1253705 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種測試分類機之變更套件（change kit)，特別係有關於一種球格陣列封裝測試分類機之通用 變更套件 【先别技術】 一測試分類 在習知積體電路封裝產品之測試裝置中1253705 IX. Description of the Invention: [Technical Field] The present invention relates to a change kit for a test sorter, and more particularly to a universal change kit for a grid array package test sorter. 】 A test classification in the test device of the conventional integrated circuit package product
機（test handler)其可在極短之時間内，快速地完成大量之 /貝J »式及刀類（將測s式通過與測試不通過之積體電路封裝產 '«为類）的工作，當該測試分類機遇上相同產品不同尺寸之 積體電路封裝產品欲進行測試及分類時，其即應更換適用 且相對應之適用變更套件（change kit)，以能定位檢測所待 測之積體電路封裝產品，俾使該積體電路封裝產品之訊號 月匕正確地電性傳送至測試分類機中進行檢測並分類。隨著 積體電路封裝產品之型態尺寸多樣化（如麟Gdd A叫 BGA、Chip Size Package，csp等），測試業者必須建購多 套適用之變更套件’始能適用因應其業務所需，如此將造 成物料管理困難與治具成本之增加。3，由於適用之變更 套件在測試分類機中需”更換交替使用，以適用於相同 f品不同尺寸之積體電路封裝產品之檢測，其所衍生之問 題P為測试分類機需經常性作機械調校及重新訂定或調 項率對於通常處於24小時持續運作之積體電路測試 工作而言，增加機械調校及重新訂定或調校頻率之工作顯 然形成有效工作時間之浪費，直接造成產能之下降，使得 6 1253705 測試之工作效率 降低， 亦導致測試業者作業成本之增加。The test handler can quickly complete a large number of jobs and tools in a very short period of time (the test will pass the test and the integrated circuit package does not pass the test) When the test classification opportunity is to test and classify the integrated circuit package products of different sizes of the same product, it shall replace the applicable and corresponding change kit to locate the product to be tested. The body circuit package product enables the signal of the integrated circuit package product to be correctly and electrically transmitted to the test classification machine for detection and classification. With the diversified size of integrated circuit package products (such as Lin Gdd A called BGA, Chip Size Package, csp, etc.), testers must build multiple sets of applicable change packages to suit their business needs. This will result in material management difficulties and increased cost of fixtures. 3. Since the applicable change kit needs to be replaced in the test sorter, it is suitable for the detection of integrated circuit package products of the same size and different sizes. The problem derived from the test P is that the test sorter needs to be used frequently. Mechanical adjustment and re-adjustment or adjustment rate For the integrated circuit test work that is usually operated continuously for 24 hours, the work of increasing the mechanical adjustment and re-setting or adjusting the frequency obviously creates a waste of effective working time, directly The decrease in production capacity has reduced the efficiency of the 6 1253705 test, which has also led to an increase in the operating costs of test operators.
一夂同进度表面接合使用之積體電路封裝產品，係 夕為球格陣列封裝件（㈣Grid Array package，BGAAn integrated circuit package product used in conjunction with the progress surface, the system is a grid array package ((4) Grid Array package, BGA
=广）’其係以銲球作為對外表面接合之電性連接。然 而，同—功能產品之球格陣列封裝件僅限定其銲球為固定 1歹。不同的封裝廠會採用不同基板（Substrate)尺寸與封 :製程使侍後續的測試及分類工作困難。請參閱第1圖， 同-功能產品之球格陣列封裝件可至少區分為不同尺寸 之第一球格陣列封I件11G與第二球格陣列封裝件12〇， 第一球格陣列封裝件11〇係包含一第一基板⑴，一晶片 該f基板⑴纟以適當封膠材料包覆之（圖未緣 )，在该第-基板m之下表面係設置有複數個格狀陣列 輝球112;同樣地，第二球格陣列封料12〇係包 含一第二基板121以及複數個在該第二基板ΐ2ι之第二銲 球122。依據全球半導體工業標準化組織卿EC(Joint= wide) 'The solder ball is used as the electrical connection for the external surface bonding. However, the ball grid array package of the same-functional product only limits the solder ball to a fixed one. Different packaging plants will use different substrate sizes and seals: the process will make the subsequent testing and classification work difficult. Referring to FIG. 1 , the ball grid array package of the same-function product can be at least divided into a first ball grid array component 11G and a second ball grid array package 12〇 of different sizes, the first ball grid array package. 11〇 comprises a first substrate (1), a f-substrate (1) is coated with a suitable encapsulant (not shown), and a plurality of lattice array flutters are disposed on the surface of the first substrate m 112. Similarly, the second ball grid array 12 includes a second substrate 121 and a plurality of second solder balls 122 on the second substrate. According to the global semiconductor industry standardization organization EC (Joint
Eiec— Device Engineering c〇uncU，聯合電子元件工程 委員會）所制定之標準規範（J刪c如她叫，該些第一鲜 球H2與該些第二料122之排列位置及間距係為固定T 亦即是相同功能產品之球格陣列封裝件其供表面接人 (SMT)之銲球位置與間距之設置應為相同，如此方能_ 且精確地表面接合上一標準印刷電路板所定義之電性連 接位置。然而，各家積體電路製造商之封裝製程與選用基 板材料不儘相同，相同功能產品之球格陣列封裝件會有^ 7 1253705 -基板m與第二基板121之尺寸差異變化以 丽π512Μι品為例，球格陣列封裝之寬邊有1〇、月『 11.3、12與12.3_等種類，球格陣列封裝之長邊有⑴、 1：3、13.8、14 與 14.5 mm 等種類。 ’ 故針對相同功能產品基板尺寸不同之第-球格陣列 =件110與第二球格陣列封裝件I-在測試時應選用並 更換適用之第-變更套件與第二變更套件。請參閱第2及 4圖，該種能在測試時定位第—球格陣列封裝件加 一變更套件，係包含有—承板2⑽以及至少_第—收容座 210(或稱inserts)，如第3圖所+ „ ,Λ1 第圖所不§亥承板20〇具有複數個開 孔201，該些開孔2〇1係供複 〜 w <第一收容座210 谷入置於該承板200’以供測試分類機可同時 板 細上之複數個第—收容座210所容置之積體電路封裝產 品進行電性測試工作；該第一收容座2ι〇係具有一第一基 板限位孔211，其開口尺寸恰等於該第—基板m之外徑， 其周邊係形成為-階梯部212，並在該第一收容座no之 兩側係各形成為一結八邻21 巧、〇 C-卩213，該些結合部213係具有結 4 214,以供螺检等固定元件固定於一承板綱。在進 仃測试及自動分類時’該第一球格陣列封裝件削係被擋 止於該階梯部212，且1A , 且其第-基板m之基板邊緣113(如 f1圖所不）係被框限於該第—基板限位孔m内達到水平 ° ί準疋位由於㈣二球格陣列封裝件⑽之第二基 之尺寸係不同於第—球格陣列封裝件削之第一基 板⑴之尺寸，因此，第一變更套件之第一收容座21〇之 8 1253705 第一基板限㈣m係無法^位該第二球格陣列封展件 120’為了定位測試第二球格陣列封裝件12〇，必需要更換 成另-適用之第二變更套件。請參閱第，第二變更套 ?系包含至少一第二收容座220’其係具有一周邊形成有 化梯部222之第二基板限位孔221，其開π尺寸係恰等於 该第二基板121，以框限該第二球格陣列封裝# 12〇之第 二基板⑵之基板邊緣123(如第i圖所示），並使該第二 球格陣列封裝件12G係被播止於該第二收Eiec—Device Engineering c〇uncU, in conjunction with the standard specification developed by the Electronic Components Engineering Committee (J delete, as she calls, the arrangement position and spacing of the first fresh balls H2 and the second materials 122 are fixed T That is, the ball grid array package of the same functional product should have the same position and spacing of the solder balls for surface access (SMT), so that the surface can be accurately bonded to the surface defined by a standard printed circuit board. Electrical connection position. However, the package process of each integrated circuit manufacturer is different from the selected substrate material, and the ball grid array package of the same functional product may have a difference in size between the substrate m and the second substrate 121. For example, the width of the grid array package is 1〇, month “11.3, 12 and 12.3_, and the long side of the grid array package has (1), 1:3, 13.8, 14 and 14.5 mm. And so on. Therefore, for the same function product substrate size different - the ball grid array piece 110 and the second ball grid array package I - should be selected and replaced in the test of the first - change kit and the second change kit. Please refer to section 2 In the figure, the type of the ball grid array package plus a change kit can be positioned during testing, and includes a carrier plate 2 (10) and at least a _ first-seat holder 210 (or inserts), as shown in FIG. 3 „ , Λ1 The first figure does not include the plurality of openings 201, and the openings 2〇1 are provided for the rest of the body. The first receiving seat 210 is placed in the receiving plate 200' for testing. The sorting machine can perform electrical testing work on the integrated circuit package products of the plurality of first receiving receptacles 210 at the same time; the first receiving base 2 〇 has a first substrate limiting hole 211, and the opening thereof The dimension is exactly equal to the outer diameter of the first substrate m, and the periphery thereof is formed as a step portion 212, and is formed on each side of the first receiving seat no as a knot, a choker, and a C-卩213. The joint portion 213 has a knot 4 214 for fixing a fixing member such as a screw to a support plate. When the test and automatic sorting are performed, the first ball grid array package is blocked. The step portion 212, and 1A, and the substrate edge 113 of the first substrate m (as shown in the figure f1) are limited to the first substrate limiting hole m The horizontal 疋 position is because the size of the second base of the (four) two-ball array package (10) is different from the size of the first substrate (1) of the first-frame array package, so the first accommodation of the first change kit Block 21〇8 1253705 First substrate limit (4) m system cannot be used. The second ball grid array seal member 120' must be replaced with another second applicable for the positioning of the second ball grid array package 12〇. The second change socket includes at least one second receiving seat 220' having a second substrate limiting hole 221 formed with a stepped portion 222 at the periphery, and the opening π dimension is exactly equal to the first The second substrate 121 is configured to frame the substrate edge 123 of the second substrate (2) of the second ball grid array package (as shown in FIG. 19), and the second ball grid array package 12G is broadcasted. In the second harvest
部如’通常該第二收容座220係可具有往該第二基^ 位孔如縮小之導滑面223。因&，即使在相同電性功能 之積體電路產品測試中，隨著基板尺寸之變化測試業者 需要經常性變更及轉換適用之變更套件。 刪公司（INTERNATL BUSINESS machine c〇Rp) 於日本國公開特許公報之特開細1 832()7號專利案中揭 露一種可供冑試不❹板尺寸積冑電路封裝i品之變更 套件（change kit)，其係利用複數個可調整固定位置之概呈 ^形限位件來框限待受測積體電路封裝產品之基板邊緣， 可以達成不用隨著待受測積體電路封裝產品之基板尺寸 不同而更換冑更套件，但由於料L形限位#必須具有調 整其框限位置之功能始能定位框限該不同尺寸之待受測 積體電路封裝產品，因此在進行測試前仍需對該待受測積 體電路封裝產品進行比對及作框限位置之調整與校正動 作，此外，對於待受測積體電路封裝產品之框限定位準確 性亦較差。 1253705 【發明内容】 本發明之主要目的係在於提供一種球格陣列封襄測 °式刀類機之通用變更套件（common change kit)，利用其收 4座之開口尺寸修正，使該收容座係具有一銲球限位孔與 一接觸面，該銲球限位孔之尺寸係小於多種不同尺寸之球 格陣列封裝件之基板尺寸且不小於該些球格陣列封裝件 其銲球之最外圈邊界，利用該銲球限位孔框圍限位銲球之 方式取代習知以階梯開口對基板邊緣需相同尺寸之限 位，因此，在針對不同尺寸之球格陣列封裝件進行電性測 試時，不需要更換變更套件。 依本發明之球袼陣列封裝測試分類機之通用 件，用For example, the second receiving seat 220 may have a tapered sliding surface 223 toward the second base hole. Because &, even in the test of integrated circuit products with the same electrical function, the tester needs to change and change the applicable change kit frequently as the substrate size changes. INTERNATL BUSINESS machine c〇Rp discloses a change kit for the test of the size of the circuit package in the special case of the Japanese Patent Publication No. 1 832 () No. 7 (change) Kit), which utilizes a plurality of adjustable fixed-position outline-shaped limit members to frame the edge of the substrate of the integrated circuit package product to be tested, and can achieve a substrate that does not need to be packaged with the integrated circuit to be tested. The kit is replaced by a different size, but since the material L-shaped limit # must have the function of adjusting its frame position, it can be positioned to limit the different size of the packaged product to be tested, so it is still necessary before testing. The alignment and correction operations of the integrated circuit package products to be tested are performed, and in addition, the frame limit of the products to be tested is less accurate. 1253705 SUMMARY OF THE INVENTION The main object of the present invention is to provide a common change kit for a ball grid array sealing type knife type machine, which uses the opening size correction of the four seats to make the receiving seat system Having a solder ball limiting hole and a contact surface, the size of the solder ball limiting hole is smaller than the substrate size of the plurality of different size ball grid array packages and not less than the outermost solder balls of the ball grid array packages Circle boundary, the solder ball limiting hole frame is used to replace the limit solder ball to replace the conventional step with the same size limit for the edge of the substrate. Therefore, the electrical test is performed on the ball grid array package of different sizes. There is no need to change the change kit. According to the invention, the universal part of the ball python array package test classification machine is used
接觸於該接觸面。 【實施方式】 件之基板下表面之周邊均可個別 以分別定位複數個相同功能產品但 依據本發明之第一具體 試分類機之通用變更套件， 具體實施例，一種球袼陣列封裝測 件，用以分別定位複數個不同基板 1253705 尺寸之第一球格陣列封裝件11〇與第二球格陣列封裝件 120於一測試分類機（圖未繪出）中進行電性測試。 該通用變更套件係包含一承板以及至少一如第6圖所 示之收容座310。其中該承板係為如第3圖所示之習知承 板200或其它承板。該收容座3〗〇係可結合至該承板2〇〇 之開口 201 ’其二者結合關係可藉由習知技術據以實 施，例如 AMD 公司（ADVANCED MICRO DEVICES，INC.) 之世界專利WO 02/11186號則已揭露一種習知收容座 鲁 （inserts)與承板（Substrate)之組合機構，在此不另予贅述。 或者，複數個收容座310可一體連接於一變更套件。請參 閱第6圖，該收容座31〇係另具有位於大略中央處之一凹 陷空間，用以容納一欲進行測試之球格陣列封裝件U 〇或 120。該收容座310兩側之結合部313係具有一結合孔 314，用以結合至一承板之開口内集收，俾供放置於測試 分類機中進行測試。該收容座31〇係具有一接觸面3ιι以 φ 及一銲球限位孔312，該接觸面311係位於上述凹陷空間 内，該銲球限位孔312之尺寸係同時小於該第一球格陣列 封裝件110之第一基板ln尺寸以及該第二球袼陣列封裝 件120之第二基板}21尺寸，但不小於該第一球格陣列封 裝件110之第一銲球112與該第二球格陣列封裝件12〇之 第二銲球122之最外圈邊界（如第6圖所示），亦即是，該 第一球格陣列封裝件Π0之第一銲球112與該第二球格陣 列封裝件120之第二銲球122之最外圈邊界係剛好被該銲 球限位孔312所框圍（如第6圖所示）。在本實施例中，該 11 Γ253705 銲球限位孔312係概呈矩形並呈有吉 ，、有夏線形邊緣。此外，該 收谷座310之材質應為南分子介電# 丨电材枓之塑膠，以避免在 框限球格陣列封裝件之銲球時產生短路。其中較佳地，該 u子介電材料係具有低膨腸係數與耐熱性，以適用於不 同高低溫度之電性測試。 請參閱第7圖，當測試第一球格陣列封裝件110時， 第一球格陣列封裝件1 1 〇之該歧第 〆一弟 ~球112係被框圍限 位於該銲球限位孔312内， 4第一球袼陣列封裝件110 之基板下表面周邊可接觸於該收容座31〇之接觸面川， 達到一平面定位效果。在習知| &知列5式分類機内之測試板130 係具有複數個彈簧針131(P0G0 pin)，該些彈筹針⑶係 能t確地對準並探觸該第-球格陣列封裝件m之該些第 ~球112。此外，並可去丨丨田 jL· u ，、了利用一在該通用變更套件上方之 壓板140抵壓該第一球袼陣 ^合丨早列封裝件11〇確實定位於收容 座310内而不翻動，以增進探觸機率。 請參閲第8圖，當測古古笛_ μ 土 、八第一球袼陣列封裝件120時， 在不需要更換該通用變更套件 一 艾又苌1千之條件下，該相同產品而不 Π基板尺寸之第二球格陳列 早幻封袁件120之該些第二銲球 122亦可被限位於該銲球 Κ Κ位孔312内，且該第二球格陣 列封裝件120之基板下表面周邊可接觸於該收容座別之 接觸面3U，達到精確框圍定位之效果。相同之壓板14〇 亦能抵壓該第二球格陣列封裝件12〇定位於收容座31〇 、、’使同Κ板13〇之彈簧針131可精確地對準並探 觸該第二球格陣列封裝件m之該些第二銲球122。因此， 12 ^53705 在同—功能相同產品不同尺寸之 測試過程，哕M Φ /4陣列封裝件之電性 球格陣列❹Γ 可連續定位不同基板尺寸之 陣列封装件110、120。不需要更換 4之方便性，並能簡化目前適用變更套件件，具有測 依據本發明之[二 套件之種類與管理。 測試分類機之、_另一種球格陣列封裝 體電路產” 件係亦能分別定位相同功能積 第電=口口但不同基板尺寸之第一球格陣列封裝件110與 ^列封裝件12〇。請參閲第9圖，該通用變更套 :3 一收容座41°’該收容座“Ο係具有一接觸面411 二二銲球限位孔412，該_限位孔412之尺寸係小於 ^球格陣列封裝件110、12〇之基板尺寸且不小於該此 ，球112、122之最外圈邊界，以使得該些鲜球⑴、⑵ I被圈圍限位於該銲球限位孔412内。在本實施例中，該 鲜球限位孔412之邊緣係形成有複數個缺口 413，其可為 凹弧狀或锯齒狀，用以對應框圍並接觸最外圈之鲜球 112、122。此外，該些球格陣列封裝件ιι〇、12〇之基板 下表面之周邊均可個別平面接觸於該接觸面411。 、本發明之保護範圍當視後附之申請專利範圍所界定 者為準’任肖熟知此項技藝I，在不脫離本發明之精神和 範圍内所作之任何變化與修改，均屬於本發明之保護範 圍。 【圖式簡單說明】 第1圖·習知多種球格陣列封裝件之基板下表面示意圖。 第2 @ ·習知球格陣列封裝測試分類機之變更套件之收容 13 1253705 座之上視圖。 第3圖·習知測試分類機之變更套件 又嘗忏之承板之立體示意 圖0 第4圖.一第一球格陣列^ ^ ^ ^ ^ 才裝件在知變更套件内定位 之截面不意圖。 第5圖：一第三球格陣列 ^ ~知變更套件内定 位之截面示意圖。 干鬥疋 第6圖··依據本發明之第一具 、〜 種球袼陣列封 裝測試分類機之通用變更套件之收容座 圖。 兄 第7圖:㈣一球格陣列封裝件在本發明之通用變 内定位之截面示意圖。 第8圖：㈣二球格陣列封裝件在本發明之通用變更 内疋位之截面示意圖。 =據本發明之第二具體實施例，另—種球格陣列 子裝測試分類機之通用變更套件之收 視圖。 戌又上 【主要元件符號說明】 110第一球袼陣列封裝件 111 第^一 基板 112 笛一τ-f； 112第一鋅球 113基板邊緣 12 0第二球袼陣列封裝件 123基板邊緣 140壓板 121第二基板 122第二銲球 13 0測试板 131彈簧針 200承板 201開孔 14 Γ253705 210 第一收容座 211 212 階梯部 213 220 第二收容座 221 222 階梯部 223 310 收容座 311 312 銲球限位孔 313 410 收容座 411 412 銲球限位孔 413 第一基板限位孔 結合部 214結合孔 第二基板限位孔 導滑面 接觸面 結合部 314結合孔 接觸面 缺口Contact with the contact surface. [Embodiment] The periphery of the lower surface of the substrate can be individually positioned to respectively locate a plurality of identical functional products, but the universal modification kit of the first specific test classification machine according to the present invention, a specific embodiment, a ball python array package test piece, The first ball grid array package 11A and the second ball grid array package 120 for respectively locating a plurality of different substrates 1253705 are electrically tested in a test classifier (not shown). The universal change kit includes a carrier and at least one receptacle 310 as shown in FIG. The deck is a conventional deck 200 or other deck as shown in Figure 3. The accommodating seat 3 can be coupled to the opening 201 ′ of the carrier 2 ′, and the combination of the two can be implemented by a conventional technique, such as the world patent WO of ADVANCED MICRO DEVICES, INC. No. 02/11186 has disclosed a combination mechanism of a conventional shelter and a substrate, which will not be further described herein. Alternatively, the plurality of receptacles 310 can be integrally connected to a change kit. Referring to Fig. 6, the housing 31 has a recessed space at a substantially central portion for receiving a ball grid array package U 〇 or 120 to be tested. The joint portion 313 of the two sides of the receiving base 310 has a coupling hole 314 for being integrated into the opening of a receiving plate for being placed in the test sorting machine for testing. The receiving seat 31 has a contact surface 3 ι φ and a solder ball limiting hole 312. The contact surface 311 is located in the recessed space, and the solder ball limiting hole 312 is smaller than the first ball. The first substrate ln size of the array package 110 and the second substrate 21 of the second ball grid array package 120 are not smaller than the first solder ball 112 and the second of the first ball grid array package 110 The outermost boundary of the second solder ball 122 of the ball grid array package 12 (as shown in FIG. 6), that is, the first solder ball 112 of the first ball grid array package Π0 and the second The outermost boundary of the second solder ball 122 of the ball grid array package 120 is just surrounded by the solder ball limiting hole 312 (as shown in Fig. 6). In this embodiment, the 11 Γ 253705 solder ball limiting hole 312 is generally rectangular and has a ji, with a summer line edge. In addition, the material of the receiving block 310 should be a plastic of the south molecular dielectric #,, to avoid short circuit when the solder balls of the ball grid array package are framed. Preferably, the u-substrate material has a low expansion coefficient and heat resistance for electrical testing at different high and low temperatures. Referring to FIG. 7, when testing the first ball grid array package 110, the first ball grid array package 1 1 〇 〆 〆 弟 ~ 球 ball 112 is bounded by the solder ball limiting hole In the 312, the periphery of the lower surface of the substrate of the first ball grid array package 110 can contact the contact surface of the receiving seat 31 to achieve a planar positioning effect. The test board 130 in the conventional | & 5 type classification machine has a plurality of pogo pins 131 (P0G0 pin), which can accurately align and probe the first grid array The first ball 112 of the package m. In addition, the utility model can also go to the j田 jL·u, and use the pressure plate 140 above the universal change kit to press the first ball 袼 array and the early column package 11 〇 to be positioned in the accommodating seat 310. Do not flip to increase the probability of exploration. Please refer to Fig. 8. When the Gu Gudi _ μ soil and the eight first ball 袼 array package 120 are measured, the same product is not required without replacing the universal change kit. The second solder balls 122 of the second ball grid display element 120 of the Π substrate size may also be limited to the solder ball Κ 孔 hole 312, and the substrate of the second ball grid array package 120 The periphery of the lower surface can be in contact with the contact surface 3U of the receiving seat to achieve accurate frame positioning. The same platen 14 can also be pressed against the second ball grid array package 12 and positioned on the receiving seat 31〇, so that the spring pin 131 of the same plate 13 can be accurately aligned and the second ball can be probed. The second solder balls 122 of the array package m. Therefore, 12 ^ 53705 can be used to continuously position array packages 110 and 120 of different substrate sizes in a test process of the same size and function of the same product, the electrical grid array of the 哕M Φ /4 array package. There is no need to replace the convenience of 4, and the current applicable change kit can be simplified, and the type and management of the second kit according to the present invention can be measured. The tester classifier _ another ball grid array package circuit is also capable of respectively locating the first ball grid array package 110 and the column package 12 of the same function product with different capacitances. Please refer to FIG. 9 , the universal change sleeve: 3 a receiving seat 41 ° 'the receiving seat Ο has a contact surface 411 22 solder ball limiting hole 412, the size of the _ limiting hole 412 is smaller than The substrate size of the ball grid array packages 110, 12 is not less than the outermost boundary of the balls 112, 122, so that the fresh balls (1), (2) I are enclosed by the solder ball limiting holes. Within 412. In this embodiment, the edge of the fresh ball limiting hole 412 is formed with a plurality of notches 413, which may be concave or zigzag, for correspondingly surrounding the frame and contacting the outermost balls 112, 122. . In addition, the periphery of the lower surface of the substrate of the ball grid array package 〇1, 12〇 can be individually planarly contacted with the contact surface 411. The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made without departing from the spirit and scope of the invention belong to the present invention. protected range. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a lower surface of a substrate of a plurality of ball grid array packages. The second @@知知球格Array package test classification machine change kit containment 13 1253705 seat top view. Figure 3 · The change kit of the conventional test classification machine and the stereoscopic diagram of the board. Fig. 4. A first grid array ^ ^ ^ ^ ^ The orientation of the assembly in the knowledge change kit is not intended. . Figure 5: A third grid array ^ ~ Schematic diagram of the positioning in the change kit.疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 。 。 。 。 Brother Figure 7: (iv) A schematic cross-sectional view of a ball grid array package positioned within the general variation of the present invention. Fig. 8 is a cross-sectional view showing the position of the (four) two-ball grid array package in the general modification of the present invention. According to a second embodiment of the present invention, a further view of the universal change kit of the ball grid array sub-testing sorter is provided.戌上上 [Main component symbol description] 110 first ball 袼 array package 111 first substrate 112 flute τ-f; 112 first zinc ball 113 substrate edge 12 0 second ball 袼 array package 123 substrate edge 140 Pressure plate 121 second substrate 122 second solder ball 130 test board 131 spring pin 200 carrier 201 opening 14 Γ 253705 210 first receiving seat 211 212 step portion 213 220 second receiving seat 221 222 step portion 223 310 receiving seat 311 312 solder ball limiting hole 313 410 receiving seat 411 412 solder ball limiting hole 413 first substrate limiting hole joint portion 214 bonding hole second substrate limiting hole sliding surface contact surface joint portion 314 combined with hole contact surface gap
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