CN207133392U - A kind of semiconductor laser ageing test device - Google Patents
A kind of semiconductor laser ageing test device Download PDFInfo
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- CN207133392U CN207133392U CN201721104396.XU CN201721104396U CN207133392U CN 207133392 U CN207133392 U CN 207133392U CN 201721104396 U CN201721104396 U CN 201721104396U CN 207133392 U CN207133392 U CN 207133392U
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Abstract
A kind of semiconductor laser ageing test device, including：Base, N number of groove, supporting plate, circuit board and laminating mechanism.Because circuit board is contacted by the laminating mechanism in supporting plate with COS chips, therefore reduce the resistance value in circuit, it is ensured that electric current is stable, laser is preferably made electrical contact with.Overcome that conventional springs pin conducts as electric current and it produces larger resistance as pressing laser, cause partial pressure to circuit, and due to contact it is unreal circuit may be caused unstable, the drawbacks of damage chip.This semiconductor laser ageing test device is simple, convenient, ageing efficiency is high while avoids using spring needle.
Description
Technical field
It the utility model is related to photoelectron technical field, and in particular to a kind of semiconductor laser ageing test device.
Background technology
Semiconductor laser development speed is fast, and application is wide, development potentiality is big be other current lasers without
Method analogy, in recent years, the usage quantity shelter of fixed wave length semiconductor laser has first of laser, some important applications
Other conventional in the past lasers of field, are gradually substituted by semiconductor laser.Because it has the excellent of many protrusions
Point：Small volume, in light weight, output power be small and high conversion efficiency, can be carried out by Injection Current directly modulation, reliability it is high,
From visible infrared, wide coverage, price increasingly reduce for long working life, launch wavelength.
But the aging of semiconductor laser, it is one of production testing stream being had to pass through before manufacturer's product export
Journey, the laser after burn-in screen just can ensure that its quality and service life.The method of traditional laser ageing screening
A lot；
Chinese patent document CN201010201586.X, which is disclosed, provides a kind of aging folder suitable for semiconductor laser
Tool, including：One main body, the main body are a printed circuit board (PCB), a groove are provided with the centre of the main body, among the main body
Groove is square, bar shaped or T-shaped, and the both sides of the groove of the body upper are provided with screw, the screw and the circular hole pair on cover plate
Should；One is heat sink with laser, and this is heat sink in the groove；Wherein also include a cover plate, the cover plate is used to cover this
Heat sink, the both sides above the cover plate are provided with circular hole, for cover plate to be fixed on into main body by screw.The patent can only single dress
One laser, one laser of a fixture aging, ageing efficiency are low.
Chinese patent document CN200410085345.8 discloses a kind of multi-channel semiconductor laser ageing method, will partly lead
Volumetric laser diode LD by only be mounted in multichannel LD test and aging clamp on, the fixture with equipped with power supply and with central analysis,
The multichannel constant-power control circuit connection of control computer connection；Computer tests the permanent work(matched with certain LD on fixture first
Rate resistance, then by the power control circuit unit matched in multichannel constant-power control circuit with this LD and its UNICOM, make this
LD with actual condition it is same or like like in the environment of carry out aging, foregoing step is then completed one by one to remaining LD to be measured again
Suddenly.The equipment that the present invention utilizes is mostly the transformation to existing equipment, makes the simpler circuit of equipment, reliability increase and operates
Convenient, need to only connect with the mains can carry out aging, and ageing efficiency is high, and ageing results are more accurate, more practical, exempt to debug and again permanent
Power works so that LD will not suffer damage.The patent is the aging simultaneously of more lasers, but is using the electric current for connecing regulation
To adapt to the work of laser, larger resistance can be produced in circuit, it is necessary to be equipped with multiple systems to ensure the stabilization of aging, if
Standby cumbersome, the resistance of steel is bigger in circuit.
The content of the invention
The utility model is in order to overcome the shortcomings of above technology, there is provided a kind of resistance value reduced in circuit, it is ensured that electricity
The semiconductor laser ageing test device of the stable raising semiconductor laser ageing effect of stream.
Technical scheme is used by the utility model overcomes its technical problem：
A kind of semiconductor laser ageing test device, including：
Base, its elongated structure；
N number of groove, it is arranged at intervals at base upper end, the profile chi of the groove and COS chips along base length direction
Very little matching, the depth of groove are less than the thickness of COS chips, and N is the natural number more than or equal to 2；
Supporting plate, base upper end is fixed on by bindiny mechanism's level；
Circuit board, it is provided with the electrode group of N groups and recess along its length, and every group of electrode group is by two electrode groups
Into；And
Laminating mechanism, it is arranged in supporting plate, and circuit board is pressed in each COS cores in groove by the laminating mechanism
The upper surface of piece, two electrodes of every group of electrode group on circuit board are made to be contacted respectively with two pole-faces of COS chips.
Above-mentioned bindiny mechanism includes some screws being arranged at along its length on base and is arranged at along its length
Some through holes in supporting plate, some mounting holes corresponding with lead to the hole site, the supporting plate are provided with the circuit board
Rubber blanket I is provided between circuit board, screw is combined on corresponding screw after sequentially passing through through hole, rubber blanket I and mounting hole
In.
Above-mentioned laminating mechanism include it is N number of it is vertical be combined in supporting plate and the holding screw corresponding with groove location and
Rubber blanket II, lower surface and circuit board upper end plane-plane contact, the lower end of the holding screw and the rubber blanket of the rubber blanket II
II upper end is in contact.
In order to improve the accuracy of circuit board positioning, in addition to some it is arranged at intervals at along base length direction on base
Guide rod, some pilot holes corresponding with guide rod is provided with the circuit board, the circuit board is slided by each pilot hole
Corresponding to being plugged on guide rod.
In order to prevent short circuit, set between two electrodes of every group of electrode group of foregoing circuit plate jagged.
Further, above-mentioned groove is rectangular configuration.
The beneficial effects of the utility model are：Because circuit board is contacted by the laminating mechanism in supporting plate with COS chips,
Therefore the resistance value in circuit is reduced, it is ensured that electric current is stable, laser is preferably made electrical contact with.Overcome conventional springs pin work
Conducted for electric current and it produces larger resistance as pressing laser, partial pressure is caused to circuit, and due to contacting unreal possibility
Cause circuit unstable, the drawbacks of damaging chip.This semiconductor laser ageing test device is simple, convenient, ageing efficiency
It is high to avoid using spring needle simultaneously.
Brief description of the drawings
Fig. 1 is understructure schematic diagram of the present utility model；
Fig. 2 is board structure of circuit schematic diagram of the present utility model；
Fig. 3 is cross-sectional view of the present utility model；
In figure, the breach 9. of 1. base, 2. groove, 3. screw, 4. guide rod, 5. circuit board, 6. pilot hole, 7. mounting hole 8.
The rubber blanket II of I 14. holding screw of electrode 10.COS chip 11. screw, 12. supporting plate, 13. rubber blankets 15..
Embodiment
Below in conjunction with the accompanying drawings 1, accompanying drawing 2, accompanying drawing 3 are described further to the utility model.
A kind of semiconductor laser ageing test device, including：Base 1, its elongated structure；N number of groove 2, its edge
The length direction of base 1 is arranged at intervals at the upper end of base 1, and the appearance and size of groove 2 and COS chips 10 matches, and the depth of groove 2 is small
In the thickness of COS chips 10, N is the natural number more than or equal to 2；Supporting plate 12, it is fixed on by bindiny mechanism's level on base 1
End；Circuit board 5, it is provided with the electrode group that N groups match with groove 2 along its length, and every group of electrode group is by two 9 groups of electrodes
Into；And laminating mechanism, it is arranged in supporting plate 12, and circuit board 5 is pressed in each COS cores in groove 2 by laminating mechanism
The upper surface of piece 10, two electrodes 9 of every group of electrode group on circuit board 5 are made to be contacted respectively with two pole-faces of COS chips 10.By
Contacted in circuit board 5 by the laminating mechanism in supporting plate 12 with the face of COS chips 10, therefore reduce the resistance value in circuit,
Ensure that electric current is stable, laser is preferably made electrical contact with.Conventional springs pin is overcome to conduct as electric current and as pressing laser
It produces larger resistance with device, and partial pressure is caused to circuit, and due to contacting the unreal disadvantage that may be caused circuit shakiness, damage chip
End.This semiconductor laser ageing test device is simple, convenient, ageing efficiency is high while avoids using spring needle.
Embodiment 1：
Bindiny mechanism can be following structure, and it includes being arranged at some screws 3 and edge on base 1 along its length
Length direction is arranged at some through holes in supporting plate 12, and some installations corresponding with lead to the hole site are provided with circuit board 5
Hole 7, is provided with rubber blanket I 13 between supporting plate 12 and circuit board 5, screw 11 sequentially passes through through hole, rubber blanket I 13 and installation
In screw 3 corresponding to being combined on behind hole 7.Rubber blanket I 13 serves cushioning effect, and after screw 11 screws, rubber blanket I 13 is sent out
Raw elastic deformation preferably can uniformly transfer pressure to circuit board 5, prevent the crushing of circuit board 5.
Embodiment 2：
Laminating mechanism include it is N number of it is vertical be combined in supporting plate 12 and the holding screw 14 corresponding with the position of groove 2 with
And rubber blanket II 15, lower surface and the upper end plane-plane contact of circuit board 5, the lower end of holding screw 14 and the rubber of rubber blanket II 15
The upper end of pad II 15 is in contact.Lower pressure to circuit board 15 can be adjusted by rotating holding screw 14, due to rubber blanket II
15 between holding screw 14 and circuit board 5, therefore it plays cushioning effect, while is with circuit board 5 after its elastic deformation
Face contacts, therefore increase effectively contact area, it is ensured that the electrode seal face of each electrode 9 and COS chips on circuit board 5 connects
Touch.
Embodiment 3：
Also include some guide rods 4 being arranged at intervals at along the length direction of base 1 on base 1, be provided with circuit board 5 some
The pilot hole 6 corresponding with guide rod 4, circuit board 5 is slided by each pilot hole 6 to be plugged on corresponding guide rod 4.Circuit board 5
Accurate positioning between each group electrode group on circuit board 5 and corresponding COS chips can be improved by the guide effect of guide rod 4
Property, improve the reliability used.
Embodiment 4：
Further, jagged 8 are set between two electrodes 9 of every group of electrode group of circuit board 5.Breach 8 can prevent
The situation of short circuit occurs between two neighbouring electrodes 9.
Embodiment 5：
Preferably, groove 2 is rectangular configuration, and its shape preferably matches COS chips.
Claims (6)
- A kind of 1. semiconductor laser ageing test device, it is characterised in that including：Base（1）, its elongated structure；N number of groove（2）, it is along base（1）Length direction is arranged at intervals at base（1）Upper end, the groove（2）With COS chips （10）Appearance and size match, groove（2）Depth be less than COS chips（10）Thickness, N is natural number more than or equal to 2；Supporting plate（12）, base is fixed on by bindiny mechanism's level（1）Upper end；Circuit board（5）, it is provided with N groups and groove along its length（2）The electrode group of matching, every group of electrode group is by two electrodes （9）Composition；AndLaminating mechanism, it is arranged at supporting plate（12）On, the laminating mechanism is by circuit board（5）It is pressed in groove（2）In it is each Individual COS chips（10）Upper surface, make circuit board（5）On every group of electrode group two electrodes（9）Respectively with COS chips（10） Two pole-faces contact.
- 2. semiconductor laser ageing test device according to claim 1, it is characterised in that：The bindiny mechanism includes Base is arranged at along its length（1）On some screws（3）And supporting plate is arranged at along its length（12）On it is some Through hole, the circuit board（5）On be provided with some mounting holes corresponding with lead to the hole site（7）, the supporting plate（12）With electricity Road plate（5）Between be provided with rubber blanket I（13）, screw（11）Sequentially pass through through hole, rubber blanket I（13）And mounting hole（7）After revolve Together in corresponding screw（3）In.
- 3. semiconductor laser ageing test device according to claim 1, it is characterised in that：The laminating mechanism includes It is N number of to be combined on supporting plate vertically（12）Upper and and groove（2）The corresponding holding screw in position（14）And rubber blanket II（15）, The rubber blanket II（15）Lower surface and circuit board（5）Upper end plane-plane contact, the holding screw（14）Lower end and rubber Pad II（15）Upper end be in contact.
- 4. semiconductor laser ageing test device as claimed in any of claims 1 to 3, it is characterised in that：Also Including some along base（1）Length direction is arranged at intervals at base（1）On guide rod（4）, the circuit board（5）It is provided with if Dry and guide rod（4）Corresponding pilot hole（6）, the circuit board（5）Pass through each pilot hole（6）Slip is led corresponding to being plugged in Bar（4）On.
- 5. semiconductor laser ageing test device according to claim 4, it is characterised in that：The circuit board（5）'s Two electrodes of every group of electrode group（9）Between set it is jagged（8）.
- 6. semiconductor laser ageing test device according to claim 4, it is characterised in that：The groove（2）For square Shape structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721104396.XU CN207133392U (en) | 2017-08-31 | 2017-08-31 | A kind of semiconductor laser ageing test device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721104396.XU CN207133392U (en) | 2017-08-31 | 2017-08-31 | A kind of semiconductor laser ageing test device |
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| CN207133392U true CN207133392U (en) | 2018-03-23 |
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| CN201721104396.XU Active CN207133392U (en) | 2017-08-31 | 2017-08-31 | A kind of semiconductor laser ageing test device |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108254676A (en) * | 2018-03-26 | 2018-07-06 | 苏州联讯仪器有限公司 | A kind of high precision laser chip aging clamp |
| CN109870644A (en) * | 2019-04-03 | 2019-06-11 | 苏州联讯仪器有限公司 | The reliability test equipment of superpower laser chip |
| CN111123058A (en) * | 2018-10-29 | 2020-05-08 | 潍坊华光光电子有限公司 | Semiconductor laser whole aging device and aging method |
| CN111337425A (en) * | 2018-12-18 | 2020-06-26 | 山东华光光电子股份有限公司 | Semiconductor laser COS alloy strength detection device and detection method |
| CN112345873A (en) * | 2020-12-04 | 2021-02-09 | 苏州长光华芯光电技术股份有限公司 | Semiconductor laser low-temperature aging test device and low-temperature aging test method |
| CN112362919A (en) * | 2020-11-10 | 2021-02-12 | 西安微电子技术研究所 | KGS test fixture structure of multi-chip TSV silicon-based component |
| CN112798823A (en) * | 2020-12-17 | 2021-05-14 | 中国电子科技集团公司第十三研究所 | COS fixture for burn-in power-up |
| CN113049933A (en) * | 2019-12-27 | 2021-06-29 | 山东华光光电子股份有限公司 | Semiconductor laser aging clamp and aging method thereof |
| CN113314942A (en) * | 2021-05-25 | 2021-08-27 | 天津凯普林光电科技有限公司 | Power-on device of laser component |
| CN113866457A (en) * | 2020-06-30 | 2021-12-31 | 山东华光光电子股份有限公司 | Macro-channel semiconductor laser aging clamp and working method thereof |
-
2017
- 2017-08-31 CN CN201721104396.XU patent/CN207133392U/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108254676A (en) * | 2018-03-26 | 2018-07-06 | 苏州联讯仪器有限公司 | A kind of high precision laser chip aging clamp |
| CN111123058A (en) * | 2018-10-29 | 2020-05-08 | 潍坊华光光电子有限公司 | Semiconductor laser whole aging device and aging method |
| CN111337425A (en) * | 2018-12-18 | 2020-06-26 | 山东华光光电子股份有限公司 | Semiconductor laser COS alloy strength detection device and detection method |
| CN109870644A (en) * | 2019-04-03 | 2019-06-11 | 苏州联讯仪器有限公司 | The reliability test equipment of superpower laser chip |
| CN113049933A (en) * | 2019-12-27 | 2021-06-29 | 山东华光光电子股份有限公司 | Semiconductor laser aging clamp and aging method thereof |
| CN113866457A (en) * | 2020-06-30 | 2021-12-31 | 山东华光光电子股份有限公司 | Macro-channel semiconductor laser aging clamp and working method thereof |
| CN112362919A (en) * | 2020-11-10 | 2021-02-12 | 西安微电子技术研究所 | KGS test fixture structure of multi-chip TSV silicon-based component |
| CN112345873A (en) * | 2020-12-04 | 2021-02-09 | 苏州长光华芯光电技术股份有限公司 | Semiconductor laser low-temperature aging test device and low-temperature aging test method |
| CN112345873B (en) * | 2020-12-04 | 2023-08-01 | 苏州长光华芯光电技术股份有限公司 | Semiconductor laser low-temperature aging test device and low-temperature aging test method |
| CN112798823A (en) * | 2020-12-17 | 2021-05-14 | 中国电子科技集团公司第十三研究所 | COS fixture for burn-in power-up |
| CN113314942A (en) * | 2021-05-25 | 2021-08-27 | 天津凯普林光电科技有限公司 | Power-on device of laser component |
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