TWM601346U - Clamping type detection circuit mechanism - Google Patents

Abstract

A clamping type detection circuit mechanism includes a plurality of clamping arms, the plurality of clamping arms includes a first clamping arm and a second clamping arm; the first clamping arm has a first clamping portion; the second clamping arm has a second clamping Section; the first clamping portion and the second clamping portion are arranged facing each other, the first clamping arm and the second clamping arm are relatively abutting movement parallel to the first direction, and the first clamping portion and the second clamping portion are clamped together The side edge of the lower half of the electronic component arranged between the first clamping portion and the second clamping portion.

Description

Clamping detection circuit mechanism

This creation relates to electronic component testing equipment, in particular to a clamping type electronic component testing circuit mechanism.

With regard to electronic components, such as wafers, light-emitting diodes, integrated circuits, etc., the electrical conductivity of their circuits must be tested to confirm whether the electrical conductivity of the electronic components meets the requirements.

The conventional detection method is to place the electronic component on a testing mechanism carrier with a probe, and use a pressing member located above the electronic component to apply force to the top of the electronic component to press the electronic component on the lower pressing member and the carrier The probe is pressed down at the bottom of the electronic component, so that the conductive sheet of the electronic component and the detection mechanism are connected to each other through the probe, so as to know whether the conductive quality of the electronic component circuit is good.

However, the above-mentioned conventional detection methods may cause misjudgments for certain electronic components.

Please refer to FIG. 6, the electronic component 90 has a double-layer structure, consisting of a bottom layer 91 and a top layer 92 located on the top of the bottom layer 91. A circuit 94 is provided on the top of the bottom layer 91. The circuit 94 shown includes a light emitting diode. The body 941, a wire 942, and a conduction point 943 are only illustrative examples and not limited thereto. The circuit 94 is connected to a plurality of conductive sheets 93 and extends to the bottom surface of the bottom layer 91. Under normal circumstances, the first end 944 and the second end 945 of the wire 942 should be connected to the light-emitting diode 941 and the conduction point 943, respectively. The second end 945 is separated from the conduction point 943, indicating that the electronic component 90 is not Good product.

The hardness of the bottom layer 91 is greater than the hardness of the top layer 92. The material of the bottom layer 91 may be, for example, a printed circuit board material or ceramic; the material of the top layer 92 may be, for example, a soft sealant such as silicon. Since the hardness of the bottom layer 91 is greater than the hardness of the top layer 92, the thickness of this type of electronic component 90 is getting thinner (the thickness of the bottom layer 91 can be 0.2mm, for example) and the hardness of the top layer 92 is getting softer (from traditional vinyl to Soft), so it is easy to deform when pressed.

With regard to the electronic component 90 shown in FIG. 6, when the test is performed with the conventional pressing structure, the pressing plate 95 is pressed down on the top of the electronic component 90, and the conductive sheet 93 is made to hold the probe 96 at the corresponding position of the test bench 95 Pressing down, because the second end 945 and the conducting point 943 are not properly connected, it indicates that the circuit 94 and the probe 96 cannot be electrically connected, so the detection mechanism can determine that the detected electronic component 90 is defective.

However, due to the low hardness of the top layer 92 of the electronic component 90, when the pressing plate 95 is pressed down, it is very easy to cause the top layer 92 to deform, causing the second end 945 to contact the conduction point 943 and conduct, which makes the detection mechanism mistakenly believe that the electronic component 90 is The circuit conduction is normal, so it is misjudged as a good electronic component. In other words, when the pressing plate 95 rises and the down force disappears, the circuit of the electronic component 90 cannot be normally conducted, and it should be a defective product.

In the same way, the top detection mechanism similar to the above-mentioned pressing method may deform the top layer 92 and cause misjudgment.

In addition, as for the electronic component 90 with the light-emitting diode 941 in FIG. 6, the detection mechanism that is pressed down on the top of the electronic component 90 by the pressing plate 95, even if the pressure plate 95 is provided with a transparent portion 951, will still hinder the light-emitting diode The part of the body 941 emits light, which affects the light emission test of the electronic component 90.

Furthermore, by using the detection mechanism that the pressing plate 95 presses down on the top of the electronic component 90, the pressing plate 95 will scratch the contact part between the top of the top layer 92 and the pressing plate 95, affect the strength of the electronic component 90, and cause the electronic component 90 to be damaged.

Based on this, how can there be a circuit that does not touch the electronic components, can improve the detection yield and accuracy of electronic components, will not hinder other tests of electronic components, and will not cause damage to the electronic components "clamping detection circuit mechanism" , Is a topic that people in related technical fields need to solve urgently.

In one embodiment, the present invention proposes a clamping detection circuit mechanism, which includes: A plurality of clamping arms includes a first clamping arm and a second clamping arm, the first clamping arm has a first clamping portion, and the second clamping arm has a second clamping portion; The first clamping portion and the second clamping portion are arranged facing each other, the first clamping arm and the second clamping arm are parallel to a first direction and move relative to each other, and the first clamping portion and the second clamping portion are clamped in a configuration The side edge of the lower half of the electronic component between the first clamping portion and the second clamping portion.

The specific implementation of this creation will be further described below with reference to the drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of this creation, and cannot be used to limit the protection scope of this creation.

Please refer to FIG. 1, the clamping detection circuit mechanism 1 provided by the present invention includes a first clamping arm 10 and a second clamping arm 20. The material of the first clamping arm 10 and the second clamping arm 20 is not limited, and may be steel or ceramic, for example.

The first clamping arm 10 has a first clamping portion 11, and the second clamping arm 20 has a second clamping portion 21. The first clamping portion 11 and the second clamping portion 21 are disposed facing each other, and An electronic component 90 is provided between the portion 11 and the second clamping portion 21.

The electronic component 90 has a double-layer structure and is composed of a bottom layer 91 and a top layer 92 located on the top of the bottom layer 91. At the bottom of the bottom layer 91, a conductive sheet 93 is provided for circuit connection with the bottom layer 91. The hardness of the bottom layer 91 is greater than the hardness of the top layer 92. The material of the bottom layer 91 may be, for example, a printed circuit board material or ceramic; the material of the top layer 92 may be, for example, a soft sealant such as silicon.

The first clamping arm 10 and the second clamping arm 20 are connected with a driving device (not shown in the figure) to control the relative abutting or separating movement of the first clamping arm 10 and the second clamping arm 20 in a first direction F1 in parallel. When the first clamping arm 10 and the second clamping arm 20 move together, the first clamping portion 11 and the second clamping portion 12 can be clamped on the side edge of the bottom layer 91 of the lower half of the electronic component 90.

Please refer to FIG. 2 and FIG. 3, the electronic component 90 is disposed on a base 30, and the base 30 has a carrying surface 31 for carrying the electronic component 90. The first clamping arm 10 and the second clamping arm 20 may be arranged on the base 30 or may be arranged on other supporting objects. When the first clamping arm 10 and the second clamping arm 20 move relatively apart to form a relatively large margin between the first clamping portion 11 and the second clamping portion 21, a suction nozzle (not shown in the figure) (Shown) pick up the electronic component 90 and place the electronic component 90 on the supporting surface 31.

A testing machine 40 is provided under the base 30, and the testing machine 40 and the base 30 can relatively move together or move apart along a second direction F2, which is perpendicular to the first direction F1.

The testing machine 40 is provided with a vacuum suction channel 41 corresponding to the bearing surface 31, the testing machine 40 is provided with a probe 42 corresponding to the conductive sheet 93 of the electronic component 90, and a detection mechanism is provided at the bottom of the probe 42 (Not shown in the picture). The probe 42 can be elastically moved parallel to the second direction F2.

When the testing machine 40 and the base 30 are relatively abutted along the second direction F2, the vacuum suction channel 41 is used to provide a vacuum suction force to the electronic component 90 arranged on the carrying surface 31, and the vacuum degree is used to detect and determine Whether there is an electronic component 90 present, or the electronic component 90 has not been placed properly to facilitate detection.

The electronic component 90 presses down the probe 42, the conductive sheet 93 on the bottom of the electronic component 42 contacts the top 421 of the probe 42, and the top 421 of the probe 42 exerts a force on the conductive sheet 93 on the bottom surface of the electronic component 90. And the bottom end of the probe 42 is in contact with the detection mechanism, so that the circuit of the electronic component 90 and the detection mechanism are electrically conducted through the probe 40, and the detection mechanism detects the circuit of the electronic component 90.

The clamping force provided by the first clamping portion 11 and the second clamping portion 12 on the side edge of the electronic component 90 must be greater than the force exerted by the top end 421 of the probe 42 on the bottom surface of the electronic component 90 to avoid probing The force of the needle 42 pushes the electronic component 90 out of the base 30.

Please refer to FIGS. 4A to 4F, which respectively show the relative positional relationship between the clamping arm and the electronic component of the present invention. The electronic component 90 is rectangular and has four sides 901-904 and four diagonal corners 905-908.

4A shows that the first clamping arm 10 and the second clamping arm 20 are clamped on opposite sides 901 and 903 of the electronic component 90. FIG. 4B shows that the first clamping arm 10 and the second clamping arm 20 are clamped on the opposite sides 902 and 904 of the electronic component 90. FIG. 4C shows that two groups of the first clamping arm 10 and the second clamping arm 20 are respectively clamped on the four sides 901 to 904 of the electronic component 90.

4D shows that the first clamping arm 10A and the second clamping arm 20A are clamped at two opposite corners 905 and 907 of the electronic component 90. 4E shows that the first clamping arm 10A and the second clamping arm 20A are clamped at the other two opposite corners 906 and 908 of the electronic component 90. FIG. 4F shows that two groups of the first clamping arm 10A and the second clamping arm 20A are respectively clamped at four opposite corners 905 to 908 of the electronic component 90.

4A to 4F illustrate that the number of clamping arms in this creation can be set according to actual needs and the shape of the components, and the position of clamping electronic components is not limited, and can be side or diagonal.

Please refer to FIG. 5A, a first inclined portion 12B is provided on the top of the first clamping portion 11B of the first clamping arm 10B, and a second inclined portion is provided on the top of the second clamping portion 21B of the second clamping arm 20B.部22B. The first clamping portion 11B and the second clamping portion 21B are sandwiched on the side edge of the bottom layer 91 of the electronic component 90. The first inclined portion 12B and the second inclined portion 22B form a funnel shape with a wide upper portion and a narrow lower portion. The part 12B and the second inclined part 22B are not in contact with the top layer 92 of the electronic component 90.

Please refer to FIG. 5B, a first concave portion 12C is provided on the top of the first clamping portion 11C of the first clamping arm 10C, and a second concave portion 22C is provided on the top of the second clamping portion 21C of the second clamping arm 20C . The first clamping portion 11C and the second clamping portion 21C are sandwiched on the side edge of the bottom layer 91 of the electronic component 90. The first concave portion 12C and the second concave portion 22C form a stepped shape with a wide upper portion and a narrow lower portion. The second recess 22C does not contact the top layer 92 of the electronic component 90.

The structure of Figure 1, Figure 5A and Figure 5B illustrate that when the electronic component 90 is a component with light-emitting diodes, since the clamping arm provided by this creation only clamps the side of the substrate at the bottom of the electronic component 90, it will not affect The light emitted by the light-emitting diode will not affect the light detection. In other words, the slopes of the first inclined portion 12C and the second inclined portion 22C are not limited, and the depth of the recessed portion 12D and the second concave portion 22D is not limited. The first concave portion 12D and the second concave portion 22D may also be stepped concave It does not interfere with the light output of the electronic components.

In summary, the clamping detection circuit mechanism provided by the present invention uses a side clamping method to clamp electronic components for detection. Since the clamping arm only acts on the side of the substrate at the bottom of the electronic component, it will not affect the top layer of the electronic component. The pressure generated by the sealant will not cause misjudgment of circuit conduction due to the pressure of the sealant by the conventional push-down or top-up method, thus improving the detection yield and accuracy of electronic components. In addition, when the electronic component is a component with a light-emitting diode, it can avoid affecting the light emission and light emission detection. Furthermore, the top layer of the electronic component will not be damaged due to the pressure of the pressure plate.

Although this creation has been disclosed in the above embodiments, it is not intended to limit this creation. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of this creation. Therefore, The scope of protection of this creation shall be subject to the scope of the attached patent application.

1: Clamping detection circuit mechanism 10, 10A, 10B, 10C: first clamp arm 11, 11B, 11C: the first clamping part 12B: First oblique part 12C: The first recess 20, 20A, 20B, 20C: second clamp arm 21, 21B, 21C: second clamping part 22B: second slope 22C: Second recess 30: Pedestal 31: bearing surface 40: Testing machine 41: Vacuum adsorption channel 42: Probe 421: Top 90: electronic components 901~904: side 905~908: diagonal 91: bottom layer 92: top floor 93: conductive sheet 94: Circuit 941: LED 942: Wire 943: conduction point 944: first end 945: second end 95: pressure plate F1: First direction F2: second direction

Figure 1 is a schematic structural diagram of an embodiment of the creation. 2 and 3 are schematic diagrams of the structure of the embodiment in FIG. 1 with a testing machine. 4A to 4F are schematic diagrams of the top view structure of different clamping methods for electronic components of the creation. Figures 5A and 5B are schematic structural diagrams of different embodiments of the creation. Fig. 6 is a schematic diagram showing the structure of an electronic component with a double-layer structure in a conventional push-down method.

1: Clamping detection circuit mechanism

10: The first clamp arm

11: The first clamping part

20: second clamp arm

21: The second clamping part

90: electronic components

91: bottom layer

92: top floor

93: conductive sheet

F1: First direction

Claims (14)

A clamping detection circuit mechanism, which comprises: The plural clamping arms include a first clamping arm and a second clamping arm, the first clamping arm has a first clamping portion, and the second clamping arm has a second clamping portion; The first clamping portion and the second clamping portion are arranged facing each other, the first clamping arm and the second clamping arm are parallel to a first direction and move in relative abutment motion, the first clamping portion and the second clamping The part is clamped on the side edge of the lower half of the electronic component arranged between the first clamping part and the second clamping part. Such as the clamp-type detection circuit mechanism of claim 1, wherein the electronic component is disposed on a base, and the base has a bearing surface for supporting the electronic component. For example, the clamp-type detection circuit mechanism of claim 2, wherein a detection machine is provided under the base, and the detection machine and the base move relative to each other in a second direction, the second direction being perpendicular to the first direction, The testing machine is provided with a vacuum adsorption channel corresponding to the bearing surface, and the vacuum adsorption channel provides a vacuum adsorption force to the electronic component arranged on the bearing surface, and determines whether there is the Electronic components exist, or the electronic components have not been placed properly. For example, the clamp-type detection circuit mechanism of claim 2, wherein the detection machine is provided with at least one probe corresponding to the installation position of the electronic component, and a detection mechanism is provided at the bottom of the probe, and the probe is parallel to the first Elastic movement in two directions, the electronic component is arranged on the bearing surface and the probe is pressed down, the top of the probe exerts a force on the bottom surface of the electronic component. Such as the clamping detection circuit mechanism of claim 4, wherein the clamping force provided by the first clamping portion and the second clamping portion clamped on the side edge of the electronic component is greater than the force. Such as the clamp-type detection circuit mechanism of claim 4, wherein the electronic component presses down the probe, the conductive sheet at the bottom of the electronic component contacts the top end of the probe, and the bottom end of the probe contacts the detection mechanism , So that the circuit of the electronic component and the detection mechanism are electrically connected through the probe. For example, the clamping detection circuit mechanism of claim 1, wherein the electronic component is composed of a bottom layer and a top layer located on the top of the bottom layer, the hardness of the bottom layer is greater than the hardness of the top layer, the first clamping part and the second clamp The holding part is clamped on the side edge of the bottom layer of the electronic component. Such as the clamp-type detection circuit mechanism of claim 7, wherein a circuit is provided on the top surface of the bottom layer, and the circuit is connected to at least one conductive sheet extending to the bottom surface of the bottom layer. For example, the clamping detection circuit mechanism of claim 1, wherein the top of the first clamping portion is provided with a first inclined portion, and the top of the second clamping portion is provided with a second inclined portion, and the first clamping portion and The second clamping portion is arranged facing each other, the first inclined portion and the second inclined portion form a funnel shape with a wide upper portion and a narrow lower portion, and the first inclined portion and the second inclined portion are not in contact with the electronic component. For example, the clamping detection circuit mechanism of claim 1, wherein the top of the first clamping portion is provided with a first concave portion, the top of the second clamping portion is provided with a second concave portion, the first clamping portion and the first The two clamping portions are arranged facing each other, the first concave portion and the second concave portion form a step shape with a wide upper portion and a narrow lower portion, and the first concave portion and the second concave portion are not in contact with the electronic component. Such as the clamping detection circuit mechanism of claim 1, wherein the first clamping arm and the second clamping arm are respectively clamped on opposite sides of the electronic component. For example, the clamping detection circuit mechanism of claim 1, wherein the plurality of clamping arms further includes a third clamping arm and/or a fourth clamping arm, the first clamping arm, the second clamping arm, the third clamping arm, and /Or the fourth clamping arm is respectively clamped on at least two opposite sides of the electronic component. Such as the clamping detection circuit mechanism of claim 1, wherein the first clamping arm and the second clamping arm are respectively clamped at two opposite corners of the electronic component. For example, the clamping detection circuit mechanism of claim 13, wherein the plurality of clamping arms further includes a third clamping arm and/or a fourth clamping arm, the first clamping arm, the second clamping arm, the third clamping arm, and /Or the fourth clamping arm is respectively clamped on at least two opposite corners of the electronic component.

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