CN111880067A - Wafer test assembly and electrical connection module thereof - Google Patents
Wafer test assembly and electrical connection module thereof Download PDFInfo
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- CN111880067A CN111880067A CN201910299217.XA CN201910299217A CN111880067A CN 111880067 A CN111880067 A CN 111880067A CN 201910299217 A CN201910299217 A CN 201910299217A CN 111880067 A CN111880067 A CN 111880067A
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- electrical connection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Abstract
The invention discloses a chip testing assembly and an electrical connection module thereof, wherein the electrical connection module is used for clamping between two plates so as to enable the two plates to be electrically coupled with each other. The electrical connection module comprises a plurality of spring plates and an insulating piece. The elastic sheets are arranged at intervals and each elastic sheet comprises a base, an upper elastic arm and a lower elastic arm, wherein the upper elastic arm and the lower elastic arm extend from the base towards the direction away from each other. The insulating piece is connected with the base parts of the elastic sheets, and the upper elastic arm and the lower elastic arm of each elastic sheet respectively protrude out of two opposite sides of the insulating piece. The upper elastic arms of the elastic sheets are used for respectively abutting against one of the plate pieces, and the lower elastic arms of the elastic sheets are used for respectively abutting against the other plate piece. Therefore, the components of the wafer test assembly can be easily detached from each other, so that the subsequent detection and maintenance are facilitated.
Description
Technical Field
The present invention relates to a testing assembly, and more particularly to a wafer testing assembly and an electrical connection module thereof.
Background
The conventional wafer testing device comprises a testing circuit board electrically coupled to the testing machine and a signal transmission board arranged on the testing circuit board, wherein the signal transmission board is welded and fixed on the testing circuit board in the conventional testing device. However, in the process of soldering and fixing the signal transmission board and the test circuit board, the conventional wafer testing device is easily damaged by thermal shock. Moreover, the signal transmission board and the test circuit board which are welded and fixed are not beneficial to subsequent detection and maintenance of the signal transmission board and the test circuit board.
The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.
Disclosure of Invention
Embodiments of the present invention provide a wafer test assembly and an electrical connection module thereof, which can effectively overcome the defects possibly generated by the conventional wafer test apparatus.
The embodiment of the invention discloses a wafer testing component, which comprises: a signal transmission board, which comprises a plurality of connecting pads and is used for connecting a probe head; the functional board is provided with a first board surface and a second board surface which are positioned on the opposite sides, and the functional board comprises a plurality of built-in capacitors, a plurality of first contacts positioned on the first board surface and a plurality of second contacts positioned on the second board surface; the first contacts and the second contacts are electrically coupled to the capacitors; the first electric connection module is clamped between the signal transmission plate and the function plate; wherein, the first electrical connection module comprises: the first elastic sheets are arranged at intervals and respectively comprise a first base part, a first upper elastic arm and a first lower elastic arm which extend from the first base part towards the direction away from each other; the first insulating piece is connected with the first base parts of the first elastic sheets, and the first upper elastic arm and the first lower elastic arm of each first elastic sheet respectively protrude out of two opposite sides of the first insulating piece; the first upper elastic arms of the first elastic sheets respectively prop against the connecting pads of the signal transmission board, and the first lower elastic arms of the first elastic sheets respectively prop against the first contacts of the function board; the testing circuit board comprises a plurality of metal pads which are arranged at intervals and is used for being electrically coupled with a testing machine table; the second electric connection module is clamped between the function board and the test circuit board; wherein the second electrical connection module comprises: a plurality of second elastic pieces which are arranged at intervals and each of which comprises a second base part, and a second upper elastic arm and a second lower elastic arm which extend from the second base part towards the direction away from each other; the second upper elastic arm and the second lower elastic arm of each second elastic sheet respectively protrude out of two opposite sides of the second insulating piece; the second upper elastic arms of the second elastic sheets respectively abut against the second contacts of the function board, and the second lower elastic arms of the second elastic sheets respectively abut against the metal pads of the circuit board; the signal transmission board, the function board and the test circuit board can be electrically coupled with each other through the first electrical connection module and the second electrical connection module.
Preferably, the signal transmission plate comprises a top surface and a bottom surface which are positioned at opposite sides, and a plurality of connecting pads are positioned on the bottom surface of the signal transmission plate; the top surface of the signal transmission plate is used for connecting the probe head, and a plurality of connecting pads can be electrically coupled with the probe head.
Preferably, each first elastic sheet is an integrally formed one-piece member, and the plurality of first bases of the first electrical connection module are arranged in a coplanar manner through connection of the first insulating member.
Preferably, the first base of each of the first resilient sheets surrounds and forms an opening, and the opening of each of the first resilient sheets is S-shaped in a top plan view, and each of the first resilient sheets is Z-shaped in a side plan view.
Preferably, the wafer test assembly further comprises a screw set, and the signal transmission board, the first electrical connection module, the function board, the second electrical connection module and the test circuit board are fixed by the screw set to maintain their relative positions; any electrical transmission path between the test circuit board, the function board, and the signal transmission board is not achieved with any solder material.
Preferably, the wafer test assembly further comprises a probe head disposed on the signal transmission plate, and the probe head comprises: a positioning base; the plurality of conductive probes are positioned on the positioning seat body in a penetrating way; one end of each conductive probe penetrates through the positioning base body and abuts against the signal transmission plate, and the other end of each conductive probe penetrates through the positioning base body and is used for abutting against an object to be detected.
The embodiment of the invention also discloses a wafer testing component, which comprises: a signal transmission board, which comprises a plurality of connecting pads and is used for connecting a probe head; the testing circuit board comprises a plurality of metal pads which are arranged at intervals and is used for being electrically coupled with a testing machine table; the electric connection module is clamped between the signal transmission plate and the test circuit board; wherein, the electrical connection module includes: a plurality of elastic sheets which are arranged at intervals and each of which comprises a base part, an upper elastic arm and a lower elastic arm which extend from the base part towards the direction away from each other; the insulating piece is connected with the base parts of the elastic sheets, and the upper elastic arm and the lower elastic arm of each elastic sheet respectively protrude out of two opposite sides of the insulating piece; the upper elastic arms of the elastic sheets respectively prop against the connecting pads of the signal transmission plate, and the lower elastic arms of the elastic sheets respectively prop against the metal pads of the test circuit board; the signal transmission board and the test circuit board can be electrically coupled with each other through the electrical connection module.
Preferably, the signal transmission plate includes a top surface and a bottom surface on opposite sides, the connection pads are embedded in the signal transmission plate and adjacent to the top surface, the signal transmission plate is recessed from the bottom surface to form at least one blind hole, the connection pads are exposed in the blind holes, and the upper elastic arms of the elastic pieces penetrate through the blind holes and respectively abut against the connection pads; the top surface of the signal transmission plate is used for connecting the probe head, and a plurality of connecting pads can be electrically coupled with the probe head.
The embodiment of the invention also discloses an electrical connection module of a chip testing component, which is used for clamping between two plates so as to enable the two plates to be electrically coupled with each other, and the electrical connection module comprises: a plurality of elastic sheets which are arranged at intervals and each of which comprises a base part, an upper elastic arm and a lower elastic arm which extend from the base part towards the direction away from each other; the insulating piece is connected with the base parts of the elastic sheets, and the upper elastic arm and the lower elastic arm of each elastic sheet respectively protrude out of two opposite sides of the insulating piece; the upper elastic arms of the elastic sheets are used for respectively abutting against one of the plate pieces, and the lower elastic arms of the elastic sheets are used for respectively abutting against the other plate piece.
The embodiment of the invention also discloses a wafer testing assembly, which comprises: a signal transmission board, which comprises a plurality of connecting pads and is used for connecting a probe head; the functional board is provided with a first board surface and a second board surface which are positioned on the opposite sides, and the functional board comprises a plurality of built-in capacitors, a plurality of first contacts positioned on the first board surface and a plurality of second contacts positioned on the second board surface; the plurality of first contacts and the plurality of second contacts are electrically coupled to the plurality of capacitors, and the plurality of connecting pads of the signal transmission board are respectively welded and fixed to the plurality of first contacts of the function board; the testing circuit board comprises a plurality of metal pads which are arranged at intervals and is used for being electrically coupled with a testing machine table; the electric connection module is clamped between the signal transmission plate and the test circuit board; wherein, the electrical connection module includes: a plurality of elastic sheets which are arranged at intervals and each of which comprises a base part, an upper elastic arm and a lower elastic arm which extend from the base part towards the direction away from each other; the insulating piece is connected with the base parts of the elastic sheets, and the upper elastic arm and the lower elastic arm of each elastic sheet respectively protrude out of two opposite sides of the insulating piece; the upper elastic arms of the elastic sheets respectively prop against the second contacts of the function board, and the lower elastic arms of the elastic sheets respectively prop against the metal pads of the test circuit board; the function board and the test circuit board can be electrically coupled with each other through the electrical connection module.
In summary, the wafer test assembly and the electrical connection module thereof disclosed in the embodiments of the invention are formed by electrically connecting two plates (e.g., a signal transmission plate and a function plate, a function plate and a test circuit board, or a signal transmission plate and a test circuit board) with elastic arms (e.g., a first elastic arm and/or a second elastic arm) without using soldering. Further, since the elastic arm 32 is detachably pressed to the two plates, the components of the wafer test assembly can be easily separated from each other, thereby facilitating the subsequent inspection and maintenance of the wafer test assembly.
For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.
Drawings
Fig. 1A is a schematic cross-sectional view of a wafer test assembly according to a first embodiment of the invention.
FIG. 1B is a schematic view of another variation of FIG. 1A.
Fig. 2 is a partially exploded view of fig. 1A (omitting the probe head).
Fig. 3 is a schematic perspective view of an electrical connection module (a first electrical connection module or a second electrical connection module) according to a first embodiment of the invention.
Fig. 4 is a schematic top view of fig. 3.
Fig. 5 is a schematic view of a variation of fig. 3.
Fig. 6 is a top view of fig. 5.
Fig. 7 is a schematic view of another variation of fig. 3.
Fig. 8 is a schematic cross-sectional view of a wafer test assembly according to a second embodiment of the invention.
Fig. 9 is a partially exploded view of fig. 8 (omitting the probe head).
Detailed Description
Please refer to fig. 1A to 9, which are exemplary embodiments of the present invention, and it should be noted that, in the embodiments, the related numbers and shapes mentioned in the accompanying drawings are only used for describing the embodiments of the present invention in detail, so as to facilitate the understanding of the contents of the present invention, and not for limiting the protection scope of the present invention.
[ example one ]
As shown in fig. 1A to 7, it is a first embodiment of the present invention. The dimensions of the elements shown in fig. 1A-7 are merely schematic representations, which may be varied according to design requirements (e.g., the length of the elements extends outward), and are not limited to those shown in the drawings.
As shown in fig. 1A and fig. 2, the present embodiment discloses a chip testing assembly 100, which includes a signal transmission board 1(space transformer), a function board 2, a first electrical connection module 3 clamped between the signal transmission board 1 and the function board 2, a test circuit board 4, a second electrical connection module 5 clamped between the function board 2 and the test circuit board 4, a probe head 6 disposed on the signal transmission board 1, and a screw set 7. In the embodiment, the probe head 6, the signal transmission board 1, the first electrical connection module 3, the function board 2, the second electrical connection module 5, and the test circuit board 4 are stacked in order from bottom to top in fig. 1A, but the invention is not limited thereto.
It should be noted that the signal transmission board 1, the first electrical connection module 3, the function board 2, the second electrical connection module 5, and the test circuit board 4 of the chip test assembly 100 are fixed by the screws 7 to maintain their relative positions in the present embodiment, and the signal transmission board 1, the function board 2, and the test circuit board 4 can be electrically coupled to each other through the first electrical connection module 3 and the second electrical connection module 5. Accordingly, the signal transmission board 1, the first electrical connection module 3, the function board 2, the second electrical connection module 5, and the test circuit board 4 of the present embodiment can be fixed to each other without soldering. For example: any electrical transmission path between the test circuit board 4, the function board 2, and the signal transmission board 1 is not achieved with any solder material.
In addition, the first electrical connection module 3 and the second electrical connection module 5 are described together with the above components in this embodiment, but the invention is not limited thereto. For example, in other embodiments of the present invention, the first electrical connection module 3 can also be used independently and referred to as the electrical connection module 3, for being clamped between two boards to electrically couple the boards to each other.
In addition, in other embodiments not shown in the present invention, the screw set 7 can penetrate and fix the probe head 6, the signal transmission board 1, the first electrical connection module 3, the function board 2, the second electrical connection module 5, and the test circuit board 4, thereby being fixed to each other without soldering. Alternatively, the wafer test assembly 100 can replace the screw set 7 in other ways, such as: the various components of the wafer test assembly 100 are adhesively secured to one another.
In addition, the wafer test assembly 100 of the present embodiment preferably excludes any test apparatus that is not suitable for the probe head 6, but the invention is not limited thereto. The structure and connection relationship of each component of the wafer test assembly 100 of the present embodiment will be described below.
As shown in fig. 1A and fig. 2, the signal transmission plate 1 has a top surface 11 and a bottom surface 12 on opposite sides, and the bottom surface 12 of the signal transmission plate 1 faces the first electrical connection module 3. The bottom surface 12 of the signal transmission board 1 is provided with a plurality of connecting pads 13. It should be noted that the connecting pads 13 are illustrated as square in the embodiment, but in practical applications, the shape of the connecting pads 13 can be adjusted and varied according to design requirements (e.g., circular, rectangular, or irregular). The top surface 11 of the signal transmission board 1 is used to connect to the probe head 6, so that the plurality of connecting pads 13 can be electrically coupled to the probe head 6.
The function board 2 has a first board surface 21 and a second board surface 22 located on opposite sides, and the first board surface 21 of the function board 2 faces the first electrical connection module 3. The function board 2 includes a plurality of built-in capacitors 23, a plurality of first contacts 24 located on the first board 21, and a plurality of second contacts 25 located on the second board 22. Furthermore, the plurality of first contacts 24 and the plurality of second contacts 25 are electrically coupled to the plurality of capacitors 23, and the arrangement of the plurality of first contacts 24 of the functional board 2 is substantially the same as the arrangement of the plurality of connecting pads 13 of the signal transmission board 1, but the invention is not limited thereto.
As shown in fig. 2 to 4, the first electrical connection module 3 is clamped between the signal transmission board 1 and the function board 2, so that the signal transmission board 1 and the function board 2 are electrically coupled to each other through the first electrical connection module 3. The first electrical connection module 3 includes a plurality of first elastic pieces 31 disposed at intervals and a first insulating member 32 connected to the plurality of first elastic pieces 31. It should be noted that, since the structures of the plurality of first elastic pieces 31 are substantially the same in the present embodiment, for convenience of description, only the structure of one of the first elastic pieces 31 is described below, but the present invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, the structures of the plurality of first resilient sheets 31 may also be different.
In the embodiment, the first elastic sheet 31 is an integrally formed one-piece member, and the outer surface of the first elastic sheet 31 is preferably plated with a nickel layer, but not limited thereto. The first elastic sheet 31 includes a first base 311, and a first upper elastic arm 312 and a first lower elastic arm 313 extending from the first base 311 in a direction away from each other.
More specifically, the first base 311 is annular and surrounds an opening 314, the first upper elastic arm 312 and the first lower elastic arm 313 are respectively formed by bending and extending from two opposite sides of an inner edge of the first base 311, and the first upper elastic arm 312 and the first lower elastic arm 313 extend from different sides, such that the first upper elastic arm 312 is located above the first base 311, and the first lower elastic arm 313 is located below the first base 311. The angles between the first upper elastic arm 312 and the first lower elastic arm 313 and the first base 311 are preferably the same (e.g., the angle is between 100 degrees and 150 degrees), but the invention is not limited thereto.
In other words, the opening 314 of the first resilient plate 31 is S-shaped in a top plan view (see fig. 4), and the first resilient plate 31 is Z-shaped in a side plan view (see fig. 2), but the specific structure of the first resilient plate 31 can be adjusted according to design requirements, and is not limited to the embodiment. For example, the first resilient piece 31 may be formed in a modified manner as shown in fig. 5 and 6, in which the first upper resilient arm 312 and the first lower resilient arm 313 are formed by bending and extending from the same side of the inner edge of the first base 311, so that the opening 314 of the first resilient piece 31 can be E-shaped in a top plan view; alternatively, the first elastic sheet 31 may also be formed in a modified manner as shown in fig. 7.
As shown in fig. 2 to 4, the first insulating member 32 is connected to the first base portions 311 of the first elastic pieces 31, and the first base portions 311 of the first electrical connection module 3 are disposed in a coplanar manner and electrically insulated from each other by the connection of the first insulating member 32 in this embodiment, but the invention is not limited thereto. The first insulating member 32 is sheet-shaped and connected to the outer edge of each first base 311, and the first upper elastic arm 312 and the first lower elastic arm 313 of each first elastic sheet 31 respectively protrude out of two opposite sides of the first insulating member 32.
In addition, the first upper elastic arms 312 of the first elastic pieces 31 of the first electrical connection module 3 respectively prop against the connecting pads 13 of the signal transmission board 1, and the first lower elastic arms 313 of the first elastic pieces 31 respectively prop against the first contacts 24 of the function board 2, so that any one of the first elastic pieces 31 can form a current transmission path electrically coupling the signal transmission board 1 and the function board 2. Further, the first upper elastic arm 312 and the first lower elastic arm 313 of any one of the first elastic pieces 31 can store a resilient force by being pressed by the corresponding connecting pad 13 and the corresponding first contact 24, so as to stably maintain the connection.
As shown in fig. 1A and fig. 2, the test circuit board 4 is configured to be electrically coupled to a testing machine (not shown), and the test circuit board 4 includes a plurality of metal pads 41 disposed at intervals on a board surface (e.g., a top surface of the test circuit board 4 in fig. 2), and the arrangement of the plurality of connection pads 13 of the signal transmission board 1 is substantially the same as the arrangement of the plurality of first contacts 24 of the functional board 2, but the invention is not limited thereto. Accordingly, the metal pads 41 are electrically coupled to a testing machine, so as to analyze the signal received by the testing circuit board 4 through the testing machine. It should be noted that the electrical coupling between the test circuit board 4 and the test machine can be adjusted according to the design requirement. For example, in other embodiments not shown in the present invention, the test circuit board 4 may also be directly integrated into a test machine.
As shown in fig. 2 to 4, the second electrical connection module 5 is clamped between the function board 2 and the test circuit board 4, so that the function board 2 and the test circuit board 4 are electrically coupled to each other through the second electrical connection module 5. In the present embodiment, the structure of the second electrical connection module 5 is substantially the same as the first electrical connection module 3, so the following description only describes the structure of the second electrical connection module 5, but the present invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, the second electrical connection module 5 may also have a different structure from the first electrical connection module 3.
In this embodiment, the second electrical connection module 5 includes a plurality of second elastic pieces 51 disposed at intervals and a second insulating member 52 connected to the plurality of second elastic pieces 51. It should be noted that, since the structures of the plurality of second elastic pieces 51 are substantially the same in the present embodiment, for convenience of description, only the structure of one of the second elastic pieces 51 is described below, but the present invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, the structures of the plurality of second resilient sheets 51 may also be different.
In the embodiment, the second elastic sheet 51 is an integrally formed one-piece member, and the outer surface of the second elastic sheet 51 is preferably plated with a nickel layer, but not limited thereto. The second elastic piece 51 includes a second base 511, and a second upper elastic arm 512 and a second lower elastic arm 513 extending from the second base 511 in a direction away from each other. The second base 511 is annular and surrounds an opening 514, and the second upper elastic arm 512 and the second lower elastic arm 513 are respectively formed by bending and extending from two opposite sides of the inner edge of the second base 511.
The second insulating member 52 is connected to the second bases 511 of the second elastic pieces 51, and the second bases 511 of the second electrical connection module 5 are disposed in a coplanar manner and electrically insulated from each other through the connection of the second insulating member 52 in this embodiment, but the invention is not limited thereto. The second insulating member 52 is sheet-shaped and connected to the outer edge of each second base 511, and the second upper elastic arm 512 and the second lower elastic arm 513 of each second elastic sheet 51 respectively protrude out of the two opposite sides of the second insulating member 52.
In addition, the second upper elastic arms 512 of the second elastic pieces 51 of the second electrical connection module 5 respectively abut against the second contacts 25 of the function board 2, and the second lower elastic arms 513 of the second elastic pieces 51 respectively abut against the metal pads 41 of the test circuit board 4, so that any one of the second elastic pieces 51 can form a current transmission path electrically coupling the function board 2 and the test circuit board 4. Further, the second upper elastic arm 512 and the second lower elastic arm 513 of any one of the second elastic pieces 51 can store a resilient force by being pressed by the corresponding second contact 25 and the metal pad 41, so as to be stably connected.
As shown in fig. 1A, the probe head 6 is disposed on the top surface 11 of the signal transmission board 1, and the probe head 6 can be electrically coupled to the test circuit board 4 through the signal transmission board 1. The probe head 6 includes a positioning base 61 and a plurality of conductive probes 62 passing through the positioning base 61, wherein one end of each conductive probe 62 (e.g., the bottom end of the conductive probe 62 in fig. 1A) passes through the positioning base 61 and abuts against the top surface 11 of the signal transmission board 1, and the other end of each conductive probe 62 (e.g., the top end of the conductive probe 62 in fig. 1A) passes through the positioning base 61 and abuts against an object to be tested (e.g., a semiconductor wafer).
It should be noted that the conductive probe 62 is in a flexible strip-shaped structure and is electrically conductive in the embodiment, but the conductive probe 62 of the present invention is not limited to a rectangular conductive probe, a circular conductive probe, or other conductive probes.
In addition, the wafer test assembly 100 can replace the screw set 7 in other ways in the embodiment; as shown in fig. 1B, when the thickness of the signal transmission board 1 is relatively thin, the signal transmission board 1 and the function board 2 can be directly welded and fixed to each other, so as to enhance the rigidity of the signal transmission board 1, and facilitate the subsequent use of the second electrical connection module 5 for crimping with the test circuit board 4. That is, the chip testing assembly 100 omits the first electrical connection module 3, and the second electrical connection module 5 and each component thereof can omit the word "second" (e.g., the second elastic piece 51 and the second insulating piece 52 can be referred to as the elastic piece 51 and the insulating piece 52, respectively), and the connection pads 13 of the signal transmission board 1 are soldered and fixed to the first contacts 24 of the function board 2, respectively.
[ example two ]
Referring to fig. 8 and 9, which are second embodiments of the present invention, the present embodiment is similar to the first embodiment, so the same points (e.g., the probe head 6, the first electrical connection module 3, and the test circuit board 4) of the two embodiments are not repeated, and the differences between the present embodiment and the first embodiment are substantially as follows:
specifically, the first electrical connection module 3 and the first elastic piece 31 and the first insulating piece 32 thereof in the first embodiment are respectively referred to as the electrical connection module 3, the elastic piece 31 and the insulating piece 32 in the present embodiment, and the first base 311, the first upper elastic arm 312 and the first lower elastic arm 313 in the first embodiment are respectively referred to as the base 311, the upper elastic arm 312 and the lower elastic arm 313 in the present embodiment. Furthermore, the chip testing assembly 100 does not include the function board 2 and the second electrical connection module 5 in the present embodiment, so the electrical connection module 3 of the present embodiment is clamped between the signal transmission board 1 and the testing circuit board 4, so that the signal transmission board 1 and the testing circuit board 4 can be electrically coupled to each other through the electrical connection module 3.
Accordingly, since the electrical connection module 3 and the test circuit board 4 of the present embodiment are similar to the first electrical connection module 3 and the test circuit board 4 of the first embodiment, the present embodiment is not repeated, and the following description mainly describes the signal transmission board 1 and the corresponding connection relationship thereof.
As shown in fig. 8 and 9, the signal transmission plate 1 has a top surface 11 and a bottom surface 12 on opposite sides, and the bottom surface 12 of the signal transmission plate 1 faces the electrical connection module 3. The signal transmission plate 1 includes a plurality of connection pads 13 embedded therein and adjacent to the top surface 11. The top surface 11 of the signal transmission board 1 is used for connecting to the probe head 6, and a plurality of connecting pads 13 can be electrically coupled to the probe head 6. Furthermore, the signal transmission plate 1 is formed with at least one blind hole 14 recessed from the bottom surface 12, and the plurality of connection pads 13 are exposed from the at least one blind hole 14.
Furthermore, the upper elastic arms 312 of the elastic pieces 31 of the electrical connection module 3 penetrate through the at least one blind hole 14 and respectively abut against the connecting pads 13 of the signal transmission plate 1, and the lower elastic arms 313 of the elastic pieces 31 of the electrical connection module 3 respectively abut against the metal pads 41 of the test circuit board 4.
In another aspect, the electrical connection module 3 can be clamped between two plates (e.g., the signal transmission plate 1 and the test circuit board 4) to electrically couple the two plates, and the upper elastic arms 312 of the elastic pieces 31 are respectively abutted against one of the plates (e.g., the signal transmission plate 1), and the lower elastic arms 313 of the elastic pieces 31 are respectively abutted against the other plate (e.g., the test circuit board 4).
[ technical effects of embodiments of the present invention ]
In summary, the chip test assembly and the electrical connection module thereof disclosed in the embodiments of the invention electrically connect two plates (e.g., the signal transmission board and the function board, the function board and the test circuit board, or the signal transmission board and the test circuit board) with the elastic arms (e.g., the first elastic arm and/or the second elastic arm), without using soldering. Furthermore, because the elastic arm is detachably pressed on the two plates, the components of the wafer test assembly can be easily detached from each other, thereby facilitating the subsequent detection and maintenance of the wafer test assembly. However, when the signal transmission plate is thinner, the signal transmission plate and the function plate can still be directly welded with each other, so as to improve the rigidity of the signal transmission plate, and facilitate the subsequent use of the second electrical connection module (such as the second lower elastic arm) for pressure welding with the test circuit board.
Furthermore, the signal transmission board of the conventional chip testing device needs to be provided with electronic components (such as passive components), but the arrangement area of the electronic components on the signal transmission board is limited, and when the signal transmission board has the transmission quality requirement, the performance of the signal transmission board is affected by the arrangement path of the electronic components. Therefore, the wafer test assembly disclosed by the embodiment of the invention can effectively simplify the structure of the signal transmission plate by adopting the independent function plate; and the two sides of the function board are respectively and electrically connected with the integral framework of the signal transmission board and the test circuit board through the first electrical connection module and the second electrical connection module, so that the framework of the existing wafer test device is not only eliminated, but also the circuit transmission path can be effectively shortened, and the efficiency of the wafer test component is favorably improved.
The disclosure is only a preferred embodiment of the invention and is not intended to limit the scope of the invention, so that all equivalent technical changes made by using the contents of the specification and drawings are included in the scope of the invention.
Claims (10)
1. A wafer test assembly, comprising:
a signal transmission board, which comprises a plurality of connecting pads and is used for connecting a probe head;
the functional board is provided with a first board surface and a second board surface which are positioned on the opposite sides, and the functional board comprises a plurality of built-in capacitors, a plurality of first contacts positioned on the first board surface and a plurality of second contacts positioned on the second board surface; the first contacts and the second contacts are electrically coupled to the capacitors;
the first electric connection module is clamped between the signal transmission plate and the function plate; wherein, the first electrical connection module comprises:
the first elastic sheets are arranged at intervals and respectively comprise a first base part, a first upper elastic arm and a first lower elastic arm which extend from the first base part towards the direction away from each other; and
the first insulating piece is connected with the first base parts of the first elastic sheets, and the first upper elastic arm and the first lower elastic arm of each first elastic sheet respectively protrude out of two opposite sides of the first insulating piece;
the first upper elastic arms of the first elastic sheets respectively prop against the connecting pads of the signal transmission board, and the first lower elastic arms of the first elastic sheets respectively prop against the first contacts of the function board;
the testing circuit board comprises a plurality of metal pads which are arranged at intervals and is used for being electrically coupled with a testing machine table; and
the second electrical connection module is clamped between the function board and the test circuit board; wherein the second electrical connection module comprises:
a plurality of second elastic pieces which are arranged at intervals and each of which comprises a second base part, and a second upper elastic arm and a second lower elastic arm which extend from the second base part towards the direction away from each other; and
the second insulating piece is connected with the second base parts of the second elastic sheets, and the second upper elastic arm and the second lower elastic arm of each second elastic sheet respectively protrude out of two opposite sides of the second insulating piece;
the second upper elastic arms of the second elastic sheets respectively abut against the second contacts of the function board, and the second lower elastic arms of the second elastic sheets respectively abut against the metal pads of the circuit board;
the signal transmission board, the function board and the test circuit board can be electrically coupled with each other through the first electrical connection module and the second electrical connection module.
2. The wafer test assembly as recited in claim 1, wherein the signal transmission plate includes a top surface and a bottom surface on opposite sides, and a plurality of the connection pads are located on the bottom surface of the signal transmission plate; the top surface of the signal transmission plate is used for connecting the probe head, and a plurality of connecting pads can be electrically coupled with the probe head.
3. The wafer test assembly as recited in claim 1, wherein each of the first resilient tabs is a one-piece member integrally formed, and the first bases of the first electrical connection modules are disposed in a coplanar manner by connection of the first insulating members.
4. The wafer test assembly of claim 3, wherein the first base portion of each of the first resilient tabs surrounds an opening, and the opening of each of the first resilient tabs is S-shaped in a top plan view and each of the first resilient tabs is Z-shaped in a side plan view.
5. The wafer test assembly as recited in claim 1, wherein the wafer test assembly further comprises a screw set, and the signal transmission board, the first electrical connection module, the function board, the second electrical connection module, and the test circuit board are fixed to each other by the screw set; any electrical transmission path between the test circuit board, the function board, and the signal transmission board is not achieved with any solder material.
6. The wafer test assembly of claim 1, further comprising a probe head disposed on the signal transmission plate, wherein the probe head comprises:
a positioning base; and
the plurality of conductive probes are positioned on the positioning seat body in a penetrating way; one end of each conductive probe penetrates through the positioning base body and abuts against the signal transmission plate, and the other end of each conductive probe penetrates through the positioning base body and is used for abutting against an object to be detected.
7. A wafer test assembly, comprising:
a signal transmission board, which comprises a plurality of connecting pads and is used for connecting a probe head;
the testing circuit board comprises a plurality of metal pads which are arranged at intervals and is used for being electrically coupled with a testing machine table; and
the electrical connection module is clamped between the signal transmission plate and the test circuit board; wherein, the electrical connection module includes:
a plurality of elastic sheets which are arranged at intervals and each of which comprises a base part, an upper elastic arm and a lower elastic arm which extend from the base part towards the direction away from each other; and
the insulating piece is connected with the base parts of the elastic sheets, and the upper elastic arm and the lower elastic arm of each elastic sheet respectively protrude out of two opposite sides of the insulating piece;
the upper elastic arms of the elastic sheets respectively prop against the connecting pads of the signal transmission plate, and the lower elastic arms of the elastic sheets respectively prop against the metal pads of the test circuit board;
the signal transmission board and the test circuit board can be electrically coupled with each other through the electrical connection module.
8. The wafer test assembly according to claim 7, wherein the signal transmission plate comprises a top surface and a bottom surface on opposite sides, the connection pads are embedded in the signal transmission plate and adjacent to the top surface, the signal transmission plate is recessed from the bottom surface to form at least one blind hole, the connection pads are exposed in the at least one blind hole, and the upper elastic arms of the elastic pieces penetrate through the at least one blind hole and respectively abut against the connection pads; the top surface of the signal transmission plate is used for connecting the probe head, and a plurality of connecting pads can be electrically coupled with the probe head.
9. An electrical connection module of a chip testing device, the electrical connection module being configured to be clamped between two plates so as to be electrically coupled to each other, the electrical connection module comprising:
a plurality of elastic sheets which are arranged at intervals and each of which comprises a base part, an upper elastic arm and a lower elastic arm which extend from the base part towards the direction away from each other; and
the insulating piece is connected with the base parts of the elastic sheets, and the upper elastic arm and the lower elastic arm of each elastic sheet respectively protrude out of two opposite sides of the insulating piece;
the upper elastic arms of the elastic sheets are used for respectively abutting against one of the plate pieces, and the lower elastic arms of the elastic sheets are used for respectively abutting against the other plate piece.
10. A wafer test assembly, comprising:
a signal transmission board, which comprises a plurality of connecting pads and is used for connecting a probe head;
the functional board is provided with a first board surface and a second board surface which are positioned on the opposite sides, and the functional board comprises a plurality of built-in capacitors, a plurality of first contacts positioned on the first board surface and a plurality of second contacts positioned on the second board surface; the plurality of first contacts and the plurality of second contacts are electrically coupled to the plurality of capacitors, and the plurality of connecting pads of the signal transmission board are respectively welded and fixed to the plurality of first contacts of the function board;
the testing circuit board comprises a plurality of metal pads which are arranged at intervals and is used for being electrically coupled with a testing machine table; and
the electrical connection module is clamped between the signal transmission plate and the test circuit board; wherein, the electrical connection module includes:
a plurality of elastic sheets which are arranged at intervals and each of which comprises a base part, an upper elastic arm and a lower elastic arm which extend from the base part towards the direction away from each other; and
the insulating piece is connected with the base parts of the elastic sheets, and the upper elastic arm and the lower elastic arm of each elastic sheet respectively protrude out of two opposite sides of the insulating piece;
the upper elastic arms of the elastic sheets respectively prop against the second contacts of the function board, and the lower elastic arms of the elastic sheets respectively prop against the metal pads of the test circuit board;
the function board and the test circuit board can be electrically coupled with each other through the electrical connection module.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910299217.XA CN111880067B (en) | 2019-04-15 | 2019-04-15 | Chip testing assembly and electric connection module thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910299217.XA CN111880067B (en) | 2019-04-15 | 2019-04-15 | Chip testing assembly and electric connection module thereof |
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| CN111880067A true CN111880067A (en) | 2020-11-03 |
| CN111880067B CN111880067B (en) | 2023-05-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI759937B (en) * | 2020-11-03 | 2022-04-01 | 中華精測科技股份有限公司 | Board-like connector and wafer testing assembly |
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| CN111880067B (en) | 2023-05-05 |
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