JP2006220627A - Probe pin, probe pin unit, and inspection method of inspection object using unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe pin unit and an inspection method of an electronic component using the unit not requiring necessarily a mechanical chuck, capable of mitigating a pressing pressure to a work by using a diaphragm type probe pin unit, recovering dust even if the dust is generated, and coping even with an instantaneous contact. <P>SOLUTION: This probe pin unit 1A is characterized by being equipped with a probe pin 10 wherein a plurality of pins 20 whose tips 24 are aligned in a prescribed array on the same plane, wherein a lead wire 25 is connected to a base part of a pipe 21 respectively, and at least one vacuum pipe 11 are supported in the penetrated state from one surface of a diaphragm 13 of an elastic material to the other surface thereof; a housing 30 for supporting it; a work positioning piece 40 for positioning the work W to be pressed into its tip part 32; and a pin guide plate 50 and an attachment 60. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  In the present invention, a plurality of inspection points of an object to be inspected (hereinafter referred to as “work”) such as a semiconductor product, a printed wiring circuit board, and the like are in contact with each electrode of a semiconductor product, and the work is a non-defective product. The present invention relates to a probe pin composed of a large number of pins, a probe pin unit including the probe pin, and a method for inspecting an object to be inspected using the probe pin, which are incorporated in an inspection apparatus for measuring and inspecting whether or not.

  In a conventional inspection apparatus for inspecting the quality of a work, a contact probe unit comprising a large number of contact pins is used. In a general contact probe unit of the prior art, a pin-type plunger is a work electrode by a spring. Or a metal piece having a spring structure, or an insulating cushioning material affixed with a conductive material abuts against a workpiece electrode.

  Therefore, the pressing pressure causes the workpiece to be distorted, and it may not be possible to correctly inspect the quality. This is because the contact pressure of the contact probe works in the direction away from the workpiece, and therefore it is necessary to support the workpiece. Many workpieces do not cause problems even if such an inspection method is adopted, but some workpieces cannot be supported. Some processes cannot be supported. A contact probe that can be contacted in such a state has not yet been put into practical use.

  In such a contact method, a force is always applied to the work from the outside. For this reason, it is absolutely necessary that the support structure of the workpiece is formed with a structure that can withstand the load.

  There is also a socket-type contact probe, but works other than those optimized for this method cannot be contacted. Also, dust is generated due to the friction of the contact element of the socket, and there is a difficulty in durability. This method also requires a load to be applied when the workpiece is pushed into the socket.

  The contact pressure for contact acts on the workpiece electrode in proportion to the number of contacts, and stress distortion occurs. In order to eliminate the distortion, a jig having a structure capable of accurately receiving a portion where the workpiece is easily distorted is required. Therefore, a conventional inspection apparatus using a contact probe is required to have rigidity and accuracy including a jig.

  Inspection devices that require contacts with a scale of several hundred points require a structure comparable to a press machine for pressurization. On the other hand, for example, when the substrate area of the workpiece is relatively small, there are a large number of narrow-pitch patterned lands (electrodes) that require contact on one side of the substrate, and the thickness of the substrate itself is about 0.3 mm. In the case of a work in which a CCD (= Charge Coupled Device) type image sensor is mounted on the opposite surface, backing up the CCD type image sensor side may contaminate the light incident surface. Because there is no such thing, I don't want to back up the CCD image sensor. In this case, it is necessary to take measures such as changing the contact target with a flexible circuit board (FPC) or providing a land on the surface of the substrate on the CCD image sensor side. However, when the substrate is enlarged, another problem occurs, which is not a good idea.

  The contact probe unit is driven by a mechanically activated system or a compressed air activated system, but a vacuum activated system is used because of the above-mentioned undesirable problems. As an example of this vacuum starting system, the following [Patent Document 1] discloses a “vacuum starting test head” which is a contact probe unit.

  To summarize the configuration and structure of this vacuum start type test head, a base plate that supports a plurality of spring probes in a predetermined arrangement, a support plate that supports the workpiece, and the support plate together with the attached workpiece. And a guide member for guiding the front and rear from the base plate. An elastic seal is interposed between the support plate and the base plate, and the elastic seal has a free end in the vicinity of the base plate so that a vacuum chamber can be formed between the plates. Has been.

The vacuum activated test head constructed in this way is such that the work is attracted by pulling the vacuum chamber to a vacuum, and therefore, until the spring probe engages each electrode of the work and makes direct electrical contact. The support plate moves toward the base plate.
JP-A-58-102175 ("Claims (1), FIGS. 1 to 5" on page 1 and page 2)

However, as mentioned above, in the conventional vacuum start type test head,
1) Dust is generated because the free end of the elastic seal slides on the surface of the base plate. 2) A contour in which the current flow path is attached to the programming plate from the workpiece electrode. Engage with the probe and contact probe attached to the base plate to reach the measuring instrument. Since there are two contact points on the path, there is a factor that the contact resistance fluctuates at each contact point. 3) The response speed is slow. 4) The structure is complicated.

  The present invention is intended to solve these problems. By using a diaphragm-type probe pin unit, the pressing force on the workpiece is alleviated, a mechanical chuck is not necessarily required, and dust is generated. Another object of the present invention is to provide a probe pin unit that can collect such dust and can handle instantaneous contact, and an inspection method for electronic components using the probe pin unit.

  Therefore, in the probe pin of the present invention, a plurality of pins in a predetermined arrangement and at least one vacuum pipe penetrate from one surface of the diaphragm formed of a flexible elastic material having electrical insulation to the other surface. And a lead wire is connected to the base of each pin.

  It is desirable that a virtual plane connecting the tips of the pins protruding from the diaphragm is aligned in a plane along the surface of the inspection object. The virtual plane is usually aligned in one plane. Moreover, it is desirable that the flexible elastic material having electrical insulation is formed of rubber or resin.

  In the probe pin unit of the present invention, a plurality of pins in a predetermined arrangement and at least one vacuum pipe penetrate from one surface of the diaphragm formed of a flexible elastic material having electrical insulation properties to the other surface. And a probe pin having a lead wire connected to the base of each pin, a housing supporting the outer periphery of the probe pin, and an outer periphery of the tip of the housing. A workpiece positioning piece having a mounting portion on which a test object can be mounted in parallel to a surface formed by the tip of each pin formed by the tip; and A pin guide plate that guides the base side of the probe, and a housing in which the probe pin and the work positioning piece are mounted includes a pin guide plate. Characterized in that it is configured with an attachment with an opening for deriving a fixed surface fixed via a de plate and with said plurality of leads and the base of the vacuum pipe. The workpiece positioning piece may be formed of an electrically insulating material, or at least a part thereof may be formed of a conductive metal.

  In the probe pin unit of the present invention, a plurality of pins in a predetermined arrangement and at least one vacuum pipe penetrate from one surface of the diaphragm formed of a flexible elastic material having electrical insulation properties to the other surface. A probe pin to which a lead wire is connected to a base portion of each pin, a first flange that receives an inner surface side of an outer peripheral portion of the diaphragm of the probe pin, and an outer peripheral portion of the diaphragm of the probe pin A second flange in which a support portion on which an object to be inspected is mounted is formed at the opposite central portion, and a pin guide plate for guiding the base side of each pin behind the first flange And means for fastening the first flange and the second flange with the outer periphery of the diaphragm sandwiched therebetween, and the first flange is the pin Characterized in that it is configured with an attachment with an opening for deriving a fixed surface and the plurality of leads and the base of the vacuum pipe to be fixed via the id plate.

  Further, according to the inspection method of the inspected object of the present invention, a plurality of pins in a predetermined arrangement and at least one vacuum pipe are formed from one surface to the other surface of a diaphragm formed of a flexible elastic material having electrical insulation. Forming a chamber between the probe pin that is supported by penetrating the pin and the lead wire is connected to the base of each pin, and the object to be inspected supported along the tip of the probe pin, By reducing the pressure of the chamber through the vacuum pipe to a reduced pressure state or a vacuum state, the probe pin is moved to the inspection object side at the same time as the inspection object is chucked, and the tip of each of the plurality of pins is moved. The electrical characteristics are inspected by contacting the inspection points of the inspection object corresponding to the respective inspection objects.

  Therefore, according to the present invention, by supporting a plurality of pins with a diaphragm, when the atmospheric pressure of the chamber is reduced or vacuumed, the diaphragm bends and each pin corresponds to a workpiece (inspection object). It is possible to uniformly contact each inspection point (“electrode” in the case of an electronic component) and simultaneously chuck the workpiece.

  In addition, by forming at least a part of the workpiece positioning piece from a conductive metal, the chuck of the workpiece can detect contact with the housing and check the chucking state. Even if it touches, the object to be inspected can be short-circuited and other damage can be prevented.

  Moreover, since there is no sliding part as in the prior art, there is no element that generates dust, and even if dust is generated, it can be discharged to the outside by vacuum, so work can be performed in a clean room. it can.

  Furthermore, the probe pin can be instantaneously brought into contact with the electrode of the workpiece by setting the chamber to a reduced pressure state or a vacuum state.

Therefore, according to the present invention,
1. 1. No mechanical dynamic mechanism is required to contact the probe pin with each inspection point (electrode) on the workpiece. 2. Even if the probe pin contacts each inspection point (electrode) of the workpiece and dust is generated, such dust can be cleaned and collected, so it is suitable for clean specifications. 3. Contact is possible even if the workpiece is thin and vulnerable to external forces. 4. In principle, there is a diversity that allows the contact surface between the probe pin and each inspection point (electrode) on the workpiece to be a polygonal surface or a free curved surface. Can handle workpieces that are not allowed to touch other than the contact surface. Since it also serves as a vacuum chuck, it has multiple functions such as chucking, transportability, and inspection during movement. 7. Easy to use immediately if a vacuum source is available. 8. Simple structure and structure. The probe pin unit can be easily replaced according to the type and area of the workpiece, and has many excellent effects such as versatility.

  Hereinafter, the present invention will be described, and an electronic component such as a semiconductor product or a printed wiring circuit board in which a plurality of electrodes are formed in a predetermined arrangement will be described as an object to be inspected. An electronic component to be inspected is referred to as a workpiece.

  The present invention is a probe pin unit having probe pins made up of a large number of pins, which is used by being incorporated in an inspection apparatus for contacting a work electrode and inspecting the quality of the work. The probe pin unit is supported by a certain diaphragm and operates under reduced pressure or under vacuum, and an inspection method for an inspection object using the probe pin unit.

  In the probe pin of the present invention, a diaphragm is formed using a flexible electrical insulator, and a plurality of pins are directly planted on the diaphragm in an arrangement corresponding to the arrangement of workpiece electrodes, so that a film around the pin is formed. It is composed of a structure formed so as to bend in a vacuum.

  The probe pin unit of the present invention has a structure in which such a probe pin and a workpiece positioning piece are attached to a housing and assembled to an attachment via a pin guide plate.

  Such a probe pin unit is attached to an electronic component inspection device with a replaceable mechanism, and when inspecting the quality of a workpiece by an electronic component inspection method using the probe pin unit, the tip of each pin is directly connected to the workpiece. Butt against each electrode. According to this inspection method, contact is possible even if the surface formed by the plurality of electrodes of the work is a free curved surface. It is the surrounding film (diaphragm) that supports the pin that determines the pressing force of the pin, and its area and vacuum reach.

  On the other hand, by vacuuming, the work can be attracted toward the probe pin and can be fastened to the work positioning piece. That is, the film around each pin bends in a vacuum, but the reaction force also functions to attract the workpiece. A chuck mechanism using vacuum is common, but the probe pin itself has its function. Further, as an advantage of the vacuum, even if dust adheres to the electrode surface to which each pin contacts, the dust can be removed and collected by the vacuum.

  In a general probe pin, the plunger hits the work in several tens of grams by a spring. A large number of pins are in the form of distributed loads, and the total pressing pressure is the number of pins × load per pin. This load is harmful to the workpiece and may cause distortion of the workpiece. Therefore, this load must be supported from the opposite side of the workpiece to prevent distortion.

  According to the present invention, it is possible to cancel most of the load using a vacuum. This is because the offset load acts on the contact pressure of the pin.

  In the present invention, an electric wire capable of directly communicating with the outside can be attached to the pin, so that the contact resistance with the spring and the housing pipe is not considered like a plunger.

  Since the tip of the pin planted on the diaphragm is formed so that there is no change in position between when the workpiece is vacuum-sucked and when the workpiece is released, it basically has a structure having no movable part. Therefore, there is relatively little concern about disconnection of the lead wire connected to the base end portion of the pin. However, there are no moving parts at all. Since the diaphragm bends as the air pressure changes in the chamber formed with the workpiece, the pin itself also moves slightly. This has important implications for contacts. In other words, the contact surfaces of each other are swung, and the effect of eliminating substances that become electrical resistance can be expected.

  The probe pin of the present invention can theoretically have a contact area of several square meters, and can directly act on the pattern of a large substrate. Even in such a case, a large device for pressurizing the probe is not required.

  Hereinafter, a probe pin, a probe pin unit, and an electronic component inspection method using the same according to the present invention will be described with reference to the drawings.

  FIG. 1 is a front view of a probe pin unit according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of the probe pin unit shown in FIG. 1 on the AA line, and FIG. It is sectional drawing of a pin.

  1 and 2, reference numeral 1A indicates the probe pin unit of the present invention as a whole. The probe pin unit 1A includes a probe pin 10 of the present invention, a pin 20 (FIG. 3) constituting the probe pin 10, a housing 30, a workpiece positioning piece 40, a pin guide plate 50, and an attachment 60. Yes.

  First, the structure of the probe pin 10 of the present invention, which is a major feature of the present invention, will be described. The probe pin 10 includes a plurality of pins 20, a single vacuum pipe 11, a diaphragm 13, and a housing 30.

  As shown in FIG. 3, the pin 20 has a base portion of a pin body 22 inserted into one end of a pipe 21 and is connected by caulking at the insertion portion, and a core wire 26 of a lead wire 25 is soldered to the other end. Connected by attaching. The tip portion vicinity 23 of the pin body 22 is formed to be slightly thick, and the tip 24 is formed in a structure that can easily contact each electrode of the workpiece W, for example, a sharp shape, a rounded shape, or the like. As described above, the reason why the vicinity of the tip portion 23 of the pin 20 is formed to be slightly thick is that the portion is bonded and supported by the diaphragm 13 at this portion, but it is added to the axial direction of the pin 20 by vacuum. This is to withstand the load that is applied.

  The pin 20 is bonded and supported by a diaphragm 13, part of which is illustrated by a dotted line, at a position straddling the most part 23 in the vicinity of the tip end portion of the pin main body 22 and the rear pin main body 22. Therefore, the pin 20 has a structure that penetrates the membrane of the diaphragm 13. This pin 20 does not include a spring for pressurization as found in a pin of the prior art, and has a simple structure in which only a lead wire 25 is connected.

  In the pin 20 of the above embodiment, since the tip 24 of the pin body 22 is required to have wear resistance, there is a problem in terms of material or soldering technology with respect to the soldering of the lead wire 25. Although the pipe 21 is interposed and soldered to the lead wire 25, it is not necessary to dare to take such a structure, and a structure in which the pipe 21 is directly connected by welding or pressure bonding is preferable.

  The diaphragm 13 constituting the probe pin 10 is a one-component curing type film of silicon rubber, or another elastic resin film, and a large number of pins 20 are planted in a predetermined arrangement. It's like a sword mountain for ikebana. The thickness of the diaphragm 13 is about 3 mm in the case of the dimension of the workpiece W described below, but is appropriately selected depending on the area of the workpiece W, the thickness of the substrate, and the like. When the diaphragm 13 is cured by itself, the housing 30, the vacuum pipe 11, and the plurality of pins 20 are bonded and held together. The vacuum pipe 11 is formed with a protrusion 12 having a diameter slightly larger than the diameter of the vacuum pipe 11 on the outer periphery of the joint portion with the diaphragm 13. The pin 20 has a tip portion vicinity 23 of the pin body 22 thicker than the base. As a structure with a step, the structure can withstand axial loads.

  The tips 24 of the plurality of pins 20 constituting the probe pin 10 are aligned in a plane along the surface of the workpiece W. Accordingly, the virtual surface may form a flat surface, but may form a curved surface.

  The structure of the housing 30 is a two-stage cylindrical part in which the base end portion 31 and the tip end portion 32 are formed integrally and concentrically. The base end portion 31 has a large outer diameter, and a through hole 33 through which a plurality of bolts 70 for fixing the housing 30 itself to the attachment 60 can be inserted. The distal end portion 32 has an outer diameter smaller than the outer diameter of the base end portion 31. The diaphragm 13 is bonded to the inner peripheral surface of the distal end portion 32, and the workpiece positioning piece 40 is fitted to the outer peripheral surface. It is attached with.

  The workpiece positioning piece 40 has a cup shape, and the workpiece positioning opening 42 is opened on the mounting portion 41 and a surface perpendicular to the outer peripheral surface of the mounting portion 41, that is, as if the surface corresponds to the bottom surface of the cup. These are parts having a structure in which and are formed. As described above, the mounting portion 41 is formed with an inner diameter that is press-fitted onto the distal end portion 32 of the housing 30. The workpiece positioning opening 42 is formed to have the same outer shape as the outer shape of the workpiece W, and is large enough to fit the workpiece W therein. As will be described later, an annular support portion 43 is formed to support the workpiece W when suctioned by vacuum. That is, the workpiece positioning piece 40 attracts the workpiece W to a predetermined position by the mounting portion 41, the workpiece positioning opening 42 and the support portion 43, and the surface connecting the tips 24 of the plurality of pin bodies 22 holds the workpiece W. Before the suction, it is set so that it is in a position immediately before contacting the electrode surface of the workpiece W. Therefore, contact can be started immediately by attracting the workpiece W by vacuum, and when the workpiece W is mounted in the workpiece positioning opening 42, the contact of the pin 20 as the inside of the chamber C formed by the diaphragm 13 approaches vacuum. The pressure increases.

  The material of the workpiece positioning piece 40 is usually formed of an engineering resin having electrical insulation, and it is preferable that the workpiece W is short-circuited and not damaged even if the workpiece W is inadvertently contacted. Depending on the type of W, a conductive metal is buried in a predetermined part of the engineering resin, or the whole is formed of a conductive metal, and when it is attached to the front end portion 32 of the housing 30, the work positioning piece is obtained. It can also be configured so that it can be confirmed that 40 is attached to the front end portion 32 of the housing 30 satisfactorily.

  The pin guide plate 50 is formed with an insertion hole 51 through which the pipe 21 portion of each pin 20 passes at the center thereof, and serves to prevent mutual contact of the rear portions of the pins 20. Further, a plurality of through holes 52 into which bolts 70 for attaching the pin guide plate 50 itself to the attachment 60 can be inserted are formed in the outer peripheral portion.

  The attachment 60 is a cup-shaped member composed of a thick cylindrical portion 61 and a disc portion 62 that closes one end of the cylindrical portion 61, and a pin is provided on the end surface of the cylindrical portion 61 opposite to the disc portion 62. A circular recess 63 into which the guide plate 50 can be fitted, and a plurality of female screws 64 capable of fastening the bolt 70 are formed on the outer periphery of the circular recess 63. Further, a notch 65 is formed in a part of the outer periphery of the disc portion 62, and a plurality of lead wires 25 are bundled from the notch 65 and can be led out to the outside. On the other hand, a through hole 66 is formed in the central portion of the disc part 62, and the vacuum pipe 11 is inserted into the through hole 66 to prevent the vacuum pipe 11 from falling.

  The probe pin unit 1A of the present invention is composed of the above-described components. The vacuum pipe 11 is inserted into the through hole 66 of the attachment 60, and the pin guide plate 50 is inserted into the circular recess 63 of the attachment 60. When the housing 30 is fastened with a plurality of bolts 70 with the pin guide plate 50 interposed, the probe pin unit 1A of the present invention is obtained.

  As an example of the workpiece W, a semiconductor product on which a CCD image sensor having the following dimensions is mounted will be described, and an inspection method for inspecting using the probe pin unit 1A of the present invention will be described.

  The workpiece W is as thin as 0.37 mm, its area is 6 mm × 6 mm, and the inspection points E, which are 20 electrodes, are arranged in a pattern with a pitch of 0.65 mm in an area of 5 mm × 5 mm. Therefore, there is no mechanically supportable space on the opposite surface of the workpiece W.

  When contacting each pin 20 of the probe pin 10 to each inspection point (electrode) E of the workpiece W, it is conceivable to fix the side surface of the workpiece W, but the contact pressure of the pin 20 applied to the workpiece W is low. If the total is 400 to 600 gf, the work W is distorted as a result. I want to apply contact pressure, but I want to suppress deformation. And it is also necessary to perform mechanical positioning. The probe pin unit 1A of the present invention can also solve these two problems.

  First, the attachment 60 of the probe pin unit 1A of the present invention is attached to the inspection apparatus, the probe pin unit 1A is fixed, the lead wire 25 is connected, and the vacuum pipe 11 is connected to a vacuum pump (not shown).

  Next, the workpiece positioning opening of the workpiece positioning piece 40 is set so that the workpiece W as described above is on the probe pin 10 side on the surface to be inspected (electrode) E (hereinafter referred to as “contact surface side”). The fitting portion 41 of the work positioning piece 40 is fitted into the outer peripheral surface of the distal end portion 32 of the housing 30. By attaching the workpiece W to the housing 30 in this way, a chamber C is formed between the diaphragm 13 and the workpiece W.

  For example, there is a room with the diaphragm 13 as a floor plate, a hard wall that rises up from the floor plate, and a 360-degree secret wall, and there are many pillars of the pin 20 having the same height as this wall. The work W with the contact surface facing downward is placed on the ceiling so as not to be laterally displaced. The work W corresponding to the ceiling has a structure that is supported by the upper end surface of the wall and the pillar of the pin 20.

  In this chamber C, an opening of a vacuum pipe 11 for extracting air in the chamber C faces, and the opening position is formed on the side surface of the wall, the center of the diaphragm 13, or a plurality of locations of the diaphragm 13. This opening position is formed in consideration of the area and strength of the workpiece W. In the illustrated example, it is formed at the center of the diaphragm 13.

  The volume of the chamber C can be changed depending on the area and strength of the workpiece W to be inspected and the thickness and area of the diaphragm 13. The volume of the chamber C for a specific workpiece W is different from that of the diaphragm 13 and the workpiece positioning piece 40. It can be adjusted by interposing shims 100 (FIG. 2) having various thicknesses between the inner peripheral portion and the inner peripheral portion. In FIG. 2, the thickness of the shim 100 is thin, and is represented only by a line.

  When the air in the chamber C, which is a substantially closed room, is extracted, the heavy pressure of the outside air is applied to the pin 20 that hits the pillar. Even if the upper ends of the pins 20 are aligned, if the workpiece W that hits the ceiling is not flat, the diaphragm 13 that hits the floor rises, and this bump can eliminate the gap between the column and the ceiling. That is, this chamber C functions like that.

  That is, when the vacuum pump is operated, the air in the chamber C is sucked through the vacuum pipe 11 and becomes a vacuum state while being gradually reduced in pressure. The relationship between the pin 20 and the workpiece W is pressed against each other by the external pressure due to the reduced pressure or the vacuum state. Since the diaphragm 13 is flexible, the diaphragm 13 is bent toward the inside of the chamber C, and the deformation is maintained by a balance between its own elastic force and external pressure. One work W is not flexible enough to be bent by a partial stress, and is fixed to the support portion 43 of the chamber C. The pin 20 in contact with the contact surface of the workpiece W suppresses further deflection of the diaphragm 13 and generates a contact pressure to the contact surface of the workpiece W. The deflection of the diaphragm 13 is an element that attracts the workpiece W to the support portion 43 of the chamber C and works so as not to fall into an unstable state such as chattering even when a vacuum leaks.

  In this way, the diaphragm 13 is pulled to the contact surface side of the workpiece W, and at the same time, the workpiece W is also pulled to the pin 20 side, and comes into contact with the support portion 43 to further seal the workpiece positioning opening 42. Positioned. Accordingly, each pin 20 of the probe pin 10 contacts each inspection point (electrode) E on the contact surface of the workpiece W. In this case, even if the contact surface of the workpiece W is slightly distorted, the elastic diaphragm 13 can absorb the distortion and cause each pin 20 to contact each inspection point (electrode) E of the workpiece W accurately. it can.

  When the size of the workpiece W is small and the number of pins 20 is large, the area where the workpiece W is attracted by vacuum is naturally small. Simply, the contact pressure per pin can be easily known as adsorption area x ultimate vacuum pressure / number of pins. In the work W mounted with high density, a sufficient contact pressure may not be obtained.

  Next, the configuration and structure of the probe pin unit according to the second embodiment of the present invention will be described with reference to FIGS.

  FIG. 4 is a front view of a probe pin unit according to a second embodiment of the present invention, and FIG. 5 is a cross-sectional view of the probe pin unit shown in FIG. In the following description, the same reference numerals are given to the same components of the probe pin unit of the second embodiment as those of the probe pin unit of the first embodiment.

  4 and 5, reference numeral 1B indicates the probe pin unit of the second embodiment of the present invention as a whole. The probe pin unit 1B includes a probe pin 10 of the present invention, a pin 20 constituting the probe pin 10, a pin guide plate 50, an attachment 60, a first flange 80, and a second flange 90.

  The pin 20 shown in FIG. 3 is used. Therefore, the description is omitted.

  Further, the probe pin 10 is almost the same as that shown in FIG. 2, but at least the outer peripheral portion of the diaphragm 13 has the same thickness, and both surfaces thereof are formed in a substantially flat shape.

  Moreover, since the structure of the pin guide plate 50 and the attachment 60 is also the same as that shown in FIG. 2, description of these structures is omitted.

  This embodiment is characterized in that the diaphragm 13A of the probe pin 10 is fixed using the first flange 80 and the second flange 90 instead of the housing 30 in the first embodiment.

  The first flange 80 is a ring-shaped flange having a through hole 81 formed in the center, and three female screws 83 are formed at equiangular intervals on the outer peripheral portion 82 thereof.

  Further, the second flange 90 is also a ring-shaped flange having a through hole 91 formed in the center portion. On the inner surface on the second flange 90 side, a circular recess 92 having a diameter capable of fitting the diaphragm 13 is formed. On the outer surface from which the tip 24 of the pin 20 protrudes, a work mounting portion 94 having a substantially square recess 93 into which the work W can be fitted is formed in a bulging shape. Three female screws 96 are formed on the outer peripheral portion 95 of the second flange 90 at equiangular intervals at the intermediate portion of each female screw 83.

  In order to assemble such various parts to the attachment 60, first, the diaphragm 13 is fitted into the circular recess 92 of the second flange 90, the first flange 80 is passed from the base end portion of the pin 20, and the pin guide plate 50. The first flange 80 is fastened and fixed to the attachment 60 with the bolt 71 via the pin guide plate 50 with the base end portion of each pin 20 inserted through the pin guide plate 50. Next, the outer peripheral portion 82 of the first flange 80 is aligned with the outer peripheral portion 95 of the second flange 90, and each female screw 96 is positioned so as to be positioned at the intermediate portion of the female screw 83. 72 is screwed to fasten and fix the outer peripheral portion 95 of the second flange 90 to the outer peripheral portion 82 of the first flange 80. If the shim 100 is sandwiched between the first flange 80 and the second flange 90, the distance between the tip 24 of each pin 20 and the inspection point (electrode) of the workpiece W, that is, the capacity of the chamber C described later is set. Can be adjusted.

  In this way, the probe pin unit 1B of the second embodiment of the present invention is obtained.

  In addition, in the said 2nd Example, although the pin guide plate 50 and the 1st flange 80 were comprised separately, these can also be integrated and a component count can also be reduced.

  Even with such a configuration and structure, when the workpiece W is fitted into the recess 93, a chamber C is formed between the workpiece W and the diaphragm 13, and the vacuum pipe 11 is formed in the chamber C during inspection. If the air is sucked through the chamber C, the inside of the chamber C can be in a reduced pressure state or a vacuum state, the diaphragm 13 moves to the workpiece W side, and the tip 24 of each pin 20 is moved to the inspection point (electrode) of the workpiece W. ).

  As described above, according to the probe pin units 1A and 1B of the present invention, the pressure of each pin 20 applied to the contact surface of the workpiece W is canceled by each other without the pressure being biased to one side as the workpiece W pushes back. Therefore, the deformation of the workpiece W hardly occurs. Since the surface opposite to the contact surface of the workpiece W is completely open, there is no problem even if an adhesive is applied.

  Moreover, if it is probe pin unit 1A, 1B of this invention, the workpiece | work W can also be positioned from a side surface. Accordingly, the workpiece W is inspected while being handled, and alignment with other electronic components can be performed at the same time. That is, operations such as attaching the probe pin units 1A and 1A to the tip of the manipulator, handling the workpiece W, inspecting, and fixing the workpiece W to a predetermined place by bonding or the like can be continuously performed.

  In each of the embodiments described above, the diaphragm 13 is preferably made of silicon rubber. However, the diaphragm 13 does not necessarily have to be made of silicon rubber, and may be a flexible elastic material having electrical insulation.

  Further, each component of the probe pin units 1A and 1B is formed in a circular structure because it can be easily processed for manufacturing, but the cross-section does not have to be circular, and in particular, the shape of the contact surface of the probe pin 10 is It is desirable to form it according to the arrangement of a plurality of electrodes formed on the workpiece W.

  Furthermore, as described above, by forming the workpiece positioning piece 40 with a conductive metal, it is possible to detect the chucking state by detecting contact with the pin with the chuck of the workpiece. It may be made of engineering plastic.

  The probe pin unit of the present invention can be used in an electronic component manufacturing industry such as a semiconductor product, an electronic equipment manufacturing industry, or the like.

It is a front view of the probe pin unit of the 1st example of the present invention. It is sectional drawing on the AA line of the probe pin unit shown in FIG. It is sectional drawing of the pin which comprises the probe pin of this invention. It is a front view of the probe pin unit of 2nd Example of this invention. It is sectional drawing on the AA line of the probe pin unit shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1A ... Probe pin unit of 1st Example of this invention, 1B ... Probe pin unit of 2nd Example of this invention, 10 ... Probe pin, 11 ... Vacuum pipe, 12 ... Protrusion, 13 ... Diaphragm, 20 ... Pin, DESCRIPTION OF SYMBOLS 21 ... Pipe, 22 ... Pin main body, 23 ... Tip end vicinity, 24 ... Tip, 25 ... Lead wire, 26 ... Core wire, 30 ... Housing, 31 ... Base end part, 32 ... Tip part, 33 ... Through-hole, 40 ... Workpiece positioning piece 41 ... Mounting part 42 ... Workpiece positioning opening 43 ... Supporting part 50 ... Pin guide plate 51 ... Insertion hole 52 ... Through hole 60 ... Attachment 61 ... Cylindrical part 62 ... Disk 63, circular recess, 64 ... female thread, 65 ... notch, 66 ... through hole, 70, 71, 72 ... bolt, 80 ... first flange, 90 ... second flange, 92 ... circular recess, 93 Recess, 94 ... workpiece fixture, W ... workpiece, the inspection points of E ... workpiece W (electrode)

Claims (10)

  A plurality of pins in a predetermined arrangement and at least one vacuum pipe are supported by penetrating from one surface to the other surface of a diaphragm formed of a flexible elastic material having electrical insulation, A probe pin comprising a structure in which lead wires are connected to each other.   2. The probe pin according to claim 1, wherein a virtual plane connecting tips of the pins protruding from the diaphragm is aligned in a plane along the surface of the object to be inspected.   2. The probe pin according to claim 1, wherein a virtual plane connecting tips of the pins protruding from the diaphragm is aligned in one plane.   2. The probe pin unit according to claim 1, wherein the flexible elastic material having electrical insulation is made of rubber. A plurality of pins in a predetermined arrangement and at least one vacuum pipe are supported by penetrating from one surface to the other surface of a diaphragm formed of a flexible elastic material having electrical insulation, Probe pins to which the lead wires are connected, and
A housing that supports the outer periphery of the probe pin;
A workpiece positioning piece including a mounting portion that can be mounted on the outer peripheral portion of the distal end portion of the housing and can mount an object to be inspected in parallel with a surface formed by the tip end of each pin formed by the tip end of the probe pin;
A pin guide plate for guiding the base side of each pin on the side opposite to the side supporting the probe pin of the housing;
An attachment provided with a fixed surface to which a housing in which the probe pin and the workpiece positioning piece are mounted is fixed via the pin guide plate, and an opening for leading out the plurality of lead wires and the base of the vacuum pipe; A probe pin unit comprising: a probe pin unit.   The probe pin unit according to claim 5, wherein the workpiece positioning piece is formed of an electrically insulating material.   The probe pin unit according to claim 5, wherein at least a part of the workpiece positioning piece is made of a conductive metal. A plurality of pins in a predetermined arrangement and at least one vacuum pipe are supported by penetrating from one surface of the diaphragm formed of a flexible elastic material having electrical insulation to the other surface, Probe pins to which the lead wires are connected, and
A first flange for receiving an inner surface of an outer peripheral portion of the diaphragm of the probe pin;
A second flange in which a support part to which a workpiece is mounted is formed at the center part on the opposite side while suppressing the outer surface side of the outer peripheral part of the diaphragm of the probe pin;
A pin guide plate for guiding the base side of each pin behind the first flange;
Means for fastening the first flange and the second flange in a state of sandwiching the outer periphery of the diaphragm;
The first flange is configured to include a fixing surface fixed via the pin guide plate, and an attachment having an opening for leading out the plurality of lead wires and a base portion of the vacuum pipe. A featured probe pin unit.   The probe pin unit according to claim 8, wherein the first flange and the pin guide plate are integrally formed. A plurality of pins in a predetermined arrangement and at least one vacuum pipe are supported by penetrating from one surface of the diaphragm formed of a flexible elastic material having at least one vacuum pipe to the other surface. A chamber is formed between the probe pin having a lead wire connected to the base of each pin and the object to be inspected supported along the tip of the probe pin. By reducing the pressure through a vacuum pipe, or by vacuuming the test object, the probe pin is moved to the test object side at the same time, and the tip of each of the plurality of pins corresponds to the corresponding one. A method for inspecting an object to be inspected, wherein an electrical characteristic is inspected by contacting an inspection point of the object to be inspected.

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