CN114062429A - Semiconductor refrigeration chip test fixture - Google Patents
Semiconductor refrigeration chip test fixture Download PDFInfo
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- CN114062429A CN114062429A CN202111558906.1A CN202111558906A CN114062429A CN 114062429 A CN114062429 A CN 114062429A CN 202111558906 A CN202111558906 A CN 202111558906A CN 114062429 A CN114062429 A CN 114062429A
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 136
- 238000012360 testing method Methods 0.000 title claims abstract description 48
- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 238000010438 heat treatment Methods 0.000 claims abstract description 84
- 230000017525 heat dissipation Effects 0.000 claims abstract description 53
- 239000000919 ceramic Substances 0.000 claims description 20
- 238000009529 body temperature measurement Methods 0.000 claims description 10
- 229920000742 Cotton Polymers 0.000 claims description 7
- 238000004321 preservation Methods 0.000 claims description 7
- 239000012774 insulation material Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000011056 performance test Methods 0.000 abstract 2
- 238000001816 cooling Methods 0.000 description 14
- 230000003139 buffering effect Effects 0.000 description 4
- 239000004519 grease Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920001342 Bakelite® Polymers 0.000 description 2
- 239000004637 bakelite Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The embodiment of the invention provides a semiconductor refrigeration chip testing tool, which relates to the technical field of semiconductor refrigeration and comprises a positioning frame, a limiting module, a heating module and a heat dissipation module. When the refrigeration chip needs to be detached or replaced, the refrigeration chip can be exposed outside only by detaching the heat dissipation module, and the installation and detachment are very convenient. Compared with the prior art, the performance test method can realize the performance test of the semiconductor refrigeration chip, can conveniently disassemble and assemble the refrigeration chip, and has short test time and good precision.
Description
Technical Field
The invention relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration chip testing tool.
Background
The most used of traditional mechanical refrigeration equipment is freon refrigeration, but freon refrigerated mode has the pollution, and mechanical refrigeration exists bulky moreover, and system parts is many, and the consumption is big, need add refrigerant (refrigerant), defect such as refrigeration limit temperature is limited, so in some high-end manufacturing fields, mechanical refrigeration has can't satisfy the requirement in the industry.
At present, with the development of semiconductor refrigeration technology, the semiconductor refrigeration chip is gradually widely used for refrigeration, and the semiconductor refrigeration chip realizes the purposes of refrigeration and heating by respectively absorbing heat and releasing heat at two ends of a galvanic couple by means of direct current, thereby meeting the requirement of environmental protection. During the operation of the semiconductor refrigeration chip, the cold quantity is released to a refrigeration chamber of the refrigeration equipment through a cold-end radiator at the cold end, and the heat quantity is required to be radiated to the outside through a hot-end radiator at the hot end.
In practical application, different semiconductor refrigeration chips need to be selected according to different use environments and equipment, however, the semiconductor refrigeration chips related to the current market, such as the type selection of the ceramic refrigeration chips, do not have data of related instrument tests as reference, so that only direct installation can be performed for actual measurement, the consumed time is long, and the precision is poor. When the test tool is used for testing the refrigeration chip, the conventional tool is of a one-time test structure, so that the refrigeration chip is difficult to disassemble and assemble, and the test process is time-consuming and troublesome.
Disclosure of Invention
The invention aims to provide a semiconductor refrigeration chip testing tool which can realize performance testing of a semiconductor refrigeration chip, can conveniently disassemble and assemble the refrigeration chip, and has short testing time and good precision.
Embodiments of the invention may be implemented as follows:
the embodiment of the invention provides a semiconductor refrigeration chip test tool, which comprises:
a positioning frame;
the limiting module is arranged on the positioning frame;
the heating module is arranged on the limiting module;
the heat dissipation module is detachably connected with the positioning frame;
the heating module and the heat dissipation module are respectively used for being arranged on a cold surface and a hot surface of a refrigeration chip, and the heat dissipation module is used for being pressed on the refrigeration chip so as to fix the refrigeration chip.
Further, the positioning frame comprises an upper frame, a bottom plate and a stand column, the stand column is arranged at the edge of the bottom plate, the upper frame is connected with the stand column, an abdicating opening is formed in the upper frame, the limiting module is arranged on the bottom plate and penetrates out of the abdicating opening, and the heating module, the refrigerating chip and the heat dissipation module are sequentially stacked on the limiting module.
Furthermore, a positioning slide rail is further arranged on the positioning frame, two opposite positioning slide blocks are arranged on the positioning slide rail, and the two opposite positioning slide blocks are used for clamping two sides of the heat dissipation module so that the heat dissipation module is fixed on the positioning frame.
Furthermore, the limiting module comprises a limiting cylinder, a limiting block, a buffering plate, a first elastic piece and a second elastic piece, the limiting cylinder is arranged on the bottom plate, the first elastic piece is arranged in the limiting cylinder and extends upwards, the limiting block is arranged on the limiting cylinder and is abutted against the first elastic piece, the second elastic piece is arranged on the buffering plate and extends upwards, the buffering plate is arranged on the limiting block and is abutted against the second elastic piece, and the heating module is arranged on the buffering plate.
Furthermore, a locking piece is further arranged on the bottom plate and used for abutting against the limiting module to lock the limiting module, the heating module, the refrigerating chip and the heat dissipation module.
Further, heat preservation cotton is further arranged between the top frame and the bottom plate, and the heat preservation cotton is wrapped around the limiting module.
Further, semiconductor refrigeration chip test fixture still includes first heat conduction piece and second heat conduction piece, first heat conduction piece with the second heat conduction piece is used for setting up respectively the both sides of refrigeration chip, just first heat conduction piece with heat radiation module contacts, the second heat conduction piece with heating module contacts.
Further, the heating module includes heating power supply and ceramic heating plate, ceramic heating plate inlays to be established on the second heat conduction piece, be provided with the insulation material layer around the ceramic heating plate, heating power supply sets up outside the insulation material layer, and through the wire with ceramic heating plate connects.
Further, the semiconductor refrigeration chip test tool further comprises a temperature measurement module, wherein the temperature measurement module comprises a first thermocouple, a second thermocouple and a thermometer, the first thermocouple is connected with the second heat conduction block and used for measuring a first temperature value of the cold surface of the refrigeration chip, the second thermocouple is connected with the first heat conduction block and used for measuring a second temperature value of the hot surface of the refrigeration chip, and the thermometer is simultaneously connected with the first thermocouple and the second thermocouple and used for generating the steady-state refrigeration temperature according to the first temperature value and the second temperature value.
Furthermore, the bottom of the heat dissipation module is also provided with a fixed cover, the first heat conduction block is embedded in the fixed cover and is abutted against the heat dissipation module, and the second heat conduction block is attached to the heating module.
The beneficial effects of the embodiment of the invention include, for example:
according to the semiconductor refrigeration chip testing tool provided by the embodiment of the invention, the limiting module is arranged on the positioning frame, the heating module is arranged on the limiting module, and the heat dissipation module is detachably connected to the positioning frame, wherein the refrigeration chip is placed on the heating module, the heat dissipation module is used for pressing the refrigeration chip, and the refrigeration chip, the heating module and the limiting module are pressed into a whole, so that the refrigeration chip is fixed. When the refrigeration chip needs to be detached or replaced, the refrigeration chip can be exposed outside only by detaching the heat dissipation module, and the installation and detachment are very convenient. Compared with the prior art, the semiconductor refrigeration chip testing tool provided by the invention can realize performance testing of the semiconductor refrigeration chip, can conveniently disassemble and assemble the refrigeration chip, and has the advantages of short testing time and good precision.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is an exploded schematic view of a semiconductor refrigeration chip testing tool according to an embodiment of the present invention;
fig. 2 is a schematic view of a working principle of a semiconductor refrigeration chip testing tool provided in an embodiment of the present invention;
fig. 3 is a schematic view of an overall structure of a semiconductor refrigeration chip testing tool according to an embodiment of the present invention;
fig. 4 is a schematic view of a partially exploded structure of a semiconductor refrigeration chip testing tool according to an embodiment of the present invention.
Icon: 100-semiconductor refrigeration chip testing tooling; 110-a refrigeration chip; 113-a first thermally conductive block; 115-a second thermally conductive mass; 130-heating module; 131-a heating power supply; 133-ceramic heating plates; 135-a layer of insulating material; 150-a heat dissipation module; 151-fixed cover; 160-heat preservation cotton; 170-temperature measurement module; 171-a first thermocouple; 173-second thermocouple; 175-a thermometer; 180-positioning frame; 181-top frame; 183-base plate; 185-upright post; 186-a retaining member; 187-a yield opening; 188-positioning a slide rail; 189-positioning slide block; 190-a limit module; 191-a limiting cylinder; 193-a stop block; 195-a buffer plate; 197-a first resilient member; 199-second elastic member.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
Referring to fig. 1 to 4 in combination, the present embodiment provides a semiconductor refrigeration chip testing tool 100, which can implement performance testing on a semiconductor refrigeration chip 110, and can conveniently disassemble and assemble the refrigeration chip 110, and the testing time is short and the precision is good.
The semiconductor refrigeration chip test tool 100 provided by the embodiment is used for testing a refrigeration chip 110, and the semiconductor refrigeration chip test tool 100 comprises a heating module 130, a heat dissipation module 150, a temperature measurement module 170, a positioning frame 180 and a limiting module 190, wherein the heating module 130 is arranged on a cold surface of the refrigeration chip 110, the heat dissipation module 150 is arranged on a hot surface of the refrigeration chip 110, and the temperature measurement module 170 is connected with the refrigeration chip 110, wherein the heating module 130 is used for heating the refrigeration chip 110 and has a plurality of different heating powers, the heat dissipation module 150 is used for cooling the refrigeration chip 110, the temperature measurement module 170 is used for measuring a steady-state refrigeration temperature of the refrigeration chip 110, and the steady-state refrigeration temperature is used for representing the performance of the refrigeration chip 110. The limiting module 190 is disposed on the positioning frame 180, and the heating module 130 is disposed on the limiting module 190.
In this embodiment, the cooling chip 110, the heating module 130, and the heat dissipation module 150 are detachably stacked on the limiting module 190, wherein the bottom of the heat dissipation module 150 is detachably connected to the positioning frame 180, so that the heat dissipation module 150, the cooling chip 110, and the heating module 130 are pressed together. Meanwhile, when the refrigeration chip 110 needs to be replaced, the heat dissipation module 150 only needs to be disassembled, and the refrigeration chip 110 is replaced, which is very convenient.
In this embodiment, the temperature measuring module 170 includes a first thermocouple 171, a second thermocouple 173, and a temperature detector 175, the first thermocouple 171 is disposed on the cold side of the refrigeration chip 110 and is used for measuring a first temperature value of the cold side of the refrigeration chip 110, the second thermocouple 173 is disposed on the hot side of the refrigeration chip 110 and is used for measuring a second temperature value of the hot side of the refrigeration chip 110, and the temperature detector 175 is connected to the first thermocouple 171 and the second thermocouple 173 and is used for generating a steady-state refrigeration temperature according to the first temperature value and the second temperature value. Specifically, the first thermocouple 171 and the second thermocouple 173 are each an extremely fine thermocouple, which is connected to the hot side and the cold side of the refrigeration chip 110, respectively, so as to measure temperature values of the hot side and the cold side of the refrigeration chip 110, respectively.
It should be noted that, the steady-state cooling temperature mentioned in this embodiment refers to a difference between the first temperature value and the second temperature value, and the difference can represent the heat exchange capability of the cooling chip 110, that is, the performance of the cooling chip 110. Meanwhile, the heating module 130 has a plurality of different heating powers, and the steady-state refrigeration temperatures under different power conditions are recorded through the power change of the heating module 130, so that the test of the chip performance is completed, the model most conforming to the refrigeration chip 110 corresponding to each product is selected, and the performance of the refrigeration chip 110 is exerted to the maximum.
In this embodiment, the heating module 130 includes a heating power source 131 and a ceramic heating sheet 133, the ceramic heating sheet 133 is attached to the cold side of the cooling chip 110, a heat insulating material layer 135 is disposed around the ceramic heating sheet 133, and the heating power source 131 is disposed outside the heat insulating material layer 135 and connected to the ceramic heating sheet 133 through a wire. Specifically, the ceramic heating sheet 133 may be attached to the cold surface of the refrigeration chip 110 through a heat conductive silicone grease, so as to heat the cold surface.
Further, the semiconductor refrigeration chip testing tool 100 further includes a first heat conduction block 113 and a second heat conduction block 115, the first heat conduction block 113 and the second heat conduction block 115 are respectively disposed on two sides of the refrigeration chip 110, a fixing cover 151 is disposed at the bottom of the heat dissipation module 150, the first heat conduction block 113 is embedded in the fixing cover 151 and abuts against the heat dissipation module 150, and the second heat conduction block 115 is attached to the heating module 130. Specifically, the first heat conduction block 113 and the second heat conduction block 115 are both copper blocks and have excellent heat conduction performance, wherein the first heat conduction block 113 is attached to the lower side surface of the heat dissipation module 150 through heat conduction silicone grease, and the second heat conduction block 115 is attached to the surface of the ceramic heating plate 133 through heat conduction silicone grease. The fixing cover 151 is made of a bakelite plate, and can fix the first heat conduction block 113.
It should be noted that in this embodiment, the sizes of the refrigeration chip 110, the first heat conduction block 113, the second heat conduction block 115, and the ceramic heating plate 133 are all the same, for example, all are 40 × 40mm, so as to ensure the consistency of heat transfer. In addition, in the present embodiment, the first thermocouple 171 extends into the second heat conduction block 115 and is connected to the second heat conduction block 115, and the second thermocouple 173 extends into the first heat conduction block 113 and is connected to the first heat conduction block 113, so as to ensure the accuracy of temperature measurement. Meanwhile, the ceramic heating sheet 133 is embedded on the second heat conduction block 115 to achieve uniform heating.
In this embodiment, the heating module 130 is disposed on the position limiting module 190, and the heat dissipating module 150 is detachably disposed on the positioning frame 180. The positioning frame 180 comprises a top frame 181, a bottom plate 183 and a column 185, the column 185 is arranged on the edge of the bottom plate 183, the top frame 181 is connected with the column 185, an abdicating opening 187 is formed in the top frame 181, a limiting module 190 is arranged on the bottom plate 183 and penetrates out of the abdicating opening 187, and the heating module 130, the refrigeration chip 110 and the heat dissipation module 150 are sequentially stacked on the limiting module 190.
It is worth noting that the bottom plate 183 and the top frame 181 are rectangular blocks, the number of the upright columns 185 is four, the four upright columns 185 are respectively arranged at four top corners of the bottom plate 183, and the limiting module 190 is arranged at the center of the bottom plate 183 and extends out of the abdicating opening 187 on the top frame 181, so that the ceramic heating sheet 133, the refrigerating chip 110 and the heat dissipation module 150 can be conveniently installed.
In this embodiment, the positioning frame 180 is further provided with a positioning slide rail 188, the positioning slide rail 188 is provided with two opposite positioning slide blocks 189, and the two opposite positioning slide blocks 189 are used for being clamped at two sides of the heat dissipation module 150, so that the heat dissipation module 150 is fixed on the positioning frame 180. Specifically, the opposite sides of the positioning slider 189 are provided with protrusions, and the protrusions are inserted into the bottom of the heat dissipation module 150, so as to limit the bottom of the heat dissipation module 150, and the heat dissipation module 150, the refrigeration chip 110, and the heating module 130 are sequentially pressed on the limit module 190.
The limiting module 190 comprises a limiting cylinder 191, a limiting block 193, a buffer plate 195, a first elastic piece 197 and a second elastic piece 199, the limiting cylinder 191 is arranged on the bottom plate 183, the first elastic piece 197 is arranged in the limiting cylinder 191 and extends upwards, the limiting block 193 is arranged on the limiting cylinder 191 and abuts against the first elastic piece 197, the second elastic piece 199 is arranged on the buffer plate 195 and extends upwards, the buffer plate 195 is arranged on the limiting block 193 and abuts against the second elastic piece 199, and the heating module 130 is arranged on the buffer plate 195. Specifically, the buffer board 195 is a bakelite board, the second elastic member 199 includes 4 springs, 4 spring equipartitions are on the stopper 193, realize holding the buffer board 195, and first elastic member 197 also includes 4 springs simultaneously, and 4 spring pressfittings realize holding the stopper 193 in spacing section of thick bamboo 191.
In this embodiment, the first elastic member 197 and the second elastic member 199 are four compression springs, and the first elastic member 197 and the second elastic member 199 provide an upward elastic force to the buffer plate 195, and the bottom of the heat dissipation module 150 abuts against the positioning slider 189 by force transmission, so as to prevent the positioning slider 189 from sliding out to both sides.
It should be noted that, here, an upward elastic force can be applied to the positioning sliders 189 by the compression springs, a protruding piece is disposed on one side of the two positioning sliders 189 opposite to each other, and the protruding piece is engaged with the bottom of the heat dissipation module 150 at a position limited by the elastic force, when the heat dissipation module 150 needs to be detached, the heat dissipation module 150 is pressed downward, the spring element is compressed, so that the protruding piece is released from the bottom of the heat dissipation module 150, then the positioning sliders 189 are slid open to both sides, the heat dissipation module 150 can be easily taken out, then the first heat conduction block 113 is taken out, and the refrigeration chip 110 is exposed outside.
In this embodiment, the bottom plate 183 is further provided with a locking member 186, and the locking member 186 is used for abutting against the limiting module to lock the limiting module, the heating module 130, the refrigerating chip 110 and the heat dissipation module 150. Specifically, threaded holes are formed in the bottom plate 183, the locking member 186 is of a screw structure and can be upwards abutted to the limiting barrel 191 or the limiting block 193, so that the upper structure is abutted, and the first elastic member 197 and the second elastic member 199 are matched to apply elasticity to the positioning sliding block 189, so that the whole fixing is realized.
In this embodiment, still be provided with the cotton 160 that keeps warm between bottom plate 183 and the roof frame 181, the cotton cladding of heat preservation is around spacing module 190 to play the heat preservation effect, avoid heat loss.
The embodiment further provides a method for testing the semiconductor refrigeration chip 110, which is suitable for the semiconductor refrigeration chip testing tool 100, and the method comprises the following steps:
s1: the cold side of the cooling chip 110 is heated by the heating module 130.
Specifically, the heating module 130 has a plurality of different heating powers, and the heating power of the heating module 130 needs to be adjusted to heat the cold surface, for example, the heating power of the ceramic heating sheet 133 can be adjusted by adjusting the output power of the heating power source 131, and the cold surface of the refrigeration chip 110 is heated with different powers, so that the test is conveniently completed.
S2: the steady-state cooling temperature of the cooling chip 110 is measured by the temperature measuring module 170.
Specifically, the temperature measuring module 170 is configured to measure the steady-state cooling temperature of the cooling chip 110 at different heating powers, and the steady-state cooling temperature is used to characterize the performance of the cooling chip 110. In this embodiment, the first thermocouple 171 may be used to measure a first temperature value of the cold surface of the refrigeration chip 110, the second thermocouple 173 may be used to measure a second temperature value of the hot surface of the refrigeration chip 110, and the first temperature value and the second temperature value are summarized and subtracted by the temperature detector 175 to obtain a steady-state refrigeration temperature.
After the steady-state refrigeration temperature is measured, the performance of the refrigeration chip 110 can be directly visually output through a central control computer, and the subsequent judgment can be carried out by an operator after recording. The type of the refrigeration chip 110 can be selected according to the result.
In summary, in the semiconductor refrigeration chip test tool 100 and the test method provided in this embodiment, the heat dissipation module 150 is disposed on the hot side of the refrigeration chip 110, the heating module 130 is disposed on the cold side of the refrigeration chip 110, the refrigeration chip 110 is heated by the heating module 130 at different heating powers, and then the temperature measurement module 170 measures the steady-state refrigeration temperature of the refrigeration chip 110 at different heating powers, where the steady-state refrigeration temperature is used to represent the performance of the refrigeration chip 110. In the embodiment, the heating module 130 is arranged, and the power change of the heating module 130 is used to record the steady-state refrigeration temperatures under different power conditions, so as to complete the test of the chip performance, select the model of the refrigeration chip 110 most suitable for each product, and maximize the performance of the refrigeration chip 110. In addition, the positioning frame 180 is provided with the limiting module 190, the limiting module 190 is provided with the heating module 130, and the positioning frame 180 is detachably connected with the heat dissipation module 150, wherein the refrigeration chip 110 is placed on the heating module 130, the heat dissipation module 150 is used for being pressed on the refrigeration chip 110, and the refrigeration chip 110, the heating module 130 and the limiting module 190 are pressed into a whole, so that the refrigeration chip 110 is fixed. When the refrigeration chip 110 needs to be removed or replaced, the refrigeration chip 110 can be exposed only by removing the heat dissipation module 150, and the installation and the removal are very convenient.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. The utility model provides a semiconductor refrigeration chip test fixture which characterized in that includes:
a positioning frame;
the limiting module is arranged on the positioning frame;
the heating module is arranged on the limiting module;
the heat dissipation module is detachably connected with the positioning frame;
the heating module and the heat dissipation module are respectively used for being arranged on a cold surface and a hot surface of a refrigeration chip, and the heat dissipation module is used for being pressed on the refrigeration chip so as to fix the refrigeration chip.
2. The semiconductor refrigeration chip test tool according to claim 1, wherein the positioning frame comprises a top frame, a bottom plate and a stand column, the stand column is arranged at the edge of the bottom plate, the top frame is connected with the stand column, a abdicating opening is formed in the top frame, the limiting module is arranged on the bottom plate and penetrates out of the abdicating opening, and the heating module, the refrigeration chip and the heat dissipation module are sequentially stacked on the limiting module.
3. The semiconductor refrigeration chip test tool according to claim 2, wherein a positioning slide rail is further arranged on the positioning frame, two opposite positioning slide blocks are arranged on the positioning slide rail, and the two opposite positioning slide blocks are used for being clamped at two sides of the heat dissipation module so that the heat dissipation module is fixed on the positioning frame.
4. The semiconductor refrigeration chip test tool according to claim 2, wherein the limiting module comprises a limiting cylinder, a limiting block, a buffer plate, a first elastic piece and a second elastic piece, the limiting cylinder is arranged on the bottom plate, the first elastic piece is arranged in the limiting cylinder and extends upwards, the limiting block is arranged on the limiting cylinder and abuts against the first elastic piece, the second elastic piece is arranged on the buffer plate and extends upwards, the buffer plate is arranged on the limiting block and abuts against the second elastic piece, and the heating module is arranged on the buffer plate.
5. The semiconductor refrigeration chip test tool according to claim 2, wherein a locking member is further arranged on the bottom plate and used for abutting against the limiting module to lock the limiting module, the heating module, the refrigeration chip and the heat dissipation module.
6. The semiconductor refrigeration chip test tool according to claim 2, wherein heat preservation cotton is further arranged between the top frame and the bottom plate, and the heat preservation cotton is wrapped around the limiting module.
7. The semiconductor refrigeration chip testing tool according to any one of claims 1 to 6, further comprising a first heat conduction block and a second heat conduction block, wherein the first heat conduction block and the second heat conduction block are respectively arranged on two sides of the refrigeration chip, the first heat conduction block is in contact with the heat dissipation module, and the second heat conduction block is in contact with the heating module.
8. The semiconductor refrigeration chip test tool according to claim 7, wherein the heating module comprises a heating power supply and a ceramic heating sheet, the ceramic heating sheet is embedded on the second heat conduction block, a heat insulation material layer is arranged around the ceramic heating sheet, and the heating power supply is arranged outside the heat insulation material layer and is connected with the ceramic heating sheet through a wire.
9. The semiconductor refrigeration chip test tool according to claim 7, further comprising a temperature measurement module, wherein the temperature measurement module comprises a first thermocouple, a second thermocouple and a thermometer, the first thermocouple is connected with the second heat conduction block and used for measuring a first temperature value of a cold surface of the refrigeration chip, the second thermocouple is connected with the first heat conduction block and used for measuring a second temperature value of a hot surface of the refrigeration chip, and the thermometer is connected with the first thermocouple and the second thermocouple simultaneously and used for generating a steady-state refrigeration temperature according to the first temperature value and the second temperature value.
10. The semiconductor refrigeration chip test tool according to claim 9, wherein a fixing cover is further arranged at the bottom of the heat dissipation module, the first heat conduction block is embedded in the fixing cover and abuts against the heat dissipation module, and the second heat conduction block is attached to the heating module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111558906.1A CN114062429A (en) | 2021-12-20 | 2021-12-20 | Semiconductor refrigeration chip test fixture |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111558906.1A CN114062429A (en) | 2021-12-20 | 2021-12-20 | Semiconductor refrigeration chip test fixture |
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| CN114062429A true CN114062429A (en) | 2022-02-18 |
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| CN202111558906.1A Pending CN114062429A (en) | 2021-12-20 | 2021-12-20 | Semiconductor refrigeration chip test fixture |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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