JP2017194388A - Probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe card that can prevent positional deviation for a probe substrate in a plane direction at the time of inspection.SOLUTION: A probe card has a probe substrate 11 having a probe 2 erected thereon, a wiring board facing the probe substrate 11, and support means that supports the probe substrate 11 on the wiring board. The support means has bias means that biases the probe substrate 11 in the plane direction.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a probe card, and more particularly, to an improvement in a probe card including a probe board on which a probe is erected.

  The probe card is an inspection device used for inspection of electrical characteristics of an electronic circuit formed on a semiconductor wafer, and a large number of probes are arranged on a wiring board. The characteristic inspection of the electronic circuit is performed by holding the probe card with the probe formation surface facing downward, and bringing the semiconductor wafer closer from the lower side to bring the tip of the probe into contact with the electrode on the electronic circuit, and through the probe, the tester device And the electronic circuit is conducted.

  Some conventional probe cards include a wiring board connected to the inspection device and a probe board on which a probe connected to the wiring board is disposed. In this case, a part for preventing fall is used. A probe board is supported by a wiring board (for example, patent document 1). FIG. 6 is a cross-sectional view showing a part of a conventional probe card 100. The probe card 100 includes a wiring board 110, a probe board 111, and a fall prevention component 112. The fall prevention component 112 is fixed to the wiring board 110 and supports the outer edge of the probe board 111 so that the probe board 111 does not fall. A plurality of probes 120 are attached to the lower surface of the probe substrate 111.

  A gap between the end surface of the probe substrate 111 and the fall prevention component 112 for preventing deformation of the probe substrate 111 due to the outer edge of the thermally expanded probe substrate 111 coming into contact with the fall prevention component 112 during high temperature inspection. 113 is formed.

  Further, when the probe 120 is a cantilever type probe having a beam portion extending substantially parallel to the probe substrate 111, a plurality of probes 120 are arranged on the probe substrate 111 in order to arrange the probes 120 at a narrow pitch. Probe rows arranged in the direction are formed. Further, two probe rows are formed in pairs so that the beam portions extend in parallel with each other and the tips of the beam portions face each other (for example, Patent Document 2). Here, the right probe 120 is called RP, and the left probe 120 is called LP.

Special table 2009-541715 JP 2011-43441 A

  After inspecting the semiconductor wafer using the conventional probe card as described above, the inventors of the present application confirmed the length of the needle trace formed on the electrode pad on the semiconductor wafer. It was found that there was variation between them.

  FIG. 7 is a diagram showing needle trace lengths formed on electrode pads on a semiconductor wafer for each OD (overdrive) amount when a semiconductor wafer is inspected using a conventional probe card. In the drawing, the needle trace length when the OD amount is 150 μm, the needle trace length when the OD amount is 200 μm, and the needle trace length when the OD amount is 250 μm are shown. In addition, the needle trace length is shown for each of the right probe RP and the left probe LP.

  The needle trace length corresponds to the amount of scrub by the probe, and becomes longer as the OD amount increases. However, when the right probe RP and the left probe LP are compared, the right probe RP has a needle trace length of the difference value RL. Is getting longer. As a result of obtaining the difference value RL under various inspection conditions, the difference value RL is about 1 to 5 μm and the needle mark length is about 10 to 15 μm. I know that there is. Further, the needle traces extended in the extending direction of the beam part, and no shift in the direction intersecting the extending direction of the beam part was observed. From these facts, the variation in the needle trace length is considered to be one of the causes that the probe substrate slides in the extending direction of the beam portion.

  A certain amount of scrub is necessary for the probe tip to break through the oxide film on the electrode pad to ensure electrical connection between the probe and the inspection object. On the other hand, if the amount of scrub is too long, the probe tip is detached from the electrode pad, and conduction cannot be obtained. That is, the scrub amount has an appropriate range. However, in the conventional probe card, as described above, there is a problem that the amount of scrub becomes shorter or longer than an appropriate range when the probe substrate slides in the extending direction of the beam portion.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a probe card that can suppress displacement of the probe substrate in the planar direction during inspection. In particular, an object of the present invention is to provide a probe card that can ensure an appropriate amount of scrub.

  A probe card according to a first aspect of the present invention includes a probe board on which a probe is erected, a wiring board arranged to face the probe board, and support means for supporting the probe board on the wiring board. Prepare. The support means includes urging means for urging the probe substrate in a planar direction. According to such a configuration, since the sliding of the probe substrate in the planar direction is limited by the biasing means, it is possible to suppress displacement of the probe substrate in the planar direction at the time of inspection.

  In the probe card according to the second aspect of the present invention, in addition to the above configuration, the probe is a cantilever probe, and the urging direction of the urging means substantially coincides with the scrub direction of the cantilever probe. Composed. According to such a configuration, sliding of the probe substrate in the scrub direction can be prevented.

  In the probe card according to the third aspect of the present invention, in addition to the above-described configuration, a plurality of the cantilever probes are erected in parallel with the scrub direction on the probe substrate, and the biasing direction of the biasing means Is configured to substantially coincide with the scrub direction of the plurality of cantilever probes. According to such a configuration, it is possible to prevent sliding of the probe substrate in which a plurality of cantilever probes are erected in parallel with the scrub direction.

  The probe card according to the fourth aspect of the present invention is configured such that, in addition to the above configuration, the urging means urges the end surface of the probe substrate. According to such a structure, the structure of a support means can be simplified. Further, it is possible to prevent the biasing means from coming into contact with the inspection object or the stage during the inspection.

  The probe card according to the fifth aspect of the present invention is configured such that, in addition to the above configuration, the support means has two or more urging means arranged with the probe interposed therebetween. According to such a configuration, the displacement of the probe can be prevented.

  According to a sixth aspect of the present invention, in addition to the above configuration, the probe card includes a beam portion that extends substantially parallel to the probe substrate, and the biasing means has a component in a direction in which the beam portion extends. An urging force having the same is applied to the end surface of the probe substrate. According to such a configuration, since the sliding of the probe substrate in the direction in which the beam portion extends is limited, it is possible to suppress the scrub amount from greatly deviating from an appropriate range.

  In the probe card according to the seventh aspect of the present invention, in addition to the above configuration, the biasing means includes a base member fixed to the wiring board, a pressing member pressed against an end surface of the probe board, and the base member. And a spring member that urges the pressing member, and the pressing member is configured to come into contact with the end surface of the probe board in a larger area than the spring member. According to such a configuration, damage to the probe substrate can be suppressed as compared with the case where the end surface of the probe substrate is directly urged by the spring member.

  In the probe card according to the eighth aspect of the present invention, in addition to the above configuration, one member of the pressing member and the base member is provided with a guide hole, and the other member has the above-described configuration. A convex portion to be inserted into the guide hole is provided, and the spring member is configured to be a disc spring having a through hole into which the convex portion is fitted. According to such a structure, the urging | biasing force with respect to a probe board | substrate can be easily adjusted by changing the number, kind, or material of a disc spring. Further, for example, by providing the guide hole on the base member side, it is possible to prevent the pressing member from becoming thick.

  According to the present invention, since the sliding of the probe substrate in the planar direction is limited, it is possible to suppress the displacement of the probe substrate in the planar direction during the inspection. Further, since the sliding of the probe substrate in the direction in which the beam portion extends is limited, it is possible to suppress the deviation of the scrub amount of the probe from a predetermined value, and to ensure an appropriate scrub amount. .

It is the figure which showed one structural example of the probe card 1 by embodiment of this invention. It is sectional drawing which showed a part of cut surface at the time of cut | disconnecting the probe card 1 of FIG. 1 by the AA cutting line. It is the perspective view which expanded and showed the probe board | substrate support unit 12 of FIG. It is the figure which showed the other structural example of the probe card. It is the figure which showed the other structural example of the probe card. It is sectional drawing which showed a part of conventional probe card 100. FIG. It is the figure which showed the needle trace length formed in the electrode pad on a semiconductor wafer for every OD (overdrive) amount.

  Embodiments of the present invention will be described below with reference to the drawings. In the present specification, for convenience, the thickness direction of the wiring board is described as the vertical direction, but the posture of the probe card according to the present invention is not limited. In this specification, a direction substantially perpendicular to the thickness direction of the wiring board is referred to as a plane direction.

<Probe card 1>
FIG. 1 is a diagram showing a configuration example of a probe card 1 according to an embodiment of the present invention. (A) in the figure shows the lower surface of the probe card 1, and (b) shows the case where the probe card 1 is viewed from the plane direction. FIG. 2 is a cross-sectional view showing a part of the cut surface when the probe card 1 of FIG. 1 is cut along an AA cutting line.

  The probe card 1 includes a main substrate 10, a probe substrate 11, a probe substrate support unit 12, a reinforcing plate 13, a support frame 14, and a guide plate 15, and a large number of probes 2 are erected on the probe substrate 11. That is, each probe 2 is installed on the probe substrate 11 in a standing state.

  The main board 10 is a flat wiring board held by a prober (not shown). The main board 10 is a circular printed board. Two or more external terminals (not shown) for connection to a tester device (not shown) are provided on the outer peripheral edge of the main substrate 10. The reinforcing plate 13 is a flat reinforcing member for reinforcing the main board 10. The reinforcing plate 13 is attached to the upper surface of the main board 10.

  The probe board 11 is a flat wiring board to which the probe 2 is attached, and is arranged to face the main board 10. The probe substrate 11 is arranged in parallel to the main substrate 10 below the main substrate 10. For example, the probe substrate 11 is an ST (space transformer) substrate that converts the arrangement pitch of electrodes between the upper surface and the lower surface. The probe substrate 11 is a circular ceramic substrate, and is arranged in a region inside the external terminal formation region in the main substrate 10.

  The probe substrate 11 is disposed below the main substrate 10 via the support frame 14 and the guide plate 15. The support frame 14 is fixed to the lower surface of the main board 10. The probe substrate 11 may be a polygonal substrate such as an octagon or a hexagon.

  The probe 2 is a contact probe formed of a conductive material. The probe 2 is a cantilever type probe, and includes a contact portion 21, a beam portion 22, and a base portion 23. The contact portion 21 is disposed at one end of the beam portion 22, and the base portion 23 is disposed at the other end of the beam portion 22.

  The contact portion 21 is a contact portion that comes into contact with the inspection object and has a shape protruding downward. The beam part 22 has a shape extending substantially parallel to the probe substrate 11 and is elastically deformed by a reaction force from the inspection object when the contact part 21 contacts the inspection object. The base portion 23 is a needle base portion that is fixed to the probe substrate 11.

  When a semiconductor wafer (not shown) is inspected using the probe card 1, the semiconductor wafer is brought close to the probe card 1 and the contact portion 21 of the probe 2 is brought into contact with the electrode pad on the semiconductor wafer. At this time, the beam portion 22 receives a load in the vertical direction by a reaction force from the electrode pad, and elastically deforms with the end portion on the base portion 23 side as a fixed end and the end portion on the contact portion 21 side as a free end. Due to such deformation of the beam portion 22, the contact portion 21 scrubs the surface of the electrode pad in the extending direction of the beam portion 22.

  If the amount of scrub is too small, the oxide film on the electrode pad cannot be pierced and good conduction performance cannot be obtained. On the other hand, if the amount of scrub is too large, the contact portion 21 protrudes from the electrode pad of the inspection object, and conduction cannot be obtained. Therefore, in order to perform a good inspection, it is necessary to realize an appropriate scrub amount.

  For example, the probe 2 is composed of a plate-like body in which a metal material is deposited in the thickness direction by electroplating. A probe row in which two or more probes 2 are arranged in the width direction of the probe 2 is formed on the lower surface of the probe substrate 11. Each probe 2 in the probe row is arranged so that the side surfaces of the beam portion 22 face each other. In the probe card 1 shown in FIG. 1, a probe row is composed of five probes 2.

  Further, a probe unit in which two probe rows are arranged is formed so that the beam portions 22 extend in parallel with each other and the tips of the beam portions 22 face each other. In each probe row in the probe unit, the arrangement direction of the probes 2 is the same. This probe unit is arranged in an island shape on the lower surface of the probe substrate 11. In this probe card 1, probe units are formed in a matrix of 3 rows and 4 columns. Further, the arrangement direction of the probes 2 is the same between the probe units.

  The probe board support unit 12 is a support means for supporting the probe board 11 with respect to the main board 10, and is an urging means for urging the probe board 11 in the plane direction, that is, the flat probe board 11 is flat. There is an urging means for urging along the direction. By providing such an urging means, the sliding of the probe substrate 11 in the planar direction is limited by the urging means, so that the displacement of the probe substrate 11 in the planar direction at the time of inspection can be suppressed.

  The probe board support unit 12 includes a pressing member 121, a spring member 122, and a base member 123, and is fixed to the reinforcing plate 13 by a fixture 124. That is, the probe board support unit 12 is fixed to the main board 10 via the reinforcing plate 13.

  The pressing member 121 is a contact member that presses against the end surface of the probe substrate 11. The spring member 122 is a biasing unit that biases the pressing member 121 against the base member 123, and biases the end surface of the probe substrate 11 in the planar direction via the pressing member 121. The base member 123 is a base member that is fixed to the reinforcing plate 13 by the fixture 124. The fixture 124 is a fastening member for fastening the base member 123 to the reinforcing plate 13 via the support frame 14 and the main board 10, and is attached to pass through the support frame 14 and the main board 10 and screw into the reinforcing board. It consists of screws.

  The probe substrate support unit 12 is disposed outside the outer periphery of the probe substrate 11, and is disposed to face the end surface of the probe substrate 11, that is, the side surface surrounding the main surface of the probe substrate 11. In this example, six probe substrate support units 12 are arranged along the outer peripheral edge of the probe substrate 11.

  Each probe substrate support unit 12 applies an urging force in a direction toward the center of the probe substrate 11 to the end surface of the probe substrate 11. In the probe card 1 shown in FIG. 1, two probe substrate support units 12 are arranged on a straight line DL1 that passes through the center of the probe substrate 11 and is parallel to the scrub direction, that is, the extending direction of the beam portion 22. It arrange | positions so that the probe board | substrate 11 may be pinched | interposed.

  Further, it is a straight line inclined by about + 45 ° with respect to the straight line DL1, and is a straight line inclined by about (−45) ° on the straight line DL2 passing through the center of the probe substrate 11 and passes through the center of the probe substrate 11. Two probe substrate support units 12 are arranged on the straight line DL3 so as to face each other with the probe substrate 11 in between.

  In each probe board support unit 12 on the straight line DL1, the urging direction of the spring member 122 substantially coincides with the scrub direction of the probe 2. Each probe board support unit 12 on the straight lines DL2 and DL3 has a component in which the urging force of the spring member 122 substantially coincides with the scrub direction of the probe 2. That is, the spring member 122 of each probe substrate support unit 12 applies an urging force having a component in the extending direction of the beam portion 22 to the end surface of the probe substrate 11.

  With this configuration, the probe substrate 11 can be prevented from sliding in the scrub direction. Further, since the sliding of the probe substrate 11 in the extending direction of the beam portion 22 is limited, an appropriate scrub amount can be realized. Therefore, it is possible to suppress variation in the scrub amount between the probe rows in the probe unit.

  Further, the six probe substrate support units 12 are arranged with the probe 2 interposed therebetween. By configuring in this way, the displacement of the probe 2 can be prevented more reliably.

<Probe substrate support unit 12>
FIG. 3 is an exploded perspective view of the probe substrate support unit 12 of FIG. In the probe substrate support unit 12, the pressing member 121 includes a contact plate 125 extending along the end surface of the probe substrate 11 and three protrusions 126 extending from the contact plate 125 in the planar direction.

  Further, the base member 123 has three guide holes 127 into which the convex portions 126 of the presser member 121 are inserted, and two screw holes into which a fixing tool 124 for fixing the base member 123 to the support frame 14 is inserted. 128.

  The guide hole 127 is a through hole that penetrates the base member 123 in the planar direction. The screw holes 128 are through holes that penetrate the base member 123 in the vertical direction, and are respectively disposed at both ends of the base member 123 in the direction along the end surface of the probe substrate 11.

  The contact plate 125 of the pressing member 121 contacts the end surface of the probe substrate 11 in a larger area than the spring member 122. For this reason, damage to the probe substrate 11 can be suppressed as compared with the case where the end surface of the probe substrate 11 is directly urged by the spring member 122.

  The spring member 122 is composed of a disc spring disposed on the convex portion 126 of the presser member 121, for example. The disc spring is a disc-shaped spring member having a through hole in the center, and has an outer shape of a truncated cone. The spring member 122 has a through hole fitted into the convex portion 126 and is interposed between the presser member 121 and the base member 123, and biases the presser member 121 and the base member 123 away from each other. By using such a disc spring as the spring member 122, the number, type, or material of the disc springs, the arrangement of the probe substrate support units 12, or the number of the probe substrate support units 12 can be changed. The power can be adjusted.

  Further, by providing the guide hole 127 on the base member 123 side, the insertion length of the convex portion 126 with respect to the guide hole 127 can be ensured without increasing the size of the probe board support unit 12 in the outward direction from the probe board 11. it can.

  According to the present embodiment, since the slide of the probe board 11 in the planar direction is limited by the spring member 122 of the probe board support unit 12, the positional deviation of the probe board 11 in the planar direction at the time of inspection is suppressed. Can do. In addition, the spring member 122 of the probe substrate support unit 12 absorbs thermal expansion of the probe substrate 11 during high temperature use or absorbs thermal contraction during low temperature use, thereby preventing the probe substrate 11 from being damaged. Can do.

  In addition, since the probe substrate support unit 12 biases the end surface of the probe substrate 11, the configuration of the probe substrate support unit 12 can be simplified. Further, it is possible to prevent the probe substrate support unit 12 from coming into contact with the inspection object or the stage at the time of inspection.

  In the present embodiment, the example in which the six probe substrate support units 12 are arranged along the outer peripheral edge of the probe substrate 11 has been described. However, the present invention shows the arrangement of the probe substrate support units 12 in this manner. It is not limited to. For example, only one probe substrate support unit 12 may be disposed, or the probe substrate support unit 12 may not be disposed on the straight line DL1 in the scrub direction.

  FIG. 4 is a diagram showing another configuration example of the probe card 1. FIG. 4A shows a case where two probe substrate support units 12 are arranged along the outer peripheral edge of the probe substrate 11. Each probe substrate support unit 12 is disposed on a straight line DL1 that passes through the center of the probe substrate 11 and is parallel to the scrub direction 3. Further, the probe substrate support units 12 are arranged on the opposite sides with respect to the scrub direction 3.

  Such an arrangement form of the probe substrate support units 12 can prevent the probe substrate 11 from sliding in the scrub direction 3 by a small number of probe substrate support units 12.

  FIG. 4B shows a case where three probe substrate support units 12 are arranged along the outer peripheral edge of the probe substrate 11. The probe board support unit 12 on the left side of the drawing is disposed on a straight line DL1 that passes through the center of the probe board 11 and is parallel to the scrub direction 3. On the other hand, the two probe substrate support units 12 on the right side of the drawing are arranged in the vicinity of the straight line DL1.

  When the probe substrate support unit 12 disposed on the right side of the center of the probe substrate 11 and the probe substrate support unit 12 disposed on the left side of the center of the probe substrate 11 are asymmetric, the biasing force of the spring member 122 is increased. It is desirable that the left probe board support unit 12 and the right probe board support unit 12 be different. Specifically, the resultant force of the urging force by the left probe board support unit 12 is in the scrub direction 3, and the resultant force of the urging force by the right probe board support unit 12 is also in the scrub direction 3, and the magnitude of these resultant forces Match.

  (C) in the drawing shows a case where four probe substrate support units 12 are arranged along the outer peripheral edge of the probe substrate 11. The two probe substrate support units 12 on the left side of the paper surface and the two probe substrate support units 12 on the right side of the paper surface are both disposed in the vicinity of the straight line DL1.

  4A to 4C are cases in which each probe board support unit 12 is arranged with the probe 2 interposed therebetween, and can prevent the displacement of the probe 2 in the scrub direction 3 more reliably. it can.

  FIG. 5 is a diagram showing another configuration example of the probe card 1 and shows a case where the probe substrate 11 is rectangular. (A) in the drawing shows a case where two probe substrate support units 12 are arranged. Each probe board support unit 12 is arranged on a straight line DL1 parallel to the scrub direction 3 through the intersection of diagonal lines connecting the centers of the probe boards 11, that is, the apexes of the probe boards 11. Further, the probe substrate support units 12 are arranged on the opposite sides with respect to the scrub direction 3.

  FIG. 4B shows a case where three probe substrate support units 12 are arranged along the outer edge of the probe substrate 11. The probe board support unit 12 on the left side of the drawing is disposed on a straight line DL1 that passes through the center of the probe board 11 and is parallel to the scrub direction 3. On the other hand, the two probe substrate support units 12 on the right side of the drawing are arranged in the vicinity of the straight line DL1.

  (C) in the drawing shows a case where four probe substrate support units 12 are arranged along the outer edge of the probe substrate 11. The two probe substrate support units 12 on the left side of the paper surface and the two probe substrate support units 12 on the right side of the paper surface are both disposed in the vicinity of the straight line DL1.

  5 (a) to 5 (c) are cases in which each probe substrate support unit 12 is arranged with the probe 2 interposed therebetween, and it is possible to prevent the displacement of the probe 2 in the scrub direction 3 more reliably. it can.

  In the present embodiment, the example in which the convex portion 126 provided on the presser member 121 is fitted into the guide hole 127 of the base member 123 has been described, but on the contrary, the convex portion 126 is provided on the base member 123. By fitting the protruding portion into the guide hole of the pressing member 121, the pressing member 121 and the base member 123 can be relatively positioned.

  Moreover, although this Embodiment demonstrated the example in case the spring member 122 of the probe board | substrate support unit 12 consists of a disc spring, this invention does not limit the structure of the spring member 122 to this. For example, the spring member 122 may be an elastic member having elasticity such as rubber or a coil spring.

  In the present embodiment, an example in which the probe 2 is a cantilever type probe has been described. However, the present invention does not limit the configuration of the probe 2. For example, the present invention can also be applied to a vertical needle type probe card.

DESCRIPTION OF SYMBOLS 1 Probe card 10 Main board 11 Probe board 12 Probe board support unit 121 Holding member 122 Spring member 123 Base member 124 Fixing tool 125 Abutting plate 126 Protruding part 127 Guide hole 128 Screw hole 13 Reinforcement board 14 Support frame 15 Guide board 2 Probe 21 Contact part 22 Beam part 23 Base part 3 Scrub direction

Claims (8)

A probe substrate on which a probe is erected, and
A wiring board disposed to face the probe board;
Support means for supporting the probe board on the wiring board,
The probe card according to claim 1, wherein the support unit includes a biasing unit that biases the probe substrate in a planar direction. The probe is a cantilever type probe,
2. The probe card according to claim 1, wherein an urging direction of the urging unit substantially coincides with a scrub direction of the cantilever type probe. On the probe substrate, a plurality of the cantilever probes are erected in parallel with the scrub direction,
3. The probe card according to claim 2, wherein the urging direction of the urging means substantially coincides with the scrub direction of the plurality of cantilever probes.   The probe card according to claim 1, wherein the biasing unit biases an end surface of the probe substrate.   The probe card according to any one of claims 1 to 4, wherein the support means includes two or more urging means arranged with the probe interposed therebetween. The probe has a beam portion extending substantially parallel to the probe substrate,
The probe card according to claim 1, wherein the biasing unit applies a biasing force having a component in a direction in which the beam portion extends to the end face of the probe substrate. The biasing means includes a base member fixed to the wiring board, a pressing member that presses against an end surface of the probe board, and a spring member that biases the pressing member against the base member,
The probe card according to claim 1, wherein the pressing member is in contact with an end surface of the probe board in a larger area than the spring member. Of the pressing member and the base member, one member is provided with a guide hole, and the other member is provided with a convex portion to be inserted into the guide hole,
The probe card according to claim 7, wherein the spring member is a disc spring having a through hole into which the convex portion is fitted.

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