CN210720639U - Testing device for laser chip - Google Patents
Testing device for laser chip Download PDFInfo
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- CN210720639U CN210720639U CN201920442627.0U CN201920442627U CN210720639U CN 210720639 U CN210720639 U CN 210720639U CN 201920442627 U CN201920442627 U CN 201920442627U CN 210720639 U CN210720639 U CN 210720639U
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- 238000012360 testing method Methods 0.000 title claims abstract description 78
- 238000001816 cooling Methods 0.000 claims abstract description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000000498 cooling water Substances 0.000 claims abstract description 6
- 230000001681 protective effect Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000013522 software testing Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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- Semiconductor Lasers (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a testing device for a laser chip, which comprises a testing carrier, a connecting block and a control assembly, wherein a carrier plate is arranged on the testing carrier, a plurality of chip grooves for embedding the chip are arranged on the carrier plate, a plurality of wires communicated with the chip are arranged on the carrier plate, the plurality of wires form an electric connector at one end of the carrier plate, a connecting port for inserting a power supply connector is arranged on the connecting block, and the connecting block is electrically connected with the control assembly; the cooling device is characterized in that a cooling box is arranged under the carrier plate, a water inlet and a water outlet are formed in the cooling box, a cooling cavity communicated with the water inlet and the water outlet is formed in the cooling box, the water inlet and the water outlet are communicated with a cooling water circulation box through water pipes, a heat-conducting plate is further arranged on the lower surface of the carrier plate, and the heat-conducting plate is used for being in contact with the upper surface of the cooling box. The utility model discloses it not only can carry out the batchization test of high power laser instrument and chip, can also the effective control temperature, improves the measuring accuracy.
Description
Technical Field
The utility model relates to a testing arrangement for laser instrument chip belongs to chip processing technology field.
Background
Chip burn-in is an electrical stress test method that uses voltage and high temperature to accelerate device electrical failures, where the burn-in process essentially simulates running the entire life of the chip, since the electrical stimuli applied during the burn-in process reflect the worst case for the chip to work.
The aging test can be used for detecting the reliability of the device or finding the early failure of the device as a production window, the device generally used for the chip aging test works together with an external circuit board through a test socket, and the high-power laser and the chip, particularly the laser and the chip with the power of more than 1W, have larger heat productivity, difficult temperature control and poorer test precision.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a testing arrangement for laser instrument chip, it not only can carry out the batchization test of high power laser instrument and chip, can also effective control temperature, improves the measuring accuracy.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a testing device for a laser chip comprises a testing carrier, a connecting block and a control assembly, wherein a carrier plate is mounted on the testing carrier, a plurality of chip grooves for embedding the chip are formed in the carrier plate, a plurality of wires communicated with the chip are arranged on the carrier plate, an electric connector is formed at one end of the carrier plate by the plurality of wires, a connecting port for inserting the electric connector is formed in the connecting block, and the connecting block is electrically connected with the control assembly;
the cooling device is characterized in that a cooling box is arranged under the carrier plate, a water inlet and a water outlet are formed in the cooling box, a cooling cavity communicated with the water inlet and the water outlet is formed in the cooling box, the water inlet and the water outlet are communicated with a cooling water circulation box through water pipes, a heat-conducting plate is further arranged on the lower surface of the carrier plate, and the heat-conducting plate is used for being in contact with the upper surface of the cooling box.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the number of the chip slots is 40.
2. In the above scheme, the plurality of chip slots are uniformly distributed in rows, and the carrier plates at the chip slots in the first row and the last row are provided with the labels corresponding to the chip slots.
3. In the above scheme, a protective cover is installed on the support plate, and a chip hole corresponding to the chip slot is formed in the protective cover.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
1. the test device for the laser chip is characterized in that the carrier plate is provided with a plurality of wires communicated with the chip, the plurality of wires form an electric connector at one end of the carrier plate, the connecting block is provided with a connecting port for inserting a power supply connector, the connecting block is electrically connected with the control assembly, the density of the chips on the carrier plate is improved through the matching of the chip grooves on the carrier plate and the wires, the simultaneous test of a plurality of chips by one carrier plate is realized, the test efficiency is effectively improved, the consistency of the test environment of each chip can be ensured, the difference of the test results of different chips is reduced, and the chips are convenient for workers to disassemble and assemble.
2. According to the testing device for the laser chip, the cooling box is arranged right below the carrier plate, the lower surface of the carrier plate is also provided with the heat conducting plate, the heat conducting plate is used for being in contact connection with the upper surface of the cooling box, the cooling box is arranged below the carrier plate, and heat generated by the chip in the testing process is taken away, so that the testing result of the chip can be prevented from being influenced due to heat accumulation of the chip, the chip can be maintained in a stable temperature range, temperature fluctuation is reduced, the consistency of the testing environment is ensured, and the testing precision is improved; furthermore, through the setting of cooling box, can eliminate the influence that many chips generate heat to the measuring accuracy to can use a support plate to test many chips simultaneously, effectively improve efficiency of software testing, can also guarantee the uniformity of every chip test environment, in order to reduce the difference of different chip test results, and the radiating effect of each part of support plate can be evenly distributed in the setting of heat-conducting plate, further improves the precision of test result.
3. According to the test device for the laser chip, 40 chip grooves are formed in one carrier plate, the chip grooves in the first row and the chip grooves in the last row are provided with corresponding labels, and the chip grooves can be marked and distinguished through the arrangement of the labels in the first row and the last row, so that workers can distinguish the chip grooves conveniently; the side wall of the protective cover close to one side of the connecting block is provided with a fool-proof through groove, the fool-proof through groove is communicated with the corresponding positioning hole, and through the arrangement of the fool-proof through groove, workers can conveniently distinguish the protective cover, and the use is convenient.
Drawings
FIG. 1 is a schematic view of the overall structure of a test apparatus for a laser chip according to the present invention;
FIG. 2 is a schematic view of an internal structure of a test apparatus for a laser chip;
FIG. 3 is a schematic view of the construction of the connecting block portion;
FIG. 4 is a schematic view of the structure of a portion of the substrate;
FIG. 5 is a schematic structural view of a carrier and a substrate portion;
FIG. 6 is a partial cross-sectional view of a carrier plate and a substrate portion;
fig. 7 is an enlarged view of a portion a of fig. 6.
In the above drawings: 1. testing the carrier; 101. a control component; 2. a carrier plate; 21. a wire; 22. an electrical connector; 201. a chip slot; 202. labeling; 3. connecting blocks; 31. a connecting port; 32. a cross beam; 33. a second tension spring; 4. a cooling box; 401. a water inlet; 402. a water outlet; 403. a cooling water circulation tank; 5. a substrate; 51. a base plate; 511. a cooling through groove; 52. a heat conducting plate; 53. a first tension spring; 54. a cylinder; 55. a through hole; 56. a protective cover; 561. a chip hole; 562. positioning holes; 563. a fool-proof through groove; 501. a positioning column; 7. briquetting; 71. and a presser foot.
Detailed Description
Example 1: a testing device for a laser chip is disclosed, referring to the attached figures 1-7, and comprises a testing carrier 1, a connecting block 3 and a control assembly 101, wherein a carrier plate 2 is installed on the testing carrier 1, a plurality of chip grooves 201 for embedding the chip are formed on the carrier plate 2, a plurality of wires 21 communicated with the chip are arranged on the carrier plate 2, an electric connector 22 is formed at one end of the carrier plate 2 by the plurality of wires 21, a connector 31 for inserting the power connector 22 is formed on the connecting block 3, and the connecting block 3 is electrically connected with the control assembly 101;
a cooling box 4 is arranged under the carrier plate 2, a water inlet 401 and a water outlet 402 are arranged on the cooling box 4, a cooling cavity communicated with the water inlet 401 and the water outlet 402 is arranged in the cooling box 4, the water inlet 401 and the water outlet 402 are both communicated with a cooling water circulation box 403 through water pipes, a heat conduction plate 52 is further arranged on the lower surface of the carrier plate 2, and the heat conduction plate 52 is used for being in contact connection with the upper surface of the cooling box 4.
The number of the chip slots 201 is 40, the chip slots 201 are uniformly distributed in rows, and the carrier plate 2 at the first row and the last row of the chip slots 201 is provided with a label 202 corresponding to the chip slots 201;
a protection cover 56 is installed on the carrier 2, and a chip hole 561 corresponding to the chip slot 201 is opened on the protection cover 56; a positioning column 501 is arranged on the heat conducting plate 52, and a positioning hole 562 for embedding the positioning column 501 is formed in the protective cover 56; a foolproof through groove 563 is formed in the side wall of the protective cover 56, which is close to one side of the connecting block 3, and the foolproof through groove 563 is communicated with the corresponding positioning hole 562; the two presser feet 71 are provided and distributed at both ends of one side edge of the protective cover 56.
Example 2: a testing device for a laser chip is disclosed, referring to the attached figures 1-7, and comprises a testing carrier 1, a connecting block 3 and a control assembly 101, wherein the control assembly 101 comprises a power module and a testing module, the power module is used for supplying power to the chip, the testing module is used for collecting and transmitting data of chip testing, a carrier plate 2 is installed on the testing carrier 1, a plurality of chip grooves 201 for embedding the chip are formed on the carrier plate 2, a plurality of wires 21 communicated with the chip are arranged on the carrier plate 2, an electric connector 22 is formed at one end of the carrier plate 2 by the plurality of wires 21, a connector 31 for inserting the power connector 22 is formed on the connecting block 3, and the connecting block 3 is electrically connected with the control assembly 101;
a cooling box 4 is arranged right below the carrier plate 2, a water inlet 401 and a water outlet 402 are formed in the cooling box 4, a cooling cavity communicated with the water inlet 401 and the water outlet 402 is formed in the cooling box 4, the water inlet 401 and the water outlet 402 are both communicated with a cooling water circulation box 403 through water pipes, a heat conduction plate 52 is further arranged on the lower surface of the carrier plate 2, and the heat conduction plate 52 is used for being in contact connection with the upper surface of the cooling box 4;
the test carrier 1 further comprises a substrate 5 and a bottom plate 51 arranged below the substrate 5, wherein a cooling through groove 511 is formed in the bottom plate 51, the heat conducting plate 52 is embedded into the cooling through groove 511, the carrier plate 2 is positioned on the upper surface of the heat conducting plate 52, a plurality of first tension springs 53 are connected between the bottom plate 51 and the substrate 5, the plurality of first tension springs 53 are positioned on two sides of the substrate 5, an air cylinder 54 is respectively arranged on two sides of the substrate 5, a through hole 55 is formed in the substrate 5 positioned below the air cylinder 54, a piston rod of the air cylinder 54 penetrates through the through hole 55 in the substrate 5 and is used for pressing the heat conducting plate 52 downwards, a cross beam 32 is arranged above the connecting block 3, and a plurality of second tension springs 33 are connected between the cross beam 32 and;
a press block 7 is mounted on a piston rod of the air cylinder 54, the press block 7 is provided with at least two press feet 71, the press feet 71 are formed by bending and folding a metal sheet, and the at least two press feet 71 are arranged at intervals along the arrangement direction of the first tension spring 53 and are uniformly arranged above the side edge of the support plate 2;
the testing device comprises a testing carrier 1 and is characterized in that two mounting plates 13 are respectively arranged on two sides of the testing carrier 1 in parallel, a sliding groove 14 is formed in the side wall of the inner side of each of the two mounting plates 13, two sides of a substrate 5 are embedded into the sliding grooves 14, a plurality of partition plates 11 are arranged around the testing carrier 1, a testing cavity 12 is defined by the plurality of partition plates 11, a socket 15 for the substrate 5 to be inserted is formed in one side of the testing cavity 12, and a baffle 34 matched with the socket 15 is arranged at the end part of the substrate 5.
When the testing device for the laser chip is adopted, the chip density on the carrier plate is improved through the matching of the chip grooves and the wires on the carrier plate, the simultaneous testing of a plurality of chips by one carrier plate is realized, the testing efficiency is effectively improved, the consistency of the testing environment of each chip can be ensured, the difference of the testing results of different chips is reduced, and the chips are convenient for workers to disassemble and assemble;
in addition, the cooling box is arranged below the carrier plate, so that heat generated by the chip in the test process is taken away, the test result of the chip can be prevented from being influenced by the heat accumulation of the chip, the chip can be maintained in a stable temperature range, the temperature fluctuation is reduced, the consistency of the test environment is ensured, and the test precision is improved; furthermore, the cooling box can eliminate the influence of the heat generation of a plurality of chips on the test precision, so that a carrier plate can be used for testing a plurality of chips simultaneously, the test efficiency is effectively improved, the consistency of the test environment of each chip can be ensured, the difference of the test results of different chips is reduced, the heat dissipation effect of each part of the carrier plate can be uniform due to the arrangement of the heat conducting plate, and the precision of the test results is further improved;
in addition, through the arrangement of the first tension spring, a certain gap is ensured between the heat conducting plate and the cooling box which are positioned below the carrier plate when the carrier plate is in a non-testing state, so that the connecting head of the carrier plate can be conveniently inserted into the connecting port of the connecting block, the combination of the cylinder and the first tension spring can press the installed carrier plate and the heat conducting plate down in a test state, so that the heat conducting plate is tightly attached to the top surface of the cooling box, the heat dissipation effect of the cooling box is ensured, meanwhile, the environmental temperature of each chip on the carrier plate is consistent, the difference of the test results is reduced, the test precision is improved, the connecting block is arranged below the cross beam through a second tension spring, so that the connecting block can synchronously move along with the connecting head of the inserted carrier plate, the support plate is spliced and then attached, a large number of gaps between the heat conducting plate and the cooling box caused by synchronous splicing and insertion are eliminated, and the testing precision is further improved;
in addition, when the carrier plate is pressed down by a plurality of evenly distributed press feet, on one hand, the pressure points are pressed down and evenly distributed at multiple points, so that the applied pressure is more even, the heat conducting plate can be stably attached to the cooling box, and is not easy to have clearance, on the other hand, because the presser foot of the pressing heat conducting plate has elastic deformation capability, even if it is difficult to maintain the heat conductive plate in a horizontal state due to various adverse factors, after the heat conductive plate is brought into contact with the cooling box, the cylinder continues to compress the presser foot, the presser foot at the contact position of the heat conduction plate and the cooling box continues to compress, the part of the heat conduction plate which is not in contact with the cooling box can be attached to the top surface of the cooling box under the pressure of the rest of the presser feet, and the existence of deformation of the presser foot enables each part of the heat conduction plate to be well attached to the top surface of the cooling box, so that the uniformity of the heat conduction effect of each part is ensured, and the precision of a test result is ensured;
in addition, each chip groove can be marked and distinguished by setting the first row and the last row of labels, so that the chips can be distinguished by workers; this prevent slow-witted logical groove and the locating hole intercommunication that corresponds, through preventing the setting of slow-witted logical groove, the staff of being convenient for distinguishes the visor convenience, convenient to use.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (4)
1. The utility model provides a testing arrangement for laser instrument chip which characterized in that: the test device comprises a test carrier (1), a connecting block (3) and a control assembly (101), wherein a carrier plate (2) is installed on the test carrier (1), a plurality of chip grooves (201) for embedding chips are formed in the carrier plate (2), a plurality of wires (21) communicated with the chips are arranged on the carrier plate (2), an electric connector (22) is formed at one end of the carrier plate (2) by the plurality of wires (21), a connector (31) for inserting the power connector (22) is formed in the connecting block (3), and the connecting block (3) is electrically connected with the control assembly (101);
a cooling box (4) is arranged under the carrier plate (2), a water inlet (401) and a water outlet (402) are formed in the cooling box (4), a cooling cavity communicated with the water inlet (401) and the water outlet (402) is formed in the cooling box (4), the water inlet (401) and the water outlet (402) are communicated with a cooling water circulation box (403) through water pipes, a heat-conducting plate (52) is further arranged on the lower surface of the carrier plate (2), and the heat-conducting plate (52) is used for being in contact connection with the upper surface of the cooling box (4).
2. The test apparatus for a laser chip according to claim 1, wherein: the number of the chip grooves (201) is 40.
3. The test apparatus for a laser chip according to claim 2, wherein: the chip grooves (201) are uniformly distributed in rows, and the carrier plates (2) at the positions of the first row and the last row of chip grooves (201) are provided with marks (202) corresponding to the chip grooves (201).
4. The test apparatus for a laser chip according to claim 1, wherein: a protective cover (56) is arranged on the carrier plate (2), and a chip hole (561) corresponding to the chip groove (201) is formed in the protective cover (56).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920442627.0U CN210720639U (en) | 2019-04-03 | 2019-04-03 | Testing device for laser chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920442627.0U CN210720639U (en) | 2019-04-03 | 2019-04-03 | Testing device for laser chip |
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| Publication Number | Publication Date |
|---|---|
| CN210720639U true CN210720639U (en) | 2020-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920442627.0U Active CN210720639U (en) | 2019-04-03 | 2019-04-03 | Testing device for laser chip |
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|---|---|
| CN (1) | CN210720639U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022068166A1 (en) * | 2020-09-29 | 2022-04-07 | 苏州联讯仪器有限公司 | High-reliability laser chip test system |
-
2019
- 2019-04-03 CN CN201920442627.0U patent/CN210720639U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022068166A1 (en) * | 2020-09-29 | 2022-04-07 | 苏州联讯仪器有限公司 | High-reliability laser chip test system |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Building 5, No. 1508, Xiangjiang Road, Suzhou High-tech Zone, Suzhou City, Jiangsu Province 215129 Patentee after: Suzhou Lianxun Instrument Co.,Ltd. Address before: Building 1, No. 1508 Xiangjiang Road, High tech Zone, Suzhou City, Jiangsu Province, 215000, China Post code: 215011 Patentee before: STELIGHT INSTRUMENT Inc. |
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| CP03 | Change of name, title or address |