CN214519750U

CN214519750U - Power electronic semiconductor module test fixture

Info

Publication number: CN214519750U
Application number: CN202120426336.XU
Authority: CN
Inventors: 张永健; 李耀武
Original assignee: Xi'an Yien Electric Technology Co ltd
Current assignee: Xi'an Yien Electric Technology Co ltd
Priority date: 2021-02-26
Filing date: 2021-02-26
Publication date: 2021-10-29
Anticipated expiration: 2031-02-26

Abstract

The utility model relates to a power electronic semiconductor module test fixture, which comprises a bracket, wherein one end of the bracket is provided with a cylinder, the other end is fixed with a pressing plate, a plurality of placing plates are arranged on the bracket in a sliding manner between the pressing plate and the cylinder, the placing plates are all distributed in parallel along the telescopic direction of the cylinder, and a telescopic frame for linking the placing plates is arranged between the placing plates; the expansion bracket comprises a plurality of groups of X-shaped structures which are linearly arranged, the end parts of two adjacent groups of X-shaped structures are mutually rotatably connected to form a parallelogram, the central fork point of the X-shaped structures is connected with the side wall of the placing plate, and the expansion bracket has the advantages of high testing efficiency and no need of installing a valve group.

Description

Power electronic semiconductor module test fixture

Technical Field

The utility model belongs to the technical field of semiconductor testing device, especially, relate to a power electronics semiconductor module test fixture.

Background

The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, and has wide application in radio, television and temperature measurement, for example, a diode is a device made of semiconductor, and a semiconductor refers to a material with controllable conductivity ranging from an insulator to a conductor, and the importance of the semiconductor is very great from the viewpoint of technology or economic development.

At present, in the field of power semiconductor application, the application range of modules is more and more extensive, the types of the modules are more and more, the modules are divided into a single tube, a single-phase rectifier bridge, a three-phase rectifier bridge, a full-control bridge, a semi-control bridge, a series bridge arm, a common-negative module, a common-positive module and the like in terms of functions, and the modules are further divided into a single-screw fixing mode, a double-screw fixing mode, a four-screw fixing mode and the like in terms of fixing modes. The power semiconductor device is developed in the high-voltage field at present, and is between the technical bottleneck of voltage resistance of a single semiconductor power device, and a plurality of devices are mostly connected in series. Because the characteristic curves of the single device are not completely consistent, the type selection is tightly dependent on the characteristic parameters, and whether the serial connection of the devices under different working conditions has consistent characteristics cannot be completely verified. Therefore, a plurality of used devices are required to be connected in series, and then the dynamic and static voltage-sharing characteristics of the devices are verified under the working condition of practical application.

As the high-voltage semiconductor power device is mostly applied to the field of high-voltage and high-current application, the device needs to apply specified pressure and can be used after a dynamic and static pressure equalizing system is installed. As the high-voltage semiconductor power device is mostly applied to the field of high-voltage and high-current application, the device needs to apply specified pressure and can be used after a dynamic and static pressure equalizing system is installed. Therefore, the semiconductor power device test fixture capable of improving the working efficiency is developed, and the problems of inconvenience in mounting and low efficiency of the valve bank are solved.

SUMMERY OF THE UTILITY MODEL

The utility model has the advantages of the efficiency of software testing is high and need not install the valves.

In order to solve the problems in the background art, the utility model discloses a realize through following technical scheme:

a power electronic semiconductor module test fixture comprises a support, wherein one end of the support is provided with an air cylinder, the other end of the support is fixedly provided with a pressing plate, a plurality of placing plates are arranged on the support in a sliding mode between the pressing plate and the air cylinder, the placing plates are distributed in parallel along the telescopic direction of the air cylinder, and a telescopic frame used for linking the placing plates is arranged between the placing plates;

the telescopic frame comprises a plurality of groups of X-shaped structures which are linearly arranged, the end parts of two adjacent groups of X-shaped structures are mutually rotatably connected to enclose a parallelogram, and the central fork point of each X-shaped structure is connected with the side wall of the placing plate.

As a further explanation of the utility model: the X-shaped structure comprises two connecting rods, the two connecting rods are rotatably connected at the middle point, and the end parts of the two connecting rods are rotatably connected with the end parts of the connecting rods of the adjacent X-shaped structures.

As a further explanation of the utility model: the telescopic direction of following the cylinder on the support is equipped with the guided way, place the board and slide through slider and guided way and be connected.

As a further explanation of the utility model: the placing plate is provided with a limiting part used for limiting the to-be-tested device.

As a further explanation of the utility model: the locating part is the stopper, be equipped with the inserted block on the stopper, place on the board correspond the stopper is equipped with the slot.

As a further explanation of the utility model: the slot is provided with a plurality of.

As a further explanation of the utility model: the placing plate is internally provided with an interlayer, the interlayer is internally provided with a heating element, and the center of the placing plate is provided with an end face thermal resistor.

As a further explanation of the utility model: and a radiator is arranged on one side of the placing plate close to the cylinder.

As a further explanation of the utility model: and a partition plate is arranged on one side of the radiator close to the cylinder.

As a further explanation of the utility model: one side of the partition board, which is far away from the radiator, is provided with a buffer layer.

Compared with the prior art, the utility model discloses following profitable technological effect has:

1. during the use, with the await measuring device place on placing the board, then place the board through the cylinder drive and remove, under the effect of expansion bracket, it will synchronous movement to place the board, after the await measuring device and adjacent board butt of placing, continue to promote through the cylinder and place the board and remove, the await measuring device will receive the pressure that comes from placing board or baffle, then test can, can test a plurality of await measuring devices simultaneously like this, and is not only efficient, and through the promotion of cylinder, the cooperation is placed board and baffle and is accomplished the exerting pressure to the await measuring device, and is more convenient.

2. When the reliability of the device to be tested needs to be tested, the power supply is switched on, the heating element works to heat the device to be tested to the required temperature, then the test is carried out to complete the reliability test of the device to be tested, and after the heating is completed, the cooling work is completed through the radiator, so that the test is more convenient and faster.

3. The setting of baffle can prevent that the radiator during operation from causing the influence to adjacent board of placing.

4. The arrangement of the buffer layer can avoid damage to the device to be tested in the pressure application process.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a top view of the cross-sectional structure of the present invention;

FIG. 3 is an exploded view of a portion of the structure of the present invention;

fig. 4 is a partial structural sectional view of the present invention.

1. A support; 11. a guide rail; 2. a cylinder; 3. a connecting rod; 4. pressing a plate; 5. placing the plate; 51. a slot; 52. a limiting block; 521. inserting a block; 53. a heating member; 54. a heat sink; 55. a partition plate; 56. a buffer layer; 57. an end face thermal resistor; 58. a slide block.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, a power electronic semiconductor module test fixture comprises a support 1, wherein one end of the support 1 is provided with a cylinder 2, the other end of the support 1 is fixed with a pressing plate 4, a plurality of placing plates 5 are arranged on the support 1 in a sliding manner between the pressing plate 4 and the cylinder 2, the placing plates 5 are all distributed in parallel along the stretching direction of the cylinder 2, and a stretching frame used for linking the placing plates 5 is arranged between the placing plates 5.

Specifically, the telescopic frame comprises a plurality of groups of X-shaped structures which are linearly arranged, the end parts of two adjacent groups of X-shaped structures are mutually rotatably connected to enclose a parallelogram, and a central fork point of each X-shaped structure is connected with the side wall of the placing plate 5; the X-shaped structure comprises two connecting rods 3, the two connecting rods 3 are rotatably connected at the middle point, and the end parts of the two connecting rods are rotatably connected with the end parts of the connecting rods 3 of the adjacent X-shaped structures.

In this embodiment, the central fork of the X-shaped structure and the side wall of the placing plate 5 can be replaced by connecting the two ends of the X-shaped structure and the side wall of the placing plate 5, and the end of the side wall of the placing plate 5 corresponding to the X-shaped structure is provided with a sliding groove along the horizontal direction, when the cylinder 2 pushes the placing plate 5 to move, the placing plate 5 moves synchronously to be close to each other, and the ends of the two connecting rods 3 of the X-shaped structure slide along the sliding groove, so that the telescopic frame is retracted.

The support 1 is provided with the guide rail 11 along the telescopic direction of the cylinder 2, the placing plate 5 is connected with the guide rail 11 in a sliding mode through the sliding block 58, and along with the movement of the placing plate 5, the sliding block 58 slides along the guide rail 11 to play a guiding role.

Place and be equipped with on the board 5 and be used for carrying out spacing locating part to the device to be tested, the locating part is stopper 52, be equipped with inserted block 521 on the stopper 52, it is equipped with slot 51 to place to correspond stopper 52 on the board 5, slot 51 is equipped with a plurality ofly, and in this embodiment, a plurality of slots 51 equidistance are the grid form and distribute, stopper 52 is provided with three, in the time of the use, according to the size of the device to be tested, change stopper 52's position, in order to carry on spacingly to the device to be tested, avoid the device to be tested to drop from placing board 5, and make this test fixture not only can vertical direction use, also can transversely use.

The placing plate 5 is internally provided with an interlayer, the interlayer is internally provided with a heating element 53, the center of the placing plate 5 is provided with an end surface thermal resistor 57, the end surface thermal resistor 57 is used for measuring the temperature at the center of the placing plate 5, in the embodiment, the heating element 53 is a heating pipe, and can also be other components capable of realizing a heating function, such as a resistance wire and the like; the side of the placing plate 5 close to the cylinder 2 is provided with a radiator 54, in the embodiment, the radiator 54 includes a housing and a fan arranged in the housing and blowing air to the placing plate 5, the fan is driven by a motor, and a cooling pipe can also be arranged in the housing and used for cooling and radiating the placing plate 5.

A partition plate 55 is arranged on one side of the radiator 54 close to the cylinder 2, a gap is reserved between the partition plate 55 and the radiator 54 so as to facilitate the operation of the radiator 54, and the partition plate 55 is arranged to prevent the radiator 54 from influencing the adjacent placing plate 5 when in operation; the side of the partition plate 55 facing away from the heat sink 54 is provided with a buffer layer 56, and the buffer layer 56 is arranged to prevent the device to be tested from being damaged during the pressing process, and in this embodiment, the buffer layer 56 may be made of rubber or other flexible substances such as silicone rubber.

The utility model discloses a theory of operation does: when the device testing device is used, a to-be-tested device is placed on the placing plate 5, the placing plate 5 is driven to move through the air cylinder 2, the placing plate 5 can move synchronously under the action of the telescopic frame, after the to-be-tested device is abutted against the adjacent placing plate 5, the placing plate 5 is continuously pushed to move through the air cylinder 2, the to-be-tested device can be subjected to pressure from the placing plate 5 or the partition plate 55, and then testing can be carried out, so that a plurality of to-be-tested devices can be tested simultaneously, the efficiency is high, and the to-be-tested devices can be pressed through the pushing of the air cylinder 2 in a matching mode by the placing plate 5 and the partition plate 55, and the device testing device; when the reliability of the device to be tested needs to be tested, the power supply is switched on, the heating member 53 works to heat the device to be tested to the required temperature, then the test is carried out to complete the reliability test of the device to be tested, and after the heating is completed, the cooling work is completed through the radiator 54, so that the test is more convenient and faster.

The embodiments given above are preferred examples for implementing the present invention, and the present invention is not limited to the above-described embodiments. Any non-essential addition and replacement made by the technical features of the technical solution of the present invention by those skilled in the art all belong to the protection scope of the present invention.

Claims

1. The utility model provides a power electronics semiconductor module test fixture which characterized in that: the device comprises a support (1), wherein one end of the support (1) is provided with a cylinder (2), the other end of the support is fixedly provided with a pressing plate (4), a plurality of placing plates (5) are arranged on the support (1) in a sliding manner between the pressing plate (4) and the cylinder (2), the placing plates (5) are all distributed in parallel along the telescopic direction of the cylinder (2), and a telescopic frame used for linking the placing plates (5) is arranged between the placing plates (5);

the telescopic frame comprises a plurality of groups of X-shaped structures which are linearly arranged, the end parts of two adjacent groups of X-shaped structures are mutually rotatably connected to enclose a parallelogram, and the central fork point of each X-shaped structure is connected with the side wall of the placing plate (5).

2. A power electronics semiconductor module test fixture according to claim 1, wherein: the X-shaped structure comprises two connecting rods (3), the two connecting rods (3) are rotatably connected at the middle point, and the end parts of the connecting rods (3) are rotatably connected with the end parts of the adjacent X-shaped structures.

3. A power electronics semiconductor module test fixture according to claim 1, wherein: the telescopic guide rail (11) is arranged on the support (1) along the telescopic direction of the cylinder (2), and the placing plate (5) is connected with the guide rail (11) in a sliding mode through a sliding block (58).

4. A power electronics semiconductor module test fixture according to claim 1, wherein: the placing plate (5) is provided with a limiting part for limiting the to-be-tested device.

5. A power electronics semiconductor module test fixture according to claim 4, characterized in that: the limiting piece is a limiting piece (52), an inserting piece (521) is arranged on the limiting piece (52), and a slot (51) is formed in the placing plate (5) corresponding to the limiting piece (52).

6. A power electronics semiconductor module test fixture according to claim 5, characterized in that: the number of the insertion grooves (51) is multiple.

7. A power electronics semiconductor module test fixture according to claim 1, wherein: the novel electric heating plate is characterized in that an interlayer is arranged in the placing plate (5), a heating element (53) is arranged in the interlayer, and an end face thermal resistor (57) is arranged at the center of the placing plate (5).

8. A power electronics semiconductor module test fixture according to claim 7, wherein: and a radiator (54) is arranged on one side of the placing plate (5) close to the cylinder (2).

9. A power electronics semiconductor module test fixture according to claim 8, wherein: and a partition plate (55) is arranged on one side of the radiator (54) close to the cylinder (2).

10. A power electronics semiconductor module test fixture according to claim 9, wherein: and a buffer layer (56) is arranged on one side of the partition plate (55) departing from the radiator (54).