CN219574177U - Slide glass device and probe station equipment - Google Patents

Abstract

The utility model relates to a slide glass device and probe station equipment. When the component to be tested is tested, the device to be tested can be placed on the bearing surface of the supporting component, and then the supporting component adjusts the temperature of the bearing surface, so that the device to be tested can be in a low-temperature, normal-temperature or high-temperature environment. And the supporting component is connected with the base through a plurality of heat insulation columns, most areas between the supporting component and the base are filled with air, and the heat conduction efficiency between the supporting component and the base is low due to the fact that the heat conduction coefficient of the air is low. Therefore, although the temperature span of the support assembly in the three-temperature test process is larger, the temperature of the base can be kept relatively stable, so that the junction of the base and the probe station main body is prevented from being greatly deformed due to overlarge temperature difference, and the inclination of the bearing surface is further prevented. Therefore, the slide glass device and the probe station equipment can be well suitable for three-temperature testing.

Description

Slide glass device and probe station equipment

Technical Field

The utility model relates to the technical field of semiconductor equipment, in particular to a slide device and a probe station device.

Background

In semiconductor processing, it is common to test electrical parameters of semiconductor chips using a common apparatus with a probe station. When in testing, the device to be tested is firstly placed on the object carrying device of the probe station, and then the probe is pricked into the tested point, so that the detection of the electric parameters of voltage, current, resistance, capacitance and the like of the integrated circuit can be completed.

The existing probe station is generally only suitable for testing at normal temperature and high temperature, and the carrying device can be heated and cooled so that the device to be tested is in different temperature environments. With the continuous development of technology, the market demand for three-temperature testing is increasing, namely, the probe station needs to be tested not only in normal temperature and high temperature environments, but also in low temperature environments.

The temperature span of the load device in the three temperature test is extremely large, typically between-55 ℃ and 150 ℃. Because of thermal expansion and cold contraction, the deformation of the joint of the object carrying device and the probe station main body is easily caused by the overlarge temperature difference, so that the bearing surface of the object carrying device is inclined, and the three-temperature test cannot be smoothly performed.

Disclosure of Invention

In view of the foregoing, it is desirable to provide a slide device and a probe station apparatus suitable for three-temperature testing.

A slide apparatus, comprising:

a base;

the support assembly is provided with a bearing surface for bearing and adsorbing a device to be tested, and can adjust the temperature of the bearing surface within a preset temperature range; a kind of electronic device with high-pressure air-conditioning system

The heat insulation columns are arranged between the base and the support component and are connected with the base.

In one embodiment, the support assembly comprises a sucker and a cooling disc, a cooling flow passage is formed in the cooling disc, the sucker is connected to the cooling disc, the bearing surface is located on the adsorption surface of the sucker, and the plurality of heat insulation columns are used for connecting the cooling disc to the base.

In one embodiment, the support assembly comprises a cooling disc and a heating wire, a cooling flow passage through which cooling liquid flows is formed in the cooling disc, the heating wire is embedded in the cooling disc and can heat the bearing surface, and the cooling disc is connected to the base through a plurality of heat insulation columns.

In one embodiment, the heating wires are formed with a plurality of mutually nested annular heating zones on the cooling plate, and the power density of the heating wires in the plurality of annular heating zones increases in the direction from the center to the edge of the cooling plate.

In one embodiment, the heating wire is in a spiral shape, and the distance between two adjacent circles of the heating wire is reduced in the direction from the center to the edge of the cooling disc.

In one embodiment, the heat insulation column is offset from the heating wire on the cooling plate.

In one embodiment, the heat insulating pillars are ceramic pillars.

In one embodiment, a part of the heat insulation columns are arranged at intervals along the edge of the base, another part of the heat insulation columns are arranged in the middle of the base, one end of each heat insulation column positioned at the edge of the base is fixedly connected with the base, the other end of each heat insulation column is abutted to the supporting component, and two ends of each heat insulation column positioned in the middle of the base are respectively fixedly connected with the base and the supporting component.

In one embodiment, the heat insulation column is of a hollow structure, the heat insulation column located in the middle of the base is fixedly connected with the base and the supporting component through a locking bolt, and the locking bolt penetrates through the heat insulation column and is screwed with the base and the supporting component.

A probe station apparatus comprising a probe station body and a slide device as in any of the above preferred embodiments, the base of the slide device being mounted to the probe station body.

According to the slide glass device and the probe station equipment, the device to be tested can be placed on the bearing surface of the supporting component, and then the supporting component is used for adjusting the temperature of the bearing surface, so that the device to be tested can be in a low-temperature, normal-temperature or high-temperature environment. And the supporting component is connected with the base through a plurality of heat insulation columns, most areas between the supporting component and the base are filled with air, and the heat conduction efficiency between the supporting component and the base is low due to the fact that the heat conduction coefficient of the air is low. Therefore, although the temperature span of the support assembly in the three-temperature test process is larger, the temperature of the base can be kept relatively stable, so that the junction of the base and the probe station main body is prevented from being greatly deformed due to overlarge temperature difference, and the inclination of the bearing surface is further prevented. Therefore, the slide glass device and the probe station equipment can be well suitable for three-temperature testing.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a carrier device according to a preferred embodiment of the present utility model;

FIG. 2 is an exploded view of a support assembly of the slide assembly of FIG. 1;

FIG. 3 is a schematic view of the suction cup of the support assembly of FIG. 2;

FIG. 4 is a schematic view of the cooling plate of the support assembly of FIG. 2;

fig. 5 is a schematic diagram of a configuration of the slide apparatus shown in fig. 1 in which a base is mated with a thermally insulating column.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

The utility model provides a slide glass device and a probe station device. The probe station device comprises a probe station main body and the slide device, wherein the slide device is arranged on the probe station main body. The slide device is used for bearing and fixing the device to be tested. In addition, the probe station apparatus generally further includes a probe that can be inserted into a device under test fixed to the slide device to test the device under test. In particular, in this embodiment, the device under test may be a wafer.

Referring to fig. 1, a slide apparatus 100 according to a preferred embodiment of the utility model includes a base 110, a support assembly 120, and an insulating column 130.

The base 110 is used for supporting the slide device 100 on the probe stage main body, and the base 110 and the probe stage main body can be connected through a slide stage bearing (not shown). The base 110 has high mechanical strength and is not easy to deform. Specifically, the base 110 may be a plate-like structure formed of metal. The base 110 may be circular, rectangular, or other shape. In particular, in the present embodiment, the base 110 is circular.

The supporting component 120 has a bearing surface 101, and the bearing surface 101 is used for bearing and adsorbing the device to be tested. The carrying surface 101 generally adopts a vacuum adsorption mode to adsorb the device to be tested. Specifically, the support assembly 120 is capable of creating a negative pressure on the bearing surface 101, thereby adsorbing the device under test.

Further, the support assembly 120 can adjust the temperature of the bearing surface 101 within a preset temperature range. The support assembly 120 can be cooled or heated to adjust the temperature of the carrying surface 101, so that the device under test carried on the carrying surface 101 is in different temperature environments. Specifically, the supporting component 120 can make the device to be tested in a low-temperature, normal-temperature or high-temperature environment by performing temperature adjustment on the bearing surface 101, so as to realize three-temperature test on the device to be tested. It should be noted that the above low temperature, normal temperature or high temperature represent three temperature ranges from small to large, respectively, and specific temperature values are not specified. Specific temperature values corresponding to the low temperature, the normal temperature or the high temperature can be different for different types of devices to be tested.

Referring to fig. 2, 3 and 4, in the present embodiment, the support assembly 120 includes a suction cup 121 and a cooling plate 122, a cooling flow passage 1221 is formed in the cooling plate 122, the suction cup 121 is connected to the cooling plate 122, and the bearing surface 101 is located on an adsorption surface of the suction cup 121.

The suction surface of the suction cup 121 is provided with suction holes (not shown), and an air passage (not shown) is formed therein. In addition, the sidewall of the suction cup 121 is provided with a suction hole 1211, and the suction hole 1211 communicates with the air passage. In use, the suction hole 1211 can be connected to a vacuum device (not shown), and the vacuum device can form a negative pressure on the adsorption surface, i.e. the bearing surface 101, by vacuum-pumping the air channel through the suction hole 1211, so as to adsorb the device to be tested.

The support assembly 120 is also typically provided with a temperature sensor (not shown) that is capable of detecting the temperature of the bearing surface 101 in real time, thereby facilitating control of the temperature of the bearing surface 101 within a desired range. The side of the sucker 121 is further provided with a mounting hole 1212, and the mounting hole 1212 can be used for accommodating the temperature sensor, so as to avoid the temperature sensor from being damaged due to exposure.

In the operation process of the probe station apparatus, the cooling flow passage 1221 is communicated with a cooling liquid circulation device (not shown), and the cooling liquid can take away the heat on the suction cup 121 when flowing through the cooling flow passage 1221, so as to cool the bearing surface 101, so that the bearing surface 101 is switched from the high-temperature environment to the normal-temperature environment or the low-temperature environment, or from the normal-temperature environment to the low-temperature environment. In order to increase the cooling rate and to make the cooling of the adsorption surface 101 more uniform, the cooling flow passage 1221 extends along a spiral line in the cooling pan 122.

Specifically, the cooling flow passage 1221 may be formed on a surface of the cooling plate 122 facing the suction cup 121, and the suction cup 121 may be welded to the cooling plate 122 to seal the cooling flow passage 1221. The suction plate 121 and the cooling plate 122 are plate-shaped, such as disk-shaped, and are stacked on each other and are reliably mounted. Moreover, since the suction plate 121 and the cooling plate 122 are welded instead of connected by bolts, the torsion of the bolts can be prevented from affecting the flatness of the suction plate 121, thereby ensuring the flatness of the suction surface, i.e. the bearing surface 101.

It is understood that when the cooling flow passage 1221 is opened inside the cooling disk 122, the cooling flow passage 1221 is already sealed inside the cooling disk 122, and other connection manners such as bolting may be used between the suction cup 121 and the cooling disk 122.

It should be noted that in other embodiments, the suction cup 121 and the cooling plate 122 may be integrally formed. For example, the suction holes, the air passages and the cooling passages 1221 may be simultaneously formed in a metal block by etching, so that the suction cups 121 and the cooling plates 122 may be realized by simply avoiding the positions of the suction holes and the cooling passages 1221.

In addition, referring to fig. 2 again, in the present embodiment, the supporting component 120 further includes a heating wire 123, and the heating wire 123 is embedded in the cooling disc 122 and can heat the carrying surface 101.

The heating wire 123 may be a nichrome wire or an iron-chromium-aluminum wire, and is capable of generating heat when energized. Specifically, a mounting groove 1222 is formed on a side of the cooling disc 122 facing away from the bearing surface 101, and the heating wire 123 is accommodated in the mounting groove 1222. When the heating wire 123 is electrified, the cooling disc 122 can be heated, so that the temperature of the bearing surface 101 rises, and the device to be tested is switched from a low-temperature environment to a normal-temperature environment or a high-temperature environment, or from the normal-temperature environment to the high-temperature environment. It can be seen that the device to be tested on the carrying surface 101 can be switched between the low temperature environment, the normal temperature environment and the high temperature environment by the cooperation of the heating wire 123 and the cooling disc 122.

The heating wire 123 is used for heating the bearing surface 101, so that the bearing surface 101 can be quickly heated. Moreover, since the heating wires 123 are embedded in the cooling plate 122, adverse effects on the flatness of the adsorption surface 101 after the heating plates are adhered or bolted on the side of the cooling plate 122 facing away from the bearing surface 101 are avoided, and the flatness of the adsorption surface 101 is advantageously maintained.

It should be noted that in other embodiments, the support assembly 120 may also heat the bearing surface 101 in other ways. For example, when heating the carrying surface 101 is required, the cooling passage 1221 may be switched to communicate with a heating liquid circulation device (not shown), and the heating liquid (such as hot water) may transfer heat to the suction cup 121 when flowing through the cooling passage 1221, so as to raise the temperature of the carrying surface 101.

In the present embodiment, the heating wires 123 are formed with a plurality of annular heating regions (not shown) nested with each other on the cooling plate 122, and the power density of the heating wires 123 in the plurality of annular heating regions increases in the direction from the center to the edge of the cooling plate 122.

That is, the power density of the heating wire 123 is not uniformly distributed. The closer to the center of the cooling pan 122, the less the power density of the heating wire 123, the less heat generated per unit time; and the closer to the edge of the cooling plate 122, the greater the power density of the heating wire 123, the more heat is generated per unit time. Since the edge of the cooling plate 122 exchanges heat with the external environment more than the center during actual operation, heat loss is more. Therefore, by increasing the heating amount of the edge region of the cooling pan 20 per unit time, the temperature distribution in the cooling pan 122 can be made more uniform, thereby ensuring the uniformity of the temperature distribution of the bearing surface 101.

Further, in the present embodiment, the heating wires 123 are in a spiral shape, and the distance between two adjacent turns of the heating wires 123 decreases in the direction from the center to the edge of the cooling plate 122.

The spiral heating wires 123 are uniformly distributed in the cooling pan 122, so that the cooling pan 122 can be uniformly heated. Also, as the spacing between adjacent turns of the heating wire 123 decreases, it means that the heating wire 123 is denser in the region closer to the edge of the cooling pan 122, thereby making the power density higher.

It should be noted that in other embodiments, the spacing between adjacent turns of the heating wire 123 may also be kept constant, while the power density of the heating wire 123 is otherwise made higher in the region closer to the edge of the cooling disc 122. For example, the wire diameter or the resistance of the heating wire 123 may be set differently so that the wire diameter or the resistance of the heating wire 123 is smaller in a region closer to the edge of the cooling plate 122.

The support assembly 120 is mounted on the base 110 through the heat insulating columns 120. The heat insulation columns 120 are disposed in plurality, and the plurality of heat insulation columns 130 are disposed between the base 110 and the support assembly 120 and connect the support assembly 120 to the base 110. In particular, in the present embodiment, a plurality of heat insulating columns 130 connect the cooling pan 122 to the base 110.

The heat insulating column 120 is formed of a heat insulating material, and may have a cylindrical shape, a rectangular parallelepiped shape, or the like. The heat insulating column 120 can not only serve to connect the base 110 and the support assembly 120, but also reduce the efficiency of heat conduction between the base 110 and the support assembly 120.

In particular, in the present embodiment, the heat insulating pillars 130 are ceramic pillars. The ceramic column has low heat conduction efficiency, high hardness and difficult deformation. Obviously, in other embodiments, the insulating column 130 may be formed using other thermally poor conductors.

When the probe station equipment is used for testing, a device to be tested is firstly placed on the bearing surface 101, and then the supporting component 120 is used for adjusting the temperature of the bearing surface 101, so that the device to be tested is in low-temperature, normal-temperature and high-temperature environments, and the three-temperature test of the device to be tested is realized. Since the support assembly 120 is connected to the base 110 through the plurality of heat insulating columns 130, most of the area between the support assembly 120 and the base 110 is filled with air. The thermal conductivity of air is lower than that of the thermal insulation column 120, so that the thermal conduction efficiency between the support assembly 120 and the base 110 is further reduced.

During the process of adjusting the temperature of the bearing surface 101 by the support assembly 120, the temperature of the base 110 can be maintained relatively stable despite the large temperature span of the support assembly 120. In this way, the joint (specifically, the stage bearing) between the base 110 and the probe stage main body can be prevented from being greatly deformed due to the excessively large temperature difference, thereby effectively preventing the bearing surface 101 from being inclined.

In the present embodiment, the heat insulating columns 130 are offset from the heating wires 123 in position on the cooling pan 122. That is, the heating wire 123 is not provided at a position where the heat insulation column 130 contacts the cooling pan 122. In this way, the heat insulating column 130 can be prevented from interfering with the heating wire 123. Also, the heating wire 123 can be prevented from directly heating the insulation column 130, thereby further reducing the amount of heat transferred to the base 110 through the insulation column 130.

Referring to fig. 5, in the present embodiment, a portion of the heat-insulating columns 130 are disposed along the edge of the base 110 at intervals, another portion of the heat-insulating columns 130 are disposed in the middle of the base 110, one end of the heat-insulating column 130 located at the edge of the base 110 is fixedly connected with the base 110, the other end is abutted to the supporting component 120, and two ends of the heat-insulating column 130 located in the middle of the base 110 are respectively fixedly connected with the base 110 and the supporting component 120.

The plurality of heat insulation columns 130 in the middle of the base 110 can provide a pulling force to the base 110 and the support assembly 120, and the plurality of heat insulation columns 130 at the edge of the base 110 can provide a pushing force to the support assembly 120. Under the interaction of the pushing force and the pulling force, balance is maintained between the base 110 and the supporting component 120. This arrangement enables a more stable connection of the plurality of heat insulating columns 130 between the base 110 and the support assembly 120.

As shown in fig. 5 for example, 20 heat insulation columns 130 are provided at the edge of the base 110, and 5 heat insulation columns 130 are provided at the middle of the base 110. Obviously, the specific number of insulation columns 130 may be set as desired.

In addition, when the supporting component 120 heats the bearing surface 101, the deformation amount of the middle part of the supporting component 120 is larger than that of the edge region at high temperature, and the two ends of the heat insulation column 130 in the middle part of the base 110 are respectively and fixedly connected with the base 110 and the supporting component 120, so that the middle region of the supporting component 120 can be tensioned and fixed, and the deformation amount is reduced. The heat insulation columns 130 at the edge of the base 110 are not fixed to the support assembly 120, so that the edge region of the support assembly 120 can be freely expanded. In this way, the deformation amounts of the middle region and the edge region of the supporting component 120 tend to be consistent, so that the flatness of the bearing surface 101 is better.

Further, in the present embodiment, the heat insulation column 130 is a hollow structure, the heat insulation column 130 located in the middle of the base 110 is fixedly connected with the base 110 and the support assembly 120 through the locking bolt 140, and the locking bolt 140 passes through the heat insulation column 130 and is screwed with the base 110 and the support assembly 120.

Because of the hollow structure of the heat insulating columns 130, the contact area with the base 110 and the support assembly 120 is further reduced, so that the heat conduction efficiency between the base 110 and the support assembly 120 can be further reduced. Specifically, the locking bolt 140 can penetrate through the base 110 from the bottom and penetrate into the heat insulation column 130, and the portion of the locking bolt 140 protruding from the heat insulation column 120 is screwed with the support assembly 120.

It should be noted that, in other embodiments, the heat insulation column 130 in the middle of the base 110 may be fixedly connected to the base 110 and the support assembly 120 in other manners. Such as welding, clamping, etc.

In addition, the edge of the base 110 is provided with a plurality of grooves (not shown) for inserting the heat insulation columns 120, and the sidewall of the base 110 is provided with a jackscrew hole 111 communicating with the grooves. After the insulation columns 120 at the edge of the base 110 are inserted into the grooves, the jackscrews (not shown) can pass through the jackscrew holes 111 and abut against the insulation columns 120 in the corresponding grooves, so that the insulation columns 120 can be fixed at the edge of the base 110.

In the slide device 100 and the probe station apparatus, the device to be tested can be placed on the bearing surface 101 of the supporting component 120, and then the supporting component 120 adjusts the temperature of the bearing surface 101, so that the device to be tested can be in a low-temperature, normal-temperature or high-temperature environment. In addition, the support assembly 120 is connected to the base 110 through the plurality of heat insulation columns 130, most of the area between the support assembly 120 and the base 110 is filled with air, and the heat conduction efficiency between the support assembly 120 and the base 110 is low due to the low heat conduction coefficient of air. Therefore, although the temperature span of the support assembly 120 is larger during the three-temperature test, the temperature of the base 110 can be maintained relatively stable, so that the junction between the base 110 and the probe station body is prevented from being deformed greatly due to too large temperature difference, and the bearing surface 101 is prevented from being inclined. It can be seen that the slide device 100 and the probe station apparatus described above can be well adapted for three-temperature testing.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. A slide apparatus, comprising:

a base;

the support assembly is provided with a bearing surface for bearing and adsorbing a device to be tested, and can adjust the temperature of the bearing surface within a preset temperature range; a kind of electronic device with high-pressure air-conditioning system

The heat insulation columns are arranged between the base and the support component and are connected with the base.

2. The slide device of claim 1, wherein the support assembly comprises a suction cup and a cooling plate, wherein a cooling flow channel is formed in the cooling plate, the suction cup is connected to the cooling plate, the bearing surface is located on an adsorption surface of the suction cup, and the plurality of heat insulation columns connect the cooling plate to the base.

3. The slide device of claim 1, wherein the support assembly comprises a cooling plate and a heating wire, wherein a cooling flow channel through which a cooling liquid flows is formed in the cooling plate, the heating wire is embedded in the cooling plate and can heat the bearing surface, and the cooling plate is connected to the base by a plurality of heat insulation columns.

4. The slide assembly of claim 3 wherein the heater wires are formed with a plurality of nested annular heating zones on the cooling plate, the power density of the heater wires in the plurality of annular heating zones increasing in a direction from the center to the edge of the cooling plate.

5. The slide assembly as in claim 4, wherein the heater wire is spiral and the spacing between adjacent turns of the heater wire decreases in a direction from the center to the edge of the cooling disk.

6. The slide assembly of claim 3 wherein the insulating column is offset from the heater wire on the cooling plate.

7. The slide apparatus of claim 1, wherein the thermally insulating posts are ceramic posts.

8. The slide device of claim 1, wherein a portion of the heat insulation columns are disposed at intervals along an edge of the base, and another portion of the heat insulation columns are disposed in a middle portion of the base, one end of the heat insulation column located at the edge of the base is fixedly connected with the base, the other end of the heat insulation column is abutted to the supporting component, and two ends of the heat insulation column located in the middle portion of the base are fixedly connected with the base and the supporting component respectively.

9. The slide device of claim 8, wherein the heat insulating column is of a hollow structure, the heat insulating column in the middle of the base is fixedly connected with the base and the support assembly through a locking bolt, and the locking bolt passes through the heat insulating column and is screwed with the base and the support assembly.

10. A probe station apparatus comprising a probe station body and a slide device according to any one of claims 1 to 9, the base of the slide device being mounted to the probe station body.