiconductor refrigeration transformer |
| CN202993715U (en) * | 2012-08-06 | 2013-06-12 | 浙江日普电子科技有限公司 | Combined refrigerator |
| CN104930890B (en) * | 2014-03-19 | 2017-01-18 | 海尔集团公司 | Heat exchanger and semi-conductor wine cabinet |
| CN104329866B (en) * | 2014-03-28 | 2017-02-15 | 海尔集团公司 | Semiconductor refrigeration refrigerator and cold end heat exchange device thereof |
| CN104329847B (en) * | 2014-03-28 | 2017-01-04 | 海尔集团公司 | A kind of semiconductor freezer and installation method thereof |
| CN203964503U (en) * | 2014-06-04 | 2014-11-26 | 宁波余通电器有限公司 | Multifunctional refrigerator |
| CN104329871B (en) * | 2014-08-29 | 2017-01-18 | 青岛海尔股份有限公司 | Semi-conductor refrigeration refrigerator and cold end heat exchanging device thereof |
| CN104215013B (en) * | 2014-09-03 | 2016-09-14 | 四川长虹电器股份有限公司 | Modular combination refrigerator and control method thereof |
| CN105716365B (en) * | 2014-12-01 | 2018-09-07 | 青岛海尔特种电冰柜有限公司 | Semiconductor wine cabinet |
| CN105650933B (en) * | 2014-12-01 | 2018-10-09 | 青岛海尔特种电冰柜有限公司 | The refrigerating method of semiconductor refrigerating equipment |
| CN105716315B (en) * | 2014-12-01 | 2018-09-07 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment |
| CN204373306U (en) * | 2014-12-01 | 2015-06-03 | 青岛海尔特种电冰柜有限公司 | Refrigeration plant casing and semiconductor refrigerating equipment |
| CN204555502U (en) * | 2015-03-17 | 2015-08-12 | 合肥美的电冰箱有限公司 | Refrigerator and ducting system thereof |
| CN205048780U (en) * | 2015-09-10 | 2016-02-24 | 东莞市金河田实业有限公司 | Semiconductor refrigerating assembly |
| CN106524567A (en) * | 2016-12-26 | 2017-03-22 | 华南理工大学 | Box-type semi-conductor refrigerating device |
| CN106766348A (en) * | 2017-01-17 | 2017-05-31 | 中国科学院深圳先进技术研究院 | A kind of semiconductor freezer |
| CN209840455U (en) * | 2019-03-29 | 2019-12-24 | 江苏中科新源半导体科技有限公司 | Energy-saving heat dissipation structure of semiconductor direct cooling device |
-
2017
- 2017-11-08 CN CN201711089391.9A patent/CN108800656B/en active Active
- 2017-12-28 CN CN201711459711.5A patent/CN108375274B/en active Active
- 2017-12-28 CN CN201711457945.6A patent/CN108397959B/en active Active
- 2017-12-28 CN CN201711461857.3A patent/CN108375276B/en active Active
-
2018
- 2018-04-19 WO PCT/CN2018/083811 patent/WO2018196679A1/en active Application Filing
- 2018-04-27 CN CN201810391986.8A patent/CN108731298B/en active Active
- 2018-04-27 CN CN201810393836.0A patent/CN108917256B/en active Active
- 2018-04-27 CN CN201810391975.XA patent/CN108895705B/en active Active
- 2018-04-27 CN CN201810393866.1A patent/CN108709335B/en active Active
- 2018-04-27 CN CN201810392900.3A patent/CN108679877B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09172203A (en) * | 1995-12-18 | 1997-06-30 | Aisin Seiki Co Ltd | Thermoelectric conversion equipment |
| US5865031A (en) * | 1996-05-29 | 1999-02-02 | Aisin Seiki Kabushiki Kaisha | Heat exchange device having thermoelectric device |
| CN2658653Y (en) * | 2003-07-31 | 2004-11-24 | 刘富林 | Semiconductor refrigerating adiabatic structure |
| US20060000221A1 (en) * | 2004-07-01 | 2006-01-05 | The Coleman Company, Inc. | Insulated container with thermoelectric unit |
| CN2783219Y (en) * | 2004-11-24 | 2006-05-24 | 温耀生 | Thermoelectric refrigerating module |
| CN2830989Y (en) * | 2005-07-15 | 2006-10-25 | 佛山市顺德区富信制冷设备有限公司 | Novel thermoelectric refrigerating modular structure |
| CN201014879Y (en) * | 2007-03-29 | 2008-01-30 | 黄龙 | Wine chest with humidity control device |
| CN101158521A (en) * | 2007-11-11 | 2008-04-09 | 海南瑞尔电子科技有限公司 | semi-conductor temperature and moisture controlling device |
| CN203163332U (en) * | 2013-01-19 | 2013-08-28 | 广东科荣电器有限公司 | Novel heat transfer device for electronic refrigerator or wine cabinet |
| CN104329870A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Cold transferring and heat dissipating modular component, assembling method thereof and semiconductor refrigerator |
| CN104329853A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN204373262U (en) * | 2014-12-01 | 2015-06-03 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment |
| CN104501498A (en) * | 2014-12-18 | 2015-04-08 | 合肥华凌股份有限公司 | Refrigerator |
| CN106123659A (en) * | 2016-08-12 | 2016-11-16 | 中山市凯得电器有限公司 | The heat pipe of a kind of Electronic Wine Cabinet and cold and hot generating means |
| CN106403356A (en) * | 2016-10-09 | 2017-02-15 | 珠海格力电器股份有限公司 | Semiconductor refrigeration heat dissipation assembly, assembly method thereof and refrigeration equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111197908A (en) * | 2018-11-19 | 2020-05-26 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigeration wine cabinet with dehumidification function and dehumidification method |
| CN111197907A (en) * | 2018-11-19 | 2020-05-26 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigeration wine cabinet with dehumidification function and dehumidification method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108397959B (en) | 2020-12-15 |
| CN108895705B (en) | 2022-03-22 |
| CN108917256A (en) | 2018-11-30 |
| CN108731298A (en) | 2018-11-02 |
| CN108709335A (en) | 2018-10-26 |
| CN108731298B (en) | 2022-03-22 |
| CN108375274B (en) | 2020-08-18 |
| CN108800656B (en) | 2020-09-08 |
| CN108375276A (en) | 2018-08-07 |
| CN108709335B (en) | 2022-03-22 |
| CN108917256B (en) | 2022-03-22 |
| CN108895705A (en) | 2018-11-27 |
| CN108397959A (en) | 2018-08-14 |
| CN108375276B (en) | 2020-12-04 |
| CN108679877B (en) | 2022-03-22 |
| CN108800656A (en) | 2018-11-13 |
| CN108375274A (en) | 2018-08-07 |
| WO2018196679A1 (en) | 2018-11-01 |
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