CN209432867U - Variable probe chip testing base - Google Patents
Variable probe chip testing base Download PDFInfo
- Publication number
- CN209432867U CN209432867U CN201822131952.3U CN201822131952U CN209432867U CN 209432867 U CN209432867 U CN 209432867U CN 201822131952 U CN201822131952 U CN 201822131952U CN 209432867 U CN209432867 U CN 209432867U
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- hole
- chip testing
- sliding
- sliding unit
- base
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Abstract
The utility model discloses a kind of variable probe chip testing base, comprising: base portion, sliding unit, cover and probe；The base portion is equipped with multiple first through hole, the base portion is surrounded by block piece, multiple sliding units are fixed on base portion by block piece encirclement, the sliding unit is slidably connected each other, the cover lid dress on the sliding unit, is provided with multiple second through-holes in the cover, the sliding unit is clamped by base portion and cover, the sliding unit is equipped with third through-hole, and the probe passes through cover and penetrate third through-hole and is pierced by from first through hole from the second through-hole.The utility model can need to adjust the number of probes and probe location of testing base according to chip testing, can effectively reduce the risk that electrostatic damages chip in test process, chip rejection caused by avoiding because of electrostatic damage, reduce testing time and testing cost.
Description
Technical field
The utility model relates to integrated circuit fields, more particularly to a kind of variable spy for IC chip test
Needle chip test base (Socket).
Background technique
In the research and development of semiconductor chip and large-scale production process, it is required to test all kinds of performances of chip,
Chip test base (Socket) is the critical component in test device.The function of chip test base (Socket) is by chip positioning
The transmission of electric signal and electric current between clamping and wiring board.The function superiority and inferiority of chip test base (Socket) directly affects chip
The reliability and accuracy of test.As the speed of service of chip increasingly improves and the reduction of electronic product size, chip is surveyed
The requirement of examination seat (Socket) performance also increasingly improves.It is, in general, that the main component of chip test base (Socket) includes visiting
Needle (probe), probe carriage and other electrical connections.There is needle cave in probe carriage to place the needle body of probe, needle body holds placement
On structural member inside it, probe can ensure that the transmission of electric current and electric signal.
Existing chip test base (Socket) its bottom probe is fixed form, the fixed probe position simultaneously of number of probes at present
It is also fixed for setting.It is docked by the contact hole that chip test base (Socket) is inserted into test substrate, then by chip
It is put into chip test base (Socket), achievees the purpose that connect chip under test and tests substrate, and then pass through tester table pair
Chip under test carries out parameter testing and functional test.
In actual chips test job, the huge number of chip, chip layout is different, tests required probe location also not
It is identical.By the ESD design defect of some chip under test can be encountered, if probes certain on chip do not have esd protection circuit,
So that electrostatic enters chip interior by these probes, cause chip interior damage to influence chip functions.It needs more various
Product redundancy come ensure test be normally carried out, increase testing time and testing cost.
Utility model content
The technical problem to be solved by the present invention is to provide it is a kind of can be needed to adjust according to chip testing number of probes and
The variable probe chip testing base of probe location.
In order to solve the above technical problems, variable probe chip testing base provided by the utility model, comprising: base portion, cunning
Moving cell, cover and probe；
The base portion is equipped with multiple first through hole, and the base portion is surrounded by block piece, and multiple sliding units are by institute
It states block piece encirclement to be fixed on base portion, the sliding unit is slidably connected each other, and the cover lid is mounted in the sliding
On unit, multiple second through-holes are provided in the cover, the sliding unit is clamped by base portion and cover, the sliding unit
It is equipped with third through-hole, the probe passes through cover and penetrate third through-hole and is pierced by from first through hole from the second through-hole.
It is further improved the variable probe chip testing base, the cover bottom surface is surrounded by block piece, multiple
The sliding unit is fixed on base portion by block piece encirclement.
Be further improved the variable probe chip testing base, the base portion is rectangle, the first through hole with
Array format is arranged on base portion.
Be further improved the variable probe chip testing base, the cover is rectangle, second through-hole with
Array format is arranged in cover.
It is further improved the variable probe chip testing base, the base portion and cap shape same area are equal.
It is further improved the variable probe chip testing base, the first through hole, the second through-hole and third through-hole
Quantity is identical, and position corresponds arrangement.
It is further improved the variable probe chip testing base, the first through hole and third through-hole are circular holes, institute
Stating the second through-hole is square hole.
It is further improved the variable probe chip testing base, in the vertical direction, the first through hole and third
Through-hole is located at the underface of the second through-hole geometric center.
It is further improved the variable probe chip testing base, the first through hole and third through-hole area of section are big
In being equal to probe cross section area, the second through hole section area is more than or equal to chip signal contact point area.
It is further improved the variable probe chip testing base, at least block piece of side is equipped with closing device.
It is further improved the variable probe chip testing base, the sliding unit is rectangle sliding shoe.
It is further improved the variable probe chip testing base, the sliding block edge at least one side wall is equipped with convex
Edge, flange opposite side side wall are equipped with groove, and the sliding shoe passes through the flange each other and groove forms sliding and fixes.
It is further improved the variable probe chip testing base, sliding block edge two-phase neighbour's side wall is equipped with convex
Edge, in addition two adjacent walls are equipped with groove, and the sliding shoe passes through the flange each other and groove forms sliding and fixes.
It is further improved the variable probe chip testing base, the sliding unit is divided at least three kinds, every kind
The area of sliding unit is different, and the third through-hole quantity being arranged on every kind of sliding unit is different.
It is further improved the variable probe chip testing base, the first sliding unit is equipped at least one third
Through-hole.
It is further improved the variable probe chip testing base, second of sliding unit is equipped at least two thirds
Through-hole.
It is further improved the variable probe chip testing base, the third sliding unit is equipped at least three thirds
Through-hole.
It is further improved the variable probe chip testing base, the third through-hole is divided into two parts, and described the
Three through-hole first parts are located above its second part, and it is straight that third through-hole first part diameter is greater than third through-hole second part
Diameter.
It is further improved the variable probe chip testing base, third through-hole first part diameter is equal to probe
With chip signal contact jaw diameter, the third through-hole second part diameter is equal to probe diameter.
The variable probe chip testing base probe of the utility model is fixed on sliding unit, between sliding unit
It is to be slidably connected.When needing to change number of probes and probe location, the closing device on block piece can be opened, make to be located at most
The sliding unit of marginal position removes, and then each sliding unit can be made to be located at test by adjusting the position of other sliding units
Position required for probe.Then, then cover installation probe is opened, that is, realizes and changes number of probes and probe location.Pass through change
Number of probes and probe location can make the probe location for not needing to be tested vacant, and will have the probe of ESD risk to be placed in
Floating, the electrical contact of cutting test chip ESD high risk probe and test equipment, avoids test equipment from physical layer
Or substrate generates electrostatic damage to unrelated or not esd protection circuit probe is tested.
The utility model can be designed according to different chips, realize different probe array by sliding unit various combination, can
To play the role of the ESD protection to chip from the connection of physical layer cutting chip and tester table.It can by the utility model
The risk that electrostatic damages chip in test process is effectively reduced, chip rejection caused by avoiding because of electrostatic damage, when reducing test
Between and testing cost.
Detailed description of the invention
The utility model is described in further detail with specific embodiment with reference to the accompanying drawing:
Fig. 1 is a kind of existing chip testing schematic diagram of base structure one.
Fig. 2 is a kind of existing chip testing schematic diagram of base structure two.
Fig. 3 is that the utility model can be changed probe chip testing base first embodiment overall structure diagram.
Fig. 4 is that the utility model can be changed one embodiment schematic diagram of probe chip testing base base portion.
Fig. 5 the utility model can be changed one embodiment schematic diagram of probe chip testing base cover.
Fig. 6 is the utility model sliding unit schematic structural diagram of the second embodiment.
Fig. 7 is the utility model sliding unit 3rd embodiment structural schematic diagram.
Fig. 8 is the utility model sliding unit fourth embodiment structural schematic diagram.
Fig. 9 is the 5th example structure schematic diagram of the utility model sliding unit.
Figure 10 is the utility model sliding unit third through-hole embodiment schematic diagram.
Description of symbols
Base portion 1
First through hole 1.1
Block piece 1.2
Closing device 1.3
Sliding unit 2
Third through-hole 2.1
Third through-hole first part 2.1.1
Third through-hole second part 2.1.2
Cover 3
Second through-hole 3.1
Probe 4
Block piece 5
Chip signal contact point 6
Probe and chip signal contact jaw A
Chip signal terminal B
Specific embodiment
As shown in figure 3, variable probe chip testing base first embodiment provided by the utility model, comprising: base portion 1,
Sliding unit 2, cover 3 and probe 4；
The base portion 1 is equipped with multiple first through hole 1.1, and the base portion 1 is surrounded by block piece 1.2, multiple slidings
Unit 2 is fixed on base portion 1 by the block piece 1.2 encirclement, and the sliding unit 2 is slidably connected each other, the cover 3
Lid is provided with multiple second through-holes 3.1, the sliding unit 2 is by 1 He of base portion on the sliding unit 2 in the cover 3
Cover 3 clamps, and the sliding unit 2 is equipped with third through-hole 2.1, and the probe 4 passes through cover 3 from the second through-hole 3.1 and wears
It is pierced by after entering third through-hole 2.1 from first through hole 1.1.The block piece 1.2 surrounds fixed multiple sliding units 2 on base portion.
As shown in figure 4, the utility model can be changed one embodiment of probe chip testing base base portion, the base portion 1 is rectangular
Shape, the first through hole 1.1 are arranged in the form of an array on base portion 1.Base portion 1 is surrounded by block piece 1.2, the block piece
1.2 encirclements are fixed on base portion 1.The block piece 1.2 of the base portion 1 at least side is equipped with closing device 1.3.In the present embodiment
Closing device 1.3 is the baffle that one end axis fixation can be selected along fixing axle.
As shown in figure 5, the utility model can be changed one embodiment of probe chip testing base cover, the cover 3 is rectangular
Shape, second through-hole 3.1 are arranged in the form of an array in cover 3.In a deformable embodiment of the utility model, resistance
The bottom surface surrounding of cover 3 is arranged in block piece 1.2, and at least block piece 1.2 of side is equipped with closing device 1.3.Also, closing device
1.3 baffles that can also can be rotated along fixing axle using the fixation of one end axis.
Variable probe chip testing base second embodiment provided by the utility model, comprising: base portion 1, sliding unit 2,
Cover 3 and probe 4；
The base portion 1 is equipped with multiple first through hole 1.1, and the base portion 1 is surrounded by block piece 1.2, multiple slidings
Unit 2 is fixed on base portion 1 by the block piece 1.2 encirclement, and the lid of cover 3 is on the sliding unit 2, the cover
Multiple second through-holes 3.1 are provided on 3, the sliding unit 2 is clamped by base portion 1 and cover 3, and the sliding unit 2 is equipped with
Third through-hole 2.1, the probe 4 pass through cover 3 and penetrate after third through-hole 2.1 and wear from first through hole 1.1 from the second through-hole 3.1
Out.The block piece 1.2 surrounds fixed multiple sliding units 2 on base portion.
The base portion 1 is rectangle, and the first through hole 1.1 is arranged in the form of an array on base portion 1.1 surrounding of base portion is set
There is block piece 1.2, the encirclement of block piece 1.2 is fixed on base portion 1.The block piece 1.2 of the base portion 1 at least side is equipped with and opens
It attaches together and sets 1.3.Closing device 1.3 in the present embodiment is the baffle that one end axis fixation can be selected along fixing axle.
The cover 3 is rectangle, and second through-hole 3.1 is arranged in the form of an array in cover 3.In the utility model
A deformable embodiment in, block piece 1.2 is arranged in the bottom surface surrounding of cover 3, and at least the block piece 1.2 of side is equipped with and opens
It attaches together and sets 1.3.Also, the baffle that closing device 1.3 can also can be rotated using the fixation of one end axis along fixing axle.
The base portion 1 is equal with 3 shape same area of cover, and the first through hole 1.1, the second through-hole 3.1 and third are logical
2.1 quantity of hole is identical, and position corresponds arrangement.
The first through hole 1.1 and third through-hole 2.1 are circular holes, and second through-hole 3.1 is square hole, the first through hole
1.1 and third through-hole 3.1 be located at the underface of 2.1 geometric center of the second through-hole.
The first through hole 1.1 and 3.1 area of section of third through-hole are more than or equal to 4 area of section of probe, and described second is logical
3.1 area of section of hole is more than or equal to 6 area of chip signal contact point.
The first embodiment of the sliding unit 2, the sliding unit 2 are rectangle sliding shoes, and the sliding block edge is extremely
Few one side wall is equipped with flange 2.2, and flange opposite side side wall is equipped with groove (not showing opposite side groove in figure), the sliding shoe 2
Sliding is formed by the flange 2.2 and groove 2.3 each other to fix.
As shown in fig. 6, the second embodiment of the sliding unit 2, which is rectangle sliding shoe, the cunning
2 edge of motion block, two adjacent wall is equipped with flange 2.2, and in addition two adjacent walls are equipped with groove 2.3, and the sliding shoe is logical each other
It crosses the flange 2.2 and groove 2.3 forms sliding and fixes.
As shown in fig. 7, the 3rd embodiment of the sliding unit 2, which is rectangle sliding shoe, the cunning
2 edge of motion block, two adjacent wall is equipped with flange 2.2, and in addition two adjacent walls are equipped with groove 2.3, and the sliding shoe is logical each other
It crosses the flange 2.2 and groove 2.3 forms sliding and fixes.The sliding unit is divided at least three kinds, every kind of sliding unit
Area is different, and the third through-hole quantity being arranged on every kind of sliding unit is different.
2 3rd embodiment of sliding unit is equipped with a third through-hole 2.1.
As shown in figure 8, the fourth embodiment of the sliding unit 2, which is rectangle sliding shoe, the cunning
2 edge of motion block, two adjacent wall is equipped with flange 2.2, and in addition two adjacent walls are equipped with groove 2.3, and the sliding shoe is logical each other
It crosses the flange 2.2 and groove 2.3 forms sliding and fixes.The sliding unit is divided at least three kinds, every kind of sliding unit
Area is different, and the third through-hole quantity being arranged on every kind of sliding unit is different.
2 fourth embodiment of sliding unit is equipped with two third through-holes 2.1.
As shown in figure 9, the fourth embodiment of the sliding unit 2, which is rectangle sliding shoe, the cunning
2 edge of motion block, two adjacent wall is equipped with flange 2.2, and in addition two adjacent walls are equipped with groove 2.3, and the sliding shoe is logical each other
It crosses the flange 2.2 and groove 2.3 forms sliding and fixes.The sliding unit is divided at least three kinds, every kind of sliding unit
Area is different, and the third through-hole quantity being arranged on every kind of sliding unit is different.
Third through-hole 2.1 there are three being set in 2 fourth embodiment of sliding unit.
As shown in Figure 10, the third through-hole 2.1 is divided into two parts, and the third through-hole first part 2.1.1 is located at
Above its second part 2.1.2, third through-hole first part 2.1.1 diameter is greater than third through-hole second part 2.1.2 diameter.Institute
Third through-hole first part 2.1.1 diameter is stated equal to probe and chip signal contact jaw A diameter, the third through-hole second part
2.1.2 diameter is equal to probe diameter.
The utility model is described in detail above by specific embodiment and embodiment, but these are not structure
At limitations of the present invention.In the case where not departing from the utility model principle, those skilled in the art can also be made
Many modification and improvement, these also should be regarded as the protection scope of the utility model.
Claims (19)
1. a kind of variable probe chip testing base characterized by comprising base portion, sliding unit, cover and probe；
The base portion is equipped with multiple first through hole, and the base portion is surrounded by block piece, and multiple sliding units are by the resistance
Block piece encirclement is fixed on base portion, and the sliding unit is slidably connected each other, and the cover lid is mounted in the sliding unit
On, multiple second through-holes are provided in the cover, the sliding unit is clamped by base portion and cover, is set on the sliding unit
There is third through-hole, the probe passes through cover and penetrate third through-hole and is pierced by from first through hole from the second through-hole.
2. variable probe chip testing base as described in claim 1, it is characterised in that: the cover bottom surface is surrounded by resistance
Block piece, multiple sliding units are fixed on base portion by block piece encirclement.
3. variable probe chip testing base as claimed in claim 1 or 2, it is characterised in that: the base portion is rectangle, institute
First through hole is stated to be arranged on base portion in the form of an array.
4. variable probe chip testing base as claimed in claim 3, it is characterised in that: the cover is rectangle, described
Second through-hole is arranged in cover in the form of an array.
5. variable probe chip testing base as claimed in claim 4, it is characterised in that: the base portion is identical with cap shape
Area equation.
6. variable probe chip testing base as claimed in claim 5, it is characterised in that: the first through hole, the second through-hole
Identical with third through-hole quantity, position corresponds arrangement.
7. variable probe chip testing base as claimed in claim 6, it is characterised in that: the first through hole and third through-hole
It is circular hole, second through-hole is square hole.
8. variable probe chip testing base as claimed in claim 7, it is characterised in that: in the vertical direction, described first
Through-hole and third through-hole are located at the underface of the second through-hole geometric center.
9. variable probe chip testing base as claimed in claim 8, it is characterised in that: the first through hole and third through-hole
Area of section is more than or equal to probe cross section area, and the second through hole section area is more than or equal to chip signal contact point area.
10. variable probe chip testing base as claimed in claim 1 or 2, it is characterised in that: the block piece of at least side is set
There is closing device.
11. variable probe chip testing base as claimed in claim 1 or 2, it is characterised in that: the sliding unit is rectangular
Shape sliding shoe.
12. variable probe chip testing base as claimed in claim 11, it is characterised in that: the sliding block edge at least one
Side wall is equipped with flange, and flange opposite side side wall is equipped with groove, and the sliding shoe passes through the flange and groove type each other
It is fixed at sliding.
13. variable probe chip testing base as claimed in claim 11, it is characterised in that: the sliding block edge two-phase is adjacent
Side wall is equipped with flange, and in addition two adjacent walls are equipped with groove, and the sliding shoe passes through the flange each other and groove is formed
Sliding is fixed.
14. variable probe chip testing base as claimed in claim 11, it is characterised in that: the sliding unit be divided into
Three kinds few, the area of every kind of sliding unit is different, and the third through-hole quantity being arranged on every kind of sliding unit is different.
15. variable probe chip testing base as claimed in claim 14, it is characterised in that: the first sliding unit is equipped with
At least one third through-hole.
16. variable probe chip testing base as claimed in claim 14, it is characterised in that: second of sliding unit is equipped with
At least two third through-holes.
17. variable probe chip testing base as claimed in claim 14, it is characterised in that: the third sliding unit is equipped with
At least three third through-holes.
18. variable probe chip testing base as claimed in claim 1 or 2, it is characterised in that: the third through-hole is divided into
Two parts, the third through-hole first part are located above its second part, and third through-hole first part diameter is logical greater than third
Hole second part diameter.
19. variable probe chip testing base as claimed in claim 12, it is characterised in that: the third through-hole first part is straight
Diameter is equal to probe and chip signal contact jaw diameter, and the third through-hole second part diameter is equal to probe diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822131952.3U CN209432867U (en) | 2018-12-19 | 2018-12-19 | Variable probe chip testing base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822131952.3U CN209432867U (en) | 2018-12-19 | 2018-12-19 | Variable probe chip testing base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209432867U true CN209432867U (en) | 2019-09-24 |
Family
ID=67972407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822131952.3U Active CN209432867U (en) | 2018-12-19 | 2018-12-19 | Variable probe chip testing base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209432867U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117289115A (en) * | 2023-11-24 | 2023-12-26 | 北京国科天迅科技股份有限公司 | Chip test base generation method and device and computer equipment |
-
2018
- 2018-12-19 CN CN201822131952.3U patent/CN209432867U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117289115A (en) * | 2023-11-24 | 2023-12-26 | 北京国科天迅科技股份有限公司 | Chip test base generation method and device and computer equipment |
| CN117289115B (en) * | 2023-11-24 | 2024-02-20 | 北京国科天迅科技股份有限公司 | Chip test base generation method and device and computer equipment |
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