CN114325293A - High-reliability laser chip test system - Google Patents
High-reliability laser chip test system Download PDFInfo
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- CN114325293A CN114325293A CN202011052493.5A CN202011052493A CN114325293A CN 114325293 A CN114325293 A CN 114325293A CN 202011052493 A CN202011052493 A CN 202011052493A CN 114325293 A CN114325293 A CN 114325293A
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- 238000012360 testing method Methods 0.000 title claims abstract description 98
- 238000003825 pressing Methods 0.000 claims abstract description 25
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 239000013307 optical fiber Substances 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 2
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- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 14
- 230000032683 aging Effects 0.000 description 10
- RIMXLXBUOQMDHV-UHFFFAOYSA-N 1,2-dichloro-4-(2-chlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1Cl RIMXLXBUOQMDHV-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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Abstract
The invention discloses a high-reliability laser chip testing system which comprises a plurality of operation tables, a cooling plate, a plurality of TEC modules, a temperature equalizing plate and a clamping jig, wherein the operation tables are arranged on a rack in a stacked mode, the cooling plate is arranged on each operation table, the TEC modules are arranged on the upper surface of the cooling plate at intervals, the temperature equalizing plate is arranged on the lower surface of the cooling plate and is in contact with the TEC modules, and the clamping jig is movably arranged on the operation tables and is positioned right above the temperature equalizing plate; the clamping jig comprises a supporting plate, a testing PCB and a heat conducting cover plate, wherein a plurality of testing seats are welded at intervals on the testing PCB, a light splitting assembly is further arranged above the clamping jig and comprises a supporting plate, a plurality of mounting seats and a plurality of PCBs, the mounting seats are mounted on the upper surface of the supporting plate at intervals, the PCBs are connected onto the mounting seats, and a light-emitting device to be tested is arranged below the supporting plate; two ends of the upper surface of the support plate are respectively provided with a pressing block. The invention not only improves the testing efficiency, but also improves the testing precision, accuracy and data consistency.
Description
Technical Field
The invention relates to a high-reliability laser chip test system, and belongs to the technical field of optical communication.
Background
The design of a clamp for testing aging of a laser chip is always difficult, particularly the aging test of high-power TO, because the power of a product is higher and the temperature is more difficult TO control, the aging and the test of the high-power TO in the industry are performed separately at present, and the aging and testing integrated system is lacked in the industry. Most of the current schemes are normal temperature test systems, aging and testing are carried out separately, and the test efficiency is low and the precision is poor.
Disclosure of Invention
The invention aims to provide a high-reliability laser chip testing system, which not only improves the testing efficiency, but also improves the testing precision, accuracy and data consistency.
In order to achieve the purpose, the invention adopts the technical scheme that: a high-reliability laser chip test system comprises a plurality of operation tables, a cooling plate, a plurality of TEC modules, a temperature equalizing plate and a clamping jig, wherein the operation tables are arranged on a rack in a stacked mode, the cooling plate is arranged on each operation table, the TEC modules are arranged on the upper surface of the cooling plate at intervals, the temperature equalizing plate is arranged on the lower surface of the cooling plate and is in contact with the TEC modules, and the clamping jig is movably arranged on the operation tables and is positioned right above the temperature equalizing plate;
the clamping jig comprises a supporting plate, a testing PCB and a heat conducting cover plate, wherein a plurality of testing seats are welded at intervals on the testing PCB, the supporting plate, the testing PCB and the heat conducting cover plate are arranged in a stacking mode from bottom to top, and pin ends of a plurality of devices to be tested penetrate through the heat conducting cover plate to be electrically connected with the testing seats on the testing PCB;
the lower surface of the heat-conducting cover plate is provided with a plurality of lugs at intervals, through holes corresponding to the lugs are formed in the test PCB and the supporting plate, and the lugs respectively penetrate through the through holes in the test PCB and the supporting plate and are exposed out of the bottom surface of the supporting plate;
a frame is arranged on the outer sides of the periphery of the test PCB and the heat-conducting cover plate, the left end and the right end of the supporting plate are both positioned under the frame, a first groove embedded with a first supporting rod is formed in the lower surface of the left end and the right end of the supporting plate, two second grooves corresponding to the first grooves in the left end and the right end of the supporting plate are formed in the upper surface of the frame, a second supporting rod is embedded in the second grooves, and the first supporting rod and the second supporting rod are connected through a plurality of springs arranged at intervals;
the left end face and the right end face of the frame are respectively provided with a convex strip portion extending outwards, the operating platform is provided with two first mounting seats at intervals, and the opposite surfaces of the two first mounting seats are respectively provided with a groove for the convex strip portion of the frame to be embedded in;
the clamping jig is characterized in that a light splitting assembly is further arranged above the clamping jig, the light splitting assembly comprises a carrier plate, a plurality of mounting seats arranged on the upper surface of the carrier plate at intervals and a plurality of PCB plates connected to the mounting seats, and a light-emitting device to be tested is arranged below the carrier plate;
a plurality of first through holes which are communicated up and down are formed in each mounting seat at intervals, a second through hole which is communicated with the first through holes is formed in the carrier plate, the light-emitting device is positioned right below the second through hole, a plurality of mounting holes which are communicated with the first through holes are formed in the side surface of each mounting seat at intervals, the PCB is connected to the side surface of each mounting seat in a welding manner, and a photoelectric conversion device is embedded into the mounting holes and is connected with the PCB in a welding manner;
a half-reflecting semi-transparent mirror is arranged at the intersection of the first through hole and the mounting hole, and an optical fiber flange connected with an optical fiber is arranged at the upper end of the first through hole;
the two ends of the upper surface of the support plate are respectively provided with a pressing block, the bottom of the pressing block is arranged on the support plate, the upper part of the pressing block is used for being connected with a driving mechanism, and the middle part of the pressing block is provided with a plurality of strip-shaped grooves at intervals in a staggered manner.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the front end face of the frame is connected with a handle part.
2. In the above scheme, the edge at the left and right both ends of frame has a baffle portion that extends downwards, and when the spring was in the natural tension state, the bottom surface of layer board was higher than the bottom surface of baffle portion, when the spring received external force and was in the extension state, the bottom surface of layer board flushed with the bottom surface of baffle portion and contacted with the temperature-uniforming plate.
3. In the scheme, 2-8 mounting seats are arranged in parallel and are mounted on the upper surface of the carrier plate through bolts.
4. In the above scheme, two cylinders are mounted on the first mounting seats, and piston rods of the cylinders are connected with the upper surface of the pressing block.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the high-reliability laser chip testing system realizes aging and testing of a plurality of chips, can measure a plurality of parameters before and after the chips are aged and in the aging process without moving the chips, not only improves the testing efficiency, but also improves the testing precision, accuracy and data consistency; in addition, the left end face and the right end face of the frame are respectively provided with a convex strip portion extending outwards, the front end face of the frame is connected with a handle portion, and through the arrangement of the handle portion and the convex strip portions, the pull-out type loading and unloading of the supporting plate are achieved, the loading and unloading operation is facilitated, the testing efficiency is improved, the stability of the state of the device in the loading and unloading process can be protected, and therefore the testing precision and the consistency of the testing result are improved.
2. The high-reliability laser chip test system of the invention is characterized in that the outer sides of the periphery of the test PCB and the heat-conducting cover plate are provided with a frame, the left end and the right end of the supporting plate are both positioned under the frame, the lower surfaces of the left end and the right end of the supporting plate are provided with a first groove embedded with a first supporting rod, the upper surface of the frame is provided with two second grooves corresponding to the first grooves at the left and right ends of the supporting plate, the second bracing piece has been embedded in the second recess, through the spring coupling that a plurality of interval set up between first bracing piece, the second bracing piece, realized to layer board and top test PCB board, the design of floating of heat conduction apron, both can protect the layer board not worn and torn in long-time use, can guarantee anchor clamps again and its face contact between the subassembly from top to bottom to it is more even to make the device be heated, improves the efficiency and the precision of test.
3. According to the high-reliability laser chip testing system, the two ends of the upper surface of the support plate are respectively provided with the pressing block, the bottom of the pressing block is arranged on the support plate, the upper part of the pressing block is used for being connected with the driving mechanism, the middle part of the pressing block is provided with the plurality of strip-shaped grooves at intervals in a staggered manner, the force for driving the support plate to press downwards by the driving mechanism can be buffered and balanced through the arrangement of the strip-shaped grooves, the surface contact between the bottom surface of the support plate and a device clamp can be ensured, the light leakage of the device is avoided, the testing consistency is ensured, the device is prevented from being damaged due to overlarge force, and the testing precision and the testing efficiency of the device are further ensured.
Drawings
FIG. 1 is a schematic structural diagram of a high-reliability laser chip test system according to the present invention;
FIG. 2 is a schematic diagram of a partial structure of a high-reliability laser chip test system according to the present invention;
FIG. 3 is a partial cross-sectional view of a high reliability laser chip test system according to the present invention;
FIG. 4 is a schematic structural diagram of a fixture in a high-reliability laser chip testing system according to the present invention;
FIG. 5 is an exploded view of a portion of a fixture of the laser chip test system of the present invention;
FIG. 6 is a partial cross-sectional structural view of a fixture in the high reliability laser chip test system of the present invention;
FIG. 7 is a schematic structural diagram of an optical splitter module in the high-reliability laser chip test system according to the present invention;
FIG. 8 is a partial cross-sectional structural view of a beam splitting assembly in a laser chip testing system in accordance with the present invention.
In the above drawings: 1. a support plate; 2. testing the PCB; 3. a heat conducting cover plate; 4. a bump; 11. a frame; 12. a first support bar; 13. a second support bar; 14. a spring; 15. a raised strip portion; 16. a handle portion; 17. a baffle portion; 21. an operation table; 22. a cooling plate; 23. a TEC module; 24. a temperature equalizing plate; 25. clamping a jig; 26. a first mounting seat; 27. a cylinder; 31. a carrier plate; 32. a mounting seat; 33. a PCB board; 34. a first through hole; 35. a second through hole; 36. mounting holes; 37. a photoelectric conversion device; 38. a half-reflecting and half-transmitting mirror; 39. an optical fiber flange; 41. briquetting; 42. a strip-shaped groove.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a high-reliability laser chip test system comprises a plurality of operation platforms 21 which are arranged on a rack in a stacking mode, a cooling plate 22 arranged on each operation platform 21, a plurality of TEC modules 23 arranged on the upper surface of the cooling plate 22 at intervals, a temperature equalizing plate 24 with the lower surface in contact with the TEC modules 23, and a clamping jig 25 which is movably arranged on the operation platforms 21 and is positioned right above the temperature equalizing plate 24;
the clamping jig 25 comprises a supporting plate 1, a testing PCB 2 and a heat-conducting cover plate 3, wherein a plurality of testing seats are welded at intervals on the testing PCB 2, the supporting plate 1, the testing PCB 2 and the heat-conducting cover plate 3 are arranged in a stacked mode from bottom to top, and pin ends of a plurality of devices to be tested penetrate through the heat-conducting cover plate 3 to be electrically connected with the testing seats on the testing PCB 2;
a plurality of bumps 4 are arranged on the lower surface of the heat-conducting cover plate 3 at intervals, through holes corresponding to the bumps 4 are formed in the test PCB 2 and the supporting plate 1, and the bumps 4 respectively penetrate through the through holes in the test PCB 2 and the supporting plate 1 and are exposed out of the bottom surface of the supporting plate 1;
a frame 11 is arranged on the outer side of the periphery of the test PCB 2 and the heat-conducting cover plate 3, the left end and the right end of the supporting plate 1 are both positioned under the frame 11, a first groove embedded with a first supporting rod 12 is formed in the lower surface of the left end and the right end of the supporting plate 1, two second grooves corresponding to the first grooves at the left end and the right end of the supporting plate 1 are formed in the upper surface of the frame 11, a second supporting rod 13 is embedded in the second grooves, and the first supporting rod 12 and the second supporting rod 13 are connected through a plurality of springs 14 arranged at intervals;
the left end face and the right end face of the frame 11 are respectively provided with a convex strip part 15 extending outwards, the operating platform 21 is provided with two first mounting seats 26 at intervals, and the opposite surfaces of the two first mounting seats 26 are respectively provided with a groove for the convex strip part 15 of the frame 11 to be embedded in;
a light splitting assembly is further arranged above the clamping jig 25, the light splitting assembly comprises a carrier plate 31, a plurality of mounting seats 32 which are mounted on the upper surface of the carrier plate 31 at intervals, and a plurality of PCB boards 33 connected to the mounting seats 32, and a light emitting device to be tested is arranged below the carrier plate 31;
a plurality of first through holes 34 which are communicated up and down are formed in each mounting seat 32 at intervals, a second through hole 35 which is communicated with the first through holes 34 is formed in the carrier plate 31, the light-emitting device is positioned right below the second through hole 35, a plurality of mounting holes 36 which are communicated with the first through holes 34 are formed in the side surface of each mounting seat 32 at intervals, the PCB 33 is connected to the side surface of the mounting seat 32 in a welding manner, and a photoelectric conversion device 37 is embedded in the mounting holes 36 and is connected with the PCB 33 in a welding manner;
a half-reflecting and half-transmitting mirror 38 is arranged at the intersection of the first through hole 34 and the mounting hole 36, and an optical fiber flange 39 connected with an optical fiber is arranged at the upper end of the first through hole 34;
two ends of the upper surface of the carrier plate 31 are respectively provided with a pressing block 41, the bottom of the pressing block 41 is mounted on the carrier plate 31, the upper part of the pressing block 41 is used for connecting with a driving mechanism, and the middle part of the pressing block 41 is provided with a plurality of strip-shaped grooves 42 at intervals in a staggered manner.
A handle part 16 is connected to the front end surface of the frame 11; 4 of the mounting seats 32 are arranged in parallel and mounted on the upper surface of the carrier plate 31 through bolts; the edge of the left and right ends of the frame 11 has a baffle part 17 extending downwards, when the spring 14 is in a natural stretching state, the bottom surface of the supporting plate 1 is higher than the bottom surface of the baffle part 17, when the spring 14 is in an extending state by an external force, the bottom surface of the supporting plate 1 is flush with the bottom surface of the baffle part 17 and contacts with the temperature equalizing plate 24.
Example 2: a high-reliability laser chip test system comprises a plurality of operation platforms 21 which are arranged on a rack in a stacking mode, a cooling plate 22 arranged on each operation platform 21, a plurality of TEC modules 23 arranged on the upper surface of the cooling plate 22 at intervals, a temperature equalizing plate 24 with the lower surface in contact with the TEC modules 23, and a clamping jig 25 which is movably arranged on the operation platforms 21 and is positioned right above the temperature equalizing plate 24;
the clamping jig 25 comprises a supporting plate 1, a testing PCB 2 and a heat-conducting cover plate 3, wherein a plurality of testing seats are welded at intervals on the testing PCB 2, the supporting plate 1, the testing PCB 2 and the heat-conducting cover plate 3 are arranged in a stacked mode from bottom to top, and pin ends of a plurality of devices to be tested penetrate through the heat-conducting cover plate 3 to be electrically connected with the testing seats on the testing PCB 2;
a plurality of bumps 4 are arranged on the lower surface of the heat-conducting cover plate 3 at intervals, through holes corresponding to the bumps 4 are formed in the test PCB 2 and the supporting plate 1, and the bumps 4 respectively penetrate through the through holes in the test PCB 2 and the supporting plate 1 and are exposed out of the bottom surface of the supporting plate 1;
a frame 11 is arranged on the outer side of the periphery of the test PCB 2 and the heat-conducting cover plate 3, the left end and the right end of the supporting plate 1 are both positioned under the frame 11, a first groove embedded with a first supporting rod 12 is formed in the lower surface of the left end and the right end of the supporting plate 1, two second grooves corresponding to the first grooves at the left end and the right end of the supporting plate 1 are formed in the upper surface of the frame 11, a second supporting rod 13 is embedded in the second grooves, and the first supporting rod 12 and the second supporting rod 13 are connected through a plurality of springs 14 arranged at intervals;
the left end face and the right end face of the frame 11 are respectively provided with a convex strip part 15 extending outwards, the operating platform 21 is provided with two first mounting seats 26 at intervals, and the opposite surfaces of the two first mounting seats 26 are respectively provided with a groove for the convex strip part 15 of the frame 11 to be embedded in;
a light splitting assembly is further arranged above the clamping jig 25, the light splitting assembly comprises a carrier plate 31, a plurality of mounting seats 32 which are mounted on the upper surface of the carrier plate 31 at intervals, and a plurality of PCB boards 33 connected to the mounting seats 32, and a light emitting device to be tested is arranged below the carrier plate 31;
a plurality of first through holes 34 which are communicated up and down are formed in each mounting seat 32 at intervals, a second through hole 35 which is communicated with the first through holes 34 is formed in the carrier plate 31, the light-emitting device is positioned right below the second through hole 35, a plurality of mounting holes 36 which are communicated with the first through holes 34 are formed in the side surface of each mounting seat 32 at intervals, the PCB 33 is connected to the side surface of the mounting seat 32 in a welding manner, and a photoelectric conversion device 37 is embedded in the mounting holes 36 and is connected with the PCB 33 in a welding manner;
a half-reflecting and half-transmitting mirror 38 is arranged at the intersection of the first through hole 34 and the mounting hole 36, and an optical fiber flange 39 connected with an optical fiber is arranged at the upper end of the first through hole 34;
two ends of the upper surface of the carrier plate 31 are respectively provided with a pressing block 41, the bottom of the pressing block 41 is mounted on the carrier plate 31, the upper part of the pressing block 41 is used for connecting with a driving mechanism, and the middle part of the pressing block 41 is provided with a plurality of strip-shaped grooves 42 at intervals in a staggered manner.
The 6 mounting seats 32 are arranged in parallel and mounted on the upper surface of the carrier plate 31 through bolts; the two first mounting seats 26 are respectively provided with an air cylinder 27, a piston rod of each air cylinder 27 is connected with the upper surface of the pressing block 41, and the air cylinders 27 drive the carrier plate 31 to press downwards through the pressing blocks 41, so that the carrier plate 31 of the light splitting assembly is in surface contact with the heat conducting cover plate 3 of the clamping jig 25, and the supporting plate 1 of the clamping jig 25 is in surface contact with the temperature equalizing plate 24 on the operation table 21.
When the high-reliability laser chip test system is adopted, the aging and testing of a plurality of chips are realized, the chips do not need to be moved, and a plurality of parameters before and after the aging and in the aging process of the chips can be measured, so that the test efficiency is improved, and the test precision, accuracy and data consistency are improved;
in addition, through the arrangement of the handle part and the convex strip part, the pull-type loading and unloading of the supporting plate are realized, the loading and unloading operation is convenient, the testing efficiency is improved, the state stability of the device in the loading and unloading process can be protected, and the testing precision and the consistency of the testing result are improved;
in addition, the floating design of the supporting plate, the PCB for testing above the supporting plate and the heat-conducting cover plate is realized, the supporting plate can be protected from being abraded in the long-time use process, and the surface contact between the clamp and the upper assembly and the lower assembly of the clamp can be ensured, so that the device is heated more uniformly, and the testing efficiency and precision are improved;
in addition, through the arrangement of the strip-shaped groove, the force for driving the carrier plate to be pressed downwards by the driving mechanism can be buffered and balanced, the surface contact between the bottom surface of the carrier plate and the device clamp can be ensured so as to avoid the light leakage of the device and ensure the consistency of the test, the damage of the device caused by the overlarge force can be avoided, and the test precision and efficiency of the device are further ensured.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (5)
1. A high-reliability laser chip test system is characterized in that: the device comprises a plurality of operation platforms (21) which are arranged on a rack in a stacked mode, a cooling plate (22) arranged on each operation platform (21), a plurality of TEC modules (23) which are arranged on the upper surface of the cooling plate (22) at intervals, a temperature equalizing plate (24) of which the lower surface is in contact with the TEC modules (23), and a clamping jig (25) which is movably arranged on the operation platforms (21) and is positioned right above the temperature equalizing plate (24);
the clamping jig (25) comprises a supporting plate (1), a testing PCB (2) and a heat-conducting cover plate (3), wherein a plurality of testing seats are welded at intervals on the testing PCB, the supporting plate (1), the testing PCB (2) and the heat-conducting cover plate (3) are arranged in a stacking mode from bottom to top, and pin ends of a plurality of devices to be tested penetrate through the heat-conducting cover plate (3) to be electrically connected with the testing seats on the testing PCB (2);
the lower surface of the heat-conducting cover plate (3) is provided with a plurality of bumps (4) at intervals, through holes corresponding to the bumps (4) are formed in the test PCB (2) and the supporting plate (1), and the bumps (4) respectively penetrate through the through holes in the test PCB (2) and the supporting plate (1) and are exposed out of the bottom surface of the supporting plate (1);
a frame (11) is arranged on the outer sides of the periphery of the test PCB (2) and the heat-conducting cover plate (3), the left end and the right end of the support plate (1) are both positioned under the frame (11), a first groove embedded with a first supporting rod (12) is formed in the lower surface of the left end and the right end of the support plate (1), two second grooves corresponding to the first grooves at the left end and the right end of the support plate (1) are formed in the upper surface of the frame (11), a second supporting rod (13) is embedded in the second grooves, and the first supporting rod (12) and the second supporting rod (13) are connected through a plurality of springs (14) arranged at intervals;
the left end face and the right end face of the frame (11) are respectively provided with a convex strip portion (15) extending outwards, the operating platform (21) is provided with two first mounting seats (26) at intervals, and the opposite surfaces of the two first mounting seats (26) are respectively provided with a groove for the convex strip portion (15) of the frame (11) to be embedded in;
a light splitting assembly is further arranged above the clamping jig (25), the light splitting assembly comprises a carrier plate (31), a plurality of mounting seats (32) which are mounted on the upper surface of the carrier plate (31) at intervals and a plurality of PCB boards (33) connected to the mounting seats (32), and a light-emitting device to be tested is arranged below the carrier plate (31);
a plurality of first through holes (34) which are communicated up and down are formed in each mounting seat (32) at intervals, second through holes (35) which are communicated with the first through holes (34) are formed in the carrier plate (31), the light-emitting devices are located right below the second through holes (35), a plurality of mounting holes (36) which are communicated with the first through holes (34) are formed in the side surface of each mounting seat (32) at intervals, the PCB (33) is connected to the side surface of each mounting seat (32) in a welding mode, and a photoelectric conversion device (37) is embedded into the mounting holes (36) and connected with the PCB (33) in a welding mode;
a half-reflecting and half-transmitting mirror (38) is arranged at the intersection of the first through hole (34) and the mounting hole (36), and an optical fiber flange (39) connected with an optical fiber is arranged at the upper end of the first through hole (34);
both ends of the upper surface of the support plate (31) are respectively provided with a pressing block (41), the bottom of the pressing block (41) is arranged on the support plate (31), the upper part of the pressing block (41) is used for being connected with a driving mechanism, and the middle part of the pressing block (41) is provided with a plurality of strip-shaped grooves (42) at intervals in a staggered manner.
2. The high reliability laser chip test system of claim 1, wherein: the front end face of the frame (11) is connected with a handle part (16).
3. The high reliability laser chip test system of claim 1, wherein: the edge at the left end and the right end of the frame (11) is provided with a baffle part (17) extending downwards, when the spring (14) is in a natural stretching state, the bottom surface of the supporting plate (1) is higher than the bottom surface of the baffle part (17), and when the spring (14) is in an extending state under the action of external force, the bottom surface of the supporting plate (1) is flush with the bottom surface of the baffle part (17) and is in contact with the temperature equalizing plate (24).
4. The high reliability laser chip test system of claim 1, wherein: 2-8 installation seats (32) are arranged in parallel and are installed on the upper surface of the carrier plate (31) through bolts.
5. The high reliability laser chip test system of claim 1, wherein: an air cylinder (27) is mounted on each of the two first mounting seats (26), and a piston rod of each air cylinder (27) is connected with the upper surface of the pressing block (41).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011052493.5A CN114325293B (en) | 2020-09-29 | 2020-09-29 | High-reliability laser chip testing system |
| PCT/CN2021/085490 WO2022068166A1 (en) | 2020-09-29 | 2021-04-03 | High-reliability laser chip test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011052493.5A CN114325293B (en) | 2020-09-29 | 2020-09-29 | High-reliability laser chip testing system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114325293A true CN114325293A (en) | 2022-04-12 |
| CN114325293B CN114325293B (en) | 2024-03-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011052493.5A Active CN114325293B (en) | 2020-09-29 | 2020-09-29 | High-reliability laser chip testing system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114325293B (en) |
| WO (1) | WO2022068166A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115122256A (en) * | 2022-05-26 | 2022-09-30 | 苏州联讯仪器有限公司 | Temperature control clamping device for optical module, crimping box and error code testing device |
| CN115932550A (en) * | 2022-12-29 | 2023-04-07 | 佛山市蓝箭电子股份有限公司 | Semiconductor testing device |
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| CN117872098B (en) * | 2024-03-13 | 2024-05-14 | 无锡迈步智能装备有限公司 | High-temperature high-voltage aging device for high-capacity packaged chip |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6259264B1 (en) * | 1999-08-30 | 2001-07-10 | Agere Systems Optoelectronics Guardian Corp. | Apparatus and method for testing semiconductor laser chips |
| US20010052782A1 (en) * | 2000-05-12 | 2001-12-20 | Brule David Alan | BGA on-board tester |
| CN2935474Y (en) * | 2007-01-12 | 2007-08-15 | 吴庆华 | Functional lighting LED |
| CN204359825U (en) * | 2015-01-04 | 2015-05-27 | 昆山凯耀电子科技有限公司 | Circuit board for testing function of main machine |
| CN109870644A (en) * | 2019-04-03 | 2019-06-11 | 苏州联讯仪器有限公司 | Reliability test equipment for high-power laser chip |
| CN209894923U (en) * | 2019-04-12 | 2020-01-03 | 苏州联讯仪器有限公司 | Reliability test system for laser chip |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2691540B1 (en) * | 1992-05-22 | 1994-07-29 | Froilabo | SAMPLE HOLDER MODULE FOR TESTING AN OPTICAL COMPONENT. |
| JP4646037B2 (en) * | 2006-11-24 | 2011-03-09 | 三菱電機株式会社 | Burn-in equipment tank rack |
| JP4871852B2 (en) * | 2007-12-05 | 2012-02-08 | シャープ株式会社 | Burn-in equipment |
| CN201751851U (en) * | 2010-08-02 | 2011-02-23 | 众达光通科技(苏州)有限公司 | Testing fixture for DFB/FP |
| CN202182813U (en) * | 2011-08-30 | 2012-04-04 | 杭州创惠仪器有限公司 | Light-emitting diode (LED) light attenuation testing device |
| CN209085898U (en) * | 2018-11-27 | 2019-07-09 | 深圳市东飞凌科技有限公司 | Laser ageing test board |
| CN210720639U (en) * | 2019-04-03 | 2020-06-09 | 苏州联讯仪器有限公司 | Testing device for laser chip |
| CN210072001U (en) * | 2019-04-03 | 2020-02-14 | 苏州联讯仪器有限公司 | High-efficiency test equipment for chip aging |
| CN210720638U (en) * | 2019-04-03 | 2020-06-09 | 苏州联讯仪器有限公司 | Chip aging testing device with cooling function |
| CN211043568U (en) * | 2019-04-12 | 2020-07-17 | 苏州联讯仪器有限公司 | Testing device for semiconductor laser chip assembly |
-
2020
- 2020-09-29 CN CN202011052493.5A patent/CN114325293B/en active Active
-
2021
- 2021-04-03 WO PCT/CN2021/085490 patent/WO2022068166A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6259264B1 (en) * | 1999-08-30 | 2001-07-10 | Agere Systems Optoelectronics Guardian Corp. | Apparatus and method for testing semiconductor laser chips |
| US20010052782A1 (en) * | 2000-05-12 | 2001-12-20 | Brule David Alan | BGA on-board tester |
| CN2935474Y (en) * | 2007-01-12 | 2007-08-15 | 吴庆华 | Functional lighting LED |
| CN204359825U (en) * | 2015-01-04 | 2015-05-27 | 昆山凯耀电子科技有限公司 | Circuit board for testing function of main machine |
| CN109870644A (en) * | 2019-04-03 | 2019-06-11 | 苏州联讯仪器有限公司 | Reliability test equipment for high-power laser chip |
| CN209894923U (en) * | 2019-04-12 | 2020-01-03 | 苏州联讯仪器有限公司 | Reliability test system for laser chip |
Non-Patent Citations (1)
| Title |
|---|
| 宋巧莲;吴斌;: "新型模块化结构的ICT测试治具设计", 工具技术, no. 09, 20 September 2015 (2015-09-20) * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115122256A (en) * | 2022-05-26 | 2022-09-30 | 苏州联讯仪器有限公司 | Temperature control clamping device for optical module, crimping box and error code testing device |
| CN115122256B (en) * | 2022-05-26 | 2023-11-17 | 苏州联讯仪器股份有限公司 | Temperature control clamping device for optical module, compression joint box and error code testing device |
| CN115932550A (en) * | 2022-12-29 | 2023-04-07 | 佛山市蓝箭电子股份有限公司 | Semiconductor testing device |
| CN115932550B (en) * | 2022-12-29 | 2023-08-29 | 佛山市蓝箭电子股份有限公司 | Semiconductor testing device |
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| WO2022068166A1 (en) | 2022-04-07 |
| CN114325293B (en) | 2024-03-01 |
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