CN210720638U - Chip aging testing device with cooling function - Google Patents
Chip aging testing device with cooling function Download PDFInfo
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- CN210720638U CN210720638U CN201920442626.6U CN201920442626U CN210720638U CN 210720638 U CN210720638 U CN 210720638U CN 201920442626 U CN201920442626 U CN 201920442626U CN 210720638 U CN210720638 U CN 210720638U
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Abstract
The utility model discloses a chip aging testing device with cooling function, it has a plurality of chip grooves that supply the chip embedding to open on the support plate, a plurality of wire with the chip intercommunication has on the support plate, and this a plurality of wire forms an electric connector in support plate one end, it has power supply connector male connector to open on the connecting block, be provided with a cooling box under the support plate, the test microscope carrier further includes the base plate and installs the bottom plate in the base plate below, it has a cooling to lead to open on the bottom plate, this cooling of heat-conducting plate embedding leads to the inslot, be connected with first extension spring between bottom plate and the base plate, a cylinder is installed respectively to the base plate both sides, and it has a through-hole to be located to open on the base plate of cylinder below, the piston rod of cylinder passes the through-hole on the. The utility model discloses it can avoid giving out heat the big chip of heat and produce a large amount of heat energy to constantly pile up, and influence the test result of chip, eliminated the integrated harmful effects that bring of chip, effectively improved efficiency of software testing.
Description
Technical Field
The utility model relates to a chip aging testing device with cooling function belongs to chip testing technical field.
Background
Chip burn-in is an electrical stress test method that uses voltage and high temperature to accelerate device electrical failures, where the burn-in process essentially simulates running the entire life of the chip, since the electrical stimuli applied during the burn-in process reflect the worst case for the chip to work.
The aging test can be used for detecting the reliability of the device or finding the early failure of the device as a production window, the device generally used for the chip aging test works together with an external circuit board through a test socket, and the high-power laser and the chip, particularly the laser and the chip with the power of more than 1W, have larger heat productivity and are difficult to control the temperature.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a chip aging testing device with cooling function, it can avoid giving out heat the big chip of heat and produce a large amount of heat energy to constantly pile up, and influence the test result of chip, eliminated the integrated harmful effects who brings of chip, effectively improved efficiency of software testing.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a chip aging test device with a cooling function comprises a test carrier, a connecting block and a control assembly, wherein a carrier plate is mounted on the test carrier, a plurality of chip grooves for embedding chips are formed in the carrier plate, a plurality of wires communicated with the chips are arranged on the carrier plate, an electric connector is formed at one end of the carrier plate by the plurality of wires, a connecting port for inserting the electric connector is formed in the connecting block, and the connecting block is electrically connected with the control assembly;
a cooling box is arranged under the carrier plate, a water inlet and a water outlet are formed in the cooling box, a cooling cavity communicated with the water inlet and the water outlet is formed in the cooling box, the water inlet and the water outlet are both communicated with a cooling water circulation box through water pipes, and a heat-conducting plate is further arranged on the lower surface of the carrier plate and is used for being in contact connection with the upper surface of the cooling box;
the test carrier further comprises a base plate and a base plate arranged below the base plate, wherein a cooling through groove is formed in the base plate, the heat conducting plate is embedded into the cooling through groove, the carrier plate is positioned on the upper surface of the heat conducting plate, a plurality of first tension springs are connected between the base plate and positioned on two sides of the base plate, an air cylinder is respectively arranged on two sides of the base plate, a through hole is formed in the base plate below the air cylinder, a piston rod of the air cylinder penetrates through the through hole in the base plate and is used for pressing the heat conducting plate downwards, a cross beam is arranged above the connecting block, and a plurality of second tension springs are connected between the cross;
when the cooling box is in a non-testing state, a gap is formed between the heat conduction plate and the cooling box, and when the cooling box is in a testing state, the heat conduction plate is in contact connection with the cooling box.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, a protective cover is installed on the support plate, and a chip hole corresponding to the chip slot is formed in the protective cover.
2. In the above scheme, the heat conducting plate is provided with a positioning column, and the protective cover is provided with a positioning hole for embedding the positioning column.
3. In the above scheme, the side wall of the protective cover close to one side of the connecting block is provided with the fool-proof through groove, and the fool-proof through groove is communicated with the corresponding positioning hole.
4. In the above scheme, all install a pull rod on bottom plate, base plate, crossbeam and the connecting block, first extension spring both ends are installed respectively on two pull rods of bottom plate and base plate, second extension spring both ends are installed respectively on two pull rods of crossbeam and connecting block.
5. In the above-mentioned scheme, base plate top surface and bottom plate bottom surface all open there is the bar groove, during this bar groove of pull rod embedding, it has the hole of stepping down that supplies first extension spring embedding to open in bottom plate and the base plate.
6. In the above scheme, the second extension spring is parallel to the first extension spring.
7. In the above scheme, the connecting block is provided with a guide rod, the cross beam is provided with a guide hole for embedding the guide rod, and the guide rod is parallel to the second tension spring.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
1. the chip aging test device with the cooling function has the advantages that the carrier plate is provided with the plurality of wires communicated with the chips, the plurality of wires form an electric connector at one end of the carrier plate, the connecting block is provided with a connecting port for inserting the power supply connector, the connecting block is electrically connected with the control assembly, the density of the chips on the carrier plate is improved through the matching of the chip grooves on the carrier plate and the wires, the simultaneous test of a plurality of chips by one carrier plate is realized, the test efficiency is effectively improved, the consistency of the test environment of each chip can be ensured, the difference of the test results of different chips is reduced, and the chips are convenient for workers to disassemble and assemble.
2. According to the chip aging testing device with the cooling function, the cooling box is arranged right below the carrier plate, the lower surface of the carrier plate is also provided with the heat conducting plate, the heat conducting plate is used for being in contact connection with the upper surface of the cooling box, the cooling box is arranged below the carrier plate, heat generated by a chip in the testing process is taken away, the heat accumulation of the chip can be avoided, the testing result of the chip is influenced, the chip can be maintained in a stable temperature range, temperature fluctuation is reduced, the consistency of the testing environment is ensured, and the testing precision is improved; furthermore, through the setting of cooling box, can eliminate the influence that many chips generate heat to the measuring accuracy to can use a support plate to test many chips simultaneously, effectively improve efficiency of software testing, can also guarantee the uniformity of every chip test environment, in order to reduce the difference of different chip test results, and the radiating effect of each part of support plate can be evenly distributed in the setting of heat-conducting plate, further improves the precision of test result.
3. The invention relates to a chip aging test device with a cooling function, wherein a plurality of first tension springs are connected between a base plate and a base plate, the plurality of first tension springs are positioned at two sides of the base plate, two sides of the base plate are respectively provided with an air cylinder, the base plate positioned below the air cylinder is provided with a through hole, a piston rod of the air cylinder penetrates through the through hole on the base plate, through the arrangement of the first tension springs, a certain gap is ensured between a heat conduction plate positioned below the carrier plate and a cooling box in a non-test state, a connecting head of the carrier plate is conveniently inserted into a connecting port of a connecting block, and the combination arrangement of the air cylinder and the first tension springs can press the mounted carrier plate and the heat conduction plate downwards in a test state, so that the heat conduction plate is tightly attached to the top surface of the cooling box, the heat dissipation effect of the cooling box is ensured, meanwhile, the test precision is improved;
in addition, a cross beam is arranged above the connecting block, a plurality of second tension springs are connected between the cross beam and the connecting block, and the connecting block is arranged below the cross beam through the second tension springs, so that the connecting block can move synchronously along with the connector of the inserted support plate, the support plate is spliced firstly and then attached, a large number of gaps between the heat conducting plate and the cooling box are brought synchronously in the process of eliminating the splicing, and the testing precision is further improved.
4. The chip aging test device with the cooling function is characterized in that the support plate is provided with a protective cover, the protective cover is provided with a chip hole corresponding to the chip groove, the heat conducting plate is provided with a positioning column, the protective cover is provided with a positioning hole for embedding the positioning column, the side wall of one side of the protective cover, which is close to the connecting block, is provided with a foolproof through groove, the foolproof through groove is communicated with the corresponding positioning hole, the support plate and the chip on the support plate can be protected from being damaged through the arrangement of the protective cover, the protective cover is installed in a guiding mode through the matching of the positioning column and the positioning hole, and through the arrangement of the foolproof through groove.
5. According to the chip aging testing device with the cooling function, the pull rods are respectively arranged on the bottom plate, the base plate, the cross beam and the connecting block, two ends of the first tension spring are respectively arranged on the two pull rods of the bottom plate and the base plate, two ends of the second tension spring are respectively arranged on the two pull rods of the cross beam and the connecting block, and the tension of the first tension spring and the tension of the second tension spring are uniformly distributed on the whole pull rod through the arrangement of the pull rods, so that the bottom plate and the connecting block are pressed down more stably and can be kept in the same reference plane, and the laminating property of a heat conducting plate and a cooling box is improved; be equipped with a guide bar on its connecting block, it has the guiding hole that supplies the guide bar embedding to open on the crossbeam, the guide bar is parallel with the second extension spring, and through the cooperation of guide bar and guiding hole, the direction of sliding of connecting block when direction second extension spring is tensile stabilizes the butt joint of connecting block and connector.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a chip aging test device with a cooling function according to the present invention;
FIG. 2 is a schematic diagram of an internal structure of a chip burn-in tester with a cooling function;
FIG. 3 is a schematic view of the construction of the connecting block portion;
FIG. 4 is a schematic view of the structure of a portion of the substrate;
FIG. 5 is a schematic structural view of a carrier and a substrate portion;
FIG. 6 is a partial cross-sectional view of a carrier plate and a substrate portion;
fig. 7 is an enlarged view of a portion a of fig. 6.
In the above drawings: 1. a frame; 101. a control component; 2. a carrier plate; 21. a wire; 22. a connector; 201. a chip slot; 3. connecting blocks; 31. a connecting port; 32. a cross beam; 33. a second tension spring; 301. a guide bar; 302. a guide hole; 4. a cooling box; 401. a water inlet pipe; 402. a water outlet pipe; 403. a cooling water circulation tank; 5. a substrate; 51. a base plate; 511. a cooling tank; 52. a heat conducting plate; 53. a first tension spring; 54. a cylinder; 55. a through hole; 56. a protective cover; 561. a chip hole; 562. positioning holes; 563. a fool-proof through groove; 501. a positioning column; 57. a pull rod; 571. a strip-shaped groove; 502. and (4) a yielding hole.
Detailed Description
Example 1: a chip aging test device with a cooling function refers to the attached figures 1-7, and comprises a test carrier 1, a connecting block 3 and a control assembly 101, wherein the control assembly 101 comprises a power module and a test module, the power module is used for supplying power to a chip, the test module is used for collecting and transmitting data of chip test, a carrier plate 2 is installed on the test carrier 1, a plurality of chip grooves 201 for embedding the chip are formed in the carrier plate 2, a plurality of wires 21 communicated with the chip are arranged on the carrier plate 2, an electric connector 22 is formed at one end of the carrier plate 2 by the plurality of wires 21, a connector 31 into which the power connector 22 is inserted is formed in the connecting block 3, and the connecting block 3 is electrically connected with the control assembly 101;
a cooling box 4 is arranged right below the carrier plate 2, a water inlet 401 and a water outlet 402 are formed in the cooling box 4, a cooling cavity communicated with the water inlet 401 and the water outlet 402 is formed in the cooling box 4, the water inlet 401 and the water outlet 402 are both communicated with a cooling water circulation box 403 through water pipes, a heat conduction plate 52 is further arranged on the lower surface of the carrier plate 2, and the heat conduction plate 52 is used for being in contact connection with the upper surface of the cooling box 4;
the test carrier 1 further comprises a substrate 5 and a bottom plate 51 arranged below the substrate 5, wherein a cooling through groove 511 is formed in the bottom plate 51, the heat conducting plate 52 is embedded into the cooling through groove 511, the carrier plate 2 is arranged on the upper surface of the heat conducting plate 52, a plurality of first tension springs 53 are connected between the bottom plate 51 and the substrate 5, the plurality of first tension springs 53 are arranged on two sides of the substrate 5, an air cylinder 54 is respectively arranged on two sides of the substrate 5, a through hole 55 is formed in the substrate 5 below the air cylinder 54, piston rods of the air cylinders 54 penetrate through the through holes 55 in the substrate 5 and are used for pressing the heat conducting plate 52, a cross beam 32 is arranged above the connecting block 3, and a plurality of second tension springs 33 are connected between the cross beam 32 and the connecting block.
A protection cover 56 is installed on the carrier 2, and a chip hole 561 corresponding to the chip slot 201 is opened on the protection cover 56; a positioning post 501 is disposed on the heat conducting plate 52, and a positioning hole 562 for inserting the positioning post 501 is disposed on the protecting cover 56; the side wall of the protective cover 56 close to the connecting block 3 is provided with a fool-proof through groove 563, and the fool-proof through groove 563 is communicated with the corresponding positioning hole 562.
A pull rod 57 is mounted on each of the base plate 51, the base plate 5, the cross beam 32 and the connecting block 3, two ends of the first tension spring 53 are respectively mounted on the base plate 51 and the two pull rods 57 of the base plate 5, and two ends of the second tension spring 33 are respectively mounted on the cross beam 32 and the two pull rods 57 of the connecting block 3; the top surface of the substrate 5 and the bottom surface of the bottom plate 51 are both provided with a strip-shaped groove 571, the pull rod 57 is embedded into the strip-shaped groove 571, and the bottom plate 51 and the substrate 5 are provided with a relief hole 502 for the first tension spring 53 to be embedded into.
The second tension spring 33 is parallel to the first tension spring 53; the connecting block 3 is provided with a guide rod 301, the cross beam 32 is provided with a guide hole 302 for the guide rod 301 to be inserted into, and the guide rod 301 is parallel to the second tension spring 33.
Example 2: a chip aging test device with a cooling function refers to the attached figures 1-7, and comprises a test carrier 1, a connecting block 3 and a control assembly 101, wherein the control assembly 101 comprises a power module and a test module, the power module is used for supplying power to a chip, the test module is used for collecting and transmitting data of chip test, a carrier plate 2 is installed on the test carrier 1, a plurality of chip grooves 201 for embedding the chip are formed in the carrier plate 2, a plurality of wires 21 communicated with the chip are arranged on the carrier plate 2, an electric connector 22 is formed at one end of the carrier plate 2 by the plurality of wires 21, a connector 31 into which the power connector 22 is inserted is formed in the connecting block 3, and the connecting block 3 is electrically connected with the control assembly 101;
a cooling box 4 is arranged right below the carrier plate 2, a water inlet 401 and a water outlet 402 are formed in the cooling box 4, a cooling cavity communicated with the water inlet 401 and the water outlet 402 is formed in the cooling box 4, the water inlet 401 and the water outlet 402 are both communicated with a cooling water circulation box 403 through water pipes, a heat conduction plate 52 is further arranged on the lower surface of the carrier plate 2, and the heat conduction plate 52 is used for being in contact connection with the upper surface of the cooling box 4;
the test carrier 1 further comprises a substrate 5 and a bottom plate 51 arranged below the substrate 5, wherein a cooling through groove 511 is formed in the bottom plate 51, the heat conducting plate 52 is embedded into the cooling through groove 511, the carrier plate 2 is arranged on the upper surface of the heat conducting plate 52, a plurality of first tension springs 53 are connected between the bottom plate 51 and the substrate 5, the plurality of first tension springs 53 are arranged on two sides of the substrate 5, an air cylinder 54 is respectively arranged on two sides of the substrate 5, a through hole 55 is formed in the substrate 5 below the air cylinder 54, piston rods of the air cylinders 54 penetrate through the through holes 55 in the substrate 5 and are used for pressing the heat conducting plate 52, a cross beam 32 is arranged above the connecting block 3, and a plurality of second tension springs 33 are connected between the cross beam 32 and the connecting block.
A protection cover 56 is installed on the carrier 2, and a chip hole 561 corresponding to the chip slot 201 is opened on the protection cover 56; a positioning post 501 is disposed on the heat conducting plate 52, and a positioning hole 562 for inserting the positioning post 501 is disposed on the protecting cover 56; the side wall of the protective cover 56 close to the connecting block 3 is provided with a fool-proof through groove 563, and the fool-proof through groove 563 is communicated with the corresponding positioning hole 562.
A pull rod 57 is mounted on each of the base plate 51, the base plate 5, the cross beam 32 and the connecting block 3, two ends of the first tension spring 53 are respectively mounted on the base plate 51 and the two pull rods 57 of the base plate 5, and two ends of the second tension spring 33 are respectively mounted on the cross beam 32 and the two pull rods 57 of the connecting block 3; the top surface of the substrate 5 and the bottom surface of the bottom plate 51 are both provided with a strip-shaped groove 571, the pull rod 57 is embedded into the strip-shaped groove 571, and the bottom plate 51 and the substrate 5 are provided with a relief hole 502 for the first tension spring 53 to be embedded into.
When the chip aging testing device with the cooling function is adopted, the chip density on the carrier plate is improved through the matching of the chip grooves and the wires on the carrier plate, the fact that one carrier plate simultaneously tests a plurality of chips is achieved, the testing efficiency is effectively improved, the consistency of the testing environment of each chip can be guaranteed, the difference of testing results of different chips is reduced, and the chips are convenient for workers to disassemble and assemble.
In addition, the cooling box is arranged below the carrier plate, so that heat generated by the chip in the test process is taken away, the test result of the chip can be prevented from being influenced by the heat accumulation of the chip, the chip can be maintained in a stable temperature range, the temperature fluctuation is reduced, the consistency of the test environment is ensured, and the test precision is improved; furthermore, the cooling box can eliminate the influence of the heat generation of a plurality of chips on the test precision, so that a carrier plate can be used for testing a plurality of chips simultaneously, the test efficiency is effectively improved, the consistency of the test environment of each chip can be ensured, the difference of the test results of different chips is reduced, the heat dissipation effect of each part of the carrier plate can be uniform due to the arrangement of the heat conducting plate, and the precision of the test results is further improved;
in addition, through the arrangement of the first tension spring, a certain gap is ensured between the heat conduction plate and the cooling box which are positioned below the support plate in a non-test state, so that the connecting head of the support plate can be conveniently inserted into the connecting port of the connecting block, and the combination arrangement of the cylinder and the first tension spring can press the installed support plate and the heat conduction plate downwards in a test state, so that the heat conduction plate is tightly attached to the top surface of the cooling box, the heat dissipation effect of the cooling box is ensured, meanwhile, the environmental temperature of each chip on the support plate is consistent, the difference of test results is reduced, and the test precision is improved;
in addition, the connecting block is arranged below the cross beam through the second tension spring, so that the connecting block can synchronously move along with the connecting head of the inserted carrier plate, the carrier plate is firstly spliced and then attached, a large number of gaps between the heat conducting plate and the cooling box caused by synchronous splicing and insertion are eliminated, and the testing precision is further improved;
in addition, the support plate and the chip on the support plate can be protected from being damaged by the arrangement of the protective cover, the protective cover is guided to be installed by the matching of the positioning column and the positioning hole, and the protective cover is convenient for workers to distinguish and use by the arrangement of the foolproof through groove;
in addition, through the arrangement of the pull rod, the tension of the first tension spring and the tension of the second tension spring are uniformly distributed on the whole pull rod, so that the bottom plate and the connecting block are pressed more stably and can be kept in the same reference surface, and the bonding property of the heat conducting plate and the cooling box is improved; through the cooperation of guide bar and guiding hole, the butt joint of connecting block and connector is stabilized to the slip direction of direction second extension spring when tensile.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (8)
1. The utility model provides a chip aging testing device with cooling function which characterized in that: the test device comprises a test carrier (1), a connecting block (3) and a control assembly (101), wherein a carrier plate (2) is installed on the test carrier (1), a plurality of chip grooves (201) for embedding chips are formed in the carrier plate (2), a plurality of wires (21) communicated with the chips are arranged on the carrier plate (2), an electric connector (22) is formed at one end of the carrier plate (2) by the plurality of wires (21), a connector (31) for inserting the power connector (22) is formed in the connecting block (3), and the connecting block (3) is electrically connected with the control assembly (101);
a cooling box (4) is arranged right below the carrier plate (2), a water inlet (401) and a water outlet (402) are formed in the cooling box (4), a cooling cavity communicated with the water inlet (401) and the water outlet (402) is formed in the cooling box (4), the water inlet (401) and the water outlet (402) are communicated with a cooling water circulation box (403) through water pipes, a heat-conducting plate (52) is further arranged on the lower surface of the carrier plate (2), and the heat-conducting plate (52) is used for being in contact connection with the upper surface of the cooling box (4);
the test stage (1) further comprises a substrate (5) and a base plate (51) mounted below the substrate (5), a cooling through groove (511) is arranged on the bottom plate (51), the heat conducting plate (52) is embedded into the cooling through groove (511), the carrier plate (2) is positioned on the upper surface of the heat conducting plate (52), a plurality of first tension springs (53) are connected between the bottom plate (51) and the base plate (5), the first tension springs (53) are positioned on two sides of the base plate (5), the two sides of the base plate (5) are respectively provided with an air cylinder (54), the base plate (5) positioned below the air cylinder (54) is provided with a through hole (55), the piston rod of the air cylinder (54) passes through a through hole (55) on the base plate (5), the heat conducting plate is used for pressing down the heat conducting plate (52), a cross beam (32) is arranged above the connecting block (3), and a plurality of second tension springs (33) are connected between the cross beam (32) and the connecting block (3);
when in a non-testing state, the heat conduction plate (52) and the cooling box (4) have a gap, and when in a testing state, the heat conduction plate (52) is in contact connection with the cooling box (4).
2. The chip burn-in apparatus having a cooling function according to claim 1, wherein: a protective cover (56) is arranged on the carrier plate (2), and a chip hole (561) corresponding to the chip groove (201) is formed in the protective cover (56).
3. The chip burn-in apparatus with cooling function according to claim 2, wherein: the heat conduction plate (52) is provided with a positioning column (501), and the protective cover (56) is provided with a positioning hole (562) for embedding the positioning column (501).
4. The chip burn-in apparatus having a cooling function according to claim 3, wherein: the side wall of the protective cover (56) close to one side of the connecting block (3) is provided with a fool-proof through groove (563), and the fool-proof through groove (563) is communicated with a corresponding positioning hole (562).
5. The chip burn-in apparatus having a cooling function according to claim 1, wherein: all install a pull rod (57) on bottom plate (51), base plate (5), crossbeam (32) and connecting block (3), install respectively at bottom plate (51) and two pull rod (57) of base plate (5) at first extension spring (53) both ends, install respectively on two pull rod (57) of crossbeam (32) and connecting block (3) at second extension spring (33) both ends.
6. The chip burn-in apparatus with cooling function according to claim 5, wherein: the top surface of the base plate (5) and the bottom surface of the bottom plate (51) are both provided with a strip-shaped groove (571), the pull rod (57) is embedded into the strip-shaped groove (571), and the bottom plate (51) and the base plate (5) are provided with a yielding hole (502) for embedding the first tension spring (53).
7. The chip burn-in apparatus having a cooling function according to claim 1, wherein: the second tension spring (33) is parallel to the first tension spring (53).
8. The chip burn-in apparatus with cooling function according to claim 7, wherein: be equipped with a guide bar (301) on connecting block (3), it has guide hole (302) that supply guide bar (301) embedding to open on crossbeam (32), guide bar (301) are parallel with second extension spring (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920442626.6U CN210720638U (en) | 2019-04-03 | 2019-04-03 | Chip aging testing device with cooling function |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920442626.6U CN210720638U (en) | 2019-04-03 | 2019-04-03 | Chip aging testing device with cooling function |
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| CN210720638U true CN210720638U (en) | 2020-06-09 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022068166A1 (en) * | 2020-09-29 | 2022-04-07 | 苏州联讯仪器有限公司 | High-reliability laser chip test system |
| CN114384404A (en) * | 2022-03-23 | 2022-04-22 | 上海菲莱测试技术有限公司 | Cooling test assembly unit and aging cooling device |
-
2019
- 2019-04-03 CN CN201920442626.6U patent/CN210720638U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022068166A1 (en) * | 2020-09-29 | 2022-04-07 | 苏州联讯仪器有限公司 | High-reliability laser chip test system |
| CN114384404A (en) * | 2022-03-23 | 2022-04-22 | 上海菲莱测试技术有限公司 | Cooling test assembly unit and aging cooling device |
| CN114384404B (en) * | 2022-03-23 | 2022-08-23 | 上海菲莱测试技术有限公司 | Cooling test assembly unit and aging cooling device |
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Address after: Building 5, No. 1508, Xiangjiang Road, Suzhou High-tech Zone, Suzhou City, Jiangsu Province 215129 Patentee after: Suzhou Lianxun Instrument Co.,Ltd. Address before: Building 1, No. 1508 Xiangjiang Road, High tech Zone, Suzhou City, Jiangsu Province, 215000, China Post code: 215011 Patentee before: STELIGHT INSTRUMENT Inc. |
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