CN206945746U - Integrated chip test bench and integrated chip test module - Google Patents

Integrated chip test bench and integrated chip test module Download PDF

Info

Publication number
CN206945746U
CN206945746U CN201720550166.XU CN201720550166U CN206945746U CN 206945746 U CN206945746 U CN 206945746U CN 201720550166 U CN201720550166 U CN 201720550166U CN 206945746 U CN206945746 U CN 206945746U
Authority
CN
China
Prior art keywords
integrated chip
pedestal
lid
slot
chip test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201720550166.XU
Other languages
Chinese (zh)
Inventor
段超毅
蒋伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Kaizhi Tong Micro Electronic Te Co Ltd
Original Assignee
Shenzhen Kaizhi Tong Micro Electronic Te Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Kaizhi Tong Micro Electronic Te Co Ltd filed Critical Shenzhen Kaizhi Tong Micro Electronic Te Co Ltd
Priority to CN201720550166.XU priority Critical patent/CN206945746U/en
Priority to TW106209388U priority patent/TWM557829U/en
Application granted granted Critical
Publication of CN206945746U publication Critical patent/CN206945746U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a kind of integrated chip test bench, including:First pedestal, including support and the dividing plate fixed with the support, enclose to form the first slot between any two dividing plate;First lid, has the cavity volume to connect with the first slot, and the first lid top surface offers multiple second slots;And multiple first elastic probes, including fixed part, the first elastic arm and the second elastic arm, the free end of first elastic arm is provided with the first detector, the free end of second elastic arm is provided with the second detector, first elastic arm is located in the first slot, first detector stretches out the first slot, to contact printed circuit board (PCB);Second elastic arm is placed in cavity volume, and the second detector stretches out second slot, to contact integrated circuit package;In addition, also disclosing one kind can be used for TSOP, SOP encapsulation whole looping test module of integrated chip, it is simple in construction, and purchase cost can be reduced, tester is reduced, improves testing efficiency, so that effectively save manufacturing cost and cost of equipment maintenance.

Description

Integrated chip test bench and integrated chip test module
Technical field
Integrated chip test bench field is the utility model is related to, more particularly to a kind of integrated chip test bench and integrated chip Test module.
Background technology
Conductor integrated circuit device will pass through a series of test, including IC design prototype from shaping is designed into Validation test, wafer built-in testing, packaging and testing etc..The test of integrated chip at present typically uses probe structure test bench, its It is main to include test probe base, fixed probe base and test probe.Traditional test probe is mainly by probe, sleeve and interior Portion's spring three parts are formed, complicated, and cost of manufacture is high, expensive, and during Reusability, probe and set It can cause to wear because rubbing repeatedly between cylinder, and maintenance or replacing to testing probe are more difficult, so as to add test bench Maintenance cost.
Utility model content
Main purpose of the present utility model is to propose a kind of integrated chip test bench, it is intended to solves existing probe structure and surveys Seat is tried because probe structure is complicated and easy to wear in use, causes the making of test bench and the technology that maintenance cost is higher Problem.
To achieve the above object, the utility model proposes integrated chip test bench, including:
First pedestal, including support and it is multiple in the first direction arrangement and with the support fix dividing plate, it is described every Plate is vertical with the first direction, encloses to form the first slot between any two dividing plate;
First lid, covers the top in a second direction in first pedestal, and first lid portion inside has The cavity volume to connect in the second direction with each first slot, the top surface of first lid in this second direction are opened Provided with multiple the second slots arranged in the first direction, second slot connected with the cavity volume and with first slot one One correspondence;
Multiple first elastic probes, including fixed part, from the fixed part along the first elasticity backwards to third direction extension Arm and the second elastic arm, the free end of first elastic arm are provided with the first detector, and the free end of second elastic arm is set There is the second detector, first elastic arm is located in first slot, and first detector is backwards to the second party First slot is stretched out upwards, to contact printed circuit board (PCB);Second elastic arm is placed in the cavity volume, and described second Detector stretches out second slot in this second direction, to contact integrated circuit package;Wherein, the first party It is vertical two-by-two to, second direction and third direction.
Preferably, the support includes fixed plate vertical and placing each dividing plate with the second direction;It is described solid Determine portion and pass through the neck and the fixing board card provided with the opening direction neck consistent with the third direction, the fixed part Connect.
Preferably, it is raised to be provided with multiple first for end face of first detector along the second direction;Second inspection It is raised that end face of the gauge head along the second direction is provided with multiple second.
Preferably, first elastic probe also includes the first bending part and the second bending part, and first bending part is consolidated Surely it is connected between first elastic arm and the fixed part, second bending part is fixedly connected on second elastic arm And between the fixed part.
Preferably, the support also includes the supporting plate perpendicular to the third direction, and the fixed plate is convexly equipped in described For supporting plate towards the one side of the third direction, the fixed part protrudes above first bending part and institute in the third direction The second bending part is stated, and the fixed part abuts with the supporting plate.
Preferably, the dividing plate offers material reducing notch from the feather edge in the second direction, and the dividing plate is in described The both sides of material reducing notch form the first guide portion and the second guide portion respectively, and first guide portion can with first bending part It is slidably matched, second guide portion slidably coordinates with first detector.
Preferably, the edge of first lid is carried on the back circumferentially arranged with multiple buckles, the buckle from lid edge Extend to be formed to the second direction, first pedestal has the two relative side walls on first direction, the side The buckle slot being adapted to the buckle is offered on wall.
Preferably, the integrated chip test bench also includes the first connector, first connector have one with it is described The vertical plane of symmetry of third direction, the integrated chip test bench also include the second pedestal, the second lid and multiple second elasticity Probe, wherein, second pedestal and first pedestal, second lid and first lid, second elasticity Probe is symmetrical on the plane of symmetry with first elastic probe;First connector is fixedly connected with first pedestal And second pedestal.
To achieve the above object, the utility model also proposes a kind of integrated chip test module, including:
Fixed seat, offer multiple mounting grooves penetrated along the second direction;And the integrated chip test bench, one One is correspondingly placed in the mounting groove.
Preferably, the integrated chip test bench also includes the first connector, first connector have one with it is described The vertical plane of symmetry of third direction, the integrated chip test bench also include the second pedestal, the second lid and multiple second elasticity Probe, wherein, second pedestal and first pedestal, second lid and first lid, second elasticity Probe is symmetrical on the plane of symmetry with first elastic probe;First connector is fixedly connected with first pedestal And second pedestal;
First connector is provided with positioning key towards the one side of the second direction, the fixed seat be provided with it is described The positioning hole of positioning key adaptation.
The utility model integrated chip test bench is opened up by setting the first slot on the first pedestal on the first lid There is a cavity volume to connect with the first slot, while the top surface of the first lid is provided with the second slot for being connected with cavity volume, and lead to Cross and elastic probe is arranged to the integrative-structure with the first elastic arm, the second elastic arm and fixed part, and the first elastic arm Free end be provided with the first detector, the free end of the second elastic arm is provided with the second detector, wherein, the first elastic arm is scalable It is placed in the first slot, the first detector exposes to the first slot, and to contact printed circuit board (PCB), the second elastic arm is scalable to be put In cavity volume, the second detector exposes to the second slot, and to contact integrated circuit package, integrated chip is carried out so as to realize The purpose of test.The utility model integrated chip test bench replaces traditional split type bullet by using the elastic probe being wholely set Property probe, not only simplify probe structure, and not easy to wear, save manufacturing cost, meanwhile, the utility model integrated chip It is convenient that the elastic probe of test bench is changed, and has effectively saved cost of equipment maintenance.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only It is some embodiments of the utility model, for those of ordinary skill in the art, is not paying the premise of creative work Under, other accompanying drawings can also be obtained according to the structure shown in these accompanying drawings.
Fig. 1 is the structural representation of the embodiment of the utility model integrated chip test bench one;
Fig. 2 is the partial cutaway schematic of integrated chip test bench in Fig. 1;
Fig. 3 is the decomposition texture schematic diagram of integrated chip test bench in Fig. 1;
Fig. 4 is the structural representation of the first elastic probe in Fig. 1;
Fig. 5 is the partial enlarged drawing at A in Fig. 4;
Fig. 6 is the partial enlarged drawing at B in Fig. 4;
Fig. 7 is the structural representation of the first pedestal in Fig. 1;
Fig. 8 is the partial cutaway schematic of the first pedestal in Fig. 7;
Fig. 9 is the structural representation of another angle of the first pedestal in Fig. 1;
Figure 10 is the partial cutaway schematic of the first pedestal in Fig. 9;
Figure 11 is the structural representation of the first lid in Fig. 1;
Figure 12 is the partial cutaway schematic of the first lid in Figure 11;
The structural representation of another angle of first lid in Figure 13 Fig. 1;
Figure 14 the utility model integrated chip tests the structural representation of the embodiment of module one;
Figure 15 is the partial enlarged drawing at C in Figure 14;
Figure 16 is the structural representation that integrated chip tests another angle of module in Figure 14;
Figure 17 is that integrated chip tests the whole disk combination diagram of module in Figure 14;
Figure 18 is that integrated chip tests the whole disk general assembly structural representation of module in Figure 17.
Drawing reference numeral explanation:
Realization, functional characteristics and the advantage of the utility model purpose will be described further referring to the drawings in conjunction with the embodiments.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out Clearly and completely describing, it is clear that described embodiment is only part of the embodiment of the present utility model, rather than all Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work premise Lower obtained every other embodiment, belong to the scope of the utility model protection.
If it is to be appreciated that related in the utility model embodiment directionality instruction (such as upper and lower, left and right, it is preceding, Afterwards ...), then directionality instruction be only used for explain it is relative between each part under a certain particular pose (as shown in drawings) Position relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith.
If, should " first ", " the in addition, relate to the description of " first ", " second " etc. in the utility model embodiment Two " etc. description is only used for describing purpose, and it is not intended that instruction or implying its relative importance or implicit indicating meaning The quantity of the technical characteristic shown.Thus, " first " is defined, the feature of " second " can express or implicitly include at least one Individual this feature.In addition, the technical scheme between each embodiment can be combined with each other, but must be with ordinary skill Personnel can be implemented as basis, and this technical side is will be understood that when the combination appearance of technical scheme is conflicting or can not realize The combination of case is not present, also not within the protection domain of the requires of the utility model.
The utility model proposes a kind of integrated chip test bench.
In the utility model embodiment, Fig. 1 to Fig. 3 is refer to, the integrated chip test bench 10 includes:
First pedestal 1, including support 11 and multiple arrangements in the first direction and the dividing plate 12 fixed with support 11, dividing plate 12 is vertical with first direction, encloses to form the first slot 13 between any two dividing plate 12;
First lid 2, covers the top in a second direction in the first pedestal 1, and the inside of the first lid 2 has in second party The cavity volume 21 to connect upwards with each first slot 13, the top surface of the first lid 2 in a second direction offer multiple along first party To the second slot 22 of arrangement, the second slot 22 is connected with cavity volume 21 and corresponded with the first slot 13;
Multiple first elastic probes 3, including fixed part 31, self-fixed department 31 are elastic along extend backwards to third direction first The elastic arm 33 of arm 32 and second, the free end of the first elastic arm 32 are provided with the first detector 321, the free end of the second elastic arm 33 Provided with the second detector 331, the first elastic arm 32 is located in the first slot 13, and the first detector 321 is in second direction The first slot 13 is stretched out, to contact printed circuit board (PCB);Second elastic arm 33 is placed in cavity volume 21, and the second detector 331 is The second slot 22 is stretched out on two directions, to contact integrated circuit package;Wherein, first direction, second direction and third direction It is vertical two-by-two.
In the present embodiment, the first pedestal 1 and the first lid 2 are made up of isolation material, the first pedestal 1 and the first lid 2 Between be fixedly connected, can be bonding, mode connects for screw or be connected together;Cavity volume 21 on first lid 2 has enough skies Between to ensure the scalable motion in a second direction of the second elastic arm 33, and the size of the second slot 22 is compared with the second detector 331 Size it is bigger, during ensureing test, the second detector 331 will not produce friction with the inwall of the second slot 22;First bullet Property probe 3 be electric conductor, its material is generally beryllium copper, and is formed in one, not easy to wear, the shape of the first elastic probe 3 with The shape of above-mentioned cavity volume 21 and slot is adapted, preferably shell fragment shape;First elastic arm 32, the second elastic arm 33 and fixed part 31 The elastic construction formed can be with undulate or zigzag, and the first elastic arm 32 and the second elastic arm 33 can have identical Configuration, it is possible to have different configurations is to provide different amount of elastic deformation;The quantity and arranged distribution of first elastic probe 3 It can be adjusted according to the encapsulated type of integrated chip and its point position of required test, the utility model integrated chip test bench 10 The test being particularly suitable for use in using the integrated chip with pin package form, such as to using TSOP, SOP and QFP packing forms Integrated chip test.
The utility model integrated chip test bench 10 on the first pedestal 1 by setting the first slot 13, in the first lid 2 On offer the cavity volume 21 to connect with the first slot 13, while the first lid 2 top surface be provided with connected with cavity volume 21 Two slots 22, and by the way that elastic probe is arranged to the first elastic arm 32, the second elastic arm 33 and fixed part 31 Integrative-structure, and the free end of the first elastic arm 32 is provided with the first detector 321, the free end of the second elastic arm 33 is provided with second Detector 331, wherein, the first elastic arm 32 is scalable to be placed in the first slot 13, and the first detector 321 exposes to the first slot 13, to contact printed circuit board (PCB), the second elastic arm 33 is scalable to be placed in cavity volume 21, and the second detector 331 exposes to second Slot 22, to contact integrated circuit package, so as to realize the purpose tested integrated chip.The utility model integrates core Built-in testing seat 10 replaces traditional Split type flexible probe by using the elastic probe being wholely set, and not only simplify probe knot Structure, and it is not easy to wear, manufacturing cost has been saved, meanwhile, the elastic probe of the utility model integrated chip test bench 10 is changed It is convenient, effectively save cost of equipment maintenance.
Further, support 11 includes fixed plate 111 vertical and placing each dividing plate 12 with second direction;Fixed part 31 is set There is the neck 311 that opening direction is consistent with third direction, fixed part 31 passes through neck 311 and the clamping of fixed plate 111.
In the present embodiment, by setting fixed plate 111 on support 11, and set on the fixed part 31 of elastic probe Neck 311, fixed plate 111 coordinates with neck 311 enables elastic probe to be stably mounted in the first slot 13, without Deviate from a second direction.
Further, Fig. 4 to Fig. 6 is refer to, it is raised that the end face of the first detector 321 in a second direction is provided with multiple first 322;The end face of second detector 331 in a second direction is provided with multiple second projections 332.
In the present embodiment, by setting the first projection 322 that the first detector 321 can be made more to contact printed circuit The pad of plate, by setting the second projection 332 that the second detector 331 can be made more accurately and stably to contact integrated circuit package Pin, so as to effectively improve measuring stability and accuracy.Preferably, the first projection 322 and the second projection 332 are respectively two It is individual, and electric conductivity can be improved in the surface gold-plating of the first projection 322 and the second projection 332.
Further, the first elastic probe 3 also includes the first bending part 34 and the second bending part 35, and the first bending part 34 is solid Surely it is connected between the first elastic arm 32 and fixed part 31, the second bending part 35 is fixedly connected on the second elastic arm 33 and fixed part Between 31.
In the present embodiment, by set the first bending part 34 and the second bending part 35 can be the first elastic probe 3 by An elastic buffer is provided during external forces, so as to avoid damaging printed circuit board (PCB) due to cumulative stress in test.
Further, Fig. 8 is refer to, support 11 also includes the supporting plate 112 perpendicular to third direction, and fixed plate 111 is convex One side located at supporting plate 112 towards third direction, fixed part 31 protrude above the first bending part 34 and the second folding in third direction Turn of bilge 35, and fixed part 31 abuts with supporting plate 112.
In the present embodiment, supporting plate 112 can be formed in one with fixed plate 111, can also be fixed by other modes Connection, supporting plate 112 are made up of the higher engineering plastics of intensity, such as ABS, PEI, PPS etc.;Fixed part 31 protrudes from the first folding The bending part 35 of turn of bilge 34 and second, and being abutted with supporting plate 112, on the one hand can limit elastic probe along third direction produce compared with Big displacement and influence test accuracy, on the other hand provide activity space for the first bending part 34 and the second bending part 35, and It is unlikely to produce friction with supporting plate 112 in stress.
Further, Fig. 9 and Figure 10 is refer to, feather edge of the dividing plate 12 from second direction offers material reducing notch 121, Dividing plate 12 forms the first guide portion 122 and two guide portions 123, the first guide portion 122 and respectively in the both sides of material reducing notch 121 One bending part 34 slidably coordinates, and two guide portions 123 slidably coordinate with the first detector 321.
In the present embodiment, by opening up material reducing notch 121, labor and materials have not only been saved, and dividing plate 12 is formed first The guide portion 123 of guide portion 122 and two, a guide effect can be played in test for the flexible of probes probes.
Further, Figure 11 is refer to, the edge of the first lid 2 is covered certainly circumferentially arranged with multiple buckles 23, buckle 23 For body along extending to be formed backwards to second direction, the first pedestal 1 has a two relative side walls on first direction, in side wall Offer the buckle slot 14 being adapted to buckle 23.
In the present embodiment, coordinate by buckle 23 and buckle slot 14 and the first lid 2 can be fixed on the first pedestal 1 On, it is preferable that it is further opened with extending to the guide groove 15, Ke Yiti of buckle slot 14 in a second direction in the side wall of the first pedestal 1 The degree of accuracy of height assembling.
Further, please with reference to Fig. 1 and Fig. 7, integrated chip test bench 10 also includes the first connector 4, and first connects Fitting 4 has a plane of symmetry 41 vertical with third direction, and integrated chip test bench 10 also includes the second pedestal 5, the second lid 6 And multiple second elastic probes 7, wherein, the second pedestal 5 and the first pedestal 1, the second lid 6 and the first lid 2, the second elasticity are visited Pin 7 is symmetrical on the plane of symmetry 41 with the first elastic probe 3;First connector 4 is fixedly connected with the first pedestal 1 and the second pedestal 5.
By setting two integrated chip test benches 10 symmetrically connected, the quantity of elastic probe is effectively increased, can Suitable for the more integrated chip in test point position.
Further, Figure 11 is refer to, integrated chip test bench 10 also includes the second connector 8, and the second connector 8 is fixed The first lid 2 and the second lid 6 are connected, it is into a single integrated structure by the way that the first lid 2 and the second lid 6 are set, assembling can be simplified Technique, and it is not easy to be lost.
The utility model also proposes a kind of integrated chip test module, refer to Figure 14 to Figure 16, in one embodiment, should Integrated chip test module includes:
Fixed seat 20, offer multiple mounting grooves 201 penetrated in a second direction;And
Integrated chip test bench 10, one-to-one corresponding are placed in mounting groove 201.
The concrete structure of the integrated chip test bench 10 is with reference to above-described embodiment, and this is no longer going to repeat them.
In the present embodiment, by the way that integrated chip test bench 10 is installed in fixed seat 20, an integrated chip is formed Module is tested, whole disk integrated chip module can be tested, furthermore, it is possible to according to the difference of test object, targeted specifically Connection is combined to multiple integrated chips test module, to adapt to different testing requirements.
Further, integrated chip test bench 10 also includes the first connector 4, and the first connector 4 has one and third party To the vertical plane of symmetry 41, integrated chip test bench 10 also includes the second pedestal 5, the second lid 6 and multiple second elastic probes 7, wherein, the second pedestal 5 and the first pedestal 1, the second lid 6 and the first lid 2, the second elastic probe 7 and the first elastic probe 3 It is symmetrical on the plane of symmetry 41;First connector 4 is fixedly connected with the first pedestal 1 and the second pedestal 5;
First connector 4 is provided with positioning key 42 towards the one side of second direction, and fixed seat 20 is provided with and is adapted to positioning key Positioning hole 202.
In the present embodiment, by the cooperation of positioning key 42 and positioning hole 202, integrated chip test bench 10 can be enabled Rapidly and accurately it is installed in fixed seat 20.
Further, integrated chip test bench 10 also includes the second connector 8, and the second connector 8 is fixedly connected with the first lid The lid 6 of body 2 and second;
The two side of second connector 8 in the first direction is provided with convex portion 81, and convex portion 81 is from the second connector 8 along backwards to second Direction extends to be formed, and the first connector 4 offers the groove 43 being adapted to convex portion 81 on two side in the first direction.
In the present embodiment, by setting convex portion 81 and groove 43 so that lid can be positioned fast and accurately with pedestal Connection, while the motion of pedestal in a first direction can also be limited.
Further, the first connector 4 is provided with the first mounting hole 44, is provided with fixed seat 20 corresponding with the first mounting hole 44 The second mounting hole 203, integrated chip test module also includes fastener (not indicating), fastener penetrate the first mounting hole 44 and Second mounting hole 203 is fixedly connected with integrated chip test bench 10 and fixed seat 20.
In the present embodiment, fastener can be other connected modes such as steady pin or screw or bolt.This Outside, the fluting 82 in second direction is offered on the second connector 8,82 shape of slotting can be square or circular, and The size of fluting 82 is big compared with the first mounting hole 44, can be advantageously integrated chip test base 10 and the installation of fixed seat 20 is fixed, and It is easy to whether in place to check installation.
Further, Figure 17 and Figure 18 is refer to, in order to further realize the test of whole disk integrated chip module, above-mentioned collection Can have into chip testing module it is multigroup, it is arranged in parallel along third direction and be fixedly connected.
In the present embodiment, each integrated chip test module can by bonding, mode connects for screw, be connected together or other are consolidated Determine connected mode to combine.In actual applications, in order to ensure the reliability of connection, fixed frame is usually provided with, and incite somebody to action Each integrated chip test module is fixed in fixed frame.Preferably, integrated chip tests the fixed seat 20 of module in the first direction Two side walls in the wall towards second direction be provided with recess, fixed frame is correspondingly arranged on flange, Jiang Geji with the recess The flange of recess and fixed frame into chip testing module overlaps, and offers pilot hole in fixed seat 20 and fixed frame, leads to Cross screw or fixed seat and fixed frame are connected by bolt, so as to realize the whole disk general assembly of integrated chip test module.Pass through Tester can in high volume be reduced using the test of whole disk integrated chip module, testing efficiency is improved, so as to effectively save system Cause this and cost of equipment maintenance.
Preferred embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, Every equivalent structure change under inventive concept of the present utility model, made using the utility model specification and accompanying drawing content Change, or directly/be used in other related technical areas indirectly and be included in scope of patent protection of the present utility model.

Claims (10)

  1. A kind of 1. integrated chip test bench, it is characterised in that including:
    First pedestal, including support and it is multiple in the first direction arrangement and with the support fix dividing plate, the dividing plate with The first direction is vertical, encloses to form the first slot between any two dividing plate;
    First lid, covers the top in a second direction in first pedestal, and first lid portion inside has described The cavity volume to connect in second direction with each first slot, the top surface of first lid in this second direction offer Multiple the second slots arranged in the first direction, second slot connected with the cavity volume and with a pair of first slot 1 Should;
    Multiple first elastic probes, including fixed part, from the fixed part along backwards to third direction extension the first elastic arm and Second elastic arm, the free end of first elastic arm are provided with the first detector, and the free end of second elastic arm is provided with the Two detectors, first elastic arm are located in first slot, and first detector is in the second direction First slot is stretched out, to contact printed circuit board (PCB);Second elastic arm is placed in the cavity volume, second detection Head stretches out second slot in this second direction, to contact integrated circuit package;Wherein, the first direction, Two directions and third direction are vertical two-by-two.
  2. 2. integrated chip test bench as claimed in claim 1, it is characterised in that the support includes hanging down with the second direction Direct join places the fixed plate of each dividing plate;The fixed part is provided with the opening direction neck consistent with the third direction, institute State fixed part and pass through the neck and the fixed plate clamping.
  3. 3. integrated chip test bench as claimed in claim 2, it is characterised in that first detector is along the second direction To be provided with multiple first raised for end face;It is raised that end face of second detector along the second direction is provided with multiple second.
  4. 4. integrated chip test bench as claimed in claim 3, it is characterised in that first elastic probe also includes the first folding Turn of bilge and the second bending part, first bending part is fixedly connected between first elastic arm and the fixed part, described Second bending part is fixedly connected between second elastic arm and the fixed part.
  5. 5. integrated chip test bench as claimed in claim 4, it is characterised in that the support also includes perpendicular to the described 3rd The supporting plate in direction, the fixed plate are convexly equipped in the supporting plate towards the one side of the third direction, and the fixed part is in institute State third direction and protrude above first bending part and second bending part, and the fixed part abuts with the supporting plate.
  6. 6. integrated chip test bench as claimed in claim 5, it is characterised in that the dividing plate is from the bottom in the second direction Edge has material reducing notch, and the dividing plate forms the first guide portion and the second guiding respectively in the both sides of the material reducing notch Portion, first guide portion slidably coordinate with first bending part, and second guide portion can with first detector It is slidably matched.
  7. 7. integrated chip test bench as claimed in claim 6, it is characterised in that the edge of first lid is circumferentially set There are multiple buckles, the buckle to be formed from the lid along extending backwards to the second direction, and first pedestal, which has, to be located at Two relative side walls on first direction, the buckle slot being adapted to the buckle is offered in the side wall.
  8. 8. the integrated chip test bench as described in claim any one of 1-7, it is characterised in that also including the first connector, institute Stating the first connector has a plane of symmetry vertical with the third direction, and the integrated chip test bench also includes the second base Seat, the second lid and multiple second elastic probes, wherein, second pedestal and first pedestal, second lid with First lid, second elastic probe are symmetrical on the plane of symmetry with first elastic probe;Described first Connector is fixedly connected with first pedestal and second pedestal.
  9. 9. a kind of integrated chip tests module, it is characterised in that including:
    Fixed seat, offer multiple mounting grooves penetrated along the second direction;And
    Multiple integrated chip test benches as described in claim any one of 1-8, one-to-one corresponding are placed in the mounting groove.
  10. 10. integrated chip as claimed in claim 9 tests module, it is characterised in that the integrated chip test bench also includes First connector, first connector have a plane of symmetry vertical with the third direction, the integrated chip test bench Also include the second pedestal, the second lid and multiple second elastic probes, wherein, second pedestal and first pedestal, institute The second lid and first lid are stated, second elastic probe is with first elastic probe on the plane of symmetry pair Claim;First connector is fixedly connected with first pedestal and second pedestal;
    First connector is provided with positioning key towards the one side of the second direction, and the fixed seat is provided with and the positioning The positioning hole of key adaptation.
CN201720550166.XU 2017-05-17 2017-05-17 Integrated chip test bench and integrated chip test module Active CN206945746U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201720550166.XU CN206945746U (en) 2017-05-17 2017-05-17 Integrated chip test bench and integrated chip test module
TW106209388U TWM557829U (en) 2017-05-17 2017-06-28 Integrated wafer tester and integrated wafer test module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720550166.XU CN206945746U (en) 2017-05-17 2017-05-17 Integrated chip test bench and integrated chip test module

Publications (1)

Publication Number Publication Date
CN206945746U true CN206945746U (en) 2018-01-30

Family

ID=61360888

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720550166.XU Active CN206945746U (en) 2017-05-17 2017-05-17 Integrated chip test bench and integrated chip test module

Country Status (2)

Country Link
CN (1) CN206945746U (en)
TW (1) TWM557829U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108717132A (en) * 2018-07-18 2018-10-30 罗日伟 A kind of FPC test benches
CN111880067A (en) * 2019-04-15 2020-11-03 中华精测科技股份有限公司 Wafer test assembly and electrical connection module thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023076046A (en) * 2021-11-22 2023-06-01 株式会社日本マイクロニクス Probe storage jig, probe storage system, and probe storage method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108717132A (en) * 2018-07-18 2018-10-30 罗日伟 A kind of FPC test benches
CN111880067A (en) * 2019-04-15 2020-11-03 中华精测科技股份有限公司 Wafer test assembly and electrical connection module thereof

Also Published As

Publication number Publication date
TWM557829U (en) 2018-04-01

Similar Documents

Publication Publication Date Title
CN206945746U (en) Integrated chip test bench and integrated chip test module
CN104422863B (en) Semiconductor test device
US7837481B1 (en) Socket for an integrated circuit and a method of providing a connection in a socket
MY146186A (en) Probe card
CN203012063U (en) Test board for batched electronic component testing
CN204514967U (en) A kind of PCB test connector
CN104865412A (en) Chip testing board and chip testing method
CN103399176B (en) Test system for acceleration sensor
CN106199385A (en) A kind of test jack for chip and test circuit thereof
CN108120853A (en) Chip test fixture
TW201602607A (en) Testing assembly for testing magnetic sensor and method for testing magnetic sensor
CN206945747U (en) Integrated chip test bench and integrated chip test module
CN213843441U (en) Chip detection device
KR101246105B1 (en) Test socket for semiconductor package
CN207557414U (en) A kind of wafer-level test device
CN205301367U (en) Novel connect test seat
CN109585317A (en) Test equipment and test method
CN105575836A (en) Test device
KR101051783B1 (en) Handler pusher for BA package testing
CN205374651U (en) Short -circuit test carrier is opened to base plate
CN203365488U (en) Probe type connector detection apparatus
CN102081111A (en) Probe card
CN209182370U (en) Through silicon via channel measuring apparatus
CN207036996U (en) A kind of wire harness conducting test device
CN107728039B (en) Loss test probe

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant