TWM546007U - Electrometric apparatus and probe circuit structure - Google Patents

Abstract

An electrometic apparatus is used to detect a die. The electrometic apparatus includes a supporting block, a probe holding assembly, and a resilient sealing structure. The supporting block has a supporting surface and a through hole communicated with the supporting surface. The supporting surface is configured to support a die. The probe holding assembly is configured to move toward or away from the supporting block. The probe holding assembly includes a plurality of probes. The resilient sealing structure is disposed between the supporting block and the probe holding assembly and configured to separate the supporting block and the probe holding assembly. When the probe holding assembly and the supporting block compress the resilient sealing structure to abut against each other, the probes move along with the probe holding assembly to contact the die via the through hole.

Description

Electric measuring device and needle seat circuit structure

The present invention relates to an electrical measuring device and a hub circuit structure, and more particularly to an electrical measuring device and a needle block circuit structure for detecting a die.

Currently, a conventional detection architecture for detecting a conventional Light-emitting Diode (ie, front side illumination, back side transmission current) includes a carrier block and a probe. The carrier block has a pinhole and a vacuum hole. The back side of the LED die is placed on the carrier block, and the probe passes through the pinhole of the carrier block to touch the back electrode of the LED die. The vacuum hole of the carrier block is connected to the vacuum source to attract the LED die to prevent the probe from touching the back electrode of the LED die, and the LED die is lifted off the carrier block due to excessive contact force.

For the conventional back-point LED chip, the size of the LED chip is getting smaller and smaller due to the continuous progress of the LED process. However, if the small LED chip is continuously detected by the aforementioned conventional detection architecture, the area of the vacuum hole and the pinhole of the carrier block must also be designed to be smaller and smaller, and the vacuum hole requires a certain area size to stably hold the LED. The back side of the grain is adsorbed on the carrier block. Therefore, for small LED chips, the conventional detection architecture has Not enough to use.

Therefore, how to propose an electric measuring device that can solve the above problems is one of the problems that the industry is eager to invest in research and development resources.

In view of this, one of the purposes of the present invention is to propose an electrical measuring device that can effectively solve the above problems.

In order to achieve the above object, in accordance with an embodiment of the present invention, an electrical measuring device includes a carrier block, a hub assembly, and an elastic sealing structure. The carrier block has a bearing surface and the perforations communicate with the bearing surface. The bearing surface is configured to carry the die. The hub assembly is configured to move toward or away from the carrier block. The hub assembly includes a plurality of spot probes. An elastomeric sealing structure is disposed between the carrier block and the hub assembly and configured to separate the carrier block from the hub assembly. When the hub assembly abuts the carrier block compression resilient sealing structure, the spot probe contacts the die via the perforations as the hub assembly moves.

In order to achieve the above object, in accordance with another embodiment of the present invention, a hub circuit structure is used for an electrical measuring device. The electrical measuring device is for airtightly detecting the crystal grains, and provides a plurality of power supply probes separately disposed outside the needle seat circuit structure. When the electrical test device tests the die, a plurality of power supply probes are electrically connected to the power supply to provide power to the die via the header circuit structure. The hub circuit structure is hermetically connected to the electrical measuring device. The header circuit structure includes a hub module, a plurality of spot probes, and a circuit board. The needle hub module has an upper guide plate and a lower guide plate. The upper guide plate has at least one upper perforation. The lower guide has at least a lower perforation. A plurality of spot probes are inserted through the hub module. The circuit board has a plurality of first contacts and a plurality of second connections point. The first contact and the second contact are located on the same surface of the circuit board. Each of the first contacts is correspondingly and electrically connected to one of the second contacts. The hub module is fixed to the circuit board. The spot probe penetrates the upper and lower perforations to contact one of the first contacts. The spot probe is fixed in the hub module and the circuit board. The second contact is exposed outside the hub module for contacting a plurality of power supply probes.

According to the above configuration, the electrical measuring device of the present invention utilizes a perforation of the carrier block as a spot die (ie, provides an electrical signal for photoelectric testing of the die) and adsorbs the die (avoiding contact with the spot probe when contacting the die) The passage of the die from the bearing block due to excessive force. That is to say, the electric measuring device of the present invention does not need to provide a plurality of perforations for the individual spotting probes, so even if the size of the crystal grains is reduced, the carrying block still has sufficient vacuum adsorption area for adsorbing the crystal grains, and can be reduced. The cost of making micropores. In addition, the electrical measuring device of the present invention can utilize a resilient sealing structure to form a sealed passage between the carrier block and the hub assembly to hermetically communicate the perforations, thereby avoiding incomplete gas between the carrier block and the hub assembly. Secret question. Moreover, the shrinkage of the elastic sealing structure can also be used to control the function of the spotting probe to touch the force applied by the die to the die. In addition, after the test die is completed, the electrical measuring device of the present invention can also return the carrier block and the hub assembly to a separated state by using an elastic sealing structure to avoid the friction between the needle block assembly and the carrier block (due to two The gap between the two is too small to cause separation problems.

100‧‧‧Electrical measuring device

111‧‧‧Rotary Module

111a‧‧‧Rotary axis

112‧‧‧cantilever

113‧‧‧ Lifting rails

121‧‧‧Fixed stop

121a, 143c‧‧

122‧‧‧External push block lifting module

123‧‧‧Powered probe

130‧‧‧bearing block

131‧‧‧ bearing surface

132, 135‧‧‧ perforation

133‧‧‧Vacuum suction port

134, 142a12‧‧‧ lower surface

136‧‧‧Depression

140‧‧‧ needle seat assembly

141‧‧ ‧ spot probe

142‧‧‧ needle seat module

142a‧‧‧Upper guide

142a1‧‧‧Responsible Department

142a11‧‧‧ upper surface

142a2‧‧‧protrusion

142a21‧‧‧perforation

142b‧‧‧First lower guide

142b1‧‧‧First perforation

142c‧‧‧Second lower guide

142c1‧‧‧Second perforation

143‧‧‧Carrier

143a‧‧‧ring groove

143b‧‧‧ screw hole

144‧‧‧Locker

150‧‧‧Elastic sealing structure

160‧‧‧ boards

161‧‧‧ first joint

162‧‧‧second junction

163‧‧‧Surface circuit layer

164‧‧‧Structural enhancement layer

181‧‧‧ distance adjustment

182‧‧‧First guide

183‧‧‧Second guide

200‧‧‧ grain

A‧‧‧ accommodating space

G1, G2‧‧‧ gap

S1‧‧‧ recessed space

S2‧‧‧ recessed space

T1‧‧‧ sealed passage

T2‧‧‧ vacuum channel

S101~S105‧‧‧Steps

To make the above and other objects, features, advantages and embodiments of the present invention more apparent, the description of the drawings is as follows:

FIG. 1 is a partial perspective view showing an electrical measuring device according to an embodiment of the present invention.

FIG. 2 is another partial perspective view of the electrical measuring device of FIG. 1 in which the fixed stop is removed.

3 is a partial cross-sectional view of the electrical measuring device of FIG. 1 along line 3-3, wherein the external push block lifting module has not yet pushed the hub assembly.

Figure 4 is an exploded view showing the carrier block, the hub assembly, the elastic sealing structure and the circuit board.

Fig. 5 is a partially enlarged view showing Fig. 3.

Fig. 6 is a cross-sectional view showing the spotting probe and the hub module of Fig. 4 in an embodiment.

Figure 7 is a cross-sectional view showing the spotting probe and the hub module of Figure 4 in another embodiment.

Figure 8 is a perspective view showing the carrier block of Figure 4 in another perspective.

Figure 9 is a side view showing the circuit board in Figure 4.

Figure 10 is another cross-sectional view of the components of Figure 3, wherein the outer push block lift module pushes the hub assembly such that the carrier block abuts the fixed stop.

11 is a cross-sectional view showing the components of FIG. 3, wherein the outer push block lifting module continues to push the hub assembly toward the carrier block, thereby causing the hub assembly to abut the carrier block.

Fig. 12 is a partially enlarged view showing Fig. 11.

Figure 13 is a partial side elevational view showing the electrical measuring device of Figure 1.

Figure 14 is a partial cross-sectional view showing the structure of Figure 3 in another embodiment.

FIG. 15 is a flow chart showing an electrical measurement method according to an embodiment of the present invention.

In the following, a plurality of embodiments of the present invention will be disclosed in the drawings. For the sake of clarity, a number of practical details will be described in the following description. However, it should be understood that these practical details are not applied to limit the creation. That is to say, in the implementation part of this creation, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

Please refer to Figure 1 and Figure 2. FIG. 1 is a partial perspective view showing an electrical measuring device 100 according to an embodiment of the present invention. FIG. 2 is another partial perspective view of the electrical measuring device 100 of FIG. 1 in which the fixed stop 121 is removed. As shown in FIGS. 1 and 2, in the present embodiment, the electrical measuring device 100 includes a rotating module 111 and a plurality of cantilevers 112. The rotation module 111 has a rotation axis 111a. One end of each cantilever 112 is connected to the rotation module 111, and can be rotated by the rotation module 111 to rotate about the rotation axis 111a. The electrical measuring device 100 also includes a lifting rail 113. The lifting rail 113 is disposed at the other end of the cantilever 112 (ie, the end of the cantilever 112 away from the rotating shaft center 111a). The electrical testing device 100 also includes a carrier block 130, a hub assembly 140, and a circuit board 160. The hub assembly 140 is configured to move toward or away from the carrier block 130. The circuit board 160 is disposed below the hub assembly 140 for securing the hub assembly 140 to the circuit board 160, the circuit board 160 and the carrier block 130 being located on opposite sides of the hub assembly 140, respectively. The die 200 carries the die 200 thereon. The electrical measuring device 100 also includes a fixed stop 121. The fixed block 121 is located on a side of the bearing block 130 facing away from the hub module 142, and is configured to be supported by the carrier block 130. by. The hub assembly 140 is slidably coupled to the lift rail 113 such that the hub assembly 140 can be guided by the lift rail 113 to move toward or away from the fixed stop 121. Specifically, the hub assembly 140 can be pushed by the external push block lifting module 122 to drive the carrier block 130 to move toward the fixed stop 121.

In some embodiments, the electrical measuring device 100 can include eight cantilevers 112, but the present invention is not limited thereto, and can be elastically increased or decreased according to actual needs.

With the foregoing configuration, the rotating module 111 can drive all the cantilevers 112 to rotate together, so that the die 200 on the carrier block 130 at the end of each cantilever 112 can be sequentially located directly below the fixed block 121 for subsequent Test procedure. It should be noted that, when detecting the die 200 on any of the carrier blocks 130, the electrical measuring device 100 of the present invention will follow the steps of FIG. 3, FIG. 10, and FIG. 11 and back to FIG. One cycle is performed. The operation of the components included in the electrical measuring device 100 in these processes and the functions provided will be described in detail below.

Please refer to Figure 3, Figure 4 and Figure 5. 3 is a partial cross-sectional view of the electrical measuring device 100 of FIG. 1 along line 3-3, wherein the outer push block lifting module 122 has not yet pushed the hub assembly 140. FIG. 4 is an exploded view showing the carrier block 130, the hub assembly 140, the elastic sealing structure 150 and the circuit board 160. Fig. 5 is a partially enlarged view showing Fig. 3. As shown in FIGS. 3 to 5, in the present embodiment, the carrier block 130 has a bearing surface 131, a lower surface 134, and a through hole 132. The perforations 132 communicate with the bearing surface 131 and the lower surface 134. The bearing surface 131 is configured to carry the die 200. The hub assembly 140 includes a plurality of spot probes 141. One end of the spot probe 141 continues to abut the circuit board 160 to the circuit The board 160 is electrically connected. The electrical testing device 100 also includes an elastomeric sealing structure 150. The elastic sealing structure 150 is disposed between the carrier block 130 and the hub assembly 140. The spotting probe 141 can be passed through the through hole 132 to penetrate the lower surface 134 of the carrier block 130 and the bearing surface 131.

From another point of view, in the present embodiment, the hub module 142, the plurality of spot probes 141, and the circuit board 160 can form at least a portion of a header circuit structure, and the electrical testing device 100 provides a plurality of power supplies. The probe 123 (please refer to FIG. 13 first, which is only a representative) is electrically connected to a power source (not shown) and is disposed separately from the hub circuit structure. When the electrical measurement device 100 tests the die 200, a plurality of power supply probes 123 provide power to the die 200 via the header circuit structure. The hub circuit structure is hermetically connected to the electrical measuring device 100. It should be noted that the needle circuit structure of the present invention corresponds to the number of cantilevers 112 on the electrical measuring device 100. As shown in Fig. 1 and Fig. 2, the structure of the hub circuit can be eight groups, but the creation is not limited thereto.

Specifically, please refer to FIG. 6 , which is a cross-sectional view showing the spotting probe 141 and the hub module 142 in FIG. 4 in one embodiment. As shown in FIGS. 3, 4, and 6, in the present embodiment, the hub assembly 140 further includes a hub module 142. A plurality of spotting probes 141 are bored in the hub module 142. The needle hub module 142 has an upper guide plate 142a and a lower guide plate. The lower guide plate may be a one-piece or a multi-piece. In this embodiment, the lower guide plate may be composed of a first lower guide plate 142b and a second lower guide. The plate 142c is composed of. The second lower guide plate 142c is located between the upper guide plate 142a and the first lower guide plate 142b. The upper guide plate 142a has a plurality of upper perforations 142a21, and the lower guide plate has a plurality of lower perforations. In this embodiment, each of the lower perforations is a first lower perforation 142b1 and a second lower guide plate 142c of the first lower guide plate 142b. Second The perforating holes 142c1 are respectively disposed through the corresponding one of the upper perforations 142a21 and one of the lower perforations (one of the first lower perforations 142b1 and the second lower perforations 142c1 in this embodiment). The circuit board 160 has a plurality of first contacts 161 and a plurality of second contacts 162. These first contacts 161 and these second contacts 162 are located on the same surface of the circuit board 160. Each of the first contacts 161 is correspondingly and electrically connected to one of the second contacts 162. When the hub module 142 is fixed to the circuit board 160, the spot probes 141 respectively contact one of the first contacts 161 to fix the spot probes 141 in the hub module 142 and the circuit board 160. The second contacts 162 are exposed outside the hub module 142 for contacting a plurality of power supply probes 123.

In some embodiments, as shown in FIG. 4, the distance between the two first contacts 161 or the distance between the two second contacts 162 is smaller than one of the first contacts 161 and one of the second contacts 162. The distance between them.

In some embodiments, in order to absorb the tolerances of the respective circuit boards 160, as shown in FIG. 4, the area of the second contacts 162 is made larger than the first contacts 161 to ensure that the power supply probe 123 can It does contact the second contact 162. As shown in FIG. 4, in terms of spacing, the spacing between the two first contacts 161 is less than the spacing between the two second contacts 162.

More specifically, as shown in FIGS. 4 and 6, the upper guide plate 142a of the hub module 142 has a bearing portion 142a1 and a projection portion 142a2. The bearing portion 142a1 has an upper surface 142a11 and a lower surface 142a12. The upper surface 142a11 of the bearing portion 142a1 is convex to form a projection 142a2. In other words, the upper surface 142a11 of the bearing portion 142a1 has a height [0] difference from the upper end surface of the projection portion 142a2. After the upper guide plate 142a, the first lower guide plate 142b, and the second lower guide plate 142c are assembled, The lower surface of the upper guide plate 142a and the upper surface of the lower guide plate (further, the upper surface of the second lower guide plate 142c) have an accommodation space A for the spotting probe 141 to pass through the upper through hole 142a21 and The lower perforation is set in the accommodation space A. Specifically, the accommodating space A is recessed by the lower surface 142a12 of the bearing portion 142a1, and the position of the accommodating space A corresponds to the position of the protruding portion 142a2 (that is, the lower surface of the protruding portion 142a2). Part will correspond to the accommodation space A). Further, the lower surface of the protruding portion 142a2 and the bearing portion 142a1 have a height difference from the upper surface 142a11 such that a portion of the accommodating space A is formed below the lower surface of the protruding portion 142a2. The projection 142a2 has at least one upper perforation 142a21. The area of the projection 142a2 is smaller than the bearing portion 142a1. The protrusion 142a2 of the present invention is designed to reduce the gap between the upper guide plate 142a of the hub module 142 and the carrier block 130, and increase the structural strength of the upper guide plate 142a to conform to the depth of the spot probe 141. Wide ratio demand.

Please refer to FIG. 7 , which is a cross-sectional view showing the spot probe 141 and the hub module 142 in FIG. 4 in another embodiment. It should be noted that, in comparison with the hub module 142 shown in FIG. 6, the present embodiment mainly modifies the structure of the first lower guide plate 142b and the second lower guide plate 142c of the hub module 142. Specifically, the second lower guide plate 142c shown in FIG. 6 has a portion that is convex toward the upper guide plate 142a, and the first lower guide plate 142b has a flat shape to provide sufficient support for the spotting probe 141. In contrast, the second lower guide plate 142c shown in FIG. 7 has a substantially flat shape and does not have a convex portion, and the surface of the first lower guide plate 142b facing the second lower guide plate 142c has a recessed surface. Part. In practical applications, if the structural strength of the spot probe 141 is weak, the second lower guide 142c shown in FIG. 6 can be used; if the spot probe 141 is used For sufficient structural strength, the second lower guide 142c shown in Fig. 7 can be used.

As shown in FIG. 4, the hub assembly 140 further includes a carrier 143. Further, the hub circuit structure further includes the carrier 143. The carrier 143 has an opening 143c extending through the upper and lower surfaces of the carrier 143, and the hub module 142 is disposed at the opening 143c. The bearing portion 142a1 of the needle hub module 142 is used to bear against the upper surface of the carrier 143. The carrier 143 has a recessed space S1 which is recessed into a space from the lower surface of the carrier 143. The recessed space S1 communicates with the opening 143c. A portion of the circuit board 160 is disposed and hermetically connected to the recessed space S1. These first contacts 161 of the circuit board 160 are located in the recessed space S1. These second contacts 162 of the circuit board 160 are exposed outside of the carrier 143. The hub circuit structure further includes a carrier block 130 on the carrier 143.

The carrier 143 is fixed to a locking member 144. The locking member 144 is first fixed on the electrical measuring device 100, and the spotting probe 141 and the needle hub module 142 are disposed on the carrier 143, and the probe 141 and the needle are spotted. The seat module 142 can be mounted on or detached from the carrier 143. The elastic sealing structure 150 is disposed between the bearing block 130 and the carrier 143. Further, the carrier 143 has an annular groove 143a, and the elastic sealing structure 150 is disposed on the annular groove 143a.

Further, as shown in FIG. 4, in the present embodiment, the electrical measuring device 100 further includes a plurality of distance adjusting members 181. The distance adjusting member 181 is connected between the bearing block 130 and the hub assembly 140 and configured to adjust the distance between the carrier block 130 and the hub assembly 140 such that the elastic sealing structure 150 is pre-stressed on the carrier block 130 and the hub assembly 140. between. When the carrier block 130 is spaced from the hub assembly 140 by the aforementioned adjustment distance, the elastic sealing structure 150 forms a sealed passage T1 between the carrier block 130 and the hub assembly 140 (please refer to FIG. 3), and the sealed passage T1 hermetically communicates with the perforations 132. At this time, the other end of the spotting probe 141 away from the circuit board 160 penetrates into the through hole 132 but has not yet electrically contacted with the die 200.

It can be seen that the present embodiment avoids the airtight connection 132 by forming the sealing passage T1 between the bearing block 130 and the hub assembly 140 by using the elastic sealing structure 150, so that the bearing block 130 can be avoided when it contacts the needle hub assembly 140. There is a problem of incomplete airtightness between the two. Moreover, the distance adjustment member 181 can be used to limit the maximum distance between the carrier block 130 and the hub assembly 140 to the aforementioned adjustment distance. In addition, the shrinkage of the elastic sealing structure 150 can also be used to control the magnitude of the force applied to the die 200 when the spotting probe 141 touches the die 200.

In some embodiments, the distance adjusting member 181 is a screw, and the distance adjusting member 181 is inserted through the through hole 135 of the bearing block 130 to lock into the needle seat assembly 140 (specifically, the screw hole 143b of the locking carrier 143). The depth of the lock into the hub assembly 140 can be changed by rotating to adjust the aforementioned adjustment distance, but the present invention is not limited thereto.

Furthermore, as shown in FIG. 4, in the present embodiment, the electrical testing device 100 further includes a plurality of first guiding members 182 and a plurality of second guiding members 183. The first guiding member 182 is connected to the carrier block 130. For example, the first guide 182 can be embedded in the recess 136 on the lower surface 134 of the carrier block 130 to secure the first guide 182 to the carrier block 130, as shown in FIG. This creation is not limited to this. The second guiding member 183 is disposed on the carrier 143. Further, the second guiding member 183 is fixed to the carrier 143. The second guiding member 183 slidably engages the first guiding member 182, respectively, so that the bearing member 143 drives the needle holder module 142 to move toward or away from the bearing block 130. In some embodiments, the first guiding member 182 is a bushing, and the second guiding member 183 is slidable therefrom. The guide rods are movably connected, but the present invention is not limited thereto, and the two can also be interchanged, that is, the first guiding member 182 is a guiding rod, and the second guiding member 183 is a bushing. In a practical application, the first guiding member 182 and the second guiding member 183 can be regarded as an integral guiding member. A part of the guiding member is connected to the carrier member 143, and a portion is connected to the carrier block 130 to limit the carrier member 143 and The relative position of the bearing block 130 and the position of the relative displacement enable the carrier 143 to move toward or away from the carrier block 130, and the guiding member may also be a spring piece (for example, a Z-shaped spring piece).

In some embodiments, the elastic sealing structure 150 is an O-ring, but the present invention is not limited thereto.

In some embodiments, the material of the carrier 143 includes metal, but the creation is not limited thereto.

In addition, referring to FIG. 3 , in the present embodiment, the carrier block 130 has a vacuum channel T2 and a vacuum pumping port 133 , and the vacuum channel T2 is in communication with the sealing channel T1 and the vacuum pumping port 133 . Therefore, when the die 200 is carried on the bearing surface 131 of the carrier block 130 and covers the through hole 132, it can be evacuated from the vacuum pumping port 133 by an external air extracting device (not shown), thereby passing the crystal through the through hole 132. The pellets 200 are adsorbed on the bearing surface 131.

Further referring to FIG. 8 , a perspective view of the carrier block 130 in FIG. 4 is shown in another perspective. As shown in Fig. 8, the carrier block 130 has a recessed space S2. The recessed space S2 is disposed on the lower surface 134 of the carrier block 130, and the vacuum channel T2 is connected to the recessed space S2 (in FIG. 8, the vacuum channel T2 is partially located in the recessed space S2). The area of the recessed space S2 is larger than the area of the perforations 132. The perforations 132 are located in the recessed space S2. Further, the position of the projection 142a2 corresponds to the position of the recessed space S2.

However, the present invention is not limited thereto. Please refer to FIG. 14 , which is a partial cross-sectional view showing the structure in FIG. 3 in another embodiment. As shown in the figure, the vacuum channel T2 and the vacuum suction port 133 disposed on the carrier block 130 in FIG. 3 are instead disposed on the hub assembly 140 (the vacuum suction port 133 is not shown in FIG. The structure can be referred to Figure 3). Therefore, when the die 200 is carried on the bearing surface 131 of the carrier block 130 and covers the through hole 132, the air can be evacuated from the vacuum suction port 133 by an external air suction device (not shown), which can also be achieved via the through hole 132. The grain 200 is adsorbed on the bearing surface 131 for the purpose.

In addition, as shown in FIG. 3, before the die 200 is spotted, there is a gap G1 between the external push block lifting module 122 and the locking member 144 under the hub assembly 140, and the carrier block 130 and the fixed block 121. There is a gap G2 between them, so that when the rotation module 111 is rotated, no interference phenomenon occurs.

Please refer to FIG. 9, which is a side view of the circuit board 160 in FIG. As shown in FIG. 9, the circuit board 160 has a surface circuit layer 163 and a structural enhancement layer 164. The thickness of the structural enhancement layer 164 is greater than the thickness of the surface circuit layer 163. The first contact 161 and the second contact 162 are disposed on the same surface circuit layer 163. Thereby, the circuit board 160 can have better structural strength.

Please refer to FIG. 10 , which is another cross-sectional view of the components in FIG. 3 , wherein the external push block lifting module 122 pushes the hub assembly 140 such that the carrier block 130 abuts the fixed stop 121 . As shown in FIG. 10, in the present embodiment, the external push block lifting module 122 is moved upward from the position in FIG. 3 and pushes the needle hub assembly 140 such that the carrier block 130 abuts against the fixed stop 121. At this time, the die 200 enters the opening 121a of the fixed block 121, and the spot probe 141 is still not in electrical contact with the die 200 (with reference to the spot probe 141 and the die) 200 in the relative position in Figure 5). After the carrier block 130 abuts the fixed stop 121, the hub module 142 that moves toward the carrier block 130 can further compress the resilient sealing structure 150.

Please refer to Figure 11 and Figure 12. 11 is another cross-sectional view of the components of FIG. 3, wherein the outer push block lift module 122 continues to push the hub assembly 140 toward the carrier block 130, thereby causing the hub assembly 140 to abut the carrier block 130. . Fig. 12 is a partially enlarged view showing Fig. 11. As shown in FIG. 11 and FIG. 12, in the present embodiment, the external push block lifting module 122 continues to push the hub assembly 140 toward the carrier block 130 by the state in FIG. 10, and the carrier block 130 is attached. It is blocked by the fixed stop 121 and cannot continue to move upward, so the elastic sealing structure 150 will continue to be compressed by the upwardly moving needle hub assembly 140 toward the carrier block 130. At this time, as shown in FIG. 12, when the hub assembly 140 and the carrier block 130 further compress the elastic sealing structure 150, the spot probe 141 contacts the die 200 via the through hole 132 as the hub assembly 140 moves. .

In some embodiments, in the case where the fixed stopper 121 and the die 200 are removed, when the hub assembly 140 abuts against the carrier block 130, the length of the spot probe 141 passing through the through hole 132 can be set to be 0 to 10 microns, but this creation is not limited to this. Thereby, in the process of actually detecting the die 200, when the hub assembly 140 abuts against the carrier block 130, the spot probe 141 can electrically contact the contact of the die 200 with a slight force, and the crystal will not be crystallized. The pellets 200 are separated from the carrier block 130 (i.e., the aforementioned force is less than the vacuum suction).

In some embodiments, by controlling the external push block lifting module 122 such that the needle hub assembly 140 has not yet abutted against the carrier block 130, the spot probe 141 has been contacted by the through hole 132 to contact the die 200, thereby controlling the spot measurement. Probe 141 The force applied to the die 200.

Please refer to FIG. 13 , which is a partial side view showing the electrical measuring device 100 in FIG. 1 . As shown in FIG. 13, in the present embodiment, the power supply probe 123 is separately provided outside the hub assembly 140. For example, as shown in FIG. 13, the power supply probe 123 is located above the external push block lifting module 122. During the movement of the hub assembly 140 toward the carrier block 130 such that the spotting probe 141 contacts the die 200 via the via 132 (ie, the operation of the electrical measuring device 100 proceeds from the 10th to the 11th), the power supply probe The 123 series electrical contact circuit board 160 is used to supply power to the die 200 via the circuit board 160 and the spot probe 141. In some embodiments, the foregoing die 200 is a Light-emitting Diode (LED) die that can be illuminated by the front side after the back electrode is energized via the spot probe 141. Thereby, the light emission characteristics can be known by detecting the light emitted by the crystal grain 200.

It can be seen from the foregoing configuration that the electrical testing device 100 of the present embodiment utilizes the through holes 132 of the carrier block 130 as both the spot die 200 (ie, provides an electrical signal for the photoelectric test of the die 200) and the adsorption die 200 (avoiding points). When the probe 141 contacts the die 200, the die 200 is disengaged from the channel of the carrier block 130) due to excessive force. Therefore, the electrical measuring device 100 of the present invention does not need to provide a plurality of perforations 132 for the individual spotting probes 141. Even if the size of the die 200 is reduced, the carrier block 130 has sufficient vacuum adsorption area for adsorbing the die 200, and the cost required for making the microvia can be reduced.

In some embodiments, in order to obtain a more accurate detection result, an integrating sphere (not shown) may be disposed over the opening 121a of the fixed stopper 121 shown in FIG. 11 to completely cover the die 200, so the integral The ball can prevent external light from entering and affect the detection result. In some embodiments, the fixed stop 121 The opening 121a is stepped (i.e., expanded outwardly away from the die 200) to prevent the light emitted by the die 200 from being blocked by the inner wall of the opening 121a, thereby increasing the light collecting angle of the integrating sphere.

After the die 200 is detected, the electrical measuring device 100 can return to the state shown in FIG. That is, the external push block lifting and lowering module 122 will move downward from the position in FIG. 11 and return to the position in FIG. 3 to leave the needle seat assembly 140, and the needle seat assembly 140 will also follow the gravity relationship. The lifting rail 113 is moved downward from the position in Fig. 11 to return to the position in Fig. 3.

Moreover, at this time, the elastic sealing structure 150 is elastically restored to return to the pre-stressed state shown in FIG. 3, and the spacing between the carrier block 130 and the hub module 142 is restored to maintain the aforementioned distance. That is, after the test die 200 is completed, the electrical testing device 100 of the present embodiment can also return the carrier block 130 and the hub assembly 140 to the separated state by using the elastic sealing structure 150 to avoid the bearing assembly 140 being loaded and loaded. The friction between the blocks 130 (because the gap between the two is too small) causes a problem that separation is impossible.

Please refer to FIG. 15 , which is a flow chart showing an electrical measurement method according to an embodiment of the present invention. As shown in Fig. 15, in the present embodiment, the electrical measurement method is for detecting a crystal grain by using an electrical measuring device. The electrical measuring device comprises a carrier block, a hub assembly comprising a plurality of spotting probes, an elastic sealing structure and a fixed stop. The carrier block has a bearing surface configured to carry the die and a perforation that communicates to the carrier surface. For example, the electrical measurement method can detect the crystal grains by using the electrical measuring device 100 shown in FIGS. 1 to 14 , but the present invention is not limited thereto.

The electrical measurement method includes steps S101 to S105. Specifically, in step S101, the crystal grains are adsorbed on the bearing surface via the perforations. In step S102 The needle hub assembly is moved toward the fixed stop such that the carrier block abuts the fixed stop. In step S103, the hub assembly is continued to move toward the fixed stop and further compresses the resilient sealing structure such that the spot probe contacts the die via the perforations as the hub assembly moves. In step S104, the die is spotted via a spot probe. In step S105, after the spotting, the needle seat assembly is released, causing the elastic sealing structure to elastically recover to separate the needle seat assembly from the carrier block, thereby causing the spotting probe to leave the die.

In some embodiments, the electrical measurement device further includes a circuit board. The hub assembly is secured to the board. The spot probe is electrically connected to the board. The electrical measurement method further includes steps S106 to S109. In step S106, before the spot test, the resistance value of one of the spot probes is detected via the circuit board. In step S107, the resistance value of the detected spot probe is determined to be greater than a predetermined resistance value, and if so, the detected spot probe is cleaned. In step S108, the resistance value of the spot probe to be cleaned is detected via the circuit board. In step S109, the resistance value of the spot probe to be cleaned is determined to be greater than a predetermined resistance value, and if so, the spot probe to be cleaned is changed.

In some embodiments, the predetermined resistance value may be set to 0.5 to 15 ohms, but the present invention is not limited thereto.

From the above detailed description of the specific implementation of the present invention, it can be clearly seen that the electrical measuring device and the electrical measuring method of the present invention utilize a perforation of the carrying block as a spotting die (ie, providing an electrical signal for the die. Photoelectric test) and the adsorption of crystal grains (avoiding the force of the probe to contact the die when the spot probe is in contact with the die). That is to say, the electric measuring device and the electric measuring method of the present invention do not need to provide a plurality of perforations for the individual spotting probes, so even the ruler of the die As the inch is reduced, the carrier block still has sufficient vacuum adsorption area for adsorbing the crystal grains, and the cost required for making the micro holes can be reduced. In addition, the electrical measuring device and the electrical measuring method of the present invention can utilize a resilient sealing structure to form a sealed passage between the bearing block and the hub assembly to hermetically communicate the perforations, thereby avoiding the contact between the carrier block and the hub assembly. An incomplete airtight problem has occurred. Moreover, the shrinkage of the elastic sealing structure can also be used to control the function of the spotting probe to touch the force applied by the die to the die. In addition, after completing the test die, the electrical measuring device and the electrical measuring method of the present invention can also return the bearing block and the needle seat assembly to the separated state by using the elastic sealing structure to avoid the friction between the needle seat assembly and the bearing block. The force (because the gap between the two is too small) causes problems that cannot be separated.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present creation. The scope is subject to the definition of the scope of the patent application.

112‧‧‧cantilever

113‧‧‧ Lifting rails

121‧‧‧Fixed stop

121a‧‧‧ openings

122‧‧‧External push block lifting module

130‧‧‧bearing block

131‧‧‧ bearing surface

132‧‧‧Perforation

133‧‧‧Vacuum suction port

140‧‧‧ needle seat assembly

141‧‧ ‧ spot probe

142‧‧‧ needle seat module

143‧‧‧Carrier

144‧‧‧Locker

150‧‧‧Elastic sealing structure

160‧‧‧ boards

200‧‧‧ grain

G1, G2‧‧‧ gap

T1‧‧‧ sealed passage

T2‧‧‧ vacuum channel

Claims (25)

An electrical measuring device for detecting a die, the electrical measuring device comprising: a carrying block having a bearing surface and a through hole communicating to the carrying surface, the bearing surface configured to carry the die; a needle seat assembly, Configuring to move toward or away from the carrier block, the hub assembly includes a plurality of spotting probes; and a resilient sealing structure disposed between the carrier block and the hub assembly and configured to cause the carrier block to The needle hub assembly is hermetically sealed and separated, wherein the spot probes contact the die via the perforations as the hub assembly moves as the carrier block abuts against the elastomeric sealing structure. The electrical testing device of claim 1, further comprising at least one distance adjusting member coupled between the bearing block and the hub assembly, and configured to distance the carrier block from the hub assembly. And the elastic sealing structure is pre-stressed between the carrier block and the hub assembly. The electrical testing device of claim 2, wherein the elastic sealing structure forms a sealed passage between the bearing block and the hub assembly when the carrier block is at a distance from the hub assembly, and The sealing passage communicates the perforations in a gastight manner. The electrical testing device of claim 1, wherein the carrying block has a vacuum channel, and the vacuum channel communicates with the sealed channel. The electrical testing device of claim 1, wherein the hub assembly has a vacuum channel and the vacuum channel communicates with the sealing channel. The electrical testing device of claim 1, wherein the elastic sealing structure is an O-ring. The electric measuring device of claim 1, wherein the needle hub assembly further comprises a needle seat module and a carrier member, the carrier member having an opening penetrating the upper and lower surfaces of the carrier member, the spotting probes are worn The needle socket module is disposed in the opening, and the needle socket module has a bearing portion for bearing against the upper surface of the carrier, the elastic sealing structure is disposed Between the carrier block and the lock. The electrical testing device of claim 7, further comprising: a guiding member, one of the guiding members is partially connected to the carrying block, and another portion of the guiding member is connected to the carrying member to limit the carrying member The relative position of the carrier block and the relative displacement position allow the carrier to move toward or away from the carrier block. The electrical testing device of claim 1, further comprising a fixed stop, the fixed stop being located on a side of the carrying block facing the hub module, and configured to abut the carrying block, wherein After the carrier block abuts the fixed stop, the hub module moving toward the carrier block further compresses the resilient sealing structure. The electrical testing device of claim 9, wherein the needle hub assembly is adapted to be pushed by an external push block lifting module to move the carrier block toward the fixed stop. The electrical testing device of claim 10, wherein the needle hub assembly is adapted to slidably engage a lifting rail such that the hub assembly is guided by the lifting rail toward or away from the stationary barrier Block moves. The electrical testing device of claim 11, further comprising: a rotating module having a rotating axis; at least one cantilever having one end connected to the rotating module, wherein the lifting rail is disposed on the cantilever another side. The electrical testing device of claim 1, further comprising: a circuit board for fixing the needle holder assembly to the circuit board, the circuit board and the carrier block being respectively located on opposite sides of the needle holder assembly The plurality of power-measuring probes are electrically connected to the circuit board, and the plurality of power supply probes are separately disposed outside the needle seat assembly, wherein the needle-seat assembly moves toward the carrier block such that the points are measured During the contact of the probes through the vias, the power supply probes electrically contact the circuit board, thereby supplying power to the die via the circuit board and the test probes. A needle seat circuit structure for an electrical measuring device for airtightly detecting a die and providing a plurality of power supply probes separately The power supply probe is electrically connected to a power supply to supply the power to the die via the header circuit structure, and the pin is electrically connected to the die. The circuit structure is airtightly connected to the electrical measuring device, the needle seat circuit structure comprises: a needle seat module having an upper guiding plate and a lower guiding plate, the upper guiding plate having at least one upper perforation, the lower guiding The board has at least a perforation; a plurality of spotting probes are disposed in the hub module; and a circuit board having a plurality of first contacts and a plurality of second contacts, the first The contacts and the second contacts are located on the same surface of the circuit board, and the first contacts are respectively correspondingly and electrically connected to one of the second contacts; wherein the socket module is fixed to the circuit board. The spotting probes are disposed in the upper through hole and the lower through hole to contact one of the first contacts, and the spotting probes are fixed in the socket module and the circuit board, and the second connections are The point is exposed outside the hub module for contacting the plurality of power supply probes. The socket circuit structure of claim 14, wherein the socket circuit structure further comprises a carrier, the carrier has an opening, and the socket module is disposed at the opening, the socket module The set has a bearing portion for bearing against the upper surface of the carrier. The socket circuit structure of claim 15, wherein the carrier has a recessed space, and the recessed space of the carrier is recessed into a space from a lower surface of the carrier, and the recessed space of the carrier Connecting the opening, a portion of the circuit board is disposed and airtightly connected to the recessed space of the carrier, and the first contacts of the circuit board are located in the recess of the carrier The second contacts of the circuit board are exposed outside the carrier. The socket circuit structure of claim 15, wherein the carrier has an annular groove for placing a resilient sealing structure. The socket circuit structure of claim 15 further comprising a carrier block having a bearing surface, a lower surface and a through hole, the through hole communicating with the bearing surface and the lower surface, the carrier block being on the carrier The spotting probes may pass through the through holes to penetrate the lower surface of the carrier block and the bearing surface. The socket circuit structure of claim 18, wherein the carrier block has a recessed space disposed on the lower surface, an area of the recessed space of the carrier block is larger than an area of the through hole, and the punched hole is located in the recess Within the space. The needle base circuit structure of claim 14 or claim 19, wherein the upper guide plate of the needle hub module has a bearing portion and a protruding portion, the bearing portion having an upper surface and a lower portion a surface of the upper surface of the bearing portion protruding to form the protruding portion, the lower surface of the bearing portion having a recessed receiving space, the protruding portion having the at least one upper through hole, the protruding portion The area is smaller than the abutment portion, and the position of the protrusion corresponds to the position of the recessed space. The socket circuit structure of claim 20, wherein the carrier block has a vacuum channel that communicates with the recessed space. The socket circuit structure of claim 15 further comprising a guiding member, one of the guiding members partially connecting the carrier. The socket circuit structure of claim 14, wherein the distance between the two first contacts or the distance between the second contacts is less than one of the first contacts and one of the second contacts The distance between them. The socket circuit structure of claim 14, wherein the spacing between the two first contacts is less than the spacing between the second contacts. The socket circuit structure of claim 14, wherein the circuit board has a surface circuit layer and a structural reinforcement layer, the thickness of the structural reinforcement layer being greater than the thickness of the surface circuit layer, the first contacts and The second contacts are disposed on the surface circuit layer.