CN206920483U - Probe card and semiconductor test apparatus - Google Patents
Probe card and semiconductor test apparatus Download PDFInfo
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- CN206920483U CN206920483U CN201720890628.2U CN201720890628U CN206920483U CN 206920483 U CN206920483 U CN 206920483U CN 201720890628 U CN201720890628 U CN 201720890628U CN 206920483 U CN206920483 U CN 206920483U
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- probe
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- probe card
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Abstract
The utility model embodiment provides a kind of probe card and semiconductor test apparatus, including：Substrate, in the centrally disposed rectangular test specimen bearing area of the substrate, the rectangular test specimen bearing area also includes fixture, and the fixture is used to clamp test sample；In the outside on described four sides in rectangular test specimen bearing area, rectangular probe welding disking area is set；The rectangular probe welding disking area includes the first pad of array arrangement, and first pad is used to electrically connect with the first end of probe, and the second end of the probe electrically connects with the test sample.The utility model embodiment provides a kind of probe card and semiconductor test apparatus, by the welding disking area being connected with probe in probe card of making rational planning for, is beneficial to the test to the electric property of testing sample, and significantly reduce manufacturing cost.
Description
Technical field
The utility model embodiment is related to technical field of semiconductors, more particularly to a kind of probe card and semiconductor test dress
Put.
Background technology
In integrated circuit (IC) design, manufacturing technology field, there is the needs eliminated the false and retained the true, and screen defect ware, prevent
Into lower process together, the manufacturing expense of the redundancy in next process is reduced, this just needs debugging and test.
Debugging is ATE with the equipment needed for test.In the prior art, half is provided with ATE
Conductor test board, probe card is provided with semiconductor test board, probe is provided with probe card.But in existing probe card
Set for the welding disking area that is connected with the probe in probe card unreasonable, many problems and not be present planting among pin use
Just, and it have impact on the test result of the electric property for testing sample.
Utility model content
In view of this, the utility model embodiment provides a kind of probe card and semiconductor test apparatus, optimizes probe
The layout of the welding disking area being connected with probe on card, is beneficial to the test to the electric property of testing sample, and be greatly reduced
Manufacturing cost.
In a first aspect, the utility model embodiment provides a kind of probe card, including：Substrate, at the center of the substrate
Rectangular test specimen bearing area is set, and the rectangular test specimen bearing area also includes fixture, and the fixture is used to clamp
Test sample；
In the outside on described four sides in rectangular test specimen bearing area, rectangular probe welding disking area is set；
The rectangular probe welding disking area includes the first pad of array arrangement, and first pad is used for the with probe
One end electrically connects, and the second end of the probe electrically connects with the test sample.
Optionally, in addition to Rectangular Spring pin welding disking area, the Rectangular Spring pin welding disking area are positioned adjacent to described
The inner side on four sides of substrate, and the inner side on each side sets Rectangular Spring pin welding disking area described in quantity identical；The square
Shape spring needle welding disking area includes the second pad of array arrangement, for being electrically connected with spring needle card, the rectangular probe pad
First pad in region electrically connects with the second pad of the Rectangular Spring pin welding disking area.
Optionally, the substrate is that printed circuit board (PCB), second pad and first pad pass through the printing electricity
Connecting line electrical connection on the plate of road.
Optionally, a ground hole is set beside the first pad of each rectangular probe welding disking area.
Optionally, the air line distance between described two the first pads of arbitrary neighborhood be more than or equal to 100mil, and
Air line distance between adjacent second pad of any two is more than or equal to 100mil.
Optionally, the length range of the probe is less than or equal to 5000mil.
Optionally, the test sample bearing area is square.
Second aspect, the utility model embodiment provide a kind of semiconductor test apparatus, including：
ATE；
The semiconductor test board being arranged on the ATE, the automated test device include multiple ends
Mouthful, the port electrically connects with the semiconductor test board；
The spring needle card being arranged on the semiconductor test board, the spring needle card include multiple spring needles, the bullet
The first end of spring pin electrically connects with the semiconductor test board；
The probe card being arranged on the spring needle card, the probe card are included in above-mentioned technical proposal described in any one
Probe card；
The pad for the Rectangular Spring pin welding disking area being arranged in the probe card, the Rectangular Spring pin pad area
Second pad in domain electrically connects with the second end of the spring needle；
First pad of the rectangular probe welding disking area being arranged in the probe card electrically connects with the first end of probe；
Second end of the probe electrically connects with test sample.
The utility model embodiment provides a kind of probe card and semiconductor device, by rectangular test specimen supporting region
The outside on four, domain side sets rectangular probe welding disking area；The first pad and the first of probe that rectangular probe welding disking area includes
End electrical connection, the second end of probe is electrically connected with test sample to realize the test process to testing sample.Compared with prior art
In, the air line distance for the first pad pitch center test sample bearing area furthered in probe card, accordingly, reduce use
In the length for the probe for connecting the first pad and testing sample, electrical signal is reduced between the first pad and testing sample
Transmission range, there is provided test rate, while the electric energy loss on probe is reduced, save the energy.Simultaneously as in rectangle
The outside on the side of test sample bearing area four sets rectangular probe welding disking area, compared with prior art in, rectangular probe is welded
Disk area is arranged on edge, and the spatial choice scope of rectangular probe welding disking area is bigger, the straight line between adjacent first pad
Distance can also be set bigger, so be more convenient to plant pin on the first pad, that is, complete the first end and the first pad of probe
Electrical connection, reduce the difficulty of the technique, reduce the cost for producing the probe card.
Brief description of the drawings
Fig. 1 a are a kind of structural representation for probe card that the utility model embodiment one provides；
Fig. 1 b are that the first pad, the probe of a kind of probe card that the utility model embodiment one provides connect with testing sample
The structural representation of relation；
Fig. 2 is the structural representation for another probe card that the utility model embodiment one provides；
Fig. 3 a are a kind of structural representation for semiconductor test apparatus that the utility model embodiment two provides；
Fig. 3 b are Fig. 3 a partial enlarged drawing.
Embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples.It is understood that herein
Described specific embodiment is used only for explaining the utility model, rather than to restriction of the present utility model.Further need exist for
It is bright, for the ease of description, the part related to the utility model rather than entire infrastructure are illustrate only in accompanying drawing.
Embodiment one
Fig. 1 a are a kind of structural representation for probe card that the utility model embodiment one provides；Fig. 1 b are the utility model
The structural representation of a kind of the first pad of probe card, probe and testing sample annexation that embodiment one provides；Fig. 2 is this
The structural representation for another probe card that utility model embodiment one provides.
The utility model embodiment provides a kind of probe card, and referring to Fig. 1 a and Fig. 1 b, the probe card 100 includes：Substrate
1, in the centrally disposed rectangular test specimen bearing area 2 of substrate 1, rectangular test specimen bearing area 2 also includes fixture 3, folder
Tool 3 is used to clamp test sample 4；In the outside on the side 21 of rectangular test specimen bearing area 2 four, rectangular probe pad area is set
Domain 5；Rectangular probe welding disking area 5 includes the first pad 51 of array arrangement, and the first pad 51 is used for the first end 61 with probe 6
Electrical connection, the second end 62 of probe 6 electrically connects with test sample 4.
In the present embodiment, can be the examples of materials of fixture 3 epoxy resin.Fixture 3 can be exemplarily three
The shape of foot stool, person skilled can also be according to the shape of testing sample and the shape of feature sets itself fixture, this realities
Example is applied to be not construed as limiting this.Testing sample can be exemplarily wafer, wherein it is possible to be the wafer for being integrated with multiple chips,
It may also be to integrate the wafer of any circuit.Exemplary, the second end 62 of probe and sample when test can be set in test sample
The contact point of condition contact.Second end 62 of the probe 6 in probe card 100 is in contact with the contact point in test sample 4, example
Property can be treated by two probes or four-probe principle, by applying voltage or current signal to testing sample to test
The electric properties such as the resistivity of test sample product.
The utility model embodiment provides a kind of probe card 100, by the side of rectangular test specimen bearing area 2 four
21 outside sets rectangular probe welding disking area 5；The first pad 51 and the first of probe 6 that rectangular probe welding disking area 5 includes
The electrical connection of end 61, the second end 62 of probe 6 is electrically connected with test sample 4 to realize the test process to test sample 4.Compared to existing
Have in technology, the air line distance of the distance center test sample bearing area 2 of the first pad 51 in the probe card that furthered 100, phase
Answer, reduce the length of the probe 6 for connecting the first pad 51 and test sample 4, reduce electrical signal in the first weldering
Transmission range between disk 51 and test sample 4, there is provided test rate, while the electric energy loss on probe is reduced, save
The energy.Simultaneously as rectangular probe welding disking area 5, phase are set in the outside on the side 21 of rectangular test specimen bearing area 2 four
Than in the prior art, rectangular probe welding disking area 5 being arranged on into edge, the spatial choice scope of rectangular probe welding disking area is more
Greatly, what the air line distance between adjacent first pad 51 can also be set is bigger, is so more convenient to plant pin on the first pad 51,
The electrical connection of the pad 51 of first end 61 and first of probe 6 is completed, the difficulty of the technique is reduced, reduces and produce the probe
The cost of card.
Optionally, Rectangular Spring pin welding disking area 7, Rectangular Spring pin pad area are also included referring to Fig. 2, the probe card 100
Domain 7 is positioned adjacent to the inner side on four sides 11 of substrate 1, and the inner side on each side 11 sets the weldering of quantity identical Rectangular Spring pin
Disk area 7；Rectangular Spring pin welding disking area 7 includes the second pad 71 of array arrangement, for electric with spring needle card (not shown)
Connection, the first pad 51 of rectangular probe welding disking area 5 electrically connect with the second pad 71 of Rectangular Spring pin welding disking area 7.
In the present embodiment, the second pad 71 that Rectangular Spring pin welding disking area 7 includes is electrically connected with Spring Card, and rectangle is visited
First pad 51 of pin welding disking area 5 electrically connects with the second pad 71 of Rectangular Spring pin welding disking area 7, the test that probe measures
Information and the information between test sample 4 is applied to by probe 6 between sample, the second weldering is passed to by the first pad 51
Disk 71, reception that can be as test signal and sendaisle.
Optionally, substrate 1 is printed circuit board (PCB), and the second pad 71 and the first pad 51 pass through the connection on printed circuit board (PCB)
Line (not shown) electrically connects.Substrate of the printed circuit board (PCB) as whole probe card 100, for carrying the rectangle in probe card 100
Spring needle welding disking area 7, Rectangular Spring pin welding disking area 5, the second pad 71 and the connecting line of the first pad 51 and other connections
Circuit.Second pad 71 and the first pad 51 are electrically connected by the connecting line on printed circuit board (PCB), so that the test that probe measures
Information and the information being applied to by probe between test sample between sample, the second pad is passed to by the first pad 51
71, reception that can be as test signal and sendaisle.
Optionally, the side of the first pad 51 of each rectangular probe welding disking area 5 sets a ground hole, facilitates the second weldering
High speed signal between disk and first pad has shorter return flow path.
Optionally, the air line distance between two the first pads 51 of arbitrary neighborhood is more than or equal to 100mil, Yi Jiren
Air line distance between two adjacent second pads 71 of meaning is more than or equal to 100mil.Two the first pads 51 of arbitrary neighborhood it
Between air line distance be more than or equal to 100mil, be so more convenient to plant pin on the first pad 51, that is, complete the first of probe
End and the electrical connection of the first pad, the difficulty of the technique is reduced, reduces the cost for producing the probe card.Any two is adjacent
Air line distance between second pad 71 is more than or equal to 100mil, facilitates the electrical connection of spring needle card and the second pad 71.
Optionally, the length range of probe is less than or equal to 5000mil.Rectangular probe welding disking area 5 include first
Pad 51 is connected with the first end electricity 61 of probe 6, and the second end 62 of probe 6 is electrically connected with test sample 4 to realize to test specimens
The test process of product 4.In compared with prior art, the distance center test sample of the first pad 51 in the probe card that furthered 100 is held
The air line distance in region 2 is carried, accordingly, the length of the probe 6 for connecting the first pad 51 and test sample 4 is reduced, subtracts
Small transmission range of the electrical signal between the first pad 51 and test sample 4, there is provided test rate, while reduce spy
Electric energy loss on pin, saves the energy.
Optionally, test sample bearing area 2 is square, square test sample bearing area, each side 21
Equal length so that the distance of the testing sample of the fixture clamping in rectangular probe welding disking area distance test sample bearing area
It is equal, be advantageous to reduce test error.
Embodiment two
Fig. 3 a are a kind of structural representation for semiconductor test apparatus that the utility model embodiment two provides；Fig. 3 b are figure
3a partial enlarged drawing.
Based on same design utility model, the utility model embodiment provides a kind of semiconductor test apparatus, referring to figure
3a and Fig. 3 b, referring also to Fig. 1 b, the device include：ATE 400；Half be arranged on ATE 400
Conductor test board 300, automated test device 400 include multiple ports 410, and port 410 is electrically connected with semiconductor test board 300
Connect；The spring needle card 200 being arranged on semiconductor test board 300, spring needle card 200 include multiple spring needles 210, spring needle
First end 211 electrically connects with semiconductor test board 300；The probe card 100 being arranged on spring needle card 200, probe card 100 include
The probe card 100 of any one provided in above-described embodiment；The Rectangular Spring pin welding disking area 7 being arranged in probe card 100
The second pad 71, the second pad 71 electrically connects with the second end 212 of spring needle 210；The rectangle being arranged in probe card 100 is visited
First pad 51 of pin welding disking area electrically connects (referring to Fig. 1 b) with the first end 61 of probe 6；The second end 62 and the test of probe 6
Sample 4 electrically connects (referring to Fig. 1 b).
In the present embodiment, it is such that test signal reaches test sample transmittance process by automated test device：
User selects test event, such as the resistivity of test sample at automated test device end, then automated test device needs
Will will the electric signal of test sample resistivity be added in test sample, automated test device passes to signal by port
Semiconductor test board, semiconductor test board passes information to the spring needle for output signal on spring needle card, for defeated
The spring needle for going out signal passes information to the second weldering for output signal of the Rectangular Spring pin welding disking area in probe card
Disk, the second pad for output signal pass information to the first pad for output signal, and for output signal
One pad passes information to the probe for output signal, and the probe for output signal will test testing sample resistivity
Electric signal be applied on testing sample.
When being completed, the information transmission of the testing sample measured is used for reception signal by the probe for reception signal
The first pad, the first pad for reception signal passes information to the second pad for reception signal, for receiving
Second pad of signal passes information to the spring needle for reception signal, and the spring needle for reception signal passes the information on
It is to the region for being used for reception signal in semiconductor test board, semiconductor test board that information is anti-by the port for reception signal
Feed ATE, used for customer analysis.
Semiconductor test apparatus provided by the utility model, using the probe card in above-described embodiment, compared with prior art
In, the air line distance for the first pad pitch center test sample bearing area furthered in probe card, accordingly, reduce use
In the length for the probe for connecting the first pad and test sample, electrical signal is reduced between the first pad and test sample
Transmission range, there is provided test rate, while the electric energy loss on probe is reduced, save the energy.Simultaneously as in rectangle
The outside on the side of test sample bearing area four sets rectangular probe welding disking area, compared with prior art in, rectangular probe is welded
Disk area is arranged on edge, and the spatial choice scope of rectangular probe welding disking area is bigger, the straight line between adjacent first pad
Distance can also be set bigger, so be more convenient to plant pin on the first pad, that is, complete the first end and the first pad of probe
Electrical connection, reduce the difficulty of the technique, reduce the cost for producing the probe card.
Pay attention to, above are only preferred embodiment of the present utility model and institute's application technology principle.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, can carried out for a person skilled in the art various bright
Aobvious change, readjust, be combined with each other and substitute without departing from the scope of protection of the utility model.Therefore, although passing through
Above example is described in further detail to the utility model, but the utility model is not limited only to above implementation
Example, in the case where not departing from the utility model design, other more equivalent embodiments can also be included, and it is of the present utility model
Scope is determined by scope of the appended claims.
Claims (8)
- A kind of 1. probe card, it is characterised in that including：Substrate, in the centrally disposed rectangular test specimen bearing area of the substrate, the rectangular test specimen bearing area is also Including fixture, the fixture is used to clamp test sample；In the outside on described four sides in rectangular test specimen bearing area, rectangular probe welding disking area is set；The rectangular probe welding disking area includes the first pad of array arrangement, and first pad is used for the first end with probe Electrical connection, the second end of the probe electrically connects with the test sample.
- 2. probe card according to claim 1, it is characterised in thatAlso include Rectangular Spring pin welding disking area, the Rectangular Spring pin welding disking area is positioned adjacent to four sides of the substrate Inner side, and the inner side on each side sets Rectangular Spring pin welding disking area described in quantity identical；The Rectangular Spring pin pad Region includes the second pad of array arrangement, for being electrically connected with spring needle card, the first weldering of the rectangular probe welding disking area Disk electrically connects with the second pad of the Rectangular Spring pin welding disking area.
- 3. probe card according to claim 2, it is characterised in thatThe substrate is printed circuit board (PCB), and second pad and first pad pass through the connection on the printed circuit board (PCB) Line electrically connects.
- 4. probe card according to claim 1, it is characterised in thatA ground hole is set beside first pad of each rectangular probe welding disking area.
- 5. probe card according to claim 2, it is characterised in thatAir line distance between described two the first pads of arbitrary neighborhood is adjacent more than or equal to 100mil, and any two Air line distance between second pad is more than or equal to 100mil.
- 6. probe card according to claim 1, it is characterised in thatThe length range of the probe is less than or equal to 5000mil.
- 7. probe card according to claim 1, it is characterised in thatThe test sample bearing area is square.
- A kind of 8. semiconductor test apparatus, it is characterised in that including：ATE；The semiconductor test board being arranged on the ATE, the automated test device include multiple ports, institute Port is stated to electrically connect with the semiconductor test board；The spring needle card being arranged on the semiconductor test board, the spring needle card include multiple spring needles, the spring needle First end electrically connected with the semiconductor test board；The probe card being arranged on the spring needle card, the probe card are included described in the claims 1-7 any one Probe card；The pad for the Rectangular Spring pin welding disking area being arranged in the probe card, the Rectangular Spring pin welding disking area Second pad electrically connects with the second end of the spring needle；First pad of the rectangular probe welding disking area being arranged in the probe card electrically connects with the first end of probe；Second end of the probe electrically connects with test sample.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720890628.2U CN206920483U (en) | 2017-07-21 | 2017-07-21 | Probe card and semiconductor test apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720890628.2U CN206920483U (en) | 2017-07-21 | 2017-07-21 | Probe card and semiconductor test apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206920483U true CN206920483U (en) | 2018-01-23 |
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ID=61346946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720890628.2U Active CN206920483U (en) | 2017-07-21 | 2017-07-21 | Probe card and semiconductor test apparatus |
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|---|---|
| CN (1) | CN206920483U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112034218A (en) * | 2020-09-22 | 2020-12-04 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | CAF testing device and testing method |
-
2017
- 2017-07-21 CN CN201720890628.2U patent/CN206920483U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112034218A (en) * | 2020-09-22 | 2020-12-04 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | CAF testing device and testing method |
| CN112034218B (en) * | 2020-09-22 | 2024-04-05 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | CAF testing device and testing method |
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