CN114325293B - High-reliability laser chip testing system - Google Patents
High-reliability laser chip testing system Download PDFInfo
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- CN114325293B CN114325293B CN202011052493.5A CN202011052493A CN114325293B CN 114325293 B CN114325293 B CN 114325293B CN 202011052493 A CN202011052493 A CN 202011052493A CN 114325293 B CN114325293 B CN 114325293B
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- 238000012360 testing method Methods 0.000 title claims abstract description 92
- 238000001816 cooling Methods 0.000 claims abstract description 11
- 239000013307 optical fiber Substances 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 5
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 12
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 12
- 230000032683 aging Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- RIMXLXBUOQMDHV-UHFFFAOYSA-N 1,2-dichloro-4-(2-chlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1Cl RIMXLXBUOQMDHV-UHFFFAOYSA-N 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002431 foraging effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- Semiconductor Lasers (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a high-reliability laser chip testing system, which comprises a plurality of operation tables, cooling plates, a plurality of TEC modules, a temperature equalizing plate and a clamping jig, wherein the operation tables are arranged on a rack in a stacked mode; the clamping jig comprises a supporting plate, a test PCB board and a heat conduction cover plate, wherein a plurality of test seats are welded at intervals, a light splitting assembly is further arranged above the clamping jig, the light splitting assembly comprises a carrier plate, a plurality of mounting seats and a plurality of PCB boards, the mounting seats are arranged on the upper surface of the carrier plate at intervals, the PCB boards are connected to the mounting seats, and a light emitting device to be tested is arranged below the carrier plate; two ends of the upper surface of the carrier plate are respectively provided with a pressing block. The invention not only improves the efficiency of the test, but also improves the precision, accuracy and data consistency of the test.
Description
Technical Field
The invention relates to a high-reliability laser chip testing system, and belongs to the technical field of optical communication.
Background
The fixture design for testing and aging of the laser chip is always a difficult point, particularly for aging testing of high-power TO, the temperature is more difficult TO control due TO higher power of the product, and the aging and testing of the high-power TO in the industry are separately carried out at present, so that an aging and testing integrated system is lacked in the industry. At present, most of the existing schemes are normal temperature test systems, ageing and testing are performed separately, and the test efficiency is low and the precision is poor.
Disclosure of Invention
The invention aims to provide a high-reliability laser chip testing system which not only improves the testing efficiency, but also improves the testing precision, accuracy and data consistency.
In order to achieve the above purpose, the invention adopts the following technical scheme: a high-reliability laser chip testing system comprises a plurality of operation tables, cooling plates, a plurality of TEC modules, a temperature equalizing plate and a clamping jig, wherein the operation tables are installed on a rack in a stacked mode;
the clamping jig comprises a supporting plate, a test PCB and a heat conduction cover plate, wherein a plurality of test seats are welded at intervals, the supporting plate, the test PCB and the heat conduction cover plate are arranged in a stacked mode from bottom to top, and pin ends of a plurality of devices to be tested penetrate through the heat conduction cover plate and are electrically connected with the test seats on the test PCB;
a plurality of bumps are arranged on the lower surface of the heat conduction cover plate at intervals, through holes corresponding to the bumps are formed in the test PCB and the supporting plate, and the bumps respectively penetrate through the through holes in the test PCB and the supporting plate and are exposed from the bottom surface of the supporting plate;
the test PCB and the heat conduction cover plate are provided with a frame on the outer sides around, the left end and the right end of the supporting plate are located under the frame, the lower surfaces of the left end and the right end of the supporting plate are provided with a first groove embedded with a first supporting rod, the upper surface of the frame is provided with two second grooves corresponding to the first grooves of the left end and the right end of the supporting plate, the second grooves are embedded with second supporting rods, and the first supporting rods and the second supporting rods are connected through a plurality of springs arranged at intervals;
the left end face and the right end face of the frame are respectively provided with a convex strip part extending outwards, two first mounting seats are arranged on the operation table at intervals, and grooves for embedding the convex strip parts of the frame are formed in the opposite surfaces of the two first mounting seats;
the light-emitting device to be tested is arranged below the carrier plate;
each mounting seat is provided with a plurality of first through holes which are vertically communicated at intervals, the carrier plate is provided with a second through hole which is communicated with the first through holes, the light emitting device is positioned right below the second through holes, the side surface of each mounting seat is provided with a plurality of mounting holes which are communicated with the first through holes at intervals, the PCB is welded and connected to the side surface of each mounting seat, and a photoelectric conversion device is embedded in each mounting hole and is welded and connected with the PCB;
a half-reflecting half-lens is arranged at the intersection of the first through hole and the mounting hole, and an optical fiber flange connected with an optical fiber is arranged at the upper end of the first through hole;
the two ends of the upper surface of the carrier plate are respectively provided with a pressing block, the bottom of the pressing block is arranged on the carrier plate, the upper part of the pressing block is used for being connected with a driving mechanism, and a plurality of strip-shaped grooves are alternately formed in the middle of the pressing block at intervals.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, the front end face of the frame is connected with a handle part.
2. In the above scheme, the edge at the left and right ends of the frame is provided with a baffle plate part extending downwards, when the spring is in a natural stretching state, the bottom surface of the supporting plate is higher than the bottom surface of the baffle plate part, and when the spring is in an extending state due to external force, the bottom surface of the supporting plate is flush with the bottom surface of the baffle plate part and is in contact with the temperature equalizing plate.
3. In the scheme, 2-8 mounting seats are arranged in parallel and mounted on the upper surface of the carrier plate through bolts.
4. In the scheme, two first mounting seats are provided with the air cylinder, and a piston rod of the air cylinder is connected with the upper surface of the pressing block.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the high-reliability laser chip testing system realizes the aging and testing of a plurality of chips, and can measure a plurality of parameters before and after the chip aging and in the aging process without moving the chips, thereby improving the testing efficiency and the testing precision, accuracy and data consistency; in addition, the left end face and the right end face of the frame are respectively provided with an outwards extending raised line, the front end face of the frame is connected with a handle, and the pull type loading and unloading of the supporting plate is realized through the arrangement of the handle and the raised line, so that the loading and unloading operation is convenient, the testing efficiency is improved, the stability of the device in the loading and unloading process is protected, and the testing precision and the consistency of the testing result are improved.
2. According to the high-reliability laser chip testing system, the outer sides of the periphery of the testing PCB and the heat conducting cover plate are provided with the frames, the left end and the right end of the supporting plate are located under the frames, the lower surfaces of the left end and the right end of the supporting plate are provided with the first grooves embedded with the first supporting rods, the upper surface of the frame is provided with the two second grooves corresponding to the first grooves of the left end and the right end of the supporting plate, the second supporting rods are embedded in the second grooves, the first supporting rods and the second supporting rods are connected through the springs arranged at intervals, so that the floating design of the supporting plate, the upper testing PCB and the heat conducting cover plate is realized, the supporting plate can be protected from being worn in the long-time use process, the surface contact between the clamp and the upper and lower components of the clamp can be ensured, and therefore the device is heated more uniformly, and the testing efficiency and the testing precision are improved.
3. The high-reliability laser chip testing system provided by the invention has the advantages that the two ends of the upper surface of the carrier plate are respectively provided with the pressing blocks, the bottoms of the pressing blocks are arranged on the carrier plate, the upper parts of the pressing blocks are used for being connected with the driving mechanism, the middle parts of the pressing blocks are alternately provided with the plurality of strip-shaped grooves, and the driving mechanism can drive the carrier plate to press down by the aid of the arrangement of the strip-shaped grooves to buffer and balance the force, so that the surface contact between the bottom surface of the carrier plate and the device clamp can be ensured, the light leakage of the device can be avoided, the testing consistency can be ensured, the device can be prevented from being damaged due to overlarge force, and the testing precision and efficiency of the device can be further ensured.
Drawings
FIG. 1 is a schematic diagram of a high-reliability laser chip test system according to the present invention;
FIG. 2 is a schematic diagram of a partial structure of a high-reliability laser chip testing system according to the present invention;
FIG. 3 is a partial cross-sectional view of a high reliability laser chip testing system of the present invention;
FIG. 4 is a schematic diagram of the structure of the fixture in the high reliability laser chip testing system of the present invention;
FIG. 5 is a schematic diagram showing the partial structural decomposition of a fixture in the laser chip testing system of the present invention;
FIG. 6 is a partial cross-sectional view of a fixture in the high reliability laser chip testing system of the present invention;
FIG. 7 is a schematic diagram of a light splitting assembly in the high reliability laser chip testing system of the present invention;
fig. 8 is a partial cross-sectional view of a beam splitter assembly in a laser chip testing system according to the present invention.
In the above figures: 1. a supporting plate; 2. testing the PCB; 3. a thermally conductive cover plate; 4. a bump; 11. a frame; 12. a first support bar; 13. a second support bar; 14. a spring; 15. a convex strip; 16. a handle portion; 17. a baffle plate portion; 21. a work table; 22. a cooling plate; 23. a TEC module; 24. a temperature equalizing plate; 25. clamping the jig; 26. a first mount; 27. a cylinder; 31. a carrier plate; 32. a mounting base; 33. a PCB board; 34. a first through hole; 35. a second through hole; 36. a mounting hole; 37. a photoelectric conversion device; 38. a half-mirror half-lens; 39. an optical fiber flange; 41. briquetting; 42. a bar-shaped groove.
Detailed Description
In the description of this patent, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element in question must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in this patent will be understood by those of ordinary skill in the art in a specific context.
Example 1: the high-reliability laser chip testing system comprises a plurality of working tables 21, cooling plates 22, TEC modules 23, a temperature equalizing plate 24 and a clamping jig 25, wherein the working tables 21 are mounted on a rack in a stacked mode, the cooling plates 22 are arranged on each working table 21, the TEC modules 23 are arranged on the upper surfaces of the cooling plates 22 at intervals, the lower surfaces of the temperature equalizing plates 24 are in contact with the TEC modules 23, and the clamping jig 25 is movably mounted on the working tables 21 and is positioned right above the temperature equalizing plates 24;
the clamping jig 25 comprises a supporting plate 1, a test PCB 2 and a heat conduction cover plate 3, wherein a plurality of test seats are welded at intervals, the supporting plate 1, the test PCB 2 and the heat conduction cover plate 3 are arranged in a stacked mode from bottom to top, and pin ends of a plurality of devices to be tested penetrate through the heat conduction cover plate 3 and are electrically connected with the test seats on the test PCB 2;
a plurality of protruding blocks 4 are arranged on the lower surface of the heat conduction cover plate 3 at intervals, through holes corresponding to the protruding blocks 4 are formed in the test PCB 2 and the supporting plate 1, and the protruding blocks 4 respectively penetrate through the through holes in the test PCB 2 and the supporting plate 1 and are exposed from the bottom surface of the supporting plate 1;
the test PCB 2 and the heat conduction cover plate 3 are provided with a frame 11 on the outer sides around, the left and right ends of the supporting plate 1 are located under the frame 11, the lower surfaces of the left and right ends of the supporting plate 1 are provided with a first groove embedded with a first supporting rod 12, the upper surface of the frame 11 is provided with two second grooves corresponding to the first grooves of the left and right ends of the supporting plate 1, the second grooves are embedded with second supporting rods 13, and the first supporting rods 12 and the second supporting rods 13 are connected through a plurality of springs 14 arranged at intervals;
the left and right end surfaces of the frame 11 are respectively provided with a convex strip 15 extending outwards, the operation table 21 is provided with two first installation seats 26 at intervals, and the opposite surfaces of the two first installation seats 26 are respectively provided with a groove for embedding the convex strip 15 of the frame 11;
a light splitting assembly is further arranged above the clamping jig 25, the light splitting assembly comprises a carrier plate 31, a plurality of mounting seats 32 arranged on the upper surface of the carrier plate 31 at intervals and a plurality of PCB (printed circuit board) boards 33 connected to the mounting seats 32, and a light emitting device to be tested is arranged below the carrier plate 31;
each mounting seat 32 is provided with a plurality of first through holes 34 which are vertically communicated, the carrier plate 31 is provided with second through holes 35 which are communicated with the first through holes 34, the light emitting devices are positioned right below the second through holes 35, the side surfaces of the mounting seats 32 are provided with a plurality of mounting holes 36 which are communicated with the first through holes 34 at intervals, the PCB 33 is welded on the side surfaces of the mounting seats 32, and a photoelectric conversion device 37 is embedded in the mounting holes 36 and is welded with the PCB 33;
a half-reflecting half-mirror 38 is arranged at the intersection of the first through hole 34 and the mounting hole 36, and an optical fiber flange 39 connected with an optical fiber is arranged at the upper end of the first through hole 34;
two ends of the upper surface of the carrier plate 31 are respectively provided with a pressing block 41, the bottom of the pressing block 41 is arranged on the carrier plate 31, the upper part of the pressing block 41 is used for being connected with a driving mechanism, and a plurality of strip-shaped grooves 42 are alternately arranged in the middle of the pressing block 41 at intervals.
A handle part 16 is connected to the front end surface of the frame 11; the 4 mounting seats 32 are arranged in parallel and are mounted on the upper surface of the carrier plate 31 through bolts; the edges of the left and right ends of the frame 11 are provided with a baffle plate 17 extending downwards, when the spring 14 is in a natural stretching state, the bottom surface of the supporting plate 1 is higher than the bottom surface of the baffle plate 17, and when the spring 14 is in an stretching state under the action of external force, the bottom surface of the supporting plate 1 is flush with the bottom surface of the baffle plate 17 and is in contact with the temperature equalizing plate 24.
Example 2: the high-reliability laser chip testing system comprises a plurality of working tables 21, cooling plates 22, TEC modules 23, a temperature equalizing plate 24 and a clamping jig 25, wherein the working tables 21 are mounted on a rack in a stacked mode, the cooling plates 22 are arranged on each working table 21, the TEC modules 23 are arranged on the upper surfaces of the cooling plates 22 at intervals, the lower surfaces of the temperature equalizing plates 24 are in contact with the TEC modules 23, and the clamping jig 25 is movably mounted on the working tables 21 and is positioned right above the temperature equalizing plates 24;
the clamping jig 25 comprises a supporting plate 1, a test PCB 2 and a heat conduction cover plate 3, wherein a plurality of test seats are welded at intervals, the supporting plate 1, the test PCB 2 and the heat conduction cover plate 3 are arranged in a stacked mode from bottom to top, and pin ends of a plurality of devices to be tested penetrate through the heat conduction cover plate 3 and are electrically connected with the test seats on the test PCB 2;
a plurality of protruding blocks 4 are arranged on the lower surface of the heat conduction cover plate 3 at intervals, through holes corresponding to the protruding blocks 4 are formed in the test PCB 2 and the supporting plate 1, and the protruding blocks 4 respectively penetrate through the through holes in the test PCB 2 and the supporting plate 1 and are exposed from the bottom surface of the supporting plate 1;
the test PCB 2 and the heat conduction cover plate 3 are provided with a frame 11 on the outer sides around, the left and right ends of the supporting plate 1 are located under the frame 11, the lower surfaces of the left and right ends of the supporting plate 1 are provided with a first groove embedded with a first supporting rod 12, the upper surface of the frame 11 is provided with two second grooves corresponding to the first grooves of the left and right ends of the supporting plate 1, the second grooves are embedded with second supporting rods 13, and the first supporting rods 12 and the second supporting rods 13 are connected through a plurality of springs 14 arranged at intervals;
the left and right end surfaces of the frame 11 are respectively provided with a convex strip 15 extending outwards, the operation table 21 is provided with two first installation seats 26 at intervals, and the opposite surfaces of the two first installation seats 26 are respectively provided with a groove for embedding the convex strip 15 of the frame 11;
a light splitting assembly is further arranged above the clamping jig 25, the light splitting assembly comprises a carrier plate 31, a plurality of mounting seats 32 arranged on the upper surface of the carrier plate 31 at intervals and a plurality of PCB (printed circuit board) boards 33 connected to the mounting seats 32, and a light emitting device to be tested is arranged below the carrier plate 31;
each mounting seat 32 is provided with a plurality of first through holes 34 which are vertically communicated, the carrier plate 31 is provided with second through holes 35 which are communicated with the first through holes 34, the light emitting devices are positioned right below the second through holes 35, the side surfaces of the mounting seats 32 are provided with a plurality of mounting holes 36 which are communicated with the first through holes 34 at intervals, the PCB 33 is welded on the side surfaces of the mounting seats 32, and a photoelectric conversion device 37 is embedded in the mounting holes 36 and is welded with the PCB 33;
a half-reflecting half-mirror 38 is arranged at the intersection of the first through hole 34 and the mounting hole 36, and an optical fiber flange 39 connected with an optical fiber is arranged at the upper end of the first through hole 34;
two ends of the upper surface of the carrier plate 31 are respectively provided with a pressing block 41, the bottom of the pressing block 41 is arranged on the carrier plate 31, the upper part of the pressing block 41 is used for being connected with a driving mechanism, and a plurality of strip-shaped grooves 42 are alternately arranged in the middle of the pressing block 41 at intervals.
The 6 mounting seats 32 are arranged in parallel and are mounted on the upper surface of the carrier plate 31 through bolts; the two first mounting seats 26 are respectively provided with an air cylinder 27, a piston rod of each air cylinder 27 is connected with the upper surface of a pressing block 41, and the air cylinders 27 drive the carrier plate 31 to be pressed down through the pressing blocks 41, so that the carrier plate 31 of the light splitting assembly is in surface contact with the heat conducting cover plate 3 of the clamping jig 25, and the supporting plate 1 of the clamping jig 25 is in surface contact with the temperature equalizing plate 24 on the operating platform 21.
When the high-reliability laser chip testing system is adopted, the aging and testing of a plurality of chips are realized, the chips can be measured before and after aging and in the aging process without moving, the testing efficiency is improved, and the testing precision, accuracy and data consistency are improved;
in addition, through the arrangement of the handle part and the raised strip part, the drawing type loading and unloading of the supporting plate is realized, the loading and unloading operation is convenient, the testing efficiency is improved, and the stability of the device in the loading and unloading process can be protected, so that the testing precision and the consistency of the testing result are improved;
in addition, the floating design of the supporting plate, the PCB and the heat conducting cover plate above the supporting plate is realized, so that the supporting plate can be protected from being worn in the long-time use process, and the surface contact between the clamp and the upper and lower components of the clamping device can be ensured, so that the device is heated more uniformly, and the testing efficiency and precision are improved;
in addition, through the setting of bar groove, can cushion, balanced to the strength that the drive mechanism drove the support plate to push down, both can guarantee the face contact between support plate bottom surface and the device anchor clamps in order to avoid revealing of device light, guarantee the uniformity of test, can avoid the too big and damage device of strength again, further guarantee the test accuracy and the efficiency to the device.
The above embodiments are provided to illustrate the technical concept and features of the present invention and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (5)
1. A high-reliability laser chip testing system is characterized in that: the device comprises a plurality of operation tables (21) which are arranged on a rack in a stacked manner, a cooling plate (22) arranged on each operation table (21), a plurality of TEC modules (23) which are arranged on the upper surface of the cooling plate (22) at intervals, a temperature equalizing plate (24) with the lower surface contacted with the TEC modules (23) and a clamping jig (25) which is movably arranged on the operation table (21) and is positioned right above the temperature equalizing plate (24);
the clamping jig (25) comprises a supporting plate (1), a test PCB (2) and a heat conduction cover plate (3), wherein a plurality of test seats are welded at intervals, the supporting plate (1), the test PCB (2) and the heat conduction cover plate (3) are arranged in a stacked mode from bottom to top, and pin ends of a plurality of devices to be tested penetrate through the heat conduction cover plate (3) and are electrically connected with the test seats on the test PCB (2);
a plurality of protruding blocks (4) are arranged on the lower surface of the heat conduction cover plate (3) at intervals, through holes corresponding to the protruding blocks (4) are formed in the test PCB (2) and the supporting plate (1), and the protruding blocks (4) respectively penetrate through the through holes in the test PCB (2) and the supporting plate (1) and are exposed out of the bottom surface of the supporting plate (1);
the testing PCB (2) and the heat conduction cover plate (3) are provided with a frame (11) on the outer sides around, the left end and the right end of the supporting plate (1) are located under the frame (11), the lower surfaces of the left end and the right end of the supporting plate (1) are provided with a first groove embedded with a first supporting rod (12), the upper surface of the frame (11) is provided with two second grooves corresponding to the first grooves of the left end and the right end of the supporting plate (1), the second grooves are embedded with second supporting rods (13), and the first supporting rods (12) and the second supporting rods (13) are connected through springs (14) arranged at intervals;
the left end face and the right end face of the frame (11) are respectively provided with a raised strip part (15) extending outwards, two first mounting seats (26) are arranged on the operation table (21) at intervals, and grooves for embedding the raised strip parts (15) of the frame (11) are formed in the opposite surfaces of the two first mounting seats (26);
a light splitting assembly is further arranged above the clamping jig (25), the light splitting assembly comprises a carrier plate (31), a plurality of mounting seats (32) arranged on the upper surface of the carrier plate (31) at intervals and a plurality of PCB (33) connected to the mounting seats (32), and a light emitting device to be tested is arranged below the carrier plate (31);
each mounting seat (32) is provided with a plurality of first through holes (34) which are vertically communicated at intervals, each carrier plate (31) is provided with a second through hole (35) which is communicated with the corresponding first through hole (34), each light emitting device is located right below the corresponding second through hole (35), the side surface of each mounting seat (32) is provided with a plurality of mounting holes (36) which are communicated with the corresponding first through holes (34) at intervals, each PCB (33) is welded on the side surface of each mounting seat (32), and a photoelectric conversion device (37) is embedded in each mounting hole (36) and is welded with each PCB (33);
a half-reflecting half-lens (38) is arranged at the intersection of the first through hole (34) and the mounting hole (36), and an optical fiber flange (39) connected with an optical fiber is arranged at the upper end of the first through hole (34);
two ends of the upper surface of the carrier plate (31) are respectively provided with a pressing block (41), the bottom of the pressing block (41) is arranged on the carrier plate (31), the upper part of the pressing block (41) is used for being connected with a driving mechanism, and a plurality of strip-shaped grooves (42) are alternately formed in the middle of the pressing block (41) at intervals.
2. The high reliability laser chip testing system of claim 1, wherein: the front end face of the frame (11) is connected with a handle part (16).
3. The high reliability laser chip testing system of claim 1, wherein: the edges of the left end and the right end of the frame (11) are provided with a baffle plate part (17) extending downwards, when the springs (14) are in a natural stretching state, the bottom surface of the supporting plate (1) is higher than the bottom surface of the baffle plate part (17), and when the springs (14) are subjected to external force and are in an extending state, the bottom surface of the supporting plate (1) is flush with the bottom surface of the baffle plate part (17) and is in contact with the temperature equalizing plate (24).
4. The high reliability laser chip testing system of claim 1, wherein: 2-8 mounting seats (32) are arranged in parallel, and are mounted on the upper surface of the carrier plate (31) through bolts.
5. The high reliability laser chip testing system of claim 1, wherein: and the two first mounting seats (26) are provided with an air cylinder (27), and a piston rod of the air cylinder (27) is connected with the upper surface of the pressing block (41).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011052493.5A CN114325293B (en) | 2020-09-29 | 2020-09-29 | High-reliability laser chip testing system |
| PCT/CN2021/085490 WO2022068166A1 (en) | 2020-09-29 | 2021-04-03 | High-reliability laser chip test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011052493.5A CN114325293B (en) | 2020-09-29 | 2020-09-29 | High-reliability laser chip testing system |
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| Publication Number | Publication Date |
|---|---|
| CN114325293A CN114325293A (en) | 2022-04-12 |
| CN114325293B true CN114325293B (en) | 2024-03-01 |
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| CN202011052493.5A Active CN114325293B (en) | 2020-09-29 | 2020-09-29 | High-reliability laser chip testing system |
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| CN (1) | CN114325293B (en) |
| WO (1) | WO2022068166A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114670151B (en) * | 2022-05-26 | 2022-08-16 | 苏州联讯仪器有限公司 | Temperature control clamping device, crimping box and error code testing device |
| CN115932550B (en) * | 2022-12-29 | 2023-08-29 | 佛山市蓝箭电子股份有限公司 | Semiconductor testing device |
| CN117872098B (en) * | 2024-03-13 | 2024-05-14 | 无锡迈步智能装备有限公司 | High-temperature high-voltage aging device for high-capacity packaged chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6259264B1 (en) * | 1999-08-30 | 2001-07-10 | Agere Systems Optoelectronics Guardian Corp. | Apparatus and method for testing semiconductor laser chips |
| CN2935474Y (en) * | 2007-01-12 | 2007-08-15 | 吴庆华 | Functional lighting LED |
| CN204359825U (en) * | 2015-01-04 | 2015-05-27 | 昆山凯耀电子科技有限公司 | Circuit board for testing function of main machine |
| CN109870644A (en) * | 2019-04-03 | 2019-06-11 | 苏州联讯仪器有限公司 | The reliability test equipment of superpower laser chip |
| CN209894923U (en) * | 2019-04-12 | 2020-01-03 | 苏州联讯仪器有限公司 | Reliability test system for laser chip |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2691540B1 (en) * | 1992-05-22 | 1994-07-29 | Froilabo | SAMPLE HOLDER MODULE FOR TESTING AN OPTICAL COMPONENT. |
| US6583636B2 (en) * | 2000-05-12 | 2003-06-24 | Delaware Capitol Formation | BGA on-board tester |
| JP4646037B2 (en) * | 2006-11-24 | 2011-03-09 | 三菱電機株式会社 | Burn-in equipment tank rack |
| JP4871852B2 (en) * | 2007-12-05 | 2012-02-08 | シャープ株式会社 | Burn-in equipment |
| CN201751851U (en) * | 2010-08-02 | 2011-02-23 | 众达光通科技(苏州)有限公司 | Testing fixture for DFB/FP |
| CN202182813U (en) * | 2011-08-30 | 2012-04-04 | 杭州创惠仪器有限公司 | Light-emitting diode (LED) light attenuation testing device |
| CN209085898U (en) * | 2018-11-27 | 2019-07-09 | 深圳市东飞凌科技有限公司 | Laser ageing test board |
| CN210720638U (en) * | 2019-04-03 | 2020-06-09 | 苏州联讯仪器有限公司 | Chip aging testing device with cooling function |
| CN210072001U (en) * | 2019-04-03 | 2020-02-14 | 苏州联讯仪器有限公司 | High-efficiency test equipment for chip aging |
| CN210720639U (en) * | 2019-04-03 | 2020-06-09 | 苏州联讯仪器有限公司 | Testing device for laser chip |
| CN211043568U (en) * | 2019-04-12 | 2020-07-17 | 苏州联讯仪器有限公司 | Testing device for semiconductor laser chip assembly |
-
2020
- 2020-09-29 CN CN202011052493.5A patent/CN114325293B/en active Active
-
2021
- 2021-04-03 WO PCT/CN2021/085490 patent/WO2022068166A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6259264B1 (en) * | 1999-08-30 | 2001-07-10 | Agere Systems Optoelectronics Guardian Corp. | Apparatus and method for testing semiconductor laser chips |
| CN2935474Y (en) * | 2007-01-12 | 2007-08-15 | 吴庆华 | Functional lighting LED |
| CN204359825U (en) * | 2015-01-04 | 2015-05-27 | 昆山凯耀电子科技有限公司 | Circuit board for testing function of main machine |
| CN109870644A (en) * | 2019-04-03 | 2019-06-11 | 苏州联讯仪器有限公司 | The reliability test equipment of superpower laser chip |
| CN209894923U (en) * | 2019-04-12 | 2020-01-03 | 苏州联讯仪器有限公司 | Reliability test system for laser chip |
Non-Patent Citations (1)
| Title |
|---|
| 新型模块化结构的ICT测试治具设计;宋巧莲;吴斌;;工具技术;20150920(第09期);全文 * |
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