CN109870644A - Reliability test equipment for high-power laser chip - Google Patents
Reliability test equipment for high-power laser chip Download PDFInfo
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- CN109870644A CN109870644A CN201910264587.XA CN201910264587A CN109870644A CN 109870644 A CN109870644 A CN 109870644A CN 201910264587 A CN201910264587 A CN 201910264587A CN 109870644 A CN109870644 A CN 109870644A
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- 238000012360 testing method Methods 0.000 title claims abstract description 133
- 238000001816 cooling Methods 0.000 claims abstract description 74
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000000498 cooling water Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 56
- 210000002683 foot Anatomy 0.000 claims description 32
- 238000005192 partition Methods 0.000 claims description 16
- 238000003780 insertion Methods 0.000 claims description 15
- 230000037431 insertion Effects 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000032683 aging Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000000881 depressing effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013480 data collection Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses reliability test equipment of a high-power laser chip, wherein a plurality of chip grooves for embedding the chip are formed on a carrier plate, a plurality of wires communicated with the chip are arranged on the carrier plate, an electric connector is formed at one end of the carrier plate by the plurality of wires, a connecting port for inserting the electric connector is formed on a connecting block, and the connecting block is electrically connected with a control assembly; the cooling device is characterized in that a cooling box is arranged under the carrier plate, a water inlet and a water outlet are formed in the cooling box, a cooling cavity communicated with the water inlet and the water outlet is formed in the cooling box, the water inlet and the water outlet are communicated with a cooling water circulation box through water pipes, a heat-conducting plate is further arranged on the lower surface of the carrier plate, and the heat-conducting plate is used for being in contact with the upper surface of the cooling box. The invention can bring away the heat generated by chip test in real time while realizing the batch test of the chips, effectively control the test temperature of the chips, avoid the temperature fluctuation from influencing the test precision of the chips and greatly improve the test efficiency of the chips.
Description
Technical field
The present invention relates to a kind of reliability test equipment of superpower laser chip, belong to chip testing technology field.
Background technique
Chip ageing test is a kind of electric stress test method for accelerating device electrical failure using voltage and high temperature,
In, the ageing process substantially dry run chip entire service life, because the electric excitation applied in ageing process reflects chip
The worst case of work.
Burn-in test can be used as the detection of device reliability or find the early stage event of device as production window
Barrier, the device for being generally used for chip ageing test is worked together by test jack and external circuits plate, and due to high power
The laser and chip of laser and chip, especially 1W or more, calorific value is larger, and temperature control is more difficult, therefore, existing
Aging testing apparatus in, mostly use greatly single measurement mode operated, cause testing efficiency lower.
Summary of the invention
The object of the present invention is to provide a kind of reliability test equipment of superpower laser chip, are realizing chip batch
While quantization test, the heat of chip testing generation can be taken away in real time, chip testing temperature is effectively controlled, avoids temperature wave
The dynamic precision for influencing chip testing, and greatly improve chip testing efficiency.
In order to achieve the above objectives, the technical solution adopted by the present invention is that: a kind of reliability of superpower laser chip is surveyed
Equipment, including test microscope carrier, link block and control assembly are tried, a support plate is installed on the test microscope carrier, is provided on this support plate
Several chip slots for chip insertion, have several conducting wires being connected to chip on the support plate, this several conducting wire is in support plate
One end forms an electrical connector, and the connector for electrical connector insertion, this link block and control assembly are provided on the link block
Electrical connection；
It is provided with a cooling box immediately below the support plate, inlet and outlet are provided on this cooling box, are set in the cooling box
It is equipped with the cooling chamber penetrated through with water inlet, water outlet, the inlet and outlet pass through water pipe and a cooling water circulating box
Connection, the support plate lower surface are additionally provided with a heat-conducting plate, this heat-conducting plate is used to connect with cooling box upper surface；
The test microscope carrier further comprises substrate and the bottom plate that is installed below substrate, and it is cooling logical that one is provided on the bottom plate
Slot, the heat-conducting plate are embedded in this cooling through slot, and the support plate is located at heat-conducting plate upper surface, connects between the bottom plate and substrate
There are several the first tension springs, this several first tension spring is located at substrate two sides, and the substrate two sides are separately installed with a cylinder, are located at
A through-hole is provided on substrate below cylinder, the piston rod of the cylinder passes through the through-hole on substrate, for depressing heat-conducting plate, institute
It states and is provided with a crossbeam above link block, several the second tension springs are connected between this crossbeam and link block；
One briquetting is installed, this briquetting has at least two presser feets, and the presser feet is curved by sheet metal on the piston rod of the cylinder
Complications are folded to be formed, and at least two presser feet is arranged along the arragement direction interval of the first tension spring, and is uniformly arranged in support plate lateral margin
Top；
The test microscope carrier two sides are equipped with a mounting plate in parallel respectively, and it is sliding that one is provided in the inside side walls of two mounting plates
Dynamic slot, the substrate two sides are embedded in this sliding groove, and the test microscope carrier surrounding is provided with several partitions, this several partition encloses
At a test chamber, the test chamber side is provided with the socket of substrate insertion, and the base ends have the gear cooperated with socket
Plate.
Further improved scheme is as follows in above-mentioned technical proposal:
1. in above scheme, when being in non-test state, there is gap between the heat-conducting plate and cooling box, when in survey
When examination state, the heat-conducting plate and cooling box are connected.
2. in above scheme, the number of the chip slot is 40.
3. in above scheme, the support plate is equipped with label corresponding with chip slot.
4. in above scheme, a protection cap is equipped on the support plate, core corresponding with chip slot is provided in this protection cap
Film perforation.
5. in above scheme, a pull rod, first tension spring are mounted on the bottom plate, substrate, crossbeam and link block
Both ends are separately mounted on two pull rods of bottom plate and substrate, and second tension spring both ends are separately mounted to crossbeam and link block
On two pull rods.
6. in above scheme, the presser feet is set as two, and is distributed in the both ends of protection cap side lateral margin.
7. in above scheme, the support plate and corresponding cooling box are set as multiple, this multiple cooling box and one
The connection of cooling water circulating box.
8. in above scheme, the pore that water supplying pipe passes through is provided on the partition.
9. in above scheme, the test chamber is set as multiple and forms body structure.
Due to the application of the above technical scheme, compared with the prior art, the invention has the following advantages:
1, the reliability test equipment of superpower laser chip of the present invention, on support plate with it is several be connected to chip lead
Line, this several conducting wire form an electrical connector in support plate one end, the connection for electrical connector insertion are provided on the link block
Mouthful, this link block is electrically connected with control assembly, by the cooperation of chip slot on support plate and conducting wire, is improved and is carried the close of chip on board
Degree realizes one piece of support plate while testing multiple chips, effectively improves testing efficiency, it can also be ensured that every chips are surveyed
The consistency in test ring border also facilitates staff to dismount chip to reduce the otherness of different chip testing results.
2, the reliability test equipment of superpower laser chip of the present invention, support plate underface are provided with a cooling box,
The support plate lower surface is additionally provided with a heat-conducting plate, this heat-conducting plate is used to connect with cooling box upper surface, by support plate
Cooling box is installed in lower section, takes away the heat that chip generates in test process, had both been avoided that chip heat accumulation and had influenced chip
Test result, and chip can be made to maintain in a stable temperature range, reduce temperature fluctuation, guarantee the consistent of test environment
Property, improve measuring accuracy；Further, by the setting of cooling box, multiple chips fever can be eliminated to the shadow of measuring accuracy
It rings, so as to use one piece of support plate to test simultaneously multiple chips, effectively improves testing efficiency, it can also be ensured that every
The consistency of chip testing environment, to reduce the otherness of different chip testing results, and the setting of heat-conducting plate can be carried uniformly
The heat dissipation effect of plate each section further increases the precision of test result.
3, the reliability test equipment of superpower laser chip of the present invention, is connected with several between bottom plate and substrate
First tension spring, this several first tension spring are located at substrate two sides, and the substrate two sides are separately installed with a cylinder, are located at below cylinder
Substrate on be provided with a through-hole, the through-hole that the piston rod of the cylinder passes through on substrate is guaranteed by the setting of the first tension spring
When non-test state, there is certain gap between the heat-conducting plate and cooling box below support plate, convenient for by the connection of support plate
In the connector of head insertion link block, and the combination settings of cylinder and the first tension spring, it can be in test mode, it will be mounted
Support plate and heat-conducting plate push so that heat-conducting plate with cool down fitting closely for box top, guarantee the heat dissipation effect of cooling box, make simultaneously
The environment temperature for obtaining each chip on support plate is consistent, reduces the otherness of test result, improves measuring accuracy；
In addition, being provided with a crossbeam above its link block, it is connected with several the second tension springs between this crossbeam and link block, passes through
Link block is mounted below the crossbeam by the second tension spring, and the connector for enabling link block to follow the support plate of insertion moves synchronously,
To realize that the first grafting of support plate is bonded again, eliminates fitting grafting and synchronize a large amount of seams for bring between heat-conducting plate and cooling box
Gap further increases measuring accuracy.
4, the reliability test equipment of superpower laser chip of the present invention is equipped with a pressure on the piston rod of cylinder
Block, this briquetting have at least two presser feets, and the presser feet is formed by sheet metal bending fold, and at least two presser feet is along first
The arragement direction interval of tension spring is arranged, and is uniformly arranged in above support plate lateral margin, passes through ballast under multiple equally distributed presser feets
When plate, on the one hand, multiple spot pushes, is uniformly distributed pressure spot, so that the pressure applied is more uniform, heat-conducting plate can be pasted smoothly
It is bonded on cooling box, and is less prone to gap, on the other hand, the presser feet due to pushing heat-conducting plate has elastic deformation ability, i.e.,
Make the influence due to various undesirable elements, causes heat-conducting plate to be difficult to keep horizontality, however contacted in heat-conducting plate with cooling box
Afterwards, cylinder continues to start to compress presser feet, and the presser feet of contact position continues to compress heat-conducting plate with cooling box, does not contact with cooling box
Heat-conducting plate part can be bonded under the pressure of remaining presser feet with cooling box top, and the presence of presser feet deformation quantity makes heat-conducting plate each
A part good can fit in cooling box top, guarantee the uniformity of each section heat-conducting effect, it is ensured that the essence of test result
Degree.
5, it is sliding to be provided with one in the inside side walls of mounting plate for the reliability test equipment of superpower laser chip of the present invention
Dynamic slot, the substrate two sides are embedded in this sliding groove, and the test microscope carrier surrounding is provided with several partitions, this several partition encloses
At a test chamber, on the one hand, relatively independent space is formed by the test chamber that partition surrounds, and completely cuts off the influence of external environment,
The stability for further promoting chip temperature on support plate, effectively improves the precision of test result, on the other hand, will have support plate
Substrate sliding is plugged in test chamber, facilitates staff to test at any time and take out support plate, and do not interfere with remaining support plate
Test job further increases testing efficiency.
6, the reliability test equipment of superpower laser chip of the present invention, support plate are equipped with mark corresponding with chip slot
Number, by the setting of label, different chips is distinguished convenient for staff, is easy to use；Its bottom plate, substrate, crossbeam and connection
A pull rod is mounted on block, first tension spring both ends are separately mounted on two pull rods of bottom plate and substrate, and described second
Tension spring both ends are separately mounted on two pull rods of crossbeam and link block, and by the setting of pull rod, the first tension spring and second are drawn
The tension uniform of spring is distributed to whole pull rod, so that the pushing of bottom plate, link block is more steady, and is able to maintain same
In one datum level, to improve the stickiness of heat-conducting plate and cooling box.
Detailed description of the invention
Attached drawing 1 is the overall structure diagram of the reliability test equipment of superpower laser chip of the present invention；
Attached drawing 2 is that cooling water circulating box is located at the structural schematic diagram in rack；
Attached drawing 3 is the structural schematic diagram of single test chamber and cooling water circulating box；
Attached drawing 4 is the schematic diagram of internal structure of single test chamber；
Attached drawing 5 is the structural schematic diagram of link block part；
Attached drawing 6 is the structural schematic diagram of substrate portion；
Attached drawing 7 is the structural schematic diagram of support plate part；
Attached drawing 8 is the partial sectional view of support plate, bottom plate and substrate portion；
Attached drawing 9 is the enlarged drawing of part A in attached drawing 8.
In the figures above: 1, testing microscope carrier；11, partition；12, test chamber；13, mounting plate；14, sliding groove；15, socket；
101, control assembly；2, support plate；21, conducting wire；22, electrical connector；201, chip slot；202, label；3, link block；31, it connects
Mouthful；32, crossbeam；33, the second tension spring；34, baffle；4, cooling box；401, water inlet；402, water outlet；403, cooling water recycles
Case；5, substrate；51, bottom plate；511, cooling through slot；52, heat-conducting plate；53, the first tension spring；54, cylinder；55, through-hole；56, it protects
Lid；561, chip hole；57, pull rod；7, briquetting；71, presser feet.
Specific embodiment
Embodiment 1: a kind of reliability test equipment of superpower laser chip, referring to attached drawing 1-9, including test microscope carrier
1, link block 3 and control assembly 101, the control assembly 101 include power module and test module, and the power module is used for
Chip power supply, the test module are used for data collection and the transmission of chip testing, are equipped with a support plate on the test microscope carrier 1
2, it is provided with several chip slots 201 for chip insertion on this support plate 2, there are several conducting wires being connected to chip on the support plate 2
21, this several conducting wire 21 forms an electrical connector 22 in 2 one end of support plate, is provided on the link block 3 and inserts for electrical connector 22
The connector 31 entered, this link block 3 are electrically connected with control assembly 101；
It is provided with a cooling box 4 immediately below the support plate 2, water inlet 401 and water outlet 402 are provided on this cooling box 4, it is described cold
But the cooling chamber with water inlet 401, the perforation of water outlet 402 is provided in box 4, the water inlet 401 and water outlet 402 pass through
Water pipe is connected to a cooling water circulating box 403, and 2 lower surface of support plate is additionally provided with a heat-conducting plate 52, this heat-conducting plate 52 is used for
It is connected with 4 upper surface of cooling box；
The test microscope carrier 1 further comprises substrate 5 and the bottom plate 51 for being installed on 5 lower section of substrate, is provided with one on the bottom plate 51
Cooling through slot 511, the heat-conducting plate 52 are embedded in this cooling through slot 511, and the support plate 2 is located at 52 upper surface of heat-conducting plate, described
Several the first tension springs 53 are connected between bottom plate 51 and substrate 5, this several first tension spring 53 is located at 5 two sides of substrate, the base
5 two sides of plate are separately installed with a cylinder 54, are provided with a through-hole 55, the work of the cylinder 54 on the substrate 5 of 54 lower section of cylinder
The through-hole 55 that stopper rod passes through on substrate 5 is provided with a crossbeam 32, this crossbeam for depressing heat-conducting plate 52 above the link block 3
Several the second tension springs 33 are connected between 32 and link block 3；
One briquetting 7 is installed on the piston rod of the cylinder 54, this briquetting 7 have at least two presser feets 71, the presser feet 71 by
Sheet metal bending fold forms, and at least two presser feet 71 is arranged along the arragement direction interval of the first tension spring 53, and uniformly arranges
It is distributed in above 2 lateral margin of support plate；
1 two sides of test microscope carrier are equipped with a mounting plate 13 in parallel respectively, open in the inside side walls of two mounting plates 13
There is a sliding groove 14,5 two sides of substrate are embedded in this sliding groove 14, and 1 surrounding of test microscope carrier is provided with several partitions 11,
This several partition 11 surrounds a test chamber 12, and 12 side of test chamber is provided with the socket 15 of the insertion of substrate 5, the substrate
5 ends have the baffle 34 cooperated with socket 15.
When being in non-test state, there is gap between the heat-conducting plate 52 and cooling box 5, when in test mode
When, the heat-conducting plate 52 is connected with cooling box 5；The number of the chip slot 201 is 40；The support plate 2 be equipped with
The corresponding label 202 of chip slot 201；
One protection cap 56 is installed on above-mentioned support plate 2, chip hole 561 corresponding with chip slot 201 is provided in this protection cap 56；Institute
It states and is mounted on a pull rod 57 on bottom plate 51, substrate 5, crossbeam 32 and link block 3,53 both ends of the first tension spring are separately mounted to
On two pull rods 57 of bottom plate 51 and substrate 5,33 both ends of the second tension spring are separately mounted to two of crossbeam 32 and link block 3
On pull rod 57；The presser feet 71 is set as two, and is distributed in the both ends of 56 side lateral margin of protection cap；
Above-mentioned support plate 2 and corresponding cooling box 4 are set as multiple, this multiple cooling box 4 and a cooling water circulating box 403
Connection；The pore that water supplying pipe passes through is provided on the partition 11；The test chamber 12 is set as multiple and forms body structure.
Embodiment 2: a kind of reliability test equipment of superpower laser chip, referring to attached drawing 1-9, including test microscope carrier
1, link block 3 and control assembly 101, the control assembly 101 include power module and test module, and the power module is used for
Chip power supply, the test module are used for data collection and the transmission of chip testing, are equipped with a support plate on the test microscope carrier 1
2, it is provided with several chip slots 201 for chip insertion on this support plate 2, there are several conducting wires being connected to chip on the support plate 2
21, this several conducting wire 21 forms an electrical connector 22 in 2 one end of support plate, is provided on the link block 3 and inserts for electrical connector 22
The connector 31 entered, this link block 3 are electrically connected with control assembly 101；
It is provided with a cooling box 4 immediately below the support plate 2, water inlet 401 and water outlet 402 are provided on this cooling box 4, it is described cold
But the cooling chamber with water inlet 401, the perforation of water outlet 402 is provided in box 4, the water inlet 401 and water outlet 402 pass through
Water pipe is connected to a cooling water circulating box 403, and 2 lower surface of support plate is additionally provided with a heat-conducting plate 52, this heat-conducting plate 52 is used for
It is connected with 4 upper surface of cooling box；
The test microscope carrier 1 further comprises substrate 5 and the bottom plate 51 for being installed on 5 lower section of substrate, is provided with one on the bottom plate 51
Cooling through slot 511, the heat-conducting plate 52 are embedded in this cooling through slot 511, and the support plate 2 is located at 52 upper surface of heat-conducting plate, described
Several the first tension springs 53 are connected between bottom plate 51 and substrate 5, this several first tension spring 53 is located at 5 two sides of substrate, the base
5 two sides of plate are separately installed with a cylinder 54, are provided with a through-hole 55, the work of the cylinder 54 on the substrate 5 of 54 lower section of cylinder
The through-hole 55 that stopper rod passes through on substrate 5 is provided with a crossbeam 32, this crossbeam for depressing heat-conducting plate 52 above the link block 3
Several the second tension springs 33 are connected between 32 and link block 3；
One briquetting 7 is installed on the piston rod of the cylinder 54, this briquetting 7 have at least two presser feets 71, the presser feet 71 by
Sheet metal bending fold forms, and at least two presser feet 71 is arranged along the arragement direction interval of the first tension spring 53, and uniformly arranges
It is distributed in above 2 lateral margin of support plate；
1 two sides of test microscope carrier are equipped with a mounting plate 13 in parallel respectively, open in the inside side walls of two mounting plates 13
There is a sliding groove 14,5 two sides of substrate are embedded in this sliding groove 14, and 1 surrounding of test microscope carrier is provided with several partitions 11,
This several partition 11 surrounds a test chamber 12, and 12 side of test chamber is provided with the socket 15 of the insertion of substrate 5, the substrate
5 ends have the baffle 34 cooperated with socket 15.
When being in non-test state, there is gap between the heat-conducting plate 52 and cooling box 5, when in test mode
When, the heat-conducting plate 52 is connected with cooling box 5；The number of the chip slot 201 is 40；The support plate 2 be equipped with
The corresponding label 202 of chip slot 201；
One protection cap 56 is installed on above-mentioned support plate 2, chip hole 561 corresponding with chip slot 201 is provided in this protection cap 56；Institute
It states and is mounted on a pull rod 57 on bottom plate 51, substrate 5, crossbeam 32 and link block 3,53 both ends of the first tension spring are separately mounted to
On two pull rods 57 of bottom plate 51 and substrate 5,33 both ends of the second tension spring are separately mounted to two of crossbeam 32 and link block 3
On pull rod 57；The presser feet 71 is set as two, and is distributed in the both ends of 56 side lateral margin of protection cap；
Using above-mentioned superpower laser chip reliability test equipment when, by the cooperation of chip slot on support plate and conducting wire,
The density for carrying chip on board is improved, one piece of support plate is realized while multiple chips are tested, effectively improves testing efficiency,
It can also guarantee that the consistency of every chips test environment also facilitates work to reduce the otherness of different chip testing results
Personnel dismount chip；
In addition, taking away the heat that chip generates in test process by installing cooling box below support plate, it was both avoided that chip heat
The test result of chip is accumulated and influenced to amount, and chip can be made to maintain in a stable temperature range, reduces temperature fluctuation,
Guarantee the consistency of test environment, improves measuring accuracy；Further, by the setting of cooling box, multiple chips can be eliminated
The influence generated heat to measuring accuracy effectively improves test so as to use one piece of support plate to test simultaneously multiple chips
Efficiency, it can also be ensured that the consistency of every chips test environment, to reduce the otherness of different chip testing results, and it is thermally conductive
The heat dissipation effect of uniform support plate each section is capable of in the setting of plate, further increases the precision of test result；
In addition, guaranteed by the setting of the first tension spring in non-test state, the heat-conducting plate below support plate and cooling box it
Between there is certain gap, convenient for by the connector of the connector of support plate insertion link block, and the group of cylinder and the first tension spring
Close setting, can push mounted support plate and heat-conducting plate in test mode so that heat-conducting plate with cool down the tight of box top
Closely connected conjunction, guarantees the heat dissipation effect of cooling box, while making the environment temperature of each chip on support plate consistent, reduces test result
Otherness, improve measuring accuracy；
In addition, link block is mounted below the crossbeam by the second tension spring, link block is enabled to follow the company of the support plate of insertion
Connector moves synchronously, and to realize that the first grafting of support plate is bonded again, elimination fitting grafting, which synchronizes, to be carried out bringing heat-conducting plate and cooling box
Between a large amount of gaps, further increase measuring accuracy；
In addition, when passing through carrier plate under multiple equally distributed presser feets, on the one hand, multiple spot pushes, is uniformly distributed pressure spot, so that
The pressure of application is more uniform, and heat-conducting plate can be conformed to smoothly on cooling box, and be less prone to gap, on the other hand, by
There is elastic deformation ability in the presser feet for pushing heat-conducting plate, even if causing heat-conducting plate to be difficult to due to the influence of various undesirable elements
Horizontality is kept, however after heat-conducting plate is contacted with cooling box, cylinder continues to start to compress presser feet, and heat-conducting plate and cooling box are
The presser feet of contact position continues to compress, the heat-conducting plate part not contacted with cooling box can under the pressure of remaining presser feet with cooling box
Top surface fitting, the presence of presser feet deformation quantity make heat-conducting plate various pieces good can fit in cooling box top, guarantee each
The uniformity of part heat-conducting effect, it is ensured that the precision of test result；
In addition, on the one hand, relatively independent space is formed by the test chamber that partition surrounds, and completely cuts off the influence of external environment, into
One step promotes the stability of chip temperature on support plate, effectively improves the precision of test result, on the other hand, will have the base of support plate
Plate sliding is plugged in test chamber, facilitates staff to test at any time and take out support plate, and do not interfere with the survey of remaining support plate
Trial work is made, and testing efficiency is further increased；
In addition, distinguishing different chips convenient for staff by the setting of label, it is easy to use；It, will by the setting of pull rod
The tension uniform of first tension spring and the second tension spring is distributed to whole pull rod, so that the pushing of bottom plate, link block is more flat
Surely, it and is able to maintain in the same datum level, to improve the stickiness of heat-conducting plate and cooling box.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of reliability test equipment of superpower laser chip, it is characterised in that: including testing microscope carrier (1), link block
(3) and control assembly (101) support plate (2), are installed on the test microscope carrier (1), are provided on this support plate (2) several for chip
The chip slot (201) of insertion has several conducting wires (21) being connected to chip, this several conducting wire (21) on the support plate (2)
An electrical connector (22) are formed in support plate (2) one end, the connector for electrical connector (22) insertion is provided on the link block (3)
(31), this link block (3) is electrically connected with control assembly (101)；
A cooling box (4) are provided with immediately below the support plate (2), are provided with water inlet (401) and water outlet on this cooling box (4)
(402), the cooling chamber penetrated through with water inlet (401), water outlet (402), the water inlet are provided in the cooling box (4)
(401) it is connected to by water pipe with a cooling water circulating box (403) with water outlet (402), support plate (2) lower surface is also set up
There are a heat-conducting plate (52), this heat-conducting plate (52) is used to connect with cooling box (4) upper surface；
Test microscope carrier (1) further comprises substrate (5) and the bottom plate (51) being installed below substrate (5), the bottom plate
(51) one cooling through slot (511) are provided on, the heat-conducting plate (52) is embedded in this cooling through slot (511), and the support plate (2) is located at
Heat-conducting plate (52) upper surface is connected with several first tension springs (53) between the bottom plate (51) and substrate (5), this several first
Tension spring (53) is located at substrate (5) two sides, and substrate (5) two sides are separately installed with a cylinder (54), is located at below cylinder (54)
Substrate (5) on be provided with a through-hole (55), the piston rod of the cylinder (54) passes through the through-hole (55) on substrate (5), is used for down
It presses heat-conducting plate (52), is provided with a crossbeam (32) above the link block (3), is connected between this crossbeam (32) and link block (3)
There are several the second tension springs (33)；
A briquetting (7) are installed on the piston rod of the cylinder (54), this briquetting (7) has at least two presser feets (71), described
Presser feet (71) is formed by sheet metal bending fold, and at least two presser feet (71) is along the arragement direction interval of the first tension spring (53)
Setting, and be uniformly arranged in above support plate (2) lateral margin；
Test microscope carrier (1) two sides are equipped with a mounting plate (13) in parallel respectively, the inside side of two mounting plates (13)
It is provided on wall a sliding groove (14), substrate (5) two sides are embedded in this sliding groove (14), and test microscope carrier (1) surrounding is set
Several partitions (11) are equipped with, this several partition (11) surrounds a test chamber (12), and test chamber (12) side is provided with for base
The socket (15) of plate (5) insertion, substrate (5) end have the baffle (34) cooperated with socket (15).
2. the reliability test equipment of superpower laser chip according to claim 1, it is characterised in that: when in non-
When test mode, there is gap between the heat-conducting plate (52) and cooling box (4), when being in test mode, the heat-conducting plate
(52) it is connected with cooling box (4).
3. the reliability test equipment of superpower laser chip according to claim 1, it is characterised in that: the chip
The number of slot (201) is 40.
4. the reliability test equipment of superpower laser chip according to claim 3, it is characterised in that: the support plate
(2) it is equipped with label (202) corresponding with chip slot (201).
5. the reliability test equipment of superpower laser chip according to claim 1, it is characterised in that: the support plate
(2) protection cap (56) are installed on, chip hole (561) corresponding with chip slot (201) is provided in this protection cap (56).
6. the reliability test equipment of superpower laser chip according to claim 1, it is characterised in that: the bottom plate
(51), it is mounted on a pull rod (57) on substrate (5), crossbeam (32) and link block (3), the first tension spring (53) both ends difference
It is mounted on two pull rods (57) of bottom plate (51) and substrate (5), the second tension spring (33) both ends are separately mounted to crossbeam
(32) and on two pull rods (57) of link block (3).
7. the reliability test equipment of superpower laser chip according to claim 1, it is characterised in that: the presser feet
(71) two are set as, and is distributed in the both ends of protection cap (56) side lateral margin.
8. the reliability test equipment of superpower laser chip according to claim 1, it is characterised in that: the support plate
(2) and corresponding cooling box (4) is set as multiple, this multiple cooling box (4) connects with a cooling water circulating box (403)
It is logical.
9. the reliability test equipment of superpower laser chip according to claim 8, it is characterised in that: the partition
(11) pore that water supplying pipe passes through is provided on.
10. the reliability test equipment of superpower laser chip according to claim 1, it is characterised in that: the survey
Examination chamber (12) is set as multiple and forms body structure.
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| CN201910264587.XA CN109870644B (en) | 2019-04-03 | 2019-04-03 | Reliability test equipment for high-power laser chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910264587.XA CN109870644B (en) | 2019-04-03 | 2019-04-03 | Reliability test equipment for high-power laser chip |
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| CN109870644B CN109870644B (en) | 2024-06-28 |
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| CN114113969A (en) * | 2020-08-28 | 2022-03-01 | 苏州联讯仪器有限公司 | Test system for laser chip |
| CN114325293A (en) * | 2020-09-29 | 2022-04-12 | 苏州联讯仪器有限公司 | High-reliability laser chip test system |
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| CN109870644B (en) | 2024-06-28 |
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Address after: Building 5, No. 1508, Xiangjiang Road, Suzhou High-tech Zone, Suzhou City, Jiangsu Province 215129 Applicant after: Suzhou Lianxun Instrument Co.,Ltd. Address before: Building 1, No. 1508 Xiangjiang Road, High tech Zone, Suzhou City, Jiangsu Province, 215000 Applicant before: STELIGHT INSTRUMENT Inc. |
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