KR101183978B1 - Jig unit for testing LED chip - Google Patents

Abstract

The jig unit for inspecting an LED chip according to the present invention includes a seating member having a seating surface on which the LED chip is seated and a probe insertion hole, and a probe contacting a lower surface of the LED chip disposed on the seating surface through the probe insertion hole. A probe holder, an actuator for raising the probe assembly, a first holder having a first holding member for moving the first rotating arm and the first rotating arm to clamp the LED chip, and moving the LED together with the second rotating arm and the second rotating arm And a second holder having a second holding member for clamping the chip, and a holder operating member for rotating the first rotary arm and the second rotary arm while moving up and down by an actuator. Since the jig unit for inspecting the LED chip according to the present invention can contact a probe for applying power and inspecting electrical characteristics to the lower surface of the LED chip, the contacting of the probe with the LED chip can be made very easily and quickly.

Description

Jig unit for testing LED chip}

The present invention relates to a jig unit for LED chip inspection, and more particularly, to a jig unit for LED chip inspection that can supply power to the LED chip and detect the electrical characteristics of the LED chip while fixing the LED chip. .

An LED is a light emitting device using a light emitting phenomenon generated when a voltage is applied to a semiconductor. One LED serves as a point light source, but when a plurality of LEDs are gathered, they may act as line light sources or surface light sources.

LEDs are more stable and reliable than other thermal conversion light emitting devices, have low power consumption, and have long life. At present, LED technology is rapidly evolving, and high-efficiency, high-brightness LEDs of various colors are being released. In addition, the application fields of LEDs, which have been applied to simple display devices, are expanding. Recently, as LED is used as a light source of a backlight unit used in a flat panel display, the demand for LED is greatly increased.

LED chips, a key component of LED products, are formed on wafers through a semiconductor process and then cut into individual chips. The separated LED chips are commercialized through packaging processes such as lead connection and molding. Recently, a technique of attaching to a circuit board using an electrode pattern on the bottom of an LED chip without using an additional connection structure such as a metal lead or an intermediate medium such as a ball grid array (BGA) has been utilized. In addition, in the production of LED products, a manufacturing method in which a production process is reduced by applying a fluorescent layer on a wafer on which an LED chip is formed and then performing a cutting process is used.

The produced LED chips are inspected before shipment. Common LED chip inspections include luminescence properties through a spectrometer and electrical properties through a probe, and these tests are performed simultaneously.

In the LED chip inspection, conventionally, the bottom surface of the LED chip was vacuum-adsorbed with a jig, and then a probe was brought into contact with the top surface of the LED chip to supply power to the LED chip, and the electrical characteristics of the LED chip were examined. However, in order for the probe to contact the upper surface of the LED chip, an integrating sphere for guiding light generated from the LED chip to the spectrometer must be disposed away from the LED chip, so that a part of the light generated from the LED chip is integrated with the LED chip. A problem emerged through the gaps between the spheres. If some of the light emitted from the LED chip escapes, the accuracy of the light emission characteristic test will be reduced.

In addition, in the related art, the probe for inspecting the power supply and the electrical characteristics of the LED is in contact with the upper surface of the LED chip, causing interference with the integrating sphere, and the task of contacting the probe with the LED chip is cumbersome.

The present invention is to solve this problem, an object of the present invention is to contact the probe to the lower surface of the LED chip to avoid interference with the integrating sphere to facilitate the probe contact work, LED chip that can increase the accuracy of the light emission characteristic inspection It is to provide an inspection jig unit.

LED chip inspection jig unit according to the present invention for achieving the above object is a seating member having a seating surface on which the LED chip is seated and a probe insertion hole extending to the seating surface, through the probe insertion hole of the seating member A probe assembly having a probe in contact with a bottom surface of an LED chip disposed on a seating surface, the probe assembly being arranged to be liftable with respect to the seating member, and an actuator for raising the probe assembly to allow the probe to contact the bottom surface of the LED chip; A first rotary arm disposed below the seating member and a first rotary arm coupled to the first rotary arm and extending upward and downward may rotate together with the first rotary arm to move toward the probe insertion hole on the seating surface. A first holder having a first holding member coupled to the first rotational shaft, the first holder being disposed to face the first rotational arm 2 is coupled to the rotating arm and the second rotating arm and rotates together with the second rotating shaft extending up and down and the second rotating arm to face the first holding member with the probe insertion hole therebetween on the seating surface. A second holder having a second holding member coupled to the second rotational shaft so as to move toward the probe insertion hole, and a holder for rotating the first rotational arm and the second rotational arm while moving up and down by the actuator It includes an operating member.

Since the jig unit for LED chip inspection according to the present invention can contact the probe for applying power and inspecting electrical characteristics to the lower surface of the LED chip, interference does not occur between the probe and the integrating sphere installed on the LED chip. Therefore, the operation of contacting the probe to the LED chip can be made very easily and quickly, and the LED chip inspection efficiency can be greatly improved.

In addition, the jig unit for inspecting the LED chip according to the present invention can be installed so that the integrating sphere completely covers the seating surface on which the LED chip is placed, thereby preventing external radiation of light due to a gap between the LED chip and the integrating sphere as in the prior art. It is possible to increase the accuracy of the light emission characteristic inspection.

In addition, the jig unit for LED chip inspection according to the present invention is made of a compact structure can be manufactured in a small size, it can be used for the inspection of LED chips of various sizes.

In addition, the jig unit for LED chip inspection according to the present invention can perform the LED chip clamping operation and the probe contact operation with a single actuator, thereby reducing the size and manufacturing cost.

1 is a perspective view showing a jig unit for LED chip inspection according to an embodiment of the present invention.
2 is a bottom perspective view showing a jig unit for LED chip inspection according to an embodiment of the present invention.
3 is an exploded perspective view showing a jig unit for LED chip inspection according to an embodiment of the present invention.
Figure 4 is a side cross-sectional view showing a jig unit for LED chip inspection according to an embodiment of the present invention.
Figure 5a is a side view showing the state before the LED chip clamping of the LED chip inspection jig unit according to an embodiment of the present invention.
Figure 5b is a side cross-sectional view showing a state before the LED chip clamping of the jig unit for testing LED chip according to an embodiment of the present invention.
Figure 5c is a bottom view showing the state before the LED chip clamping of the jig unit for LED chip inspection according to an embodiment of the present invention.
Figure 5d is a plan view showing the state before the LED chip clamping of the jig unit for LED chip inspection according to an embodiment of the present invention.
6A is a side view illustrating an LED chip clamping state of a jig unit for inspecting an LED chip according to an embodiment of the present invention.
Figure 6b is a side cross-sectional view showing the LED chip clamping state of the jig unit for LED chip inspection according to an embodiment of the present invention.
6C is a bottom view illustrating an LED chip clamping state of a jig unit for inspecting an LED chip according to an embodiment of the present invention.
6D is a plan view illustrating an LED chip clamping state of a jig unit for inspecting an LED chip according to an exemplary embodiment of the present invention.
7 is a side cross-sectional view showing a state in which the probe of the jig unit for LED chip inspection according to an embodiment of the present invention in contact with the LED chip.
8 shows a state in which the integrating sphere is coupled to the jig unit for LED chip inspection according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, it will be described in detail with respect to the LED chip inspection jig unit according to an embodiment of the present invention.

In describing the present invention, the sizes and shapes of the components shown in the drawings may be exaggerated or simplified for clarity and convenience of explanation.

As shown in Figures 1 to 3, the jig unit 100 for LED chip inspection according to an embodiment of the present invention, the mounting member 110, the mounting member 110, the LED chip 10 is mounted A probe assembly 130 having a fixed member 120 to be fixed, a probe 131 for supplying power to the LED chip 10, and a movable member installed to be movable in a vertical direction below the probe assembly 130. 140, an actuator 150 for moving the moving member 140, and a first holder 160 and a second holder 170 for fixing the LED chip 10 mounted on the seating member 110. When using the LED inspection jig unit 100, the integrating sphere 20 in which the probe 131 is brought into contact with the lower surface of the LED chip 10 and the spectrometer 30 (see FIG. 8) is connected to the LED chip 10; 8), the electrical property test and the light emission property test may be performed at the same time.

As shown in Figure 1 and 3, the mounting member 110 is coupled to the upper surface of the fixing member (120). The mounting member 110 has a flat mounting surface 111 on which the LED chip 10 is mounted and a probe insertion hole 112 extending to the mounting surface 111. The probe insertion hole 112 extends from the bottom surface of the seating member 110 to the seating surface 111 on the top surface and is provided in a number corresponding to the number of probes 131. The probe 131 disposed below the mounting member 110 may contact the bottom surface of the LED chip 10 mounted on the mounting surface 111 through the probe insertion hole 112. At the edge of the seating member 110, a pair of installation grooves 113 and 114 that are opened to the outside is provided. Each of the installation grooves 113 and 114 has a round shape corresponding to the round appearance of the first rotary shaft support member 164 and the second rotary shaft support member 174 which will be described later.

The fixing member 120 supports the seating member 110. At the center of the fixing member 120 is provided a support member insertion hole 121 connected to the plurality of probe insertion holes 112, and a pair of installation grooves opened outward at both sides of the support member insertion hole 121. 122 and 123 are provided. The probe support member 132 of the probe assembly 130 to be described later is inserted into the support member insertion hole 121. Each of the installation grooves 122 and 123 has a round shape corresponding to the round appearance of the first rotation shaft support member 164 and the second rotation shaft support member 174 which will be described later.

3 and 4, a plurality of support bars 125 are coupled to the lower end of the fixing member 120. The plurality of support bars 125 serves to guide the probe assembly 130 and the moving member 140. The return spring 126 is installed on the plurality of support bars 125. The return spring 126 is disposed between the fixing member 120 and the probe assembly 130 to apply an elastic force in a downward direction with respect to the probe assembly 130, thereby being raised toward the fixing member 120 by the actuator 150. Return the probe assembly 130.

Some of the support bars 125 of the plurality of support bars 125 are provided with a stopper 127. The stopper 127 restricts the downward movement of the probe assembly 130. When the probe assembly 130 that has risen toward the fixing member 120 descends under the elastic force of the return spring 126, the lower surface of the probe assembly 130 is caught by the stopper 127 so that the probe assembly 130 is fixed to the fixing member ( 120) to stop at a certain position of the lower part.

The installation position of the return spring 126 and the stopper 127 is not limited to the illustrated and can be variously changed. When the working rod 152 of the probe movement actuator 150 that raised the probe assembly 130 is lowered to its original position, the probe assembly 130 may be lowered by its own weight, and thus the return spring 126 may be omitted. . When the operation rod 152 is coupled to the probe assembly 130, the probe assembly 130 may be elevated by the operation of the operation rod 142. In this case, the return spring 126 may be omitted.

As shown in Figures 1 to 3, the probe assembly 130 is disposed to be movable in the vertical direction below the fixing member 120. A probe support member 132 protruding upward is provided at the center of the upper surface of the probe assembly 130, and a plurality of probes 131 are installed in the probe support member 132. When the probe assembly 130 is raised toward the seating member 110 by the actuator 150, the probe 131 contacts the bottom surface of the LED chip 10 placed on the seating member 110 through the probe insertion hole 112. Supply power to the LED chip 10 and inspect the electrical characteristics of the LED chip 10.

The probe 131 extends from the lower surface of the probe support member 132 so that an upper end thereof protrudes in the upper direction of the probe support member 132. Although not shown, the probe 131 is connected to a cable for power supply and signal transmission. The probe 131 is a pogo type in which an upper end thereof is supported by a shock absorbing member such as a spring so that an excessive impact is not applied to the LED chip 10 when the probe 131 is in contact with the bottom surface of the LED chip 10. Can be used.

The probe assembly 130 has a plurality of support bar insertion holes 133 and a pair of rotation shaft insertion holes 134 disposed around the probe support member 132. The support bar 125 is inserted into the plurality of support bar insertion holes 133, and the first rotation shaft 162 and the second holder 170 of the first holder 160 to be described later are inserted into the pair of rotation shaft insertion holes 134. Each of the second rotation shafts 172 is inserted. Therefore, the probe assembly 130 slides upward and downward along the plurality of support bars 125 and the pair of rotation shafts 162 and 172. The slide member 135 is inserted into the support bar insertion hole 133 to facilitate the slide motion with the support bar 125, and the slide shaft insertion hole 134 smoothly slides with the rotation shafts 162 and 172. Sliding member 136 is inserted.

As shown in Figures 2 to 4, the moving member 140 is installed to be movable in the vertical direction at the bottom of the probe assembly 130. The moving member 140 is provided with a plurality of support bar insertion holes 141 and a pair of rotation shaft insertion holes 142. The support bar 125 is inserted into the plurality of support bar insertion holes 141, and the first rotation shaft 162 and the second rotation shaft 172 are respectively inserted into the pair of rotation shaft insertion holes 142. Accordingly, the movable member 140 slides upward and downward along the plurality of support bars 125 and the pair of rotation shafts 162 and 172. A sliding member 143 is inserted into the support bar insertion hole 141 to smoothly slide the support bar 125, and the slide shaft insertion hole 142 smoothly slides the rotation shafts 162 and 172. A sliding member 144 for insertion is inserted.

The upper surface of the moving member 140 is provided with a pair of pressing protrusions 145, and the lower surface of the moving member 140 is provided with a holder operating member 146. The holder operating member 146 has an inclined pressing portion 147 for operating the first rotary arm 161 of the first holder 160 and the second rotary arm 171 of the second holder 170 which will be described later. Have The actuator 150 is coupled to the holder operating member 146.

The moving member 140 moves in the vertical direction by the operation of the actuator 150, and when moving in the upper direction, the pair of pressing protrusions 145 contact the lower surface of the probe assembly 130 to move the probe assembly 130 upward. Move to. A buffer spring 148 is installed between the probe assembly 130 and the moving member 140. The shock absorbing spring 148 is coupled to the first rotation shaft 162 and the second rotation shaft 172, and serves to reduce the impact when the movable member 140 is raised to contact the probe assembly 130.

The actuator 150 includes a body 151 disposed below the moving member 140 and an operation rod 152 coupled to the body 151 so as to be slidably movable. The operating rod 152 is coupled to the holder operating member 146. As the actuator 150, various devices capable of providing a linear force to the moving member 140 such as a pneumatic cylinder and a hydraulic cylinder may be used.

As shown in FIGS. 1 to 3, the first holder 160 and the second holder 170 are clamped by the holder actuating member 146 and the actuation spring 180 and clamp the LED chip 10 or the LED chip. Spaced apart from (10). The first holder 160 may include a first rotating arm 161 disposed below the moving member 140, a first rotating shaft 162 coupled to the first rotating arm 161, and a first rotating arm 161. The first holding member 163 and the first rotating shaft 162 coupled to the first rotating shaft 162 to rotate together to move toward the probe insertion hole 112 on the seating surface 111 of the mounting member 110. It includes a first rotation shaft support member 164 to rotatably support.

The first rotary arm 161 has a first contact surface 165 that is inclined to correspond to the pressing portion 147. When the holder operating member 146 is lowered and the pressing portion 147 presses the first contact surface 165 outward, the first rotating arm 161 rotates together with the first rotating shaft 162, where the first The holding member 163 is away from the LED chip 10 placed on the seating member 110. On the contrary, when the holder operating member 146 is raised and the pressing part 147 is out of the first contact surface 165 of the first rotating arm 161, the first rotating shaft 162 is opposed by the elastic force of the operating spring 180. Direction, thereby causing the first holding member 163 to move in a direction close to the LED chip 10.

The second holder 170 is disposed below the moving member 140 to face the first rotating arm 161 and is connected to the first rotating arm 161 through a pair of operating springs 180. Rotate together with the arm 171, the second rotation arm 172 coupled to the second rotation arm 171, and the second rotation arm 171 to move toward the probe insertion hole 112 on the seating surface 111. A second holding member 173 coupled to the second rotating shaft 172, and a second rotating shaft supporting member 174 rotatably supporting the second rotating shaft 172.

The second rotary arm 171 has a second contact surface 175 that is inclined to correspond to the pressing portion 147 of the holder operating member 146. As with the operation of the first holder 160, when the holder operating member 146 is lowered, the second rotating arm 171 rotates so that the second holding member 173 is placed on the seating member 110. When the holder operating member 146 is raised to move away from the second rotary arm 171, the second rotating arm 171 rotates in the opposite direction by the elastic force of the operating spring 180, the second holding member 173 moves in a direction close to the LED chip 10.

The first holding member 163 has a first fixing groove 166 (see FIG. 5D) for accommodating a portion of the outer edge of the LED chip 10, and the second holding member 173 has a first fixing groove ( It has a second fixing groove 176 (see FIG. 5D) for receiving a portion opposite the portion of the outer edge of the LED chip 10 inserted into 166. The first fixing groove 166 has a shape corresponding to a part of the outer edge of the LED chip 10, the second fixing groove 176 has a shape corresponding to the other part of the outer edge of the LED chip 10. Is done.

Therefore, the first holding member 163 and the second holding member 173 may align the LED chip 10 while contacting the outer edge of the LED chip 10. That is, even if the LED chip 10 is placed on the seating surface 111 so that the posture is misaligned, the first holding member 163 and the second holding member 173 are joined to the outer edge of the LED chip 10 and the LED chip 10. The posture of the LED chip 10 is corrected so that the electrode pattern 11 of 10 is positioned directly above the probe insertion hole 122.

In addition, the first inclined surface 167 (see FIG. 7) and the second inclined surface 177 (see FIG. 7) are formed at the edge of the first holding member 163 and the edge of the second holding member 173 in contact with the LED chip 10. Are respectively provided. The first inclined surface 167 presses a portion of the outer edge of the LED chip 10 downward, and the second inclined surface 177 presses another portion of the outer edge of the LED chip 10 downward. When the probe 131 contacts the LED chip 10 by the action of the first inclined surface 167 and the second inclined surface 177, the LED chip 10 is not spaced apart from the probe 131, and the probe 131 May maintain a stable contact state with the electrode pattern 11 of the LED chip 10.

1 to 3, the first rotary shaft support member 164 of the first holder 160 and the second rotary shaft support member 174 of the second holder 170 are installed of the seating member 110. The grooves 113 and 114 and the mounting grooves 122 and 123 of the fixing member 120 are respectively inserted into the probe assembly 130 when viewed in the width direction. In addition, as shown in FIG. 5C, the first rotary arm 161 of the first holder 160 and the second rotary arm 171 of the second holder 170 are moved when viewed in the width direction. Limited to the inside of the 140, as shown in FIG. 5D, the first holding member 163 of the first holder 160 and the second holding member 173 of the second holder 170 extend in the width direction. When viewed, the movement is limited to the inside of the probe assembly 130. Therefore, the first holder 150 and the second holder 170 are positioned inside the probe assembly 130 in the width direction. This structure advantageously works to reduce the overall width of the jig unit 100 for LED chip inspection according to the present invention.

Hereinafter, the operation of the jig unit for LED chip inspection according to an embodiment of the present invention will be described.

First, FIGS. 5A to 5D show a state in which the first holding member 163 and the second holding member 173 are out of the loading position of the seating surface 111 on which the LED chip 10 is placed. The chip 10 may be loaded on the probe insertion hole 112 of the seating surface 111, or may be freed from this position. At this time, the actuator 150 is lowered to the holder operating member 146 to the maximum, the moving member 140 and the probe assembly 130 is located at the lowest position, the holder operating member 146 is the first rotary arm 161 And the second rotating arm 171 is maximally opened and the operation spring 180 is maximally tensioned.

As shown in FIG. 5D, after the LED chip 10 is loaded onto the probe insertion hole 112 of the seating surface 111, as shown in FIGS. 6A to 6D, the actuator 150 is a holder operating member. Pressing the 146 in the upward direction raises the holder operating member 146 and the moving member 140 toward the probe assembly 130. 6A and 6B, while the moving member 140 compresses the buffer spring 148, the pressing protrusion 145 contacts the bottom surface of the probe assembly 130.

And as shown in Figure 6c, when the pressing portion 147 of the holder operating member 146 is out of the first rotary arm 161 and the second rotary arm 171, the operating spring 180 is elastically restored The first rotary arm 161 and the second rotary arm 171 rotate to narrow the gap therebetween. When the first rotary arm 161 and the second rotary arm 171 rotate by the elastic force of the operation spring 180, as shown in Figure 6d, the first holding member 163 and the second holding member 173 ) Rotates toward the LED chip 10 so that the first holding member 163 and the second holding member 173 reach the LED chip 10.

When the first holding member 163 and the second holding member 173 reach the LED chip 10, the LED chip 10 may have a portion of an outer edge of the first fixing groove of the first holding member 163. Part of the outer edge of the second holding member 173 is received in the second fixing groove 176 of the second holding member 173. At this time, the LED chip 10 is aligned while the outer edge thereof is accommodated in the first fixing groove 166 and the second fixing groove 176 and is clamped by receiving the same elastic force of the operation spring 180 from two opposite directions. do. As described above, since the LED chip 10 is clamped by the elastic force of the operation spring 180, an excessive force is not applied to the LED chip 10 during clamping.

After the LED chip 10 is clamped in this way, as shown in FIG. 7, when the actuator 150 further pushes the movable member 140 upwards to move the movable member 140 by a predetermined distance, the movable member 140. ), The pressing protrusion 145 pushes the probe assembly 130 upward, and the probe assembly 130 rises toward the seating member 110. In this case, the first holder 160 and the second holder 170 maintain the stopped state in the clamped state of the LED chip 10.

When the probe assembly 130 is raised, the probe 131 slides along the probe insertion hole 122, and an upper end thereof contacts the electrode pattern 11 on the bottom surface of the LED chip 10. At this time, the LED chip 10 is subjected to a force in an upward direction, and the first inclined surface 167 of the first holding member 163 and the second inclined surface 177 of the second holding member 173 extend the outer edge thereof. Since the LED chip 10 is pressed downward, the probe 131 may maintain a stable contact state.

After the probe 131 contacts the electrode pattern 11 of the LED chip 10, the probe 131 supplies power to the LED chip 10 and simultaneously checks electrical characteristics of the LED chip 10. In addition, as shown in FIG. 8, when the integrating sphere 20 to which the spectrometer 30 is coupled is coupled to the jig unit 100 to cover the LED chip 10, light generated through the spectrometer 30 may be generated. The light emission characteristics of the LED chip 10 can be inspected. In this case, since the integrating sphere 20 completely covers the seating surface 121 on which the LED chip 10 is placed, external radiation of light due to the generation of a gap between the LED chip 10 and the integrating sphere 20 as in the prior art is generated. You can stop it.

As described above, the LED chip inspection jig unit 100 according to the present invention, after stably fixing the LED chip 10 placed on the seating surface 111, the probe insertion hole formed to penetrate the seating surface 111 ( Since the probe 131 may be in contact with the bottom surface of the LED chip 10 through 112, the operation of contacting the probe 131 to the LED chip 10 is very easy.

In addition, the integrating sphere 20 may be installed to completely cover the seating surface 121 on which the LED chip 10 is placed so that the light generated from the LED chip 10 may be completely trapped in the integrating sphere 20. Therefore, the external radiation of light due to the generation of a gap between the LED chip 10 and the integrating sphere 20 can be prevented as in the prior art, thereby improving the accuracy of the light emission characteristic inspection.

On the other hand, in the present invention, the structure and the connection structure of the first holder 160, the second holder 170 and the holder operating member 146 for operating them may be variously changed. For example, when the holder operating member 146 spreads the first rotary arm 161 and the second rotary arm 171 away from each other, the first holding member 163 and the second holding member 173 are the LED chips 10. ) And the first holding member 163 and the second holding member 173 are LEDs when the first rotary arm 161 and the second rotary arm 171 rotate by the elastic force of the operation spring 180. It may also be configured to deviate from the chip 10. In addition, when the holder operating member 146 rotates the first rotary arm 161 and the second rotary arm 171 in the forward and reverse directions, the first holder 160 and the second holder without the operation spring 180. 170 may be activated.

The embodiments of the present invention described above and illustrated in the drawings should not be construed as limiting the technical spirit of the present invention, and the protection scope of the present invention is limited only by the matters described in the claims. Those skilled in the art can improve or change the technical spirit of the present invention in various forms, and such improvements and modifications will fall within the protection scope of the present invention.

100: LED chip inspection jig unit 110: base
120: seating member 121: seating surface
122: probe insertion hole 130: brobe assembly
131: probe 132: probe support member
140: probe movement actuator 142: operating member
150, 160: 1st, 2nd holder 151, 161: 1st, 2nd holding member
152, 162: first and second moving members 153 and 163: first and second connecting members
154, 164: first and second fixing grooves 155, 165: first and second inclined surfaces
170: Holder Actuator

Claims (11)

A seating member having a seating surface on which an LED chip is seated and a probe insertion hole extending to the seating surface;
A probe assembly having a probe contacting a lower surface of the LED chip disposed on the seating surface through a probe insertion hole of the seating member, the probe assembly disposed to be liftable with respect to the seating member;
An actuator for raising the probe assembly to allow the probe to contact the bottom surface of the LED chip;
A first rotary arm disposed below the seating member, a first rotary shaft coupled to the first rotary arm and extending up and down, and rotated together with the first rotary arm to move toward the probe insertion hole on the seating surface A first holder having a first holding member coupled to the first rotational shaft so as to be coupled to the first rotational shaft;
A second rotary arm disposed to face the first rotary arm, a second rotary shaft coupled to the second rotary arm and extending up and down, and rotated together with the second rotary arm to intersect the probe insertion hole on the seating surface. A second holder having a second holding member coupled to the second rotational shaft so as to move toward the probe insertion hole while facing the first holding member; And
And a holder operating member for rotating the first rotary arm and the second rotary arm while moving in an up and down direction by the actuator. The method of claim 1,
The first holding member has a first fixing groove for receiving a portion of the outer edge of the LED chip,
The second holding member has a second fixing groove for accommodating the other part of the outer edge of the LED chip jig unit for inspection. The method according to claim 1 or 2,
The first holding member has a first inclined surface for pressing a portion of an outer edge of the LED chip toward the probe such that the LED chip is not spaced apart from the probe when the probe contacts the LED chip.
The second holding member has a second inclined surface for pressing another part of the outer edge of the LED chip toward the probe so that the LED chip is not spaced apart from the probe when the probe contacts the LED chip. Jig unit for LED inspection. The method of claim 1,
The holder operating member presses an outer surface of the first rotating arm to the outside to rotate the first rotating arm about the first rotating shaft, and simultaneously presses an outer surface of the second rotating arm to the outside to press the first rotating arm. 2 LED jig unit for inspection, characterized in that it comprises an inclined pressing portion for rotating the rotary arm about the second axis of rotation. The method of claim 4, wherein
The first rotary arm has a first contact surface inclined to correspond to the pressing unit, and the second rotary arm has a second contact surface inclined to correspond to the pressing unit. . The method of claim 1,
And an actuating spring connected between the first rotary arm and the second rotary arm to provide an elastic force to rotate the first rotary arm and the second rotary arm in a direction proximate to each other. Jig unit for LED inspection. The method of claim 1,
A first rotation shaft support member coupled to the seating member to rotatably support the first rotation shaft; And
And a second rotation shaft support member coupled to the seating member to rotatably support the second rotation shaft. The method of claim 1,
Further comprising a support bar disposed in the vertical direction in the lower portion of the seating member,
The probe assembly jig unit for LED inspection, characterized in that having a support bar insertion hole into which the support bar is inserted so as to slide along the support bar. The method of claim 8,
LED inspection jig unit further comprises a return spring disposed between the seating member and the probe assembly for applying the elastic force in the downward direction with respect to the probe assembly in order to return the probe assembly raised by the actuator. . The method of claim 1,
A moving member disposed below the probe assembly so as to be movable up and down; And
And a buffer spring disposed between the probe assembly and the movable member.
The holder operating member is coupled to the lower surface of the moving member,
The actuator is coupled to the holder operating member,
And the moving member moves upward to raise the probe assembly when the actuator pushes the holder operating member upward. The method of claim 1,
The first rotation arm and the second rotation to rotate the first rotary arm and the second rotary arm in a direction close to each other to move the first holding member and the second holding member toward the probe insertion hole. Further comprising an actuation spring for providing an elastic force to the arm,
The holder operating member is disposed below the probe assembly, and presses the first rotary arm and the second rotary arm to the outside to rotate the first rotary arm and the second rotary arm by the operating spring. It is provided with an inclined pressing portion for rotating in the opposite direction to,
When the actuator pushes the holder operating member upward, the holder operating member moves away from the first rotational arm and the second rotational arm so that the first holding member and the second holding member clamp the LED chip. After that, the pressing force of the actuator is transmitted to the probe assembly through the holder operating member so that the probe contacts the lower surface of the LED chip.

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