KR20110066659A - Push apparatus for test - Google Patents

Abstract

PURPOSE: A push apparatus for a test is provided to make a semiconductor device and a test socket closely contacted by tilting the semiconductor device according to a tilt angle of the test socket. CONSTITUTION: In a push apparatus for a test, a supporting plate(20) supports a guide member(30) and a pressing member(70). In the center of the guide member, a center hole(51) is extended up and down. The guide member is comprised of a supporting member(40) and a moving member(50). A second accommodating groove(52) having a shape corresponding to the accommodating groove of the supporting plate in the top of the moving member is installed. In the bottom of the supporting plate, a first accommodating groove(21) accepting the upper end of an elastic member(60) is installed.

Description

Pusher device for test

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pusher device for a semiconductor test, and more particularly, a semiconductor test in which an attached semiconductor device is stably tilted according to an inclination angle of a test socket in which the semiconductor device can be seated, thereby enabling more reliable electrical connection. For a pusher device.

A semiconductor device manufactured by a general semiconductor production process is subjected to various tests to confirm the reliability of the product. Common tests include electrical characteristics tests to check the electrical characteristics and defects of semiconductor chips, and burn-in tests to check the lifetime and defects of semiconductor chips under severe conditions such as temperature, voltage, and current higher than normal operating conditions. in Test).

Here, the electrical property test is a test for checking the normal operation and disconnection of the semiconductor chip by contacting all input / output terminals of the semiconductor chip with the test circuit board on which the test signal generation circuit is formed. Handlers are mainly used to test the electrical characteristics of semiconductor devices. The handler is configured to pressurize the semiconductor device for reliably contacting the test socket with an insert seating the semiconductor device, a test socket disposed below the insert, and a semiconductor device disposed within the insert seated within the insert. And a pusher device and a test device disposed below the test socket and performing a test by applying a current to the semiconductor device.

1 is a cross-sectional view schematically showing a pusher device according to the prior art. The pusher device 100 includes a support plate 110 and a central hole 122 disposed on a lower surface of the support plate 110 and extending in a vertical direction at a center thereof, and a lower end 121 of the pusher device 100. The guide member 120 in contact with the lead terminal 141 of the) and the support plate 110 in the state inserted into the central hole 122 of the guide member 120, the lower end of the semiconductor The pressing member 130 is formed in contact with the device 140 to elastically support the semiconductor device 140, the air hole 132 penetrating the upper and lower ends are formed at the center thereof.

A wrinkled wrinkle member 131 capable of elastically elastic deformation is disposed at the lower end of the pressing member 130 to elastically press the semiconductor device 140. That is, when the thickness of the semiconductor device is thick, the wrinkle member is compressed to absorb the thickness of the semiconductor device, and when the thickness of the semiconductor device is thin, the wrinkle member is stretched to flexibly correspond to the thickness of the semiconductor device. It is configured to be. On the other hand, when the operation of the pusher device is schematically described, when air is applied through the air hole while the corrugation member disposed at the lower end of the pressing member is seated on the upper surface of the semiconductor device, the semiconductor device is moved downward by the pneumatic pressure. The terminals of the semiconductor device are pressurized so that the terminals of the test socket are in electrical contact with each other. Thereafter, when a predetermined current is applied from the test socket, the current is transferred from the test socket to the semiconductor device to perform an electrical test.

In this case, the guide member of the semiconductor device has a lower end thereof in contact with a lead terminal of the semiconductor device, so that the lead terminal of the semiconductor device and the terminal of the test socket may contact each other.

The pusher device according to the prior art has the following problems.

First, the pusher device according to the related art has no problem as long as the test socket on which the semiconductor device is seated is exactly horizontal, but the test socket is slightly inclined at a predetermined angle α as shown in FIG. 2. There is a problem that the terminals of the semiconductor device do not come into contact with the terminals of the test socket. In other words, the pusher device is provided with a somewhat elastic corrugated member at the bottom of the pressing member to absorb the inclination of the test socket to some extent, but when the size of the semiconductor device is small or greatly inclined, any lead terminal is tested. There is a problem that the terminal of the socket can not be contacted.

In addition, in the case of the prior art, the degree of pressing of the semiconductor device is adjusted by pneumatic pressure in the pusher device. Such pneumatic pressure can be set only by a certain pressing force, so that when there is an inclination between the semiconductor device and the test socket during pressing, the test is performed. The problem is that the life of the test socket is appreciated due to excessive force applied to the first contacting part of the socket.

The present invention has been made to solve the above-described problem, and more particularly, the semiconductor device can be tilted accordingly so that the lead terminal of the semiconductor device can reliably contact the test socket even when the test socket is inclined. An object of the present invention is to provide a pusher device for semiconductor testing.

In addition, the present invention can be easily tilted by a small pressing force by arranging an elastic member that can easily adjust the pressing force in addition to the pneumatic pressure, so that excessive force acts on the contact portion of the test socket even when the test socket is inclined It is an object of the present invention to provide a pusher device for testing semiconductors.

The semiconductor test pusher device according to the present invention for solving the above-mentioned problem is a semiconductor test pusher device for mounting a semiconductor device in a test socket,

A support plate, a center hole disposed on a lower surface of the support plate and extending in a vertical direction in a center thereof, is installed in the center of the guide plate, the lower end of which is inserted into the center hole of the guide member. Is installed on the lower surface of the pusher device for a semiconductor test including a pressing member having an air hole penetrating the upper and lower ends and elastically supporting the semiconductor device and the elastic device is in contact with the semiconductor device In

The guide member,

A support part disposed on a lower surface of the support plate and having an insertion hole at a center thereof, and a locking step protruding inwardly on an inner surface thereof;

The moving part is disposed in the insertion hole of the support portion, and the center hole is installed at the center thereof, and includes a moving part in which the pressing member is inserted into the center hole.

The moving part may protrude from an outer surface of the moving part so that the semiconductor device may be seated on the test socket at a corresponding inclination angle of the test socket according to the inclination angle of the test socket, and a lower part of the moving part may be seated on an upper surface of the locking jaw. It is prepared.

In the pusher device, it is preferable that the surface facing the inner surface of the supporting portion at the locking portion of the moving portion is inclined such that the separation distance increases from the lower end to the upper end of the locking portion.

In the pusher device,

It is preferable that the surface facing the inner surface of the supporting portion at the engaging portion of the moving portion is spaced apart from the inner surface of the supporting portion.

In the pusher device,

An elastic member for elastically biasing the moving part in a direction away from the supporting plate is disposed between the moving part and the support plate.

In the pusher device, the elastic member is preferably a compression coil spring having an uncompressed state.

The semiconductor test pusher device according to the present invention for achieving the above object is a pusher device for semiconductor test for mounting the semiconductor device in the test socket,

A support plate, a center hole disposed on a lower surface of the support plate and extending in a vertical direction in a center thereof, is installed in the center of the guide plate, the lower end of which is inserted into the center hole of the guide member. Is installed on the lower surface of the pusher device for a semiconductor test including a pressing member having an air hole penetrating the upper and lower ends and elastically supporting the semiconductor device and the elastic device is in contact with the semiconductor device In

The guide member is provided with tilting means for allowing the semiconductor device to be seated in the test socket at a corresponding inclination angle according to the inclination angle of the test socket.

In the pusher device for the semiconductor test,

The tilting means,

A support part installed on a lower surface of the support plate and extending downward;

It is preferable that the support part is tiltably coupled to the support part and a lower part of the moving part is in contact with a lead terminal of the semiconductor device.

In the pusher device for the semiconductor test,

An elastic member for elastically biasing the moving part in a direction away from the supporting plate is disposed between the moving part and the support plate.

The pusher device for semiconductor test according to the present invention has the advantage of being able to tilt the attached semiconductor device according to the inclination angle of the test socket on which the semiconductor device is to be seated so that the semiconductor device and the test socket can be surely contacted with each other. .

In addition, as the semiconductor device can stably contact the test socket, there is an advantage that the lead terminal of the semiconductor device or the terminal of the test socket can be prevented from being damaged due to some concentrated load.

In addition, not only pressurizing the semiconductor device by pneumatic pressure but also by using the elastic member together, the fine pressing force can be adjusted to prevent excessive force from acting on the semiconductor device, as well as fine tilting operation of the pusher device. There is an advantage that can be adjusted.

Hereinafter, a pusher device for testing a semiconductor according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

3 is a schematic diagram of a pusher device for semiconductor testing according to a preferred embodiment of the present invention, and FIG. 4 is an operation diagram of FIG. 3.

Pusher device 10 according to a preferred embodiment of the present invention, by pressing the semiconductor device 80 toward the test socket 90 disposed below the lead terminal 81 of the semiconductor device 80 is the test socket ( It is to be able to reliably contact the predetermined terminal 91 of 90. That is, the semiconductor device 80 is not simply mounted on the test socket 90, but can be seated on the test socket 90 by a constant pressing force.

The pusher device 10 is composed of a support plate 20, guide member 30 and the pressing member 70.

The support plate 20 is a plate member for supporting the guide member 30 and the pressing member 70, and has a structure having an approximately square cross section. The support plate 20 may be formed with a communication hole (not shown) in communication with the air hole 71 of the pressing member 70 to be described later, to impart air to the air hole 71 through the communication hole. do. On the other hand, although not shown, the support plate 20 may be connected to the air supply means for supplying air to be provided through the communication hole.

The lower surface of the support plate 20 may be provided with a plurality of first receiving grooves 21 that can accommodate the upper end of the elastic member 60 of the guide member 30. The first accommodating groove 21 serves to prevent the elastic member 60 from being separated from the outside by receiving the elastic member 60. The size of the first accommodating groove 21 preferably has a size corresponding to the cross-sectional area of the installed elastic member 60, but may be somewhat larger and may be formed somewhat narrower to force the elastic member 60 to fit. Do.

The first accommodating groove 21 is disposed to be somewhat spaced around the pressing member 70, specifically, four are arranged at equal intervals around the pressing member 70. That is, four may be installed on the support plate 20 so that four elastic members 60 may be installed. However, the number of the first accommodating grooves 21 is not limited thereto, and various numbers may be used.

The guide member 30 is disposed on a lower surface of the support plate 20 and has a central hole 51 extending in an up and down direction at a center thereof, and a lower end thereof is formed with a lead terminal 81 of the semiconductor device 80. Contact.

The guide member 30 is composed of a support part 40 and a moving part 50.

The support part 40 has a form in which a side wall extending downward from a lower surface of the support plate 20 and having a predetermined thickness surrounds the moving part 50 in a forward or rectangular shape. At this time, the support portion 40 is provided with an insertion hole 41 in the center thereof, the pressing member 70 and the moving part 50 to be described later is disposed in the insertion hole 41. On the other hand, on the lower inner surface of the support portion 40 is disposed a locking jaw 42 protruding from the inner surface. The locking jaw 42 is configured to allow the locking portion 53 of the moving portion 50 to be described later to be seated.

The support part 40 may be coupled to the support plate 20 by a bolt or the like, but is not limited thereto and may be coupled to the support plate 20 by various fixing means.

The moving part 50 is disposed inside the insertion hole 41 of the support part 40, and a central hole 51 into which the pressing member 70 is inserted is installed at the center thereof. The moving part 50 has a shape in which its outer surface corresponds to the insertion hole 41 of the support part 40, but has a smaller cross-sectional size than the insertion hole 41, so that the insertion hole 41 is formed. It is possible to move up and down in the interior. The central hole 51 provided in the moving part 50 has a substantially circular cross section but at least has a larger diameter than the pressing member 70. A second accommodating groove 52 having a shape corresponding to the accommodating groove of the support plate 20 is formed at an upper end of the moving part 50. The second accommodating groove 52 is disposed at a position facing the first accommodating groove 21, and a lower end of the elastic member 60 may be accommodated therein.

On the other hand, the lower portion of the moving part 50 has a triangular cross-sectional shape so that the cross section is gradually reduced so that the lead terminal 81 of the semiconductor device 80 can be contacted, so as to be similar to the width of the lead terminal 81. It is similar to the prior art, so detailed description thereof is omitted.

The moving part 50 is provided with a locking part 53 for allowing the semiconductor device 80 to be seated on the test socket 90 at an inclination angle corresponding thereto according to the inclination angle of the test socket. The locking portion 53 is protruded from the outer surface of the moving portion 50 is configured so that the bottom surface can be caught on the upper surface of the locking jaw (42).

The surface facing the inner surface of the support portion 40 in the locking portion 53 is formed to be inclined so that the separation distance from each other increases from the lower end of the locking portion 53 toward the upper end. That is, the surface of the engaging portion 53 facing the inner surface of the support portion 40 has a shape inclined by a predetermined angle with respect to the inner surface of the support portion 40, and accordingly, the test of the moving portion 50 will be described later. Even when inclined by the socket 90, the surface of the locking portion 53 may be smoothly inclined without being caught by the support 40. On the other hand, the inclination angle is not determined and can be set to a degree desired by the user according to the conditions used.

Meanwhile, an elastic member 60 is disposed between the moving part 50 and the support plate 20 to elastically bias the moving part 50 in a direction away from the support plate 20. As described above, the elastic member 60 has its upper end positioned in the first accommodation groove 21 of the support plate 20, and its lower end located in the second accommodation groove 52 of the moving part 50. When the moving part 50 approaches the support plate 20, the moving part 50 is elastically compressed to provide a constant reaction force to the moving part 50. The elastic member 60 may be a compressed coil spring having a compressed state or an uncompressed state. However, when a compression coil spring having an uncompressed state is used, there is an advantage that tilting by low pressing force is possible.

Specifically, a compression coil spring having an uncompressed state may apply a predetermined pressing force toward the semiconductor device 80 in cooperation with the pneumatic pressure of the pressing member 70. That is, in the related art, only a predetermined pressing force may be set for pneumatic pressure. When there is an inclination between the semiconductor device 80 and the test socket 90 during compression, first, an excessive force acts on the part contacting the test socket 90 so that the socket In the present invention, the pressing force of pneumatic force and the opposite compression coil spring can be applied to the semiconductor device 80 together with the reaction force, or the pressing force of the pneumatic force in the same direction as the pneumatic force is applied. The force can be applied to the semiconductor device 80 to obtain a desired pressing force.

The elastic member 60 may be arranged in a variety of numbers around the pressing member 70, but when four are installed at equal intervals, the elastic member 60 may be tilted in any direction in which the four front and rear four directions and each direction components are mixed. Will be. Of course, eight or more other elastic members 60 may be installed.

The pressing member 70 is installed on the lower surface of the support plate 20 in a state of being inserted into the central hole 51 of the gable member, the lower end of which is in elastic contact with the semiconductor device 80. An air hole 71 is formed to elastically support the semiconductor device 80 and penetrate the upper and lower ends thereof.

Specifically, the pressing member 70 presses the semiconductor device 80 seated on the test socket 90 so that the lead terminal 81 of the semiconductor device 80 is secured with the terminal 91 of the test socket 90. To make contact with them.

At the lower end of the pressing member 70, a wrinkled elastic wrinkle member 72 is provided at the contact portion of the semiconductor device 80, and the wrinkle member 72 elastically contacts the surface of the semiconductor device 80. Do it. That is, when the thickness of the semiconductor device 80 is thick, the wrinkle member 72 is elastically compressed. When the thickness of the semiconductor device 80 is thin, the wrinkle member 72 is extended. On the other hand, the wrinkle member 72 is in communication with the air hole 71 may allow the air to communicate therein. Since the pressing member 70 is approximately similar to the prior art, a detailed description thereof will be omitted.

The pusher device 10 for a semiconductor test according to the preferred embodiment of the present invention operates as follows.

First, as shown in FIG. 4, when the test socket 90 inclined at a predetermined angle α is provided, the semiconductor device 80 is seated on the test socket 90, and the semiconductor device 80 Pusher device 10 is pressed. At this time, the pressing member 70 which is in contact with the semiconductor device 80 is in contact with the surface of the semiconductor device 80 while the lower end thereof is elastically changed, and air is injected through the air hole 71. The semiconductor device 80 is pressed downward. At this time, since the test socket 90 is inclined, the semiconductor device 80 is pressed by the air hole 71 and tries to rotate by a predetermined angle according to the inclination angle of the test socket 90.

Accordingly, the moving part 50 rotates with the semiconductor device 80 by a predetermined angle. Specifically, as shown in FIG. 4, the engaging part 53 disposed on the upper left side of the moving part 50 is lifted upward, and the engaging part 53 disposed on the upper right side thereof moves downward. At this time, since the surface facing the inner surface of the support portion 40 is inclined at the catching portion 53, the distance from the inner surface of the support portion 40 becomes narrow according to the inclination angle thereof, and is almost close. That is, as the portion of the locking portion 53 spaced apart from the inner surface of the supporting portion 40 becomes narrower, the moving portion 50 is allowed to rotate, and eventually the locking portion 53 is provided with respect to the supporting portion 40. Relative tilting is possible.

Thus, as the moving part 50 naturally permits the tilting of the semiconductor device 80, the semiconductor device 80 can be seated horizontally with the test socket 90 to enable reliable electrical connection.

Meanwhile, at this time, the elastic member 60 disposed between the moving part 50 and the support plate 20 elastically supports the moving part 50 to elastically move the moving part 50 with a predetermined force. Support. In particular, the elastic member 60 provides the elastic force of the semiconductor device 80 with respect to the socket together with the pneumatic pressure of the pressing member 70, in particular, the elastic member 60 is set to the uncompressed free-field state There is an advantage to enable the tilting by the pressing force.

The pusher device for semiconductor test according to the present invention can be modified as follows.

In the above-described embodiment, the guide member 30 has a lower end thereof in contact with the lead terminal 81 of the semiconductor device 80, and specifically, a lower end of the moving part 50 is connected to the semiconductor device 80. Although contact with the lead terminal has been described, it is not limited thereto. That is, as shown in FIG. 5, when the terminal of the semiconductor device to be inspected is in the form of a ball grid array (BGA), the lower end of the guide member, that is, the moving part 50, is the semiconductor device 80. It is also possible to contact only the body of the terminal 81 and not the terminal 81. At this time, the terminal 81 is in contact with the terminal of the test apparatus in a state arranged in the lower side. In addition, the shape of the lower end of the moving part may be modified according to the shape of the semiconductor device. That is, in FIG. 5, the step is formed at the lower end of the moving part according to the shape of the semiconductor device. However, the step may be removed or modified as necessary.

In the above-described embodiment, the surface facing the inner surface of the supporting part in the moving part of the moving part has been described that the separation distance increases from the lower end to the upper end of the moving part, but the present invention is not limited thereto, and the moving part may be easily tilted with respect to the supporting part. Any structure that can be done is possible. For example, the surface facing the inner surface of the supporting portion at the engaging portion of the moving portion may be kept constant from the inner surface of the supporting portion. In this case, it is preferable that the distance of the support part is calculated in consideration of the maximum tilting angle and accordingly the locking part of the moving part is not caught in the inner surface of the support part.

In addition, in the above-described embodiment, the compression coil spring has been described as an elastic member, but is not limited thereto, and various structures having elastic restoring force such as rubber materials or various synthetic resin materials, which are various elastic bias means, may be used.

In addition, in the above-described embodiment, it has been described that the elastic member is disposed between the supporting plate and the moving part, but the present invention is not limited thereto and may be disposed between the supporting part and the moving part. At this time, the support is preferably extended to the upper side of the moving portion, the predetermined receiving groove is formed in the support. In other words, the support plate is replaced with the support while the position of the elastic member.

Although the present invention has been described in detail by way of examples, the present invention is not necessarily limited to these embodiments and modifications, and may be variously modified and implemented within the scope of the technical spirit of the present invention.

1 is a schematic diagram of a pusher device for testing a semiconductor according to the prior art.

2 is an operation of FIG.

3 is a schematic diagram of a pusher device for semiconductor testing according to a preferred embodiment of the present invention;

4 is an operation of FIG.

5 is a schematic view of a pusher device for testing semiconductors in accordance with another embodiment of the present invention.

Claims (9)

A pusher device for semiconductor testing for mounting a semiconductor device in a test socket, A support plate, a center hole disposed on a lower surface of the support plate and extending in a vertical direction in a center thereof, is installed in the center of the guide plate, the lower end of which is inserted into the center hole of the guide member. Is installed on the lower surface of the pusher device for a semiconductor test including a pressing member having an air hole penetrating the upper and lower ends and elastically supporting the semiconductor device and the elastic device is in contact with the semiconductor device In The guide member, A support part disposed on a lower surface of the support plate and having an insertion hole at a center thereof, and a locking step protruding inwardly on an inner surface thereof; The moving part is disposed in the insertion hole of the support portion, and the center hole is installed at the center thereof, and includes a moving part in which the pressing member is inserted into the center hole. The moving part may protrude from an outer surface of the moving part so that the semiconductor device may be seated on the test socket at a corresponding inclination angle of the test socket according to the inclination angle of the test socket, and a lower part of the moving part may be seated on an upper surface of the locking jaw. A pusher device for semiconductor testing, characterized by being provided. The method of claim 1, The surface facing the inner surface of the support portion of the engaging portion of the moving part, the pusher device for a semiconductor test, characterized in that inclined so as to increase the separation distance from each other from the lower end to the upper end. The method of claim 1, And a surface facing the inner surface of the supporting portion at the engaging portion of the moving portion is spaced apart from the inner surface of the supporting portion. The method of claim 1, And an elastic member for elastically biasing the moving portion in a direction away from the supporting plate between the moving portion and the support plate. 5. The method of claim 4, And the elastic member is a compressed coil spring having an uncompressed state. 5. The method of claim 4, The elastic member is a pusher device for semiconductor testing, characterized in that the compression coil spring having a compressed state. A pusher device for semiconductor testing for mounting a semiconductor device in a test socket, A support plate, a center hole disposed on a lower surface of the support plate and extending in a vertical direction in a center thereof, is installed in the center of the guide plate, the lower end of which is inserted into the center hole of the guide member. Is installed on the lower surface of the pusher device for a semiconductor test including a pressing member having an air hole penetrating the upper and lower ends and elastically supporting the semiconductor device and the elastic device is in contact with the semiconductor device In And the guide member is provided with tilting means for allowing the semiconductor device to be seated in the test socket at an inclination angle corresponding to the inclination angle of the test socket. The method of claim 7, wherein The tilting means, A support part installed on a lower surface of the support plate and extending downward; And a moving part coupled to the support part in a tiltable manner, the lower surface of the moving part being in contact with a lead terminal of the semiconductor device. The method of claim 8, And an elastic member for elastically biasing the moving portion in a direction away from the supporting plate between the moving portion and the support plate.

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