CN213843441U - Chip detection device - Google Patents

Abstract

The utility model discloses a chip detection device, which comprises a bracket body, a circuit board, a probe seat and at least two probe sheets; the circuit board is fixedly arranged on the support body, and the probe seat is arranged on the support body; the probe sheet is provided with a plurality of probes which are arranged in an insulated way, the probe seat is provided with at least two probe hole groups, each probe hole group corresponds to one probe sheet and is provided with probe holes which are mutually insulated, each probe hole is filled with a conductive connecting end, and the conductive connecting end is connected with the circuit of the circuit board; a probe sheet is detachably arranged on the probe seat, and the second end of the probe is inserted into a probe hole and is in conductive connection with the conductive connecting end in the probe hole. The structure of the existing probe card is skillfully adjusted, a plurality of probe sheets share one probe seat, the probe seat is adapted to various chips with different designs on a wafer or before packaging to a great extent, and a special probe card does not need to be newly designed at every time, so that the universality of the chip detection device is improved, the test cost can be saved, and the test efficiency can be improved.

Description

Chip detection device

Technical Field

The utility model relates to a chip test field especially relates to, a chip detection device.

Background

With the development of technology, chip application is ubiquitous, and many supports are provided for smart life and work, but chip testing is a relatively big problem, and it directly runs through the whole chip design and mass production process, and it requires one, two or more tests, especially Wafer testing, whether Wafer testing after Wafer flow (Wafer Test), Final testing after packaging (Final Test, also called packaging Test) or Final system level testing, and its Test objects are a large number of chips on the Wafer, these chips are dies (Die), they may be the same or different, the dies do not have packaged pins (Pin), i.e. pins seen by the Final user, only the silicon Wafer (Pad) finally packaged inside the chips, and the pins between Pad and Pin are connected through wires in the packaging stage, for example, by gold wire connection, and a complete Chip (Chip) is obtained after packaging.

Therefore, wafer testing is an important basis for the following steps, and wafer testing is mostly realized by using a Probe Card, so that the wafer testing is also called Probe Card (Probe Card) testing, a tester circuit (or a test board circuit, also called Loadboard) is connected with a Pad on a Die by using the Probe Card, a signal of a tester is connected to the Pad connected to the bottom of the Probe Card through a pogo pin (pogo pins), and then the signal is led to the Die to be tested through a wiring on the Probe Card.

Chinese patent application No. CN101038302, published in 2007, discloses a probe card having a plurality of probe sets arranged in a predetermined pattern. The predetermined pattern is obtained by assuming that the plurality of unit regions 11 to 14 arranged adjacent to each other form a chip group region. The number of unit areas is equal to the number of indexes. One of the cell areas included in the chipset area is defined as a specific cell area. The chip set regions are arranged without gaps therebetween to cover the size of the wafer. The arranged chipset areas form a virtual overlay pattern. The arrangement of the specific unit regions is extracted to form a predetermined pattern. Each probe group is arranged at a position corresponding to each specific unit region of the predetermined pattern.

Chinese patent application No. CN102445668A, 2010, discloses a method and an apparatus for detecting a wafer level led chip, and a transparent probe card thereof. The detection method comprises the following steps: and providing a transparent probe card, covering the transparent probe card above the wafer, and electrically connecting the contact points of the transparent probe card with the test pads of the LED chips so as to carry out a lightening test on the LED chips. When the LED chip emits light, the optical signal of the LED chip is imaged to form an image on a sensing element. Capturing an image, and converting the signal of the image into light field information and position information corresponding to each LED chip. And obtaining the spectrum and the luminous intensity of the LED chip according to the light field information of the LED chip. And classifying the LED chips according to the spectrum and the luminous intensity of the LED chips. The wafer level LED chip detection device and the transparent probe card applying the detection method are also disclosed. The detection method, the detection device and the transparent probe card have the advantages of improving detection speed and quickly classifying.

Chinese patent application No. CN108535519A, with application time of 2018, discloses a semiconductor chip test probe card on which probes required for electrical testing of all types of chips on the same wafer are manufactured. The invention also discloses a semiconductor chip test system using the probe card, which is used for connecting and testing the tested chip through the probe card, recording the test result as different kinds of failure information and outputting the failure information to the corresponding storage server according to the kinds of the failure information. The invention also discloses a semiconductor chip testing method using the probe card. The test system and the test method of the invention reduce the card manufacturing cost of the probe card, avoid manufacturing the probe card for many times, reduce the overall production cost, correspond to all chips on a wafer by one all-in-one probe card, and facilitate the management of the probe card. The invention can complete the whole-flow test of a plurality of chips at one time, and improves the test efficiency.

Chinese patent application No. CN110907788A, having application time of 2019, discloses a probe card inspection wafer and a probe card inspection system. The probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and spaced apart from each other, wherein each of the first probe card inspection chip and the second probe card inspection chip on the base wafer is divided into a probe vertical height inspection region, a probe horizontal position inspection region, and a contact inspection region, wherein each of the first probe card inspection chip and the second probe card inspection chip includes a first pad array and a second pad array, the first pad array is positioned on the probe vertical height inspection region and configured to inspect vertical heights of a first Alternating Current (AC) probe and a second AC probe of a probe card to be inspected, the second pad array is located on the probe vertical height inspection region and is configured to inspect vertical heights of the first and second VSS probes of the probe card to be inspected.

However, for any test of any chip of various wafers, there are special requirements for layout, wiring, wire length, line width, etc. of the Loadboard, so a special probe card is usually required, the versatility is poor, and time is required for design and manufacture, thereby increasing the cost and the test efficiency. The prior art is therefore deficient and needs improvement.

SUMMERY OF THE UTILITY MODEL

The utility model provides a chip detection device, the technical problem that solve includes: how to design a probe seat can match at least two probe sheets, improve the universality of chip detection, save the test cost, improve the test efficiency and the like.

The technical scheme of the utility model as follows:

a chip detection device comprises a support body, a circuit board, a probe seat and at least two probe sheets; the support body is used for being fixed outside, the circuit board is fixedly arranged on the support body, and the probe seat is arranged on the support body; the probe sheet is provided with a plurality of probes which are arranged in an insulated manner, the probe seat is provided with at least two probe hole groups, each probe hole group corresponds to one probe sheet and is provided with probe holes which are insulated from each other, a conductive connecting end is filled in each probe hole, and the conductive connecting end is connected with the circuit of the circuit board through a lead; the probe seat is detachably provided with the probe sheet, two ends of each probe in the probe sheet protrude out of the probe sheet, the first end of each probe is vacant, and the second end of each probe is inserted into one probe hole and is in conductive connection with the conductive connecting end in the probe hole.

Preferably, the probe sheets have probes arranged in a matrix and insulated from each other, at least one of a row pitch and a column pitch of the matrix of each probe sheet being arranged differently from the matrix of the other probe sheets; each probe hole group is matched with one probe sheet and is provided with probe holes which are arranged in a matrix and are mutually insulated.

Preferably, the probe seat is provided with a needle seat body, a clamping part and a pair of slide rails; the needle seat body is arranged on the support body and provided with at least two probe hole groups, and the buckling part is fixedly arranged on the needle seat body; and the probe piece is arranged in the pair of slide rails in a sliding manner and is used for being fixed on the needle seat body through the buckling part when sliding to a preset position.

Preferably, the probe seat is further provided with at least four elastic telescopic parts, and each elastic telescopic part is fixedly arranged on the needle seat body respectively; each slide rail is arranged on the needle seat body through at least two elastic telescopic parts.

Preferably, the probe seat is arranged on the circuit board and arranged on the support body through the circuit board.

Preferably, at least two probe hole groups are partially overlapped.

Preferably, at least two of said sets of probe holes share a portion of said probe holes.

Preferably, the second end of the probe has an expansion part and the probe hole is provided with an elastic conductive structure body matched with the expansion part, and the elastic conductive structure body is in conductive connection with the conductive connecting end in the probe hole.

Preferably, the elastic conductive structure is in contact with the conductive connection terminal in the probe hole.

Preferably, the probe seat or the probe sheet is provided with at least three positioning holes; or the second end of the probe is contacted with the conductive connecting end in the probe hole; or the conductive connecting end is filled in the probe hole through an elastic piece.

Adopt above-mentioned scheme, the utility model discloses ingenious structure of having adjusted current probe card through designing a probe seat of a plurality of probe card sharings, on to a great extent adaptation wafer or the chip of multiple different designs before the encapsulation, need not all newly-designed special probe card at every turn to chip detection device's commonality has been promoted, and circuit board and probe seat are also changeable, so whole flexibility ratio is very high, can practice thrift the test cost and promote efficiency of software testing, has very high market using value.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of the present invention;

FIG. 2 is a schematic diagram of a portion of the structure of the embodiment shown in FIG. 1;

fig. 3 is a schematic view of another embodiment of the present invention;

FIG. 4 is a schematic view of an embodiment of a probe tile according to the present invention;

fig. 5 is a schematic view of another embodiment of the probe sheet according to the present invention;

fig. 6 is a schematic view of another embodiment of the probe sheet according to the present invention;

FIG. 7 is a schematic view of an embodiment of a probe holder according to the present invention;

FIG. 8 is a schematic view of another embodiment of a probe holder according to the present invention;

FIG. 9 is a schematic diagram of one embodiment of a probe hole set according to the present invention;

FIG. 10 is a schematic diagram of another embodiment of a probe hole set according to the present invention;

fig. 11 is a partial schematic structural view of another embodiment of the present invention;

fig. 12 is a partial schematic structural view of another embodiment of the present invention;

FIG. 13 is a schematic view of one embodiment of a probe according to the present invention;

fig. 14 is a schematic view of another embodiment of a probe according to the present invention;

fig. 15 is a schematic view of another embodiment of a probe according to the present invention.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

One embodiment of the utility model is a chip detection device, which comprises a bracket body, a circuit board, a probe seat and at least two probe sheets; the support body is used for being fixed outside, the circuit board is fixedly arranged on the support body, and the probe seat is arranged on the support body; the probe sheet is provided with a plurality of probes which are arranged in an insulated manner, the probe seat is provided with at least two probe hole groups, each probe hole group corresponds to one probe sheet and is provided with probe holes which are insulated from each other, a conductive connecting end is filled in each probe hole, and the conductive connecting end is connected with the circuit of the circuit board through a lead; the probe seat is detachably provided with the probe sheet, two ends of each probe in the probe sheet protrude out of the probe sheet, the first end of each probe is vacant, and the second end of each probe is inserted into one probe hole and is in conductive connection with the conductive connecting end in the probe hole. Adopt above-mentioned scheme, the utility model discloses ingenious structure of having adjusted current probe card through designing a probe seat of a plurality of probe card sharings, on to a great extent adaptation wafer or the chip of multiple different designs before the encapsulation, need not all newly-designed special probe card at every turn to chip detection device's commonality has been promoted, and circuit board and probe seat are also changeable, so whole flexibility ratio is very high, can practice thrift the test cost and promote efficiency of software testing, has very high market using value.

For example, a chip detection device comprises a bracket body, a circuit board, a probe seat and two probe sheets; or, a chip detection device, it includes the support body, breadboard, probe seat and three probe pieces; or a chip detection device, which comprises a bracket body, a circuit board, a probe seat and four probe sheets, and other embodiments can be analogized, and the description is omitted below.

In order to fix the chip detection device for independent use or matching with other existing devices, preferably, the bracket body is used for being fixed outside, the circuit board is fixedly arranged on the bracket body, and the probe seat is arranged on the bracket body; preferably, the probe seat is arranged on the circuit board and arranged on the support body through the circuit board. Preferably, the support body is provided with a plurality of mounting portions, and the support body is fixed to the outside through the mounting portions, so that the chip detection device is fixed. In practical applications, the chip detection apparatus may further include at least one of a voltage input structure, a current input structure, a voltage detection structure, a current detection structure, and an imaging structure. That is, some existing structures can be adopted on the chip detection device to cooperate with the chip detection device to realize the related detection function, which is not the limitation of the present invention.

Preferably, the probe sheet has a plurality of probes arranged in an insulated manner, the probe base is provided with at least two probe hole groups, each probe hole group corresponds to one probe sheet and is provided with probe holes insulated from each other, a conductive connecting end is filled in each probe hole, and the conductive connecting end is connected with the circuit of the circuit board through a lead; preferably, the probe sheets have probes arranged in a matrix and insulated from each other, at least one of a row pitch and a column pitch of the matrix of each probe sheet being arranged differently from the matrix of the other probe sheets; each probe hole group is matched with one probe sheet and is provided with probe holes which are arranged in a matrix and are mutually insulated. Preferably, the probe may be in the shape or structure of an existing probe, or may be adjustable. To facilitate the detection, preferably, the probe has a widened end that matches the Pad.

In order to facilitate replacement of the probe sheet, preferably, the probe base is detachably provided with the probe sheet, two ends of each probe in the probe sheet protrude out of the probe sheet, wherein a first end of each probe is vacant, and a second end of each probe is inserted into one probe hole and is electrically connected with the conductive connecting end in the probe hole. Preferably, the second end of the probe is in contact with the conductive connection end in the probe hole; preferably, the first end of the probe has a widened end portion that matches the Pad. Preferably, the second end of the probe has an expansion part and the probe hole is provided with an elastic conductive structure body matched with the expansion part, and the elastic conductive structure body is in conductive connection with the conductive connecting end in the probe hole. Preferably, the elastic conductive structure is in contact with the conductive connection terminal in the probe hole. Preferably, the elastic conductive structure and the conductive connecting end are integrally arranged. Preferably, the elastic conductive structure is a spring piece and is inserted into the slot of the conductive connecting end in an interference fit manner. In order to enhance the protection of the chip to be tested, especially the Pad portion, it is preferable that the probe sheet has pogo pins matched with the probes, and the second ends of the probes are inserted into one of the probe holes through the pogo pins and are conductively connected to the conductive connection terminals in the probe holes. That is, the pogo pin is inserted into one of the probe holes and is conductively connected to the conductive connection in the probe hole. Therefore, the elastic protection of the Pad can be realized to a certain degree, the probe can also be protected to a certain degree, and the damage of the probe, the Pad or the chip caused by misoperation is avoided. In order to protect the chip or Pad thereof, the conductive connecting end is filled in the probe hole through an elastic piece.

In order to facilitate the installation and replacement of the probe sheet, preferably, the probe seat is provided with a needle seat body, a buckling part and a pair of slide rails; the needle seat body is arranged on the support body and provided with at least two probe hole groups, and the buckling part is fixedly arranged on the needle seat body; and the probe piece is arranged in the pair of slide rails in a sliding manner and is used for being fixed on the needle seat body through the buckling part when sliding to a preset position. Preferably, the probe seat is further provided with at least four elastic telescopic parts, and each elastic telescopic part is fixedly arranged on the needle seat body respectively; each slide rail is arranged on the needle seat body through at least two elastic telescopic parts. Preferably, the height of the elastic expansion part is greater than the distance from the first end of the probe to the probe sheet. Like this, can realize quick dismantlement or installation probe piece, especially let the probe piece slide to probe punch combination assorted position with the slide rail, thereby make each probe on the probe piece can aim at a probe punch combination on the probe seat earlier, thereby the relative probe punch combination of probe has certain distance can avoid influencing probe piece and slide when the flexible portion helps the probe piece to slide again, then it makes the contact of the conductive connection end in probe and the probe hole realize electrically conductive to press down the flexible portion, last buckle portion is fixed, dismantle otherwise just can, it is all very convenient to dismantle or install, and guarantee the conductive connection end in probe and the probe hole and firmly electrically conductively connect.

In order to reduce the volume of the probe seat, namely relative to the area of the chip to be detected, at least two probe hole groups are preferably arranged in a partially overlapped mode. That is, at least two of the probe hole sets have overlapping regions on the probe holder. Preferably, at least two of said sets of probe holes share a portion of said probe holes. That is, at least one of the probe holes belongs to at least two of the probe hole groups simultaneously. For example, three probe-well groups share one, two or more of the probe-wells.

In order to facilitate positioning and aligning the detected chip, preferably, the probe seat or the probe sheet is provided with at least three positioning holes; preferably, each of said locating holes forms an apex of at least one triangle. Preferably, the probe seat or the probe sheet is provided with at least three positioning holes; the second end of the probe is in contact with the conductive connecting end in the probe hole; the conductive connecting end is filled in the probe hole through an elastic piece.

One embodiment of the present invention is, as shown in fig. 1 and 2, a chip detecting apparatus, which includes a support body 110, a circuit board 120, a probe holder 130 and at least two probe sheets 140; only one probe tile 140 is shown mounted on the probe base 130; the support body 110 is used for being fixed outside, the circuit board 120 is fixedly arranged on the support body 110, and the probe seat 130 is arranged on the support body 110; the probe sheet 140 has a plurality of probes 141 insulated from each other, the probe base 130 is provided with at least two probe hole groups, each probe hole group corresponds to one probe sheet 140 and is provided with a probe hole 131 insulated from each other, a conductive connecting end 132 is filled in each probe hole 131, and each conductive connecting end 132 is connected with the circuit of the circuit board 120 through an independent wire 121; the probe base 130 is detachably mounted with the probe sheet 140, and two ends of each probe 141 in the probe sheet 140 protrude out of the probe sheet 140, wherein a first end of the probe 141 is vacant, and a second end of the probe 141 is inserted into one of the probe holes 131 and is electrically connected to the conductive connection end 132 in the probe hole 131.

In order to reduce the weight, as shown in fig. 3, the support body 110 may be provided with a plurality of empty spaces.

A probe tile 140 is shown in fig. 4, which has six rows and twelve columns of 72 probes 141, but it should be noted that this embodiment is not to be considered as a particular limitation of the claimed invention. Another probe sheet 140 is shown in fig. 5, which has 45 probes 141 in five rows and nine columns, another probe sheet 140 is shown in fig. 6, which has 32 probes 141 in four rows and eight columns, and so on for other embodiments, which will not be described again. Preferably, the chip detecting device as shown in fig. 1 and 2 has three probe sheets as shown in fig. 4, 5 and 5.

Preferably, as shown in fig. 7, the probe socket 130 has two probe hole sets, namely a first probe hole set 133 and a second probe hole set 134, and the first probe hole set 133 has 72 mutually insulated probe holes in six rows and twelve columns, which are matched with the probe sheet shown in fig. 4; the second set of probe holes 134 has 32 mutually insulated probe holes in four rows and eight columns matching the probe tile shown in FIG. 6; the first and second probe-hole sets 133 and 134 are partially overlapped.

Preferably, as shown in fig. 8, the probe socket 130 has two probe hole sets, namely a first probe hole set 133 and a second probe hole set 134, and the first probe hole set 133 has 72 mutually insulated probe holes in six rows and twelve columns, which are matched with the probe sheet shown in fig. 4; the second set of probe holes 134 has 32 mutually insulated probe holes in four rows and eight columns matching the probe tile shown in FIG. 6; the first probe hole group 133 and the second probe hole group 134 are partially overlapped and share a part of the probe holes, i.e., the shared hole 135. Other embodiments are analogized and will not be described in detail below. The probe holes 131 of the first probe-hole group 133 are shown in FIG. 9, and the probe holes 131 of the second probe-hole group 134 are shown in FIG. 10

In one embodiment, the probe base 130 is partially constructed as shown in fig. 11, the probe holes 131 are filled with conductive connection terminals 132 and provided with elastic conductive structures 136, the elastic conductive structures 136 are integrally formed with the conductive connection terminals 132 to form a contact conductive position matching the second ends of the probes with the expansion parts, and the conductive connection terminals 132 are connected to corresponding circuits of the circuit board through the wires 121. In another embodiment, a partial structure of the probe socket 130 is shown in fig. 12, and the shape of the elastic conductive structure 136 and the conductive connection end 132 is different from that shown in fig. 11.

Preferably, as shown in fig. 13 and 14, the stylet 141 has a first end 1411 and a second end 1412, the second end 1412 of the stylet 141 having an expansion. Preferably, as shown in FIG. 15, first end 1411 of probe 141 has a widened end portion that matches Pad.

Further, the embodiment of the utility model discloses an embodiment still includes, each technical characteristic of above-mentioned each embodiment, the chip detection device that the intercombination formed, thus, the structure of current probe card has been adjusted ingeniously, through designing a probe seat of a plurality of probe piece sharings, the chip of multiple different designs before to a great extent adaptation wafer goes up or encapsulates, need not all newly-designed special probe card at every turn, thereby chip detection device's commonality has been promoted, and circuit board and probe seat are also changeable, so the whole flexibility ratio is very high, can practice thrift the test cost and promote efficiency of software testing.

It should be noted that the above technical features are continuously combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention described in the specification; moreover, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.

Claims (9)

1. A chip detection device is characterized by comprising a bracket body, a circuit board, a probe seat and at least two probe sheets;

the support body is used for being fixed outside, the circuit board is fixedly arranged on the support body, and the probe seat is arranged on the support body;

the probe sheet is provided with a plurality of probes which are arranged in an insulated manner, the probe seat is provided with at least two probe hole groups, each probe hole group corresponds to one probe sheet and is provided with probe holes which are insulated from each other, a conductive connecting end is filled in each probe hole, and the conductive connecting end is connected with the circuit of the circuit board through a lead;

the probe seat is detachably provided with the probe sheet, two ends of each probe in the probe sheet protrude out of the probe sheet, wherein the first end of each probe is vacant, and the second end of each probe is inserted into one probe hole and is in conductive connection with the conductive connecting end in the probe hole;

the probe sheets are provided with probes which are arranged in a matrix and are insulated from each other, and at least one of the row spacing and the column spacing of the matrix of each probe sheet is arranged differently from the matrix of other probe sheets; each probe hole group is matched with one probe sheet and is provided with probe holes which are arranged in a matrix and are mutually insulated.

2. The chip detection apparatus according to claim 1, wherein the probe holder is provided with a holder body, a locking portion and a pair of slide rails;

the needle seat body is arranged on the support body and provided with at least two probe hole groups, and the buckling part is fixedly arranged on the needle seat body;

and the probe piece is arranged in the pair of slide rails in a sliding manner and is used for being fixed on the needle seat body through the buckling part when sliding to a preset position.

3. The chip detection device according to claim 2, wherein the probe holder is further provided with at least four elastic expansion parts, and each elastic expansion part is fixedly arranged on the probe holder body;

each slide rail is arranged on the needle seat body through at least two elastic telescopic parts.

4. The apparatus for testing chips as defined in claim 1, wherein said probe holder is disposed on said circuit board and on said holder body through said circuit board.

5. The apparatus for detecting a chip according to claim 1, wherein at least two of the probe hole sets are partially overlapped.

6. The apparatus for detecting the chip according to claim 5, wherein at least two of the probe-hole sets share a part of the probe holes.

7. The apparatus of claim 1, wherein the second end of the probe has an expansion and the probe hole is provided with a resilient conductive structure matching the expansion, the resilient conductive structure being conductively connected to the conductive connection in the probe hole.

8. The chip detecting device according to claim 7, wherein the elastic conductive structure is in contact with the conductive connecting terminal in the probe hole.

9. The chip detecting device according to any one of claims 1 to 8, wherein the probe seat or the probe sheet is provided with at least three positioning holes; or the second end of the probe is contacted with the conductive connecting end in the probe hole; or the conductive connecting end is filled in the probe hole through an elastic piece.

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