CN217820120U - Performance testing device for vapor chamber - Google Patents
Performance testing device for vapor chamber Download PDFInfo
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- CN217820120U CN217820120U CN202221411543.9U CN202221411543U CN217820120U CN 217820120 U CN217820120 U CN 217820120U CN 202221411543 U CN202221411543 U CN 202221411543U CN 217820120 U CN217820120 U CN 217820120U
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Abstract
The utility model provides a temperature-uniforming plate performance testing device, which relates to the technical field of temperature-uniforming plate testing, and comprises a supporting and bearing mechanism, a movable temperature measuring mechanism and a movable heating mechanism, wherein the movable temperature measuring mechanism and the movable heating mechanism are both connected with the supporting and bearing mechanism; the supporting and bearing mechanism is used for fixing the temperature equalizing plate; the movable heating mechanism is provided with a heating surface, and the heating surface is used for gradually approaching the temperature-uniforming plate and supplying heat to one side of the temperature-uniforming plate; the movable temperature measuring mechanism is provided with a plurality of temperature measuring contacts, the projection of each temperature measuring contact on the plane where the heating surface is located is arranged at intervals with the heating surface, and the plurality of temperature measuring contacts are used for gradually approaching the temperature-equalizing plate and measuring the temperature of the other side of the temperature-equalizing plate. The utility model discloses the not good technical problem of the samming of existence among the prior art to the samming board and face direction heat transfer performance test has been alleviated.
Description
Technical Field
The utility model belongs to the technical field of the technique of vapor chamber test and specifically relates to a vapor chamber capability test device is related to.
Background
Along with the rapid development of electronic technology, high-power and high-heat-emitting electronic components are more and more, the size is smaller and smaller, the integration is higher and higher, and the heat flux density is higher and higher, so that the temperature of the electronic components is obviously increased, and the reliability and the service life of equipment are seriously influenced. Therefore, the product with high heat conductivity and integrated Vapor cavity (Vapor Chamber) becomes an ideal heat transfer device in the heat dissipation field.
Particularly in the field of aerospace, the requirements on the reliability and the service life of the performance of the temperature equalization plate are very important, most of the existing temperature equalization plate tests only test the temperature equalization performance and the heat transfer performance only test the performance in the vertical direction, and no integrated test device for testing the heat transfer performance of the temperature equalization plate in the surface direction exists, so that the comprehensive performance of the temperature equalization plate cannot be completely evaluated. In actual use, the problems of low testing efficiency, inconvenience in operation, lack of testing precision and the like are caused by the work of replacing testing equipment, repeatedly clamping, attaching a measuring point and the like.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a temperature-uniforming plate capability test device to alleviate the not good technical problem of the temperature-uniforming and face direction heat transfer capability test to the temperature-uniforming plate that exists among the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a performance testing device for a vapor chamber, which comprises a supporting and bearing mechanism, a movable temperature measuring mechanism and a movable heating mechanism, wherein the movable temperature measuring mechanism and the movable heating mechanism are connected with the supporting and bearing mechanism;
the supporting and bearing mechanism is used for fixing the temperature equalizing plate;
the movable heating mechanism is provided with a heating surface, and the heating surface is used for gradually approaching the temperature equalizing plate and supplying heat to one side of the temperature equalizing plate;
the movable temperature measuring mechanism is provided with a plurality of temperature measuring contacts, the projection of each temperature measuring contact on the plane where the heating surface is located is arranged at an interval with the heating surface, and the plurality of temperature measuring contacts are used for gradually approaching the temperature-uniforming plate and measuring the temperature of the other side of the temperature-uniforming plate.
In an optional embodiment of the present invention, the movable temperature measuring mechanism includes a first telescopic assembly, a supporting member and a temperature measuring element, the first telescopic assembly is mounted on the supporting and bearing mechanism, and a telescopic portion of the first telescopic assembly is connected to the supporting member;
the support piece is provided with a plurality of slideways, each slideway is internally and slidably connected with the temperature measuring element, and the temperature measuring element is provided with the temperature measuring contact.
Further, the supporting and carrying mechanism comprises a supporting component and a plurality of constant temperature components;
every constant temperature component all with the support assembly is connected, and is a plurality of constant temperature component is used for fixing the temperature-uniforming plate and provides the temperature-uniforming environment for the temperature-uniforming plate.
Furthermore, the constant temperature component comprises a constant temperature body, wherein a placing groove for installing the temperature equalizing plate is formed in the constant temperature body in a concave mode, and a constant temperature medium channel for flowing through of a constant temperature medium is formed in the constant temperature body.
Furthermore, the constant temperature assembly also comprises a plurality of fixing pieces, each fixing piece is connected with the constant temperature body and extends into the placing groove, and each fixing piece is used for fixing the temperature equalizing plate in the placing groove.
In an optional embodiment of the present invention, the support assembly includes a base plate and support legs for supporting the base plate;
the first telescopic assembly and the movable heating mechanism are connected with the substrate.
Furthermore, the base plate is concavely provided with a sliding groove;
the constant temperature body is connected with the base plate in a sliding mode through the sliding groove.
Furthermore, the base plate is further concavely provided with a groove for containing the temperature-uniforming plate, the groove is positioned on the side of the sliding groove, and a through hole for enabling the mobile heating mechanism to penetrate through the base plate to supply heat to the temperature-uniforming plate is formed in the bottom surface of the groove.
The utility model discloses in the optional embodiment, temperature-uniforming plate capability test device still includes the locating part, the locating part with the base plate is connected, just the locating part is used for injecing the constant temperature body for the position of base plate.
The utility model discloses in the optional embodiment, remove heating mechanism including heating structure and the flexible subassembly of second, the flexible subassembly of second install in support bearing mechanism, heating structure pass through the heat insulating mattress with the flexible portion of the flexible subassembly of second is connected.
The utility model discloses following beneficial effect can be realized:
the utility model provides a performance testing device for a temperature-uniforming plate, which comprises a supporting and bearing mechanism, a movable temperature measuring mechanism and a movable heating mechanism, wherein the movable temperature measuring mechanism and the movable heating mechanism are both connected with the supporting and bearing mechanism; the supporting and bearing mechanism is used for fixing the temperature equalizing plate; the movable heating mechanism is provided with a heating surface, and the heating surface is used for gradually approaching the temperature equalizing plate and supplying heat to one side of the temperature equalizing plate; the movable temperature measuring mechanism is provided with a plurality of temperature measuring contacts, the projection of each temperature measuring contact on the plane where the heating surface is located is arranged at intervals with the heating surface, and the plurality of temperature measuring contacts are used for approaching the temperature-uniforming plate gradually and measuring the temperature of the other side of the temperature-uniforming plate.
The utility model discloses in, remove temperature measurement mechanism and remove heating mechanism and bear the mechanism with supporting respectively and be connected, support and bear the mechanism and be used for fixed samming board, remove heating mechanism and be used for being close to the samming board and through heating the heat supply to the samming board, remove temperature measurement mechanism and locate the opposite side of samming board for the heating surface, and remove temperature measurement mechanism and be used for being close to the samming board and through the opposite face temperature measurement of a plurality of temperature measurement contacts on it to the samming board heating surface, a plurality of position temperature measurement values to this face promptly.
Compared with the prior art, the utility model provides a temperature-uniforming plate capability test device is through the one side heating to the temperature-uniforming plate for the temperature-uniforming plate realizes at the temperature-uniforming plate opposite side samming through self structure after the heat absorption, and the utility model discloses a remove a plurality of temperature measurement contacts on the temperature measurement mechanism and measure the temperature to the temperature-uniforming plate to the temperature-uniforming effect of temperature-uniforming plate is judged to the temperature measurement numerical value through each temperature measurement contact.
To sum up, the utility model discloses the not good technical problem of the temperature uniformity and the face direction heat transfer performance test to the temperature-uniforming plate that exist among the prior art has been alleviated at least.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of a structure of a uniform temperature plate performance testing apparatus provided in an embodiment of the present invention;
fig. 2 is a schematic perspective view of a performance testing apparatus for a vapor chamber provided in an embodiment of the present invention;
fig. 3 is a schematic view of a three-dimensional structure of a temperature measurement contact fixing plate of the device for testing the performance of the vapor chamber provided by the embodiment of the present invention;
fig. 4 is a schematic perspective view of a cold ice block of a device for testing the performance of a vapor chamber according to an embodiment of the present invention;
fig. 5 is a schematic perspective view of a substrate of a device for testing the performance of a vapor chamber according to an embodiment of the present invention;
fig. 6 is a schematic perspective view of a heating block of a device for testing performance of a vapor chamber according to an embodiment of the present invention.
An icon: 1-supporting a carrying mechanism; 11-a support assembly; 111-a substrate; 112-support legs; 113-a chute; 114-a groove; 115-through opening; 12-a thermostatic assembly; 121-a fixing member; 122-constant temperature body; 123-backing plate; 124-constant temperature medium channel; 2-moving the temperature measuring mechanism; 21-a first telescopic assembly; 211-a first telescopic member; 212-a support frame; 22-a support; 23-a temperature measuring element; 24-a slide; 3-moving the heating mechanism; 31-a heating structure; 311-a heater assembly; 3111-heater housing; 3112-heating the core; 312-a thermal insulation mat; 32-a second retraction assembly; 321-a second telescoping member; 322-a connecting frame; 4-a limiting member; 5-temperature-uniforming plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, or the directions or positional relationships that the products of the present invention are usually placed when in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the term refers must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments and features of the embodiments described below can be combined with each other without conflict.
Example one
The embodiment provides a device for testing the performance of a vapor chamber, and referring to fig. 1, the device for testing the performance of the vapor chamber comprises a supporting and bearing mechanism 1, a movable temperature measuring mechanism 2 and a movable heating mechanism 3, wherein the movable temperature measuring mechanism 2 and the movable heating mechanism 3 are both connected with the supporting and bearing mechanism 1; the supporting and bearing mechanism 1 is used for fixing the temperature-uniforming plate 5; the movable heating mechanism 3 is provided with a heating surface which is used for gradually approaching the temperature-uniforming plate 5 and supplying heat to one side of the temperature-uniforming plate 5; the movable temperature measuring mechanism 2 is provided with a plurality of temperature measuring contacts, the projection of each temperature measuring contact on the plane where the heating surface is located is arranged at intervals with the heating surface, and the plurality of temperature measuring contacts are used for gradually approaching the temperature-equalizing plate 5 and measuring the temperature of the other side of the temperature-equalizing plate 5.
The embodiment of the utility model provides a alleviate the not good technical problem of the test of the temperature uniformity and the face direction heat transfer performance to temperature-uniforming plate 5 that exist among the prior art at least.
The embodiment of the utility model provides an in, remove temperature measurement mechanism 2 and remove heating mechanism 3 and bear mechanism 1 with supporting respectively and be connected, it is used for fixed temperature uniforming plate 5 to support to bear mechanism 1, remove heating mechanism 3 and be used for being close to temperature uniforming plate 5 and through heating in the face of temperature uniforming plate 5 heat supply, remove temperature measurement mechanism 2 and locate temperature uniforming plate 5 for the opposite side of heating surface, and remove temperature measurement mechanism 2 and be used for being close to temperature uniforming plate 5 and through the opposite face temperature measurement of a plurality of temperature measurement contacts on it to temperature uniforming plate 5 heating surface, a plurality of position temperature measurement values to this face promptly.
Compared with the prior art, the embodiment of the utility model provides a temperature-uniforming plate capability test device is through the one side heating to temperature-uniforming plate 5 for temperature-uniforming plate 5 realizes at 5 opposite sides samming of temperature-uniforming plate through self structure after the heat absorption, and the embodiment of the utility model provides a through removing the temperature measurement contact on the temperature measurement mechanism 2 to the temperature-uniforming plate 5 temperature measurement, and the temperature measurement numerical value through each temperature measurement contact judges the samming plate's samming effect.
In an optional implementation manner of this embodiment, referring to fig. 2 or fig. 3, the movable temperature measuring mechanism 2 includes a first telescopic assembly 21, a support member 22, and a temperature measuring element 23, the first telescopic assembly 21 is mounted on the support bearing mechanism 1, and a telescopic portion of the first telescopic assembly 21 is connected to the support member 22; the supporting member 22 has a plurality of slide ways 24, a temperature measuring element 23 is connected in each slide way 24 in a sliding manner, and the temperature measuring element 23 is provided with a temperature measuring contact.
When the slide way 24 is plural, the plural slide ways 24 are distributed in a direction from the edge of the support to the center of the support 22.
Specifically, the first telescopic assembly 21 includes a first telescopic member 211 and a support frame 212, the first telescopic member 211 is connected to the support frame 212, the support frame 212 is connected to the support bearing mechanism 1, and the first telescopic member 211 is located above the temperature-uniforming plate 5. Preferably, the first telescopic part 211 is a telescopic cylinder, and the telescopic direction thereof is a vertical direction; the supporting member 22 is connected to the telescopic portion of the first telescopic member 211, that is, the supporting member 22 moves up and down by the telescopic movement of the telescopic portion of the first telescopic member 211. Preferably, the supporting member 22 is a supporting plate-shaped structure, a plurality of slide ways 24 are arranged on the supporting member 22, each slide way is slidably connected with at least one temperature measuring element 23, and one end of each temperature measuring element 23, which faces the temperature-uniforming plate 5, is provided with a temperature measuring contact. Preferably, the temperature measuring element 23 is a thermocouple, and the thermocouple is slidably connected in the slide 24 by a slider.
When the temperature measuring element 23 is a thermocouple, a sliding block is arranged on the side wall of the thermocouple and is connected in the sliding way 24 in a sliding way, and the temperature measuring electric contact end of the thermocouple penetrates through the sliding way 24 to measure the temperature of the temperature equalizing plate 5.
Further, the support bearing mechanism 1 comprises a support component 11 and a plurality of thermostatic components 12; each constant temperature component 12 is connected with the supporting component 11, and the constant temperature components 12 are used for fixing the temperature equalizing plate 5 and providing a temperature equalizing environment for the temperature equalizing plate 5.
Specifically, a plurality of constant temperature components 12 all are connected with supporting component 11, and a plurality of constant temperature components 12 are used for supporting temperature-uniforming plate 5 jointly and provide the constant temperature environment for temperature-uniforming plate 5, and then adjust the outside ambient temperature of temperature-uniforming plate 5 through the temperature of adjusting constant temperature components 12.
Further, referring to fig. 4, the thermostatic assembly 12 includes a thermostatic body 122, the thermostatic body 122 has a recessed groove for mounting the temperature equalizing plate 5, and a thermostatic medium passage 124 is formed in the thermostatic body 122 for flowing a thermostatic medium therethrough.
Specifically, the constant temperature body 122 includes a placing groove formed in a concave shape, the placing groove is used for mounting the temperature equalizing plate 5, the constant temperature medium channel 124 in the constant temperature body 122 is preferably a U-shaped channel, and the constant temperature medium channel 124 is connected with an external liquid supply device, and is used for circularly supplying the constant temperature medium in the constant temperature medium channel 124, so that the constant temperature body 122 keeps constant temperature.
Further, the thermostatic assembly 12 further includes a plurality of fixing members 121, each fixing member 121 is connected to the thermostatic body 122 and extends into the placing groove, and each fixing member 121 is used for fixing the temperature equalizing plate 5 in the placing groove.
Specifically, the method comprises the following steps: the fixing piece 121 is connected with the constant temperature body 122, and the temperature equalizing plate 5 is fixed in the placing groove; preferably, the fixing member 121 may be a threaded rod, a bolt, etc., and the fixing member 121 is in threaded connection with the constant temperature body 122, and one end of the fixing member 121 penetrates through the constant temperature body 122 to enter the placing groove and abut against the temperature equalizing plate 5; preferably, the fixing member 121 is provided with a backing plate 123 at one end abutted against the temperature-uniforming plate 5, and the fixing member 121 is abutted against the temperature-uniforming plate 5 through the backing plate 123, so that the surface of the temperature-uniforming plate 5 is prevented from being scratched.
In an alternative embodiment of this embodiment, the support assembly 11 includes a base plate 111 and support legs 112 for supporting the base plate 111; the first telescopic assembly 21 and the moving heating mechanism 3 are connected to the base plate 111.
Specifically, the base plate 111 is a panel structure supported by the support legs 112, and the base plate 111 provides a mounting base for the first telescopic assembly 21 and the moving heating mechanism 3, preferably, the first telescopic assembly 21 is located above the base plate 111, and the moving heating mechanism 3 is located below the base plate 111.
Further, referring to fig. 5, the base plate 111 is concavely provided with a chute 113; the constant temperature body 122 is slidably connected to the base plate 111 through the chute 113.
Specifically, the upper surface of the base plate 111 is provided with a chute 113, and the thermostatic body 122 is slidably connected with the chute 113 through a slider mounted at the bottom, that is, the thermostatic body 122 is adjusted to a proper position on the chute 113 through the size of the uniform temperature plate 5 to be detected.
Further, referring to fig. 4, the base plate 111 is further provided with a concave groove 114 for accommodating the temperature-uniforming plate 5, the concave groove 114 is located at a side of the sliding groove 113, and a through hole 115 for allowing the moving heating mechanism 3 to pass through the base plate 111 and supply heat to the temperature-uniforming plate 5 is formed in a bottom surface of the concave groove 114.
Specifically, since some of the uniform temperature plates 5 are provided with heat source bosses on their heated surfaces, the heat source bosses may have a certain degree of protrusion compared to the heated surfaces, and for the heat source bosses with higher protrusion, the grooves 114 are used for accommodating the protruding heat source bosses after the uniform temperature plates 5 are fixed on the constant temperature body 122.
The through hole 115 is formed in the bottom surface of the groove 114, and heat is supplied to the temperature equalizing plate 5 through the through hole 115 and the groove 114 in the process of moving the heating mechanism 3 upward.
In an optional embodiment of this embodiment, the device for testing performance of a temperature equalization plate further includes a limiting member 4, the limiting member 4 is connected to the substrate 111, and the limiting member 4 is used to limit a position of the constant temperature body 122 relative to the substrate 111.
Specifically, the limiting member 4 is detachably connected to the substrate 111, and after the position of the constant temperature body 122 on the sliding groove 113 is determined, the sliding groove 113 is limited and fixed by the limiting member 4.
The stopper 4 is preferably of a triangular ribbed plate-like structure, and one surface thereof abuts against the base plate 111 and the other surface thereof abuts against the constant temperature body 122.
In an alternative embodiment of this embodiment, referring to fig. 6, the mobile heating mechanism 3 includes a heating structure 31 and a second telescopic assembly 32, the second telescopic assembly 32 is installed on the supporting and carrying mechanism 1, and the heating structure 31 is connected with a telescopic portion of the second telescopic assembly 32 through a heat insulation pad 312; in use, the second telescopic assembly 32 pushes the heating structure 31 towards the vapor chamber 5 through the telescopic portion.
Specifically, the second telescopic assembly 32 includes a second telescopic member 321 and a connecting frame 322, the second telescopic member 321 is connected to the supporting and carrying mechanism 1 through the connecting frame 322, and the second telescopic member 321 is preferably a telescopic cylinder structure.
The heating structure 31 includes a heater assembly 311 and a heat insulation pad 312, the heater assembly 311 is connected to the telescopic portion of the second telescopic member 321 through the heat insulation pad 312, and the heat insulation pad 312 is used for preventing heat emitted from the heater assembly 311 from being conducted toward the second telescopic member 321.
The heater module 311 includes a heater housing 3111 and a heater core 3112 accommodated therein, and heats the housing of the heater housing 3111 by inserting the heater core 3112 into the heater housing 3111, and forms a heating surface on a surface of the heater housing 3111 facing the temperature equalizing plate 5 for heating the temperature equalizing plate 5.
Finally, it should be noted that: the embodiments in the present description are all described in a progressive manner, each embodiment focuses on the differences from the other embodiments, and the same and similar parts among the embodiments can be referred to each other; the above embodiments in the present specification are only used for illustrating the technical solution of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. The device for testing the performance of the uniform temperature plate is characterized by comprising a supporting and bearing mechanism (1), a movable temperature measuring mechanism (2) and a movable heating mechanism (3), wherein the movable temperature measuring mechanism (2) and the movable heating mechanism (3) are connected with the supporting and bearing mechanism (1);
the supporting and bearing mechanism (1) is used for fixing the temperature equalizing plate (5);
the movable heating mechanism (3) is provided with a heating surface, and the heating surface is used for gradually approaching the temperature equalizing plate (5) and supplying heat to one side of the temperature equalizing plate (5);
the movable temperature measuring mechanism (2) is provided with a plurality of temperature measuring contacts, the projection of each temperature measuring contact on the plane where the heating surface is located is arranged at intervals with the heating surface, and the plurality of temperature measuring contacts are used for approaching the temperature-equalizing plate (5) gradually and measuring the temperature of the other side of the temperature-equalizing plate (5).
2. The performance testing device of the temperature equalizing plate according to claim 1, characterized in that the movable temperature measuring mechanism (2) comprises a first telescopic component (21), a supporting member (22) and a temperature measuring element (23), wherein the first telescopic component (21) is mounted on the supporting and bearing mechanism (1), and a telescopic part of the first telescopic component (21) is connected with the supporting member (22);
the supporting piece (22) is provided with a plurality of slide ways (24), each slide way (24) is connected with the temperature measuring element (23) in a sliding mode, and the temperature measuring elements (23) are provided with the temperature measuring contacts.
3. The device for testing the performance of the vapor chamber plate according to claim 2, wherein the supporting and carrying mechanism (1) comprises a supporting component (11) and a plurality of thermostatic components (12);
every constant temperature subassembly (12) all with supporting component (11) are connected, and is a plurality of constant temperature subassembly (12) are used for fixing vapor chamber plate (5) and for vapor chamber plate (5) provide the samming environment.
4. The device for testing the performance of the temperature equalization plate as claimed in claim 3, characterized in that the constant temperature assembly (12) comprises a constant temperature body (122), a placing groove for installing the temperature equalization plate (5) is recessed in the constant temperature body (122), and a constant temperature medium channel (124) for flowing through of a constant temperature medium is arranged in the constant temperature body (122).
5. The performance testing device of the temperature equalizing plate is characterized in that the constant temperature assembly (12) further comprises a plurality of fixing pieces (121), each fixing piece (121) is connected with the constant temperature body (122) and extends into the placing groove, and each fixing piece (121) is used for fixing the temperature equalizing plate (5) in the placing groove.
6. The device for testing the performance of the temperature equalization plate according to claim 4, wherein the support assembly (11) comprises a base plate (111) and support legs (112) supporting the base plate (111);
the first telescopic assembly (21) and the movable heating mechanism (3) are both connected with the substrate (111).
7. The performance testing device of the temperature equalization plate as claimed in claim 6, wherein the base plate (111) is concavely provided with a chute (113);
the constant temperature body (122) is connected with the base plate (111) in a sliding mode through the sliding groove (113).
8. The device for testing the performance of the temperature equalization plate according to claim 7, wherein the base plate (111) is further concavely provided with a groove (114) for accommodating the temperature equalization plate (5), the groove (114) is located on the side of the sliding groove (113), and a through hole (115) for allowing the movable heating mechanism (3) to penetrate through the base plate (111) to supply heat to the temperature equalization plate (5) is formed in the bottom surface of the groove (114).
9. The device for testing the performance of the temperature equalization plate according to claim 7, further comprising a limiting member (4), wherein the limiting member (4) is connected with the base plate (111), and the limiting member (4) is used for limiting the position of the thermostatic body (122) relative to the base plate (111).
10. The device for testing the performance of the temperature equalization plate according to any one of claims 1 to 9, wherein the movable heating mechanism (3) comprises a heating structure (31) and a second telescopic assembly (32), the second telescopic assembly (32) is mounted on the supporting and carrying mechanism (1), and the heating structure (31) is connected with a telescopic part of the second telescopic assembly (32) through a heat insulation pad (312).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221411543.9U CN217820120U (en) | 2022-06-07 | 2022-06-07 | Performance testing device for vapor chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221411543.9U CN217820120U (en) | 2022-06-07 | 2022-06-07 | Performance testing device for vapor chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217820120U true CN217820120U (en) | 2022-11-15 |
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ID=83988906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221411543.9U Active CN217820120U (en) | 2022-06-07 | 2022-06-07 | Performance testing device for vapor chamber |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217820120U (en) |
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2022
- 2022-06-07 CN CN202221411543.9U patent/CN217820120U/en active Active
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