CN108397959A - Hybrid refrigeration formula refrigeration equipment - Google Patents
Hybrid refrigeration formula refrigeration equipment Download PDFInfo
- Publication number
- CN108397959A CN108397959A CN201711457945.6A CN201711457945A CN108397959A CN 108397959 A CN108397959 A CN 108397959A CN 201711457945 A CN201711457945 A CN 201711457945A CN 108397959 A CN108397959 A CN 108397959A
- Authority
- CN
- China
- Prior art keywords
- heat
- module
- air
- partition
- air inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005057 refrigeration Methods 0.000 title claims abstract description 113
- 239000004065 semiconductor Substances 0.000 claims abstract description 53
- 238000005192 partition Methods 0.000 claims description 64
- 238000009434 installation Methods 0.000 claims description 45
- 239000006260 foam Substances 0.000 claims description 28
- 238000007710 freezing Methods 0.000 claims description 22
- 230000008014 freezing Effects 0.000 claims description 22
- 238000001704 evaporation Methods 0.000 claims description 16
- 230000008020 evaporation Effects 0.000 claims description 16
- 210000000078 claw Anatomy 0.000 claims description 15
- 230000003014 reinforcing effect Effects 0.000 claims description 14
- 238000009423 ventilation Methods 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 5
- 239000002937 thermal insulation foam Substances 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 description 32
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 3
- 239000002360 explosive Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000010025 steaming Methods 0.000 description 2
- 238000010257 thawing Methods 0.000 description 2
- 235000014101 wine Nutrition 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 235000020095 red wine Nutrition 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/042—Air treating means within refrigerated spaces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/04—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with more than one refrigeration unit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/14—Collecting or removing condensed and defrost water; Drip trays
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D25/00—Charging, supporting, and discharging the articles to be cooled
- F25D25/02—Charging, supporting, and discharging the articles to be cooled by shelves
- F25D25/024—Slidable shelves
- F25D25/025—Drawers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
- F25D31/002—Liquid coolers, e.g. beverage cooler
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
- F25D2317/04—Treating air flowing to refrigeration compartments
- F25D2317/041—Treating air flowing to refrigeration compartments by purification
- F25D2317/0411—Treating air flowing to refrigeration compartments by purification by dehumidification
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
- F25D2317/04—Treating air flowing to refrigeration compartments
- F25D2317/041—Treating air flowing to refrigeration compartments by purification
- F25D2317/0413—Treating air flowing to refrigeration compartments by purification by humidification
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of hybrid refrigeration formula refrigeration equipments, including the upper box and lower box arranged up and down, the upper box and the lower box are linked together by the connect band component, also, are provided with storing cavity in the connect band component；It is provided with semiconductor refrigerating module in the upper box, ducting assembly is provided in the lower box.Function of containing articles diversification is realized, to improve user experience.
Description
Technical field
The present invention relates to refrigeration equipment more particularly to a kind of hybrid refrigeration formula refrigeration equipments.
Background technology
Currently, the incubator of wine cabinet generally includes babinet and door body, and multiple warm areas are conventionally divided into babinet, usually
In the case of, it is spaced apart between different warm areas by keeping the temperature partition, such as：China Patent No. 201410711305.3 discloses
A kind of semiconductor wine cabinet carries out patent using semiconductor refrigerating technology, and upper and lower two liners need to be spaced apart by keeping the temperature isolation.
But the storage space of cabinet is used to freeze, having a single function.How a kind of functional diversities are designed to improve user experience
The refrigeration equipment of property is the technical problems to be solved by the invention.
Invention content
The present invention provides a kind of hybrid refrigeration formula refrigeration equipments, cabinet functional diversities are realized, to improve user experience
Property.
To reach above-mentioned technical purpose, the present invention is realized using following technical scheme：
A kind of hybrid refrigeration formula refrigeration equipment, including the upper box and lower box arranged up and down, the upper box and the nowel
Body is linked together by the connect band component, also, is provided with storing cavity in the connect band component；The upper box
In be provided with semiconductor refrigerating module, be provided with ducting assembly in the lower box.
Further, the upper box includes upper shell and upper inner-liner, and the lower box includes lower casing and bottom inner container, institute
It is heat conduction courage body to state upper inner-liner, and the connect band component includes that the connect band component includes two supporting racks, front panel and pumping
Drawer component is connected between the upper shell and the respective side of the lower casing by support frame as described above, the upper inner-liner and institute
It states bottom inner container to connect by the front panel, the front panel is made of heat-insulating material, and the drawer appliance is located on described
Between babinet and the lower box, the drawer appliance includes that installation bucket and drawer, the drawer are slidably set by sliding rail
It sets in the installation bucket, the installation bucket is fixed on the front panel, and the front panel is offered to be passed through for the drawer
Through-hole；It is provided with the semiconductor refrigerating module outside the upper inner-liner, the ducting assembly is provided in the bottom inner container.
Further, the semiconductor refrigerating module includes semiconductor refrigeration chip, heat pipe and assembles module, described partly to lead
Body refrigerating chip includes the hot junction face in the cold end face and release heat of released cold quantity, and the assembling module includes the first heat-insulated branch
Frame, the second heat-insulating bracket, hot junction heat-conducting seat and cold end heat-conducting seat, first heat-insulating bracket are fixed on second heat-insulating bracket
On, installation cavity is formed between first heat-insulating bracket and second heat-insulating bracket, first heat-insulating bracket offers
It is connected to the mounting hole of the installation cavity, the semiconductor refrigeration chip is located in the mounting hole, and the cold end heat-conducting seat is set
It sets in the installation cavity and is contacted with the cold end face of the semiconductor refrigeration chip, the hot junction heat-conducting seat is arranged described
It being contacted on first heat-insulating bracket and with the hot junction face of the semiconductor refrigeration chip, the heat pipe connects the cold end heat-conducting seat,
The heat pipe is attached on the corresponding upper inner-liner.
Further, the outer surface of first heat-insulating bracket is provided with heat dam, the heat dam around the mounting hole
In be provided with heat insulation foam；The hot junction of the semiconductor refrigeration chip faces out the outer surface for protruding from first heat-insulating bracket.
Further, the cold end heat-conducting seat includes the first heat-conducting plate and the second heat-conducting plate to link together, the heat
Pipe clamp is between first heat-conducting plate and second heat-conducting plate.
Further, the inner surface of first heat-conducting plate offers the first mounting groove being laterally arranged, and described second leads
The inner surface of hot plate offers the second longitudinally disposed mounting groove, and the heat pipe is divided into lateral flat hot pipe and longitudinally flattened heat
Pipe, the transverse direction flat hot pipe are arranged in first mounting groove, and the longitudinally flattened heat pipe setting is in second installation
In slot, also, the lateral flat hot pipe contacts with each other with the longitudinally flattened heat pipe.
Further, the ducting assembly includes allocation of the amount of air module, lower partition module and wind turbine；The allocation of the amount of air mould
Block and the lower partition module are arranged in the bottom inner container, and the bottom inner container is divided by the lower partition module from the bottom to top
Freezing chamber and refrigerating chamber, the allocation of the amount of air module are vertically provided at the top of the lower partition module, the allocation of the amount of air mould
The evaporation cavity for installing the evaporator is formed between block, the lower partition module and the liner of the babinet, it is described
Allocation of the amount of air module is provided with the total air inlet for being connected to the evaporation cavity and total return air inlet, and the evaporator is arranged in the steaming
It sends out in cavity and between total air inlet and total return air inlet, the wind turbine is arranged on total air inlet；Institute
The air-supply passage for being additionally provided in allocation of the amount of air module and being connected to total air inlet is stated, is additionally provided in the allocation of the amount of air module
It is connected to the return air channel of total return air inlet, first that the connection air-supply passage is additionally provided in the allocation of the amount of air module goes out
Air port and the first return air inlet for being connected to the return air channel；It is logical that the bottom of the lower partition module is additionally provided with the connection air-supply
The bottom of second air outlet in road, the lower partition module is additionally provided with the second return air inlet for being connected to the evaporation cavity.
Further, the allocation of the amount of air module includes front shroud, back shroud and the first foams, first foams
It is arranged between the front shroud and the back shroud, first air outlet and first time described is provided on the front shroud
Air port is provided with total air inlet and total return air inlet on the back shroud, is formed in first foams described
Air-supply passage is also formed with the return air channel in first foams；The lower partition module includes upper cover plate, lower plate
With the second foams, the first mounting hole has been opened on the upper cover plate, the second mounting hole, institute have been opened on the lower plate
It states and offers ventilation hole on the second foams, first partition is provided in first mounting hole, is set in second mounting hole
It is equipped with second partition, second foams are arranged between the upper cover plate and the lower plate, the first partition and institute
Second partition is stated to overlap, the first partition and the second partition by the ventilation hole be divided into the first ventilating duct and
Second mounting hole is divided into second air outlet and second return air inlet by the second ventilating duct, the second partition,
First ventilating duct is connected to the air-supply passage, and second ventilating duct is connected to the evaporation cavity.
Further, in the lower end both sides of the upper shell and the upper end both sides of the lower casing are respectively arranged with
Folded edges, support frame as described above are connected with the corresponding inside edge structure.
Further, the upper and lower part of support frame as described above is respectively arranged with installation slot, and the inside edge structure clamps
In the corresponding installation slot, claw is provided in the installation slot, be provided in the inside edge structure with it is described
The card slot of claw cooperation, the claw are stuck in the card slot, and reinforcing rib, the reinforcing rib are additionally provided in the installation slot
It misplaces with the claw positioned opposite, clamping space is formed between the reinforcing rib and the inner wall of the installation slot.
Compared with prior art, the advantages and positive effects of the present invention are：By passing through connect band between two babinets
Component is attached, and on the one hand connect band component can link together two babinets are solid and reliable, bottom inner container in guarantee
It is adiabatic to be also formed with storage space in connect band component simultaneously, meet the diversified requirement of function of containing articles, to improve user
Experience property；And have for upper box configuring semiconductor refrigeration module, in semiconductor refrigerating module operational process preferable mute
Characteristic, it can be ensured that the red wine stored in upper box obtains more Conservation environment, and lower box is for conventional refrigeration freezing storage
Object, refrigeration that can be rapidly and efficiently by ducting assembly are more advantageous to raising user experience.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Some bright embodiments for those of ordinary skill in the art without having to pay creative labor, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram of hybrid refrigeration formula refrigeration equipment embodiment of the present invention;
Fig. 2 is the explosive view of hybrid refrigeration formula refrigeration equipment embodiment of the present invention；
Fig. 3 is the partial assembly drawing of supporting rack and shell in hybrid refrigeration formula refrigeration equipment embodiment of the present invention；
Fig. 4 is the partial assembly drawing of front panel and liner in hybrid refrigeration formula refrigeration equipment embodiment of the present invention；
Fig. 5 is the partial structural diagram of supporting rack in hybrid refrigeration formula refrigeration equipment embodiment of the present invention；
Fig. 6 is the assembling figure of upper inner-liner and semiconductor refrigerating module in hybrid refrigeration formula refrigeration equipment embodiment of the present invention；
Fig. 7 is the structural schematic diagram of semiconductor refrigerating module in hybrid refrigeration formula refrigeration equipment of the present invention;
Fig. 8 is the positive structure schematic of the first thermal insulation board in hybrid refrigeration formula refrigeration equipment of the present invention；
Fig. 9 is the reverse structure schematic of the first thermal insulation board in hybrid refrigeration formula refrigeration equipment of the present invention；
Figure 10 is the positive structure schematic of second thermal insulation board of hybrid refrigeration formula refrigeration equipment of the present invention；
Figure 11 is the reverse structure schematic of the second thermal insulation board in hybrid refrigeration formula refrigeration equipment of the present invention；
Figure 12 is the structural schematic diagram of the first heat-conducting plate in hybrid refrigeration formula refrigeration equipment of the present invention；
Figure 13 is the structural schematic diagram of the second heat-conducting plate in hybrid refrigeration formula refrigeration equipment of the present invention；
Figure 14 is the partial exploded view of semiconductor refrigerating module in hybrid refrigeration formula refrigeration equipment of the present invention；
Figure 15 is the assembling figure of bottom inner container and ducting assembly in hybrid refrigeration formula refrigeration equipment embodiment of the present invention；
Figure 16 is the explosive view of air quantity distribution module in hybrid refrigeration formula refrigeration equipment embodiment of the present invention；
Figure 17 is the explosive view of lower partition module in hybrid refrigeration formula refrigeration equipment embodiment of the present invention；
Figure 18 is the sectional view one of semiconductor refrigerating module in hybrid refrigeration formula refrigeration equipment embodiment of the present invention；
Figure 19 is the sectional view two of semiconductor refrigerating module in hybrid refrigeration formula refrigeration equipment embodiment of the present invention.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
The every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As shown in Fig. 1-Figure 19, the present embodiment hybrid refrigeration formula refrigeration equipment, including upper box 1 and lower box 2, further include
Connect band component 3, the upper box 1 and the lower box 2 are linked together by the connect band component 3, also, the company
Storing cavity is provided in tape splicing component 3.Wherein, upper box 1 includes upper shell 11 and upper inner-liner 12, and the lower box 2 is arranged
There are lower casing 21 and bottom inner container 22, upper inner-liner 12 to use heat conduction courage body；3 two supporting racks 31 of connect band component, 32 and of front panel
Drawer appliance, front panel 32 and drawer appliance, by described between the upper shell 11 and the respective side of the lower casing 12
Supporting rack 31 connects, and the upper inner-liner 12 and the bottom inner container 22 are connected by the front panel 32, and the front panel 32 uses
Heat-insulating material is made, and for the drawer appliance between the upper box 1 and the lower box 2, the drawer appliance includes peace
Barrelling 33 and drawer 34, the drawer 34 are slidably disposed in by sliding rail in the installation bucket 33, and the installation bucket 33 is solid
Be scheduled on the front panel 32, the front panel 32 offer for the drawer 34 by through-hole 321；On the upper inner-liner 12
Configured with semiconductor refrigerating module 4, ducting assembly 5 is configured in the bottom inner container 22.
Specifically, the present embodiment hybrid refrigeration formula refrigeration equipment uses two babinets independently to foam, i.e. 1 He of upper box
Lower box 2, and fixation is attached by connect band component 3 between upper box 1 and lower box 2, it is formed in connect band component 3
Storing cavity can be used for storing, to realize the function of containing articles design of cabinet.Upper shell 11 and the lower casing
12 are attached fixation by the supporting rack 31 being respectively arranged in both sides, and supporting rack 31 can connect from both sides by upper and lower two babinets
It connects and is fixed together, meanwhile, storing cavity is just formed between two babinets between supporting rack 31 is used for storing；And upper shell 11
Lower end both sides and the upper end both sides of the lower casing 21 be respectively arranged with inside edge structure（It is not shown）, the support
Frame 31 is connected with the corresponding inside edge structure, and shell generally use metal plate is made, and structural strength is larger, disclosure satisfy that connection
The requirement of intensity；And personnel assemble in order to facilitate the operation, the upper and lower part of supporting rack 31 is respectively arranged with installation slot
311, the inside edge structure 111 is installed in the corresponding installation slot；Further, it is set in the installation slot 311
It is equipped with claw 312, the card slot coordinated with the claw 312 is provided in the inside edge structure, the claw 312 is stuck in described
In card slot, coordinated by claw 312 and card slot, realizes that inside edge structure is installed on supporting rack 31, to be conveniently operated personnel
Live Fast Installation, and in order to improve connection reliability, it installs in slot 311 and is additionally provided with reinforcing rib 313, the reinforcing rib
313 misplace with the claw 312 it is positioned opposite, the reinforcing rib 313 and it is described installation slot 31 inner wall between formed clamp
Space, specifically, since the size of installation slot 311 is larger, after interior folded edges are inserted into installation slot 311, infolding
Side structure can move up and down in installing slot 311, and can be to being inserted into installation slot 311 by reinforcing rib 313
Inside edge structure is limited so that inside edge structure is reinforced muscle 313 and installs the surface clamping of slot 311, to avoid
Inside edge structure moves up and down in installing slot 311, to improve connection reliability, and smoothly will for the ease of operating personnel
Inside edge structure is inserted into installation slot 311, and reinforcing rib 313 is provided with inclined surface close to the position that installation slot 311 is open
（It is unmarked）, inclined surface can guide inside edge structure to be entered in clamping space along reinforcing rib 313, pass through reinforcing rib 313
Limitation inside edge structure moves up and down, and realizes that the horizontal direction of inside edge structure moves by claw 312 and card slot cooperation, carries
High connecting reliability.By taking the inside edge structure of upper box 1 and supporting rack 31 are attached as an example：11 bottom of shell of upper box 1
It is provided with inside edge structure 111, inside edge structure 111 is inserted into the installation slot 311 of supporting rack 31, inside edge structure 111
During being inserted into installation slot 311, inside edge structure 111 by being directed into clamping space along reinforcing rib 313,
Also, corresponding be stuck in the card slot of inside edge structure 111 is completed to install by claw 312.And front panel 32 is used just to face storage
Object cavity is blocked, also, is provided with drawer appliance on front panel 32, storing is carried out using drawer 34, to facilitate user to make
Module 341 is played configured with pushing away with, wherein drawer 34, and module 341 is played by drawer 34 from installation bucket so that pushing away by pressing drawer 34
It is released in 33.Preferably, in order to improve the structural strength of front panel 32, the both sides of front panel 32, which are respectively arranged with, reinforces iron 321,
Screw sequentially passes through the front panel 32 and the reinforcement iron 321 is fixed on support frame as described above 31, specifically, front panel 32
Both sides, which are each configured with, reinforces iron 321, reinforces iron 321 and is fixed on together on corresponding supporting rack 31 with front panel 32, is reinforced
Iron 321 can effectively enhance the structural strength of front panel 32, reliably to install drawer appliance.Wherein, the upper shell 11
With the first locating slot for positioning the front panel 32 is provided on lower casing 21（It is unmarked）, the two of the front panel 32
Side is installed in first locating slot, and the lower edges of the front panel 32 are provided with the second locating slot 322, described
The top edge of the lower edge of upper inner-liner 12 and the bottom inner container 22 is inserted in corresponding second locating slot 322.Front
The surrounding of plate 32 is correspondingly connected with shell and liner respectively so that overall appearance effect is more preferable, and so that front panel 32 from
Front is connect with the shell of upper and lower box and liner, is more advantageous to raising overall construction intensity.
For semiconductor refrigerating module 4, semiconductor refrigerating module 4 includes semiconductor refrigeration chip 41 and heat pipe 42,
The semiconductor refrigeration chip 41 includes the hot junction face in the cold end face and release heat of released cold quantity, further includes assembling module 43,
The assembling module 43 includes the first thermal insulation board 431, the second thermal insulation board 432, hot junction heat-conducting seat 433 and cold end heat-conducting seat 434, institute
It states and is provided with the first groove 4311 on the inner surface of the first thermal insulation board 431, offered in first groove 4311 through described
The mounting hole 4312 of first thermal insulation board 431, the inner surface of second thermal insulation board 432 are provided with the second groove 4321, and described
One thermal insulation board 431 is fixed on second thermal insulation board 432, shape between first groove 4311 and second groove 4321
At installation cavity, the semiconductor refrigeration chip 41 is located in the mounting hole 4312, and the cold end heat-conducting seat 434 is arranged in institute
It states in installation cavity and is contacted with the cold end face of the semiconductor refrigeration chip 41, the hot junction heat-conducting seat 433 is arranged described
It is contacted on first thermal insulation board 431 and with the hot junction face of the semiconductor refrigeration chip 41, the heat pipe 42 connects the cold end and leads
Hot seat 434, and the heat pipe 2 of two semiconductor refrigerating modules 4 will bear against and be carried out on to corresponding upper inner-liner 12 and bottom inner container 22
The transmission of cold.Specifically, semiconductor refrigeration chip 41 is embedded in the mounting hole 4312 of the first thermal insulation board 431, semiconductor system
The periphery of cold core piece 41 is wrapped by the first thermal insulation board 431, also, by the first thermal insulation board 431 by hot junction heat-conducting seat 433 and cold
It holds heat-conducting seat 434 to be spaced apart, can effectively reduce the heat generated between hot junction heat-conducting seat 433 and cold end heat-conducting seat 434 and transmit
Amount, to reduce the loss of refrigeration capacity of cold end heat-conducting seat 434, at the same time, cold end heat-conducting seat 434 is wrapped in by the first thermal insulation board
431 and second thermal insulation board 432 formed the installation cavity with thermal insulation function in, cold end heat-conducting seat 434 conduction semiconductor system
The cold that cold core piece 41 generates quickly can be transmitted to required region by heat pipe 42 to greatest extent, cold to reduce
Heat-conducting seat 434 itself cold windage is held, energy consumption is more effectively reduced and improves refrigerating efficiency.
Preferably, the outer surface of the first thermal insulation board 431 is provided with heat dam 4313 around the mounting hole 4312, described heat-insulated
It is provided with heat insulation foam in slot 4313（It is unmarked）；The hot junction of the semiconductor refrigeration chip 41 face out protrude from described first every
The outer surface of hot plate 431.Specifically, heat insulation foam can be arranged in the periphery of semiconductor refrigeration chip 41 by heat dam 4313,
To which the cold that the insulation ring formed by heat insulation foam further reduces 41 cold end face of semiconductor refrigeration chip scatters and disappears outward, together
When, the heat that can also reduce 41 hot junction face of semiconductor refrigeration chip enters in installation cavity, reduces cold to greatest extent
Loss；And 41 hot junction face of semiconductor refrigeration chip is slightly higher than the outer surface of the first thermal insulation board 431, on the one hand so that semiconductor system
41 hot junction face of cold core piece and hot junction heat-conducting seat 433 can good transmission of heat by contact, on the other hand, 41 hot junction of semiconductor refrigeration chip
Emaciated face separates out mounting hole 4312, can reduce heat and is passed in installation cavity from mounting hole 4312, it is possibility to have the reduction of effect
The loss of cold.Wherein, it being connected for the ease of wiring, the outer surface of the first thermal insulation board 431 is additionally provided with wiring groove 4314,
The wiring groove 4314 is connected to the mounting hole 4312.In addition, according to the refrigerating capacity needs of refrigeration equipment, the present embodiment is partly led
Body refrigeration module includes multiple semiconductor refrigeration chips 41, and the assembling module 43 is configured with and the semiconductor refrigerating core
The corresponding hot junction heat-conducting seat 433 of piece 41 and the cold end heat-conducting seat 434, also, first thermal insulation board 431 offer with
The semiconductor refrigeration chip 41 corresponds to the mounting hole 4312.
Further, it is produced between hot junction heat-conducting seat 433 and cold end heat-conducting seat 434 caused by assembling to more effectively reduce
Raw heat is transmitted, and evacuation notch 4340, first thermal insulation board 431, second thermal insulation board are provided on cold end heat-conducting seat 434
432 and the hot junction heat-conducting seat 433 on be respectively arranged with through-hole（It is unmarked）, bolt 435 is threaded through in the corresponding through-hole,
The bolt 435 is formed by region across the evacuation notch 4340.Specifically, in an assembling process, it will by bolt 435
Hot junction heat-conducting seat 433, the first thermal insulation board 431, cold end heat-conducting seat 434 and second thermal insulation board 432 assemble be fixed on one successively
It rises, and bolt 435 opens cold end heat-conducting seat 434 by avoiding the evacuation of notch 4340, so as to avoid hot junction heat-conducting seat 433 and cold
Heat exchange is generated by bolt 435 between the heat-conducting seat 434 of end.Wherein, the inner surface of first thermal insulation board 431, which is provided with, is used for
The first tube seat 4316 and the first tube seat 4317 of the heat pipe 42 are installed, the edge of second thermal insulation board 432, which is provided with, to be used for
The notch or through hole 4322 or the second tube seat that the heat pipe 42 passes through.Specifically, heat pipe 42 passes through the first tube seat 4316 and
One tube seat 4317 is pierced by assembling module 43 with the cooperation of through hole 4322, to facilitate heat pipe 42 to be arranged on the liner of refrigeration equipment.
In addition, for the ease of quick location and installation hot junction heat-conducting seat 433, the outer surface of the first thermal insulation board 431 is around the mounting hole 4312
Outside be provided with polylith positioning baffle 4315, the hot junction heat-conducting seat 433 is arranged between the positioning baffle 4315 described in polylith.
In assembling, by positioning baffle 4315 can convenient location and installation hot junction heat-conducting seat 433, and ensure hot junction heat-conducting seat 433
It can accurately be contacted with semiconductor refrigeration chip 41 well.
Further, the cold end heat-conducting seat 434 includes the first heat-conducting plate 4341 to link together and the second heat conduction
Plate 4342, the heat pipe 42 are clipped between first heat-conducting plate 4341 and second heat-conducting plate 4342.Specifically, first leads
The inner surface of hot plate 4341 offers the first mounting groove 43411 being laterally arranged, and the inner surface of second heat-conducting plate 4342 is opened
Equipped with the second longitudinally disposed mounting groove 43421, the heat pipe 42 divides for lateral flat hot pipe and longitudinally flattened heat pipe, the cross
It is arranged in first mounting groove 43411 to flat hot pipe, the longitudinally flattened heat pipe is arranged in second mounting groove
In 43421, also, the lateral flat hot pipe contacts with each other with the longitudinally flattened heat pipe.Specifically, using flat hot pipe energy
Enough effective contacts area for increasing heat pipe and cold end heat-conducting seat 434, meanwhile, flat hot pipe can also effectively increase and liner
Between contact area, heat exchanger effectiveness is provided.Also, lateral flat hot pipe contacts with each other with the longitudinally flattened heat pipe, makes
It obtains the heat pipe temperature at different location to be evenly distributed, reduces the temperature difference and improve uniform temperature.
Cold end heat-conducting seat is installed by using the installation cavity formed between two heat-insulating brackets so that cold end heat-conducting seat
With hot junction heat-conducting seat by heat-insulating bracket it is effective it is heat-insulated be spaced apart, so as to substantially reduce cold end heat-conducting seat and hot junction heat-conducting seat
Between the heat exchange amount that generates, it is effective to reduce scattering and disappearing for cold, to improve the refrigerating efficiency of refrigeration equipment and reduce energy consumption.With
This simultaneously, semiconductor refrigeration chip in the mounting hole of the first thermal insulation board, the cold end face that ensures semiconductor refrigeration chip with
While cold end heat-conducting seat well contacts, it is ensured that the hot junction face of semiconductor refrigeration chip is well contacted with hot junction heat-conducting seat, it is ensured that
Heat Quick diffusing improves use reliability.
For ducting assembly 5, lower box 2 carries out the interval of air-supply and compartment, ducting assembly 5 by ducting assembly 5
Including：Allocation of the amount of air module 52, lower partition module 5 and lower wind turbine 51；The allocation of the amount of air module 52 and the lower partition module 5
Be arranged in the liner of the lower box 2, the lower partition module 5 by the lower box 2 be divided into from the bottom to top freezing chamber and
Refrigerating chamber, the allocation of the amount of air module 52 be vertically provided at it is described it is lower partition module 5 top, the allocation of the amount of air module 52,
The evaporation cavity for installing the evaporator 20, institute are formed between the lower partition module 5 and the liner of the lower box 2
It states allocation of the amount of air module 52 and is provided with the total air inlet 5221 and total return air inlet 5222 for being connected to the evaporation cavity, the evaporator
20 are arranged in the evaporation cavity and between total air inlet 5221 and total return air inlet 5222, the lower wind turbine
51 are arranged on total air inlet 5221；It is additionally provided in the allocation of the amount of air module 52 and is connected to total air inlet 5221
Air-supply passage 5201 is additionally provided with the return air channel 5202 for being connected to total return air inlet 5222 in the allocation of the amount of air module 52,
The first air outlet 5211 for being connected to the air-supply passage 5201 is additionally provided in the allocation of the amount of air module 52 and described in be connected to time
First return air inlet 5212 in wind channel 5202；The bottom of the lower partition module 5, which is additionally provided with, is connected to the air-supply passage 5201
The second air outlet（It is unmarked）, the bottom of the lower partition module 5 is additionally provided with the second return air for being connected to the evaporation cavity
Mouthful（It is unmarked）.5 one side of ducting assembly can realize the supply of cold wind, on the other hand can also be split babinet,
In, allocation of the amount of air module 52 is for distributing supply cold wind unitedly, and lower partition module 5 is cold in addition to being carried out with allocation of the amount of air module 52
Wind conveying is outer, and babinet is also divided into freezing chamber and refrigerating chamber by lower partition module 5, wherein and evaporator 20 is located in refrigerating chamber, this
The size of freezing chamber can be arbitrarily arranged in sample as needed, to meet the needs of user is to small volume freezing chamber.Wherein, institute
It includes front shroud 521, back shroud 522 and the first foams 523 to state allocation of the amount of air module 52, and the setting of the first foams 22 exists
Between the front shroud 521 and the back shroud 522, first air outlet 5211 and institute are provided on the front shroud 521
The first return air inlet 5212 is stated, total air inlet 5221 and total return air inlet 5222 are provided on the back shroud 522, it is described
It is formed with the air-supply passage 5201 in first foams 523, the return air channel is also formed in first foams 523
5202.Likewise, the lower partition module 5 includes upper cover plate 531, lower plate 532 and the second foams 533, the upper cover plate
It has been opened in the first mounting hole 5310 on 531, the second mounting hole 5320, second bubble have been opened on the lower plate 532
Ventilation hole 5331 is offered on foam body 533, and first partition 5311, second peace are provided in first mounting hole 5310
Second partition 5321 is provided in dress hole 5320, second foams 533 are arranged in the upper cover plate 531 and the lower plate
Between 532, the first partition 5311 and the second partition 5321 overlap, the first partition 5311 and described
The ventilation hole 5331 is divided into the first ventilating duct 5301 and the second ventilating duct 5302, the second partition by two partition boards 5321
Second mounting hole is divided into second air outlet and second return air inlet by 5321, first ventilating duct 5301 with
The air-supply passage 5201 is connected to, and second ventilating duct 5302 is connected to the evaporation cavity.Specifically, allocation of the amount of air module 52
In 523 one side of the first foams play heat preservation to avoid evaporator 20 radiation cooling influence refrigerating chamber temperature, it is another
Air-supply passage 5201 is formed in the first foams of aspect 523 and return air channel 5202 carries out air-supply and return air so that structure is more
It is compact；And coordinated the ventilation of the second foams 533 by first partition 5311 and second partition 5321 for lower partition module 5
Hole 5331 is divided into the first ventilating duct 5301 and the second ventilating duct 5302, can make full use of the confined space of lower partition module 5
Realize air-supply and return air.Preferably, in order to ensure the thermal insulation performance of freezing chamber, the cold for reducing freezing chamber leaks to refrigerating chamber
In, the bottom of first foams 523 is provided with downward projection of cutting 5231, the lower end degree of lip-rounding of the air-supply passage 5201
At in the bottom of the cutting 5231；The cutting 5231 is inserted in first ventilating duct 5301, by inserting cutting 5231
Enter into the first ventilating duct 5301 so that air-supply passage 5201 can extend in lower partition module 5, reduce the cold of freezing chamber
It is leaked from allocation of the amount of air module 52 and lower 5 junction of partition module；Further, upper cover plate 531 is in first mounting hole
First terrace is formed in 301（It is unmarked）, the bottom of the front shroud 521 is formed with second step face（It is unmarked）, described
First terrace is close together with the second step face paste；The first partition 5311 is in tilted layout, the back shroud 522
Bottom is formed with slot 5220, and the top edge of the first partition 5311 is inserted in the slot 5220, specifically, first step
Face coordinates with the second step face, increases the contact area between allocation of the amount of air module 52 and lower partition module 5, Neng Gougeng
Effective to extend the path flowed through needed for the leakage of freezing chamber cold, the cold so as to more effectively reduce freezing chamber leaks to
In refrigerating chamber；Meanwhile first partition 5311 is inserted into slot 5220, and can to avoid air-supply passage 5201 cooling gas leakage extremely
In evaporation cavity, it is more advantageous to and improves efficiency reduction energy consumption.
Further, lower partition module 5 further includes fan housing cover board 534, and the fan housing cover board 534 is arranged in the lower plate
533 bottom simultaneously covers in second air outlet, is formed to front side between the fan housing cover board 534 and the lower plate 533
The air-supply passage of extension（It is unmarked）, the front of the fan housing cover board 534 is provided with air outlet.Specifically, passing through fan housing cover board
534 air-supply passages formed realize the air outlet of freezing chamber far from return air inlet, to be conducive to improve efficiency；Preferably, described
The rear end of fan housing cover board 534 is additionally provided with the wind shield 534 extended downward, and the wind shield 534 is located at second return air
The front side of mouth, can effectively stop that the cold air for entering freezing chamber enters directly into the second return air inlet by wind shield 534,
Ensure returning to evaporation cavity from the second return air inlet after cold air fully exchanges heat in freezing chamber；And the cross section of wind shield 5341
Can be U-shaped structure, the second return air inlet described in 5341 semi-surrounding of the wind shield.In addition, in order to adequately improve space utilization
Rate and simplified assembling process, second foams 533 are additionally provided with water receiving tank 5332, and the water receiving tank 5332 is located at the steaming
Send out the lower section of device 20, specifically, lower partition module 5 is due to positioned at the lower section of evaporator 20, can on the second foams 533 shape
At water receiving tank 5332, to which during later stage defrost, the defrosting water of evaporator 20 is collected in water receiving tank 5332, water receiving tank
5332 are connected with drainpipe（It is not shown）Defrosting water is discharged.
Cold wind is distributed to refrigerating chamber and freezing chamber by allocation of the amount of air module, under the cold air that allocation of the amount of air module conveys passes through
Partition module is delivered in freezing chamber, and evaporator setting is made to be placed outside freezing chamber in refrigerating chamber, so as to basis
Need, by lower partition module divide needed for size freezing chamber, also have while ducting assembly is integrated with air blowing function every
Disconnected function, is divided into freezing chamber and refrigerating chamber, and distribute unitedly by allocation of the amount of air module using ducting assembly by box house
The supply of cold, allocation of the amount of air module cooperate with lower partition module and send cold wind to freezing chamber, are normally made in guarantee freeze space
Also it can guarantee that chill space is normally freezed while cold, realize the freezing chamber Miniaturization Design of the air-cooled vertical refrigeration equipment of multi-temperature zone,
Space availability ratio is improved to improve user experience.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features；
And these modifications or replacements, the spirit for the present invention embodiment technical solution that it does not separate the essence of the corresponding technical solution and
Range.
Claims (10)
1. a kind of hybrid refrigeration formula refrigeration equipment, including the upper box and lower box arranged up and down, which is characterized in that the top box
Body and the lower box are linked together by the connect band component, also, are provided with storage chamber in the connect band component
Body；It is provided with semiconductor refrigerating module in the upper box, ducting assembly is provided in the lower box.
2. hybrid refrigeration formula refrigeration equipment according to claim 1, which is characterized in that the upper box include upper shell and
Upper inner-liner, the lower box include lower casing and bottom inner container, and the upper inner-liner is heat conduction courage body, and the connect band component includes institute
It includes two supporting racks, front panel and drawer appliance, the respective side of the upper shell and the lower casing to state connect band component
Between connected by support frame as described above, the upper inner-liner is connected with the bottom inner container by the front panel, and the front panel is adopted
It is made of heat-insulating material, for the drawer appliance between the upper box and the lower box, the drawer appliance includes peace
Barrelling and drawer, the drawer are slidably disposed in by sliding rail in the installation bucket, the installation bucket be fixed on it is described before
On panel, the front panel offer for the drawer by through-hole；It is provided with the semiconductor refrigerating outside the upper inner-liner
Module is provided with the ducting assembly in the bottom inner container.
3. hybrid refrigeration formula refrigeration equipment according to claim 2, which is characterized in that the semiconductor refrigerating module includes
Semiconductor refrigeration chip, heat pipe and assembling module, the semiconductor refrigeration chip include cold end face and the release heat of released cold quantity
The hot junction face of amount, the assembling module include the first heat-insulating bracket, the second heat-insulating bracket, hot junction heat-conducting seat and cold end heat-conducting seat,
First heat-insulating bracket is fixed on second heat-insulating bracket, first heat-insulating bracket and second heat-insulating bracket it
Between formed installation cavity, first heat-insulating bracket offer be connected to it is described installation cavity mounting hole, the semiconductor refrigerating
Chip is located in the mounting hole, the cold end heat-conducting seat be arranged in the installation cavity and with the semiconductor refrigeration chip
Cold end face contact, the hot junction heat-conducting seat be arranged on first heat-insulating bracket and with the heat of the semiconductor refrigeration chip
End face contacts, and the heat pipe connects the cold end heat-conducting seat, and the heat pipe is attached on the corresponding upper inner-liner.
4. hybrid refrigeration formula refrigeration equipment according to claim 3, which is characterized in that the appearance of first heat-insulating bracket
Face is provided with heat dam around the mounting hole, and heat insulation foam is provided in the heat dam；The hot junction of the semiconductor refrigeration chip
Face out the outer surface for protruding from first heat-insulating bracket.
5. hybrid refrigeration formula refrigeration equipment according to claim 3, which is characterized in that the cold end heat-conducting seat includes connection
The first heat-conducting plate together and the second heat-conducting plate, the heat pipe be clipped in first heat-conducting plate and second heat-conducting plate it
Between.
6. hybrid refrigeration formula refrigeration equipment according to claim 5, which is characterized in that the inner surface of first heat-conducting plate
The first mounting groove being laterally arranged is offered, the inner surface of second heat-conducting plate offers the second longitudinally disposed mounting groove,
The heat pipe is divided into lateral flat hot pipe and longitudinally flattened heat pipe, and the transverse direction flat hot pipe is arranged in first mounting groove
In, the longitudinally flattened heat pipe is arranged in second mounting groove, also, the lateral flat hot pipe with it is described longitudinally flattened
Heat pipe contacts with each other.
7. hybrid refrigeration formula refrigeration equipment according to claim 2, which is characterized in that the ducting assembly includes air quantity point
With module, lower partition module and wind turbine；The allocation of the amount of air module and the lower partition module are arranged in the bottom inner container, institute
It states lower partition module and the bottom inner container is divided into freezing chamber and refrigerating chamber from the bottom to top, the allocation of the amount of air module is vertically arranged
On the top of the lower partition module, shape between the allocation of the amount of air module, lower partition module and the liner of the babinet
At being useful for installing the evaporation cavity of the evaporator, the allocation of the amount of air module be provided with the connection evaporation cavity always into
Air port and total return air inlet, the evaporator are arranged in the evaporation cavity and are located at total air inlet and total return air inlet
Between, the wind turbine is arranged on total air inlet；Connection total air inlet is additionally provided in the allocation of the amount of air module
Air-supply passage, be additionally provided with the return air channel for being connected to total return air inlet, the allocation of the amount of air in the allocation of the amount of air module
The first air outlet for being connected to the air-supply passage and the first return air inlet for being connected to the return air channel are additionally provided in module；It is described
The bottom of lower partition module is additionally provided with the second air outlet for being connected to the air-supply passage, and the bottom of the lower partition module is also set
It is equipped with the second return air inlet for being connected to the evaporation cavity.
8. hybrid refrigeration formula refrigeration equipment according to claim 7, which is characterized in that the allocation of the amount of air module includes
Front shroud, back shroud and the first foams, first foams are arranged between the front shroud and the back shroud, described
First air outlet and first return air inlet are provided on front shroud, be provided on the back shroud total air inlet and
Total return air inlet is formed with the air-supply passage in first foams, is also formed in first foams described
Return air channel；The lower partition module includes upper cover plate, lower plate and the second foams, and first has been opened on the upper cover plate
Mounting hole has been opened in the second mounting hole on the lower plate, and ventilation hole, first peace are offered on second foams
Dress is provided with first partition in hole, and second partition is provided in second mounting hole, and second foams are arranged described
Between upper cover plate and the lower plate, the first partition and the second partition overlap, the first partition and institute
It states second partition and the ventilation hole is divided into the first ventilating duct and the second ventilating duct, the second partition is installed described second
Hole is divided into second air outlet and second return air inlet, and first ventilating duct is connected to the air-supply passage, described
Second ventilating duct is connected to the evaporation cavity.
9. hybrid refrigeration formula refrigeration equipment according to claim 2, which is characterized in that the lower end both sides of the upper shell
And the upper end both sides of the lower casing are respectively arranged with inside edge structure, support frame as described above and the corresponding inside edge knot
Structure connects.
10. hybrid refrigeration formula refrigeration equipment according to claim 9, which is characterized in that the top of support frame as described above is under
Portion is respectively arranged with installation slot, and the inside edge structure is installed in the corresponding installation slot, in the installation slot
It is provided with claw, the card slot coordinated with the claw is provided in the inside edge structure, the claw is stuck in the card slot,
Reinforcing rib, the reinforcing rib and claw dislocation positioned opposite, the reinforcing rib and institute are additionally provided in the installation slot
State installation slot inner wall between form clamping space.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710295280 | 2017-04-28 | ||
| CN2017102952807 | 2017-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108397959A true CN108397959A (en) | 2018-08-14 |
| CN108397959B CN108397959B (en) | 2020-12-15 |
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ID=63015401
Family Applications (9)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711089391.9A Active CN108800656B (en) | 2017-04-28 | 2017-11-08 | Semiconductor refrigeration module and refrigeration equipment |
| CN201711461857.3A Active CN108375276B (en) | 2017-04-28 | 2017-12-28 | Semiconductor refrigeration equipment |
| CN201711457945.6A Active CN108397959B (en) | 2017-04-28 | 2017-12-28 | Mixed refrigeration type refrigeration equipment |
| CN201711459711.5A Active CN108375274B (en) | 2017-04-28 | 2017-12-28 | Mixed refrigeration type multifunctional wine cabinet |
| CN201810392900.3A Active CN108679877B (en) | 2017-04-28 | 2018-04-27 | Solid-state refrigerating device |
| CN201810393866.1A Active CN108709335B (en) | 2017-04-28 | 2018-04-27 | Semiconductor refrigerating device |
| CN201810391975.XA Active CN108895705B (en) | 2017-04-28 | 2018-04-27 | Refrigeration device |
| CN201810393836.0A Active CN108917256B (en) | 2017-04-28 | 2018-04-27 | Semiconductor refrigeration equipment |
| CN201810391986.8A Active CN108731298B (en) | 2017-04-28 | 2018-04-27 | Solid-state refrigeration equipment |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711089391.9A Active CN108800656B (en) | 2017-04-28 | 2017-11-08 | Semiconductor refrigeration module and refrigeration equipment |
| CN201711461857.3A Active CN108375276B (en) | 2017-04-28 | 2017-12-28 | Semiconductor refrigeration equipment |
Family Applications After (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711459711.5A Active CN108375274B (en) | 2017-04-28 | 2017-12-28 | Mixed refrigeration type multifunctional wine cabinet |
| CN201810392900.3A Active CN108679877B (en) | 2017-04-28 | 2018-04-27 | Solid-state refrigerating device |
| CN201810393866.1A Active CN108709335B (en) | 2017-04-28 | 2018-04-27 | Semiconductor refrigerating device |
| CN201810391975.XA Active CN108895705B (en) | 2017-04-28 | 2018-04-27 | Refrigeration device |
| CN201810393836.0A Active CN108917256B (en) | 2017-04-28 | 2018-04-27 | Semiconductor refrigeration equipment |
| CN201810391986.8A Active CN108731298B (en) | 2017-04-28 | 2018-04-27 | Solid-state refrigeration equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (9) | CN108800656B (en) |
| WO (1) | WO2018196679A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108917256B (en) | 2022-03-22 |
| CN108895705A (en) | 2018-11-27 |
| CN108679877A (en) | 2018-10-19 |
| CN108800656A (en) | 2018-11-13 |
| CN108709335A (en) | 2018-10-26 |
| CN108731298B (en) | 2022-03-22 |
| CN108397959B (en) | 2020-12-15 |
| CN108917256A (en) | 2018-11-30 |
| CN108800656B (en) | 2020-09-08 |
| CN108375276B (en) | 2020-12-04 |
| CN108709335B (en) | 2022-03-22 |
| CN108731298A (en) | 2018-11-02 |
| CN108375274A (en) | 2018-08-07 |
| CN108895705B (en) | 2022-03-22 |
| CN108375274B (en) | 2020-08-18 |
| WO2018196679A1 (en) | 2018-11-01 |
| CN108679877B (en) | 2022-03-22 |
| CN108375276A (en) | 2018-08-07 |
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