JP2010197092A - Contact probe and probe unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact probe and a probe unit perform stably inspecting over a long period of time. <P>SOLUTION: The contact prove includes: a first contact member 21 which has a columnar shape with a point at one end; an elastic buckling member 22 which has a substantially columnar shape extending in the lengthwise direction of the first contact member 21 from the non-pointed end of the first contact member 21 and which elastically buckles under an external load; a connector 23 which has a columnar shape extending in the extension direction of the elastic buckling member 22 from the end of the elastic buckling member 22 opposite the end connected to the first contact member 21 in the extension direction; an arm member 24 which extends from the end of the connector 23 in a direction different from the extension direction of the connector 23 and which elastically deforms when an external load is applied thereto; and a second contact member 25 which has a pointed tip and protrudes from the arm member 24 in a direction away from the first contact member 21, the direction being substantially parallel to the extension direction of the elastic bucking member 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a contact probe and a probe unit that transmit and receive electrical signals by contacting electrodes and terminals of an electronic component when conducting a conduction state inspection or an operation characteristic inspection in an electronic component such as a semiconductor integrated circuit or a liquid crystal panel. .

  Conventionally, when conducting a conduction state inspection or an operation characteristic inspection of an inspection target such as a semiconductor integrated circuit or a liquid crystal panel, an electrical connection is made between the inspection target and a signal processing device that outputs an inspection signal. A probe unit that accommodates a plurality of conductive contact probes is used. The probe unit can be applied to highly integrated and miniaturized inspection objects by narrowing the pitch between contact probes with the progress of high integration and miniaturization of semiconductor integrated circuits and liquid crystal panels in recent years. Possible technologies are progressing. (For example, see Patent Document 1).

  As a technique for narrowing the pitch between contact probes, a technique related to a wire-type contact probe having elasticity that can be bent according to an external load is known (see, for example, Patent Documents 1 and 2). Among these, Patent Document 1 discloses a technique for generating a load at both ends by a spring action of a central portion that is bent and curved in advance. Patent Document 2 discloses a technique in which a load is always generated at an upper end connected to a wiring board that outputs an inspection signal by providing a locking portion at a lower end contacting the inspection target.

Japanese Patent Publication No. 60-34786 JP 2007-113972 A

  In the technique described in Patent Document 1, since the contact load between the upper end portion and the wiring substrate does not occur unless the lower end portion of the contact probe is in contact with the electrode to be inspected, the upper end portion is connected to the wiring substrate at the time of inspection. The contact and separation are repeated. For this reason, there has been a problem that the upper end portion of the contact probe is worn by long-term use, and a state in which a desired contact cannot be obtained at the time of inspection tends to occur, and the inspection cannot be performed stably.

  In the technique described in Patent Document 2, since the spring action of the contact probe is shared by the upper and lower ends, the direction and magnitude of the load applied to the upper end changes whenever the lower end contacts the object to be inspected. The upper end portion slides on the surface of the electrode of the wiring board at every inspection. For this reason, similarly to the technique described in Patent Document 1, the upper end portion of the contact probe is worn by long-term use, and a state in which a desired contact cannot be obtained at the time of inspection is likely to occur, and the inspection can be performed stably. There was a problem that it was impossible.

  The present invention has been made in view of the above, and an object of the present invention is to provide a contact probe and a probe unit capable of performing a stable inspection over a long period of time.

  In order to solve the above-described problems and achieve the object, a contact probe according to the present invention is in contact with two different circuit structures at both ends, and electrically connects the two circuit structures. A first contact portion having a columnar shape with one end sharpened, and a substantially columnar shape extending from the other end of the first contact portion along the longitudinal direction of the first contact portion, and an elastic seat by an external load. An elastic buckling portion that causes bending, and a connection extending in a column shape along the extending direction from an end portion in a direction in which the elastic buckling portion extends and different from an end portion connected to the first contact portion A portion extending from the end of the connecting portion in a direction different from the direction in which the connecting portion extends and causing elastic deformation in response to a load applied from the outside, and a direction in which the elastic buckling portion extends from the arm portion Substantially parallel and the first Projecting in a direction away from the contact portion, the tip is characterized in that and a second contact portion which is sharpened.

  In the contact probe according to the present invention, in the above invention, the arm portion has a downwardly convex shape with the elastic buckling portion below the connection portion, and the second contact portion is in the arm portion. It is provided near the terminal end of the arm part, starting from the boundary with the connecting part.

  Further, in the contact probe according to the present invention, in the above invention, the arm portion has a shape extending obliquely upward from the connection portion with the elastic buckling portion below the connection portion, and the second portion. The contact part is provided in the vicinity of the terminal end of the arm part starting from a boundary between the arm part and the connection part.

  In the contact probe according to the present invention, in the above invention, the elastic buckling portion has a shape in which a cross section including a width in a direction in which the arm portion extends is recessed on the side on which the arm portion extends. It is characterized by that.

  Further, in the contact probe according to the present invention, in the above invention, the arm portion has an upward convex shape with the elastic buckling portion below the connection portion, and the second contact portion is formed on the arm portion. It is provided near the upper end.

  In the contact probe according to the present invention, in the above invention, the arm portion is formed in a plate shape and extends in a direction orthogonal to the direction in which the connection portion extends, and is formed at a substantially central portion along the extending direction. It has a slit, and the 2nd contact part was provided above the slit by making the elastic buckling part below the connection part.

  In the contact probe according to the present invention, in the above invention, the elastic buckling portion has a shape in which a cross section including a width in a direction in which the arm portion extends is recessed on a side opposite to the side on which the arm portion extends. It is characterized by being.

  In the contact probe according to the present invention, in the above invention, a third contact portion that protrudes along a direction in which the connection portion extends through an end portion connected to the connection portion of the arm portion and has a sharpened tip is provided. Further, the arm portion has a shape that protrudes downward with the elastic buckling portion below the connection portion, and the second contact portion is provided near the end of the arm portion. .

  In the contact probe according to the present invention as set forth in the invention described above, the tip of the third contact portion is located above the tip of the second contact portion.

  In the contact probe according to the present invention, in the above invention, a plane parallel to a direction in which the elastic buckling portion extends through the sharpened one end of the first contact portion, and a direction in which the elastic buckling portion extends. It is different from a plane parallel to the direction in which the elastic buckling portion extends through the midpoint of the minimum width of the elastic buckling portion in the direction perpendicular to the vertical direction.

  Further, the probe unit according to the present invention includes a plurality of contact probes according to any one of the above inventions, a plurality of first holders having a plurality of first holding holes that pass through the connection portions and accommodate the arm portions, And a second holder having a plurality of second holding holes through which the first contact portion is inserted.

  According to the contact probe and the probe unit according to the present invention, the load received by the first contact portion is mainly applied to the elastic buckling portion extending in the same direction as the first contact portion, while the load received by the second contact portion is the first contact. Since it is mainly applied to the arm part extending in a direction different from the part and the elastic buckling part, the load received by the first contact part and the load received by the second contact part can be separated. Therefore, wear of the contact probe due to long-term use can be prevented by fixing the load in a state where the wiring board is in contact with one contact portion (second contact portion) when performing the inspection. A stable inspection can be performed.

  The best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described below with reference to the accompanying drawings. It should be noted that the drawings are schematic, and the relationship between the thickness and width of each part, the ratio of the thickness of each part, and the like may be different from the actual ones. Of course, there may be included portions having different dimensional relationships and ratios.

(Embodiment 1)
FIG. 1 is a perspective view showing a configuration of a probe unit according to Embodiment 1 of the present invention. The probe unit 1 shown in the figure performs a continuity test for inspecting the presence or absence of a short circuit or disconnection in a wiring pattern to be inspected such as a semiconductor integrated circuit or a liquid crystal panel, and an operation characteristic inspection when a signal is input to the inspection target. This is an apparatus for electrical connection between an inspection object and a signal processing apparatus that generates and outputs an inspection signal. Specifically, the probe unit 1 includes a plurality of conductive contact probes 2 that are in contact with electrodes or terminals provided on the inspection object side and the signal processing device side at both ends, and a plurality of contact probes 2 in a predetermined pattern. And a probe holder 3 that is received and held.

  FIG. 2 is a perspective view showing the configuration of the contact probe 2. FIG. 3 is a partial cross-sectional view showing configurations of main parts of the contact probe 2 and the probe holder 3. The contact probe 2 has a first contact portion 21 having a prismatic shape with one end sharpened, and the longitudinal direction of the first contact portion 21 from the other end of the first contact portion 21 (z-axis direction in FIG. 2). An elastic buckling portion 22 that extends in a prismatic shape and generates elastic buckling in response to an external load; and an end portion that extends in the direction in which the elastic buckling portion 22 extends and that is continuous with the first contact portion 21; 2 has a connecting portion 23 extending in a prismatic shape along the direction in which the elastic buckling portion 22 extends from different ends, and a direction different from the direction in which the connecting portion 23 extends from the end of the connecting portion 23 (the x-axis direction in FIG. 2). ) And is provided at the terminal end of the arm portion 24 with the boundary between the arm portion 24 that can be elastically deformed and the connection portion 23 in the arm portion 24 as a starting end, and protrudes in a direction parallel to the direction in which the connection portion 23 extends. Is provided with a sharpened second contact portion 25. The contact probe 2 has a substantially L-shaped appearance shape with the arm portion 24 as a base.

As shown in FIG. 3, the elastic buckling portion 22 has a shape in which the cross section including the width in the x-axis direction is recessed in an arc shape on the side where the arm portion 24 extends. As shown in FIG. 3, the smallest width of the elastic buckling portion 22 in the x-axis direction (the width having the largest difference from the maximum width R of the columnar portion of the first contact portion 21 in the x-axis direction). The plane P ₁ passing through the middle point M ₁ and parallel to the z axis is different from the plane P ₂ passing through the sharpened tip T ₁ of the first contact portion 21 and parallel to the z axis. ₁ is located farther from the arm portion 24 than the plane P ₂ .

  The arm portion 24 has an arcuate shape that protrudes downward with the elastic buckling portion 22 below the connection portion 23, and undergoes elastic deformation when a load is applied from the outside via the second contact portion 25.

  The contact probe 2 having the above configuration is formed by electroforming nickel alloy. Note that when the contact probe 2 is formed, it may be formed by etching, pressing, or a combination thereof. Alternatively, the contact probe 2 may be formed using copper, iron (stainless steel), tungsten, a beryllium-based alloy, or the like.

  The plate width of the contact probe 2 (the width in the y-axis direction in FIG. 2) is about 50 μm. The length of the contact probe 2 in the longitudinal direction (the z-axis direction in FIG. 2) is about 5 mm. Further, the radial thickness of the arc in the arm portion 24 is about 100 μm. In addition, this dimension is only an example to the last.

  The probe holder 3 is provided with a plate-like first holder 31 that passes through the connection portion 23 of the contact probe 2 and holds the arm portion 24, and is spaced apart from the first holder 31, and the first contact portion of the contact probe 2. Plate-like 2nd holder 32 holding 21, and two holder fixing members 33 and 34 which pinch and fix the 1st holder 31 and the 2nd holder 32, respectively. The surface of the first holder 31 and the surface of the second holder 32 are parallel to each other.

  FIG. 4 is a plan view of the probe holder 3 as viewed from above the first holder 31. Each of the first holders 31 has an L-shaped cross section, and has a plurality of first holding holes 311 that pass through the connection portion 23 and accommodate the arm portion 24. The first holding hole 311 has an L-shaped cross section, and has a large-diameter portion 311 a that houses the bottom surface of the arc-shaped arm portion 24 and accommodates it, and a small-diameter portion 311 b that passes through the connection portion 23. . When forming the first holding hole 311, the through hole that becomes the small diameter portion 311 b is formed by drilling or the like, and then the large diameter portion 311 a is formed by performing a counterboring process according to the shape of the arm portion 24. In the plurality of first holding holes 311, the longitudinal directions of the large diameter portions 311 a are parallel to each other and form a row. The pitch of the first holding holes 311 is about 50 to 150 μm. In addition, it is also possible to implement | achieve the 1st holder 31 by bonding the plate-shaped member which has the large diameter part 311a, and the plate-shaped member which has the small diameter part 311b.

  The second holder 32 has a plurality of second holding holes 321 each having a columnar shape through which the first contact portion 21 is inserted. The diameter of the second holding hole 321 is equal to the diameter of the small diameter portion 311 b of the first holding hole 311. The positions of the second holding holes 321 are formed in rows corresponding to the positions of the small diameter portions 311b of the first holding holes 311. In this way, the plurality of first holding holes 311 (the small-diameter portion 311b) communicate with any one of the plurality of second holding holes 321 in the vertical direction. A set of holding holes 321 holds the contact probe 2.

  The holder fixing members 33 and 34 sandwich the end surfaces of the first holder 31 and the second holder 32 in a direction orthogonal to the direction in which the first holding holes 311 and the second holding holes 321 are arranged in a line. The end face is fixed and supported.

The probe holder 3 having the above configuration is formed using an insulating material such as ceramics such as alumina (Al ₂ O ₃ ) or silicon nitride (Si ₃ N ₄ ), or a plastic resin. In addition, as a raw material of the probe holder 3, the surface of a conductive material such as metal may be coated with an insulating film.

  The arrangement pattern of the contact probe 2 shown in FIG. 4 is merely an example. That is, the wiring pattern of the probe holder 3 is determined according to the wiring pattern of the electrode or terminal to be inspected, and the design can be changed as appropriate.

  FIG. 5 is a view showing a state in which the wiring board 200 is attached to the probe unit 1 having the above configuration and a load is applied to the second contact portion 25. A wiring board 200 shown in the figure has a large number of wirings and connection electrodes made of nickel or the like formed on one surface of a sheet-like base material made of polyimide. When fixing the wiring board 200 to the probe holder 3, after positioning so that the corresponding electrode 201 and the second contact portion 25 are in contact with each other, the fixing member 300 made of the same material as the probe holder 3 and The wiring board 200 is clamped by the first holder 31 and fixed by screws or the like. When the wiring board 200 is fixed to the probe holder 3 in this way, a predetermined load is applied to the contact probe 2. In addition, you may make it provide a spacer suitably between the wiring board 200 and the 1st holder 31. FIG.

  In FIG. 5, the arm portion 24 is elastically deformed according to the load generated by the contact with the electrode 201, and has an arc shape that is slightly wider than when no load is applied. Further, the arm portion 24 slightly rotates clockwise in FIG. 5 by receiving a load, so that the first contact portion 21 and the connection portion 23 come into contact with the second holding hole 321 and the first holding hole 311, respectively. As a result, the elastic buckling portion 22 receives a force in the positive direction of the x axis in FIG. 5 at both ends, and the central portion bends in the negative direction of the x axis. At this time, since the elastic buckling portion 22 has a concave shape on the side where the arm portion 24 extends, the elastic buckling portion 22 can be easily bent.

  FIG. 6 is a diagram showing a state in which the semiconductor integrated circuit 100 is inspected by bringing the electrode 101 of the semiconductor integrated circuit 100 into contact with the first contact portion 21 from the state shown in FIG. As shown in FIG. 6, the elastic buckling portion 22 is further bent according to the load from the semiconductor integrated circuit 100. When this bending occurs, the first contact portion 21 slides the electrode 101 of the semiconductor integrated circuit 100 in the x-axis direction. Therefore, when the electrode 101 is covered with an oxide film or dirt is attached to the surface of the electrode 101, the oxide film or dirt can be scraped off.

  When the probe unit 1 is assembled, the first holder 31 and the second holder 32 are stacked in the thickness direction so that the first holding hole 311 and the second holding hole 321 corresponding to each other communicate with each other. Subsequently, the contact probe 2 is inserted from each opening surface of the plurality of first holding holes 311 with the first contact portion 21 at the head to penetrate the first holding hole 311 and the second holding hole 321, and the arm portion 24 is made large. It is embedded in the diameter portion 311a. Thereafter, the probe holder 1 is completed by separating the second holder 32 from the first holder 31, aligning the first holder 31 and the second holder 32, and fixing them with the holder fixing members 33 and 34. .

  According to the first embodiment of the present invention described above, the load received by the first contact portion 21 is mainly applied to the elastic buckling portion 22 extending in the same direction as the first contact portion 21, while being received by the second contact portion 25. Since the load is mainly applied to the arm portion 24 extending in a different direction from the first contact portion 21 and the elastic buckling portion 22, the load received by the first contact portion 21 and the load received by the second contact portion 25 can be separated. . Therefore, the wear of the contact probe 2 due to long-term use can be prevented by fixing the load in a state where the electrode 201 of the wiring board 200 is in contact with the second contact portion 25 when performing the inspection. A stable inspection can be performed.

Further, according to the first embodiment, the plane passing through the tip T ₁ of the first contact portion 21 is offset so as not to pass through the midpoint M ₁ of the minimum width of the elastic buckling portion 22. The bending direction when a load is applied from the outside can be controlled.

  Further, according to the first embodiment, the horizontally long first holding hole 311 is formed on the probe holder 3 side to accommodate the arm portion 24, and the alignment direction of the contact probe 2 can be easily aligned. And the attachment of the contact probe 2 to the probe holder 3 is facilitated. In addition, since it is not necessary to disassemble the probe holder 3 when removing the contact probe 2, the removal is also easy. Therefore, the assembly at the time of unitization can be easily performed, and the maintenance after the unitization can be performed efficiently.

(Embodiment 2)
FIG. 7 is a diagram showing the configuration of the contact probe according to Embodiment 2 of the present invention. The contact probe 4 shown in the figure includes a first contact portion 41, an elastic buckling portion 42, an elastic buckling portion 42, respectively corresponding to the first contact portion 21, the elastic buckling portion 22, the connection portion 23 and the second contact portion 25 of the contact probe 2. While having the connection part 43 and the 2nd contact part 45, it has the arm part 44 which makes the shape which slanted and extended diagonally upward from the connection part 43 by making the elastic buckling part 42 into the downward direction of the connection part 43. The contact probe 4 has a substantially L-shaped appearance with the arm portion 44 as a base.

The elastic buckling portion 42 has a shape in which the cross section including the width in the x-axis direction in FIG. 7 is recessed in an arc shape on the side where the arm portion 44 extends. Further, as shown in FIG. 7, the smallest width of the elastic buckling portion 42 in the x-axis direction (the width having the largest difference from the maximum width R in the x-axis direction of the columnar portion of the first contact portion 41). The plane P ₃ passing through the middle point M ₂ and parallel to the z-axis is different from the plane P ₄ passing through the sharpened tip T ₂ of the first contact portion 41 and parallel to the z-axis. ₃ is located farther from the arm 44 than the plane P ₄ .

  The arm portion 44 is provided with a second contact portion 45 in the vicinity of the terminal end with the boundary with the connection portion 43 as a start end. When a load is applied from the outside via the second contact portion 45, the arm portion 44 is elastically deformed.

  The contact probe 4 having the above configuration is formed using the same material as the contact probe 2.

  The probe unit according to the second embodiment includes a plurality of contact probes 4 and a probe holder 3 that individually accommodates the plurality of contact probes 4.

  FIG. 8 is a diagram illustrating a state in which the wiring board 200 is attached to the probe unit according to the second embodiment and a load is applied to the second contact portion 45. In FIG. 8, the arm portion 44 is elastically deformed by a load applied from the electrode 201 and has a slightly small inclination. Along with this elastic deformation, the first contact portion 41 and the connection portion 43 come into contact with the second holding hole 321 and the first holding hole 311, respectively. As a result, the elastic buckling portion 42 receives a force in the positive direction of the x axis in FIG. 8 at both ends, and the central portion bends in the negative direction of the x axis.

  When the inspection is performed by bringing the electrode 101 of the semiconductor integrated circuit 100 into contact with the first contact portion 41, the elastic buckling portion 42 is further bent like the elastic buckling portion 22 of the contact probe 2 shown in FIG. It becomes.

  According to the second embodiment of the present invention described above, the load received by the first contact portion 41 is mainly applied to the elastic buckling portion 42 extending in the same direction as the first contact portion 41, while the second contact portion 45 receives the load. Since the load is mainly applied to the arm portion 44 extending in a different direction from the first contact portion 41 and the elastic buckling portion 42, the load received by the first contact portion 41 and the load received by the second contact portion 45 can be separated. . Therefore, the wear of the contact probe 4 due to long-term use can be prevented by fixing the load in a state where the electrode 201 of the wiring board 200 is in contact with the second contact portion 45 at the time of inspection. A stable inspection can be performed.

Further, according to the second embodiment, the plane passing through the tip T ₂ of the first contact portion 41 is offset so as not to pass through the midpoint M ₂ of the minimum width of the elastic buckling portion 42. The bending direction when a load is applied from the outside can be controlled. Therefore, the bending directions of the plurality of contact probes 4 held by the probe holder 3 can be made uniform.

  Further, according to the second embodiment, as in the first embodiment, the assembly when unitized can be easily performed, and the maintenance after the unitization can be performed efficiently.

(Embodiment 3)
FIG. 9 is a diagram showing the configuration of the contact probe according to Embodiment 3 of the present invention. The contact probe 5 shown in the figure has a first contact portion 51 having a prismatic shape with one end sharpened, and the longitudinal direction of the first contact portion 51 from the other end of the first contact portion 51 (z-axis direction in FIG. 9). And an elastic buckling portion 52 that extends in a substantially prismatic shape and generates elastic buckling in response to a load from the outside, and an end portion in the direction in which the elastic buckling portion 52 extends and extends to the first contact portion 51. A connecting portion 53 extending in a prismatic shape along the direction in which the elastic buckling portion 52 extends from an end different from the continuous end, and an upwardly convex shape with the elastic buckling portion 52 below the connecting portion 53 is formed. And an extending arm portion 54. The contact probe 5 has a substantially L-shaped appearance with the arm portion 54 as a base.

The elastic buckling portion 52 has a shape in which the cross section including the width in the x-axis direction in FIG. 9 is recessed in an arc shape on the side opposite to the side on which the arm portion 54 extends. Moreover, as shown in FIG. 9, the smallest width among the widths of the elastic buckling portion 52 in the x-axis direction (the width having the largest difference from the maximum width R in the x-axis direction of the columnar portion of the first contact portion 51). the plane P ₅ parallel to the z-axis and passes through the middle point M ₃ of passes through the tip T obtained by sharpening the first contact portion 51 is different from the z-axis parallel to the plane P _6, the plane P ₅ Is located closer to the arm portion 54 than the plane P ₆ .

  As for the arm part 54, the substantially center part of the extending direction protrudes most upwards, and the 2nd contact part 55 is provided in the protrusion vertex vicinity. The arm portion 54 is elastically deformed when a load is applied from the outside via the second contact portion 55.

  The contact probe 5 having the above configuration is formed using the same material as that of the contact probe 2.

  The probe unit according to the third embodiment includes a plurality of contact probes 5 and a probe holder 3 that individually accommodates the plurality of contact probes 5.

  FIG. 10 is a diagram illustrating a state in which the wiring board 400 is attached to the probe unit according to the third embodiment and a load is applied to the second contact portion 55. In the wiring board 400 shown in the figure, the position of the electrode 401 connected to the signal processing circuit is different from the electrode 201 of the wiring board 200. The wiring board 400 has a large number of wirings and electrodes made of nickel or the like formed on one surface of a sheet-like base material made of polyimide. When fixing the wiring board 400 to the probe holder 3, the wiring board 400 is fixed by the fixing member 300 and the first holder 31 after the alignment is performed so that the corresponding electrode 401 and the second contact portion 55 are in contact with each other. Hold it and fix it with screws. When the wiring board 400 is fixed to the probe holder 3 in this way, a predetermined load is applied to the contact probe 5. In addition, a spacer may be provided as appropriate between the wiring board 400 and the first holder 31.

  As shown in FIG. 10, the arm portion 54 slightly expands in the extending direction due to elastic deformation caused by the load applied from the electrode 401 of the wiring substrate 400. On the other hand, the first contact portion 51, the elastic buckling portion 52, and the connection portion 53 only move slightly in the negative direction of the x axis in FIG. 9 and do not come into contact with the first holding hole 311. . Therefore, the first contact part 51, the elastic buckling part 52, and the connection part 53 are not deformed even when the wiring board 400 is fixed to the probe holder 3.

  FIG. 11 is a diagram illustrating a state in which the semiconductor integrated circuit 100 is inspected by bringing the electrode 101 of the semiconductor integrated circuit 100 into contact with the first contact portion 51 from the state illustrated in FIG. 10. In FIG. 11, the elastic buckling portion 52 has a concave shape on the side on which the arm portion 54 extends, so that it bends in the positive direction of the x-axis in FIG. 11 according to the load from the semiconductor integrated circuit 100. Mu When this bending occurs, the first contact portion 51 slides the electrode 101 of the semiconductor integrated circuit 100 in the x-axis direction. Therefore, when the electrode 101 is covered with an oxide film or dirt is attached to the surface of the electrode 101, the oxide film or dirt can be scraped off.

  According to the third embodiment of the present invention described above, the load received by the first contact portion 51 is mainly applied to the elastic buckling portion 52 extending in the same direction as the first contact portion 51, while the second contact portion 55 receives the load. Since the load is mainly applied to the arm portion 54 extending in a different direction from the first contact portion 51 and the elastic buckling portion 52, the load received by the first contact portion 51 and the load received by the second contact portion 55 can be separated. . Therefore, the wear of the contact probe 5 due to long-term use can be prevented by making the load constant in a state where the electrode 401 of the wiring board 400 is in contact with the second contact portion 55 at the time of inspection. A stable inspection can be performed.

Further, according to the third embodiment, the plane passing through the tip T ₃ of the first contact portion 51 is offset so as not to pass through the midpoint M ₃ of the minimum width of the elastic buckling portion 52. The bending direction when a load is applied from the outside can be controlled. Therefore, the bending directions of the plurality of contact probes 5 held by the probe holder 3 can be made uniform.

  Further, according to the third embodiment, as in the first embodiment, assembly when unitized can be easily performed, and maintenance after unitization can be performed efficiently.

  In the third embodiment, the shape of the elastic buckling portion of the contact probe may be a shape recessed in an arc shape on the side where the arm portion 54 extends, like the elastic buckling portion 22 of the contact probe 2. .

(Embodiment 4)
FIG. 12 is a diagram showing a configuration of a contact probe according to Embodiment 4 of the present invention. The contact probe 6 shown in the figure includes a first contact portion 61, an elastic buckling portion 62, an elastic buckling portion 52, an elastic buckling portion 52, a connection portion 53, and a second contact portion 55, respectively. It has the connection part 63 and the 2nd contact part 65, and has the arm part 64 which extends in the direction different from the direction where the connection part 63 extends in plate shape. The contact probe 6 has a substantially L-shaped appearance with the arm portion 64 as the bottom.

The elastic buckling portion 62 has a shape in which the cross section including the width in the x-axis direction in FIG. 12 is recessed in an arc shape on the side opposite to the side on which the arm portion 64 extends. As shown in FIG. 12, the smallest width of the elastic buckling portion 62 in the x-axis direction (the width having the largest difference from the maximum width R in the x-axis direction of the columnar portion of the first contact portion 61). The plane P ₇ that passes through the middle point M ₄ and is parallel to the z axis is different from the plane P ₈ that passes through the sharpened tip T ₄ of the first contact portion 61 and is parallel to the z axis. ₇ is located closer to the arm portion 64 than the plane P ₈ .

  The arm portion 64 forms a plate shape from the upper end of the connection portion 63 and extends in the positive direction of the x-axis in FIG. A slit 64 a formed along the direction in which the arm 64 extends is formed at the center of the arm 64. The second contact portion 65 is provided above the slit 64a, that is, at the upper end of the substantially central portion of the arm portion 64.

  The contact probe 6 having the above configuration is formed using the same material as that of the contact probe 2.

  The probe unit according to the fourth embodiment includes a plurality of contact probes 6 and a probe holder 3 that individually accommodates the plurality of contact probes 6.

  FIG. 13 is a diagram illustrating a state in which the wiring board 400 is attached to the probe unit according to the fourth embodiment and a load is applied to the second contact portion 65. In FIG. 13, the arm portion 64 is elastically deformed by a load applied from the electrode 401 of the wiring board 400, and the area of the slit 64a is slightly reduced. Note that the first contact portion 61, the elastic buckling portion 62, and the connection portion 63 are not deformed even when the wiring board 400 is fixed to the probe holder 3.

  FIG. 14 is a diagram showing a state in which the semiconductor integrated circuit 100 is inspected by bringing the electrode 101 of the semiconductor integrated circuit 100 into contact with the first contact portion 61 from the state shown in FIG. As shown in FIG. 14, the elastic buckling portion 62 bends in the positive direction of the x-axis in FIG. 14 according to the load from the semiconductor integrated circuit 100. When this bending occurs, the first contact portion 61 slides the electrode 101 of the semiconductor integrated circuit 100 in the x-axis direction. Therefore, when the electrode 101 is covered with an oxide film or dirt is attached to the surface of the electrode 101, the oxide film or dirt can be scraped off.

  In the fourth embodiment, the position and shape of the slit 64a provided in the arm portion 64 are not limited to those described above, and can be appropriately changed in relation to the position of the second contact portion 65. is there.

  According to the fourth embodiment of the present invention described above, the load received by the first contact portion 61 is mainly applied to the elastic buckling portion 62 extending in the same direction as the first contact portion 61, while the second contact portion 65 receives the load. Since the load is mainly applied to the arm portion 64 extending in a different direction from the first contact portion 61 and the elastic buckling portion 62, the load received by the first contact portion 61 and the load received by the second contact portion 65 can be separated. . Therefore, the wear of the contact probe 6 due to long-term use can be prevented by making the load constant in a state where the electrode 401 of the wiring board 400 is in contact with the second contact portion 65 at the time of inspection. A stable inspection can be performed.

Further, according to the fourth embodiment, the plane passing through the tip T ₄ of the first contact portion 61 is offset so as not to pass through the midpoint M ₄ of the minimum width of the elastic buckling portion 62. The bending direction when a load is applied from the outside can be controlled. Therefore, the bending directions of the plurality of contact probes 6 held by the probe holder 3 can be made uniform.

  Further, according to the fourth embodiment, as in the first embodiment, the assembly when unitized can be easily performed, and the maintenance after the unitization can be performed efficiently.

(Embodiment 5)
FIG. 15 is a diagram showing a configuration of a contact probe according to Embodiment 5 of the present invention. The contact probe 7 shown in the figure has a first contact portion 71 having a prismatic shape with one end sharpened, and the longitudinal direction of the first contact portion 71 from the other end of the first contact portion 71 (z-axis direction in FIG. 15). An elastic buckling portion 72 that extends in a prismatic shape and generates elastic buckling due to an external load, and an end portion that extends in the direction in which the elastic buckling portion 22 extends and that is continuous with the first contact portion 71 15 and a direction different from the direction in which the connecting portion 73 extends from the end of the connecting portion 73 (the x axis in FIG. 15). Direction) and is provided at the end of the arm portion 74 with the boundary between the arm portion 74 that can be elastically deformed and the connection portion 73 in the arm portion 74 as a starting end, and protrudes in a direction parallel to the direction in which the connection portion 73 extends, The second contact portion 75 having a sharp tip and the connection portion 73 of the arm portion 74 are in contact with each other. It provided projecting along the direction connecting portion 73 extends through the end that, the third contact portion 76 which the tip is sharpened, the. The contact probe 7 has a substantially L-shaped external shape with the arm portion 74 as a base.

  The arm portion 74 has an arcuate shape that protrudes downward with the elastic buckling portion 72 below the connection portion 73, and elastically deforms when a load is applied from the outside via the second contact portion 75 and the third contact portion 76. Produce.

  The third contact portion 76 has a function of receiving a load in contact with a dummy electrode provided on the wiring board side, and assists the bending of the elastic buckling portion 72. The tip of the third contact portion 76 is positioned above the tip of the second contact portion 75 with the elastic buckling portion 72 positioned below the connection portion 73.

  The contact probe 7 having the above configuration is formed using the same material as that of the contact probe 2.

  The probe unit according to the fifth embodiment includes a plurality of contact probes 7 and a probe holder 3 that individually accommodates the plurality of contact probes 7.

  FIG. 16 is a diagram illustrating a state in which the wiring board 500 is attached to the probe unit according to the fifth embodiment and a load is applied to the second contact portion 75 and the third contact portion 76. A wiring substrate 500 shown in the figure has a large number of wirings and electrodes made of nickel or the like formed on one surface of a sheet-like base material made of polyimide, and is connected to a signal processing circuit through the wirings. The same number of electrodes 501 and dummy electrodes 502 that are insulated without being connected to the signal processing circuit are provided. The electrode 501 is in contact with the second contact portion 75, while the dummy electrode 502 is in contact with the third contact portion 76. When fixing the wiring board 500 to the probe holder 3, positioning is performed so that the electrode 501 and the dummy electrode 502 are in contact with the corresponding second contact portion 75 and third contact portion 76, respectively, and then the fixing member 300. The wiring board 500 is sandwiched by the first holder 31 and fixed by screwing or the like. A spacer may be provided as appropriate between the wiring board 500 and the first holder 31.

  As shown in FIG. 16, the arm portion 74 is elastically deformed by a load from the wiring board 500. When this elastic deformation occurs, the height of the tip of the third contact portion 76 is larger than the height of the tip of the second contact portion 75, so the third contact portion 76 first contacts the dummy electrode 502. Due to this contact, the arm portion 74 is deformed while rotating slightly counterclockwise in FIG. 16, and then the second contact portion 75 contacts the electrode 501. Therefore, the elastic buckling portion 72 bends in the positive direction of the x-axis in FIG. As described above, in the fifth embodiment, since the bending of the elastic buckling portion 72 can be controlled by providing the third contact portion 76, even if the shape of the elastic buckling portion 72 is a columnar shape, in a desired direction. Can be easily bent.

  FIG. 17 is a diagram illustrating a state in which the semiconductor integrated circuit 100 is inspected by bringing the electrode 101 of the semiconductor integrated circuit 100 into contact with the first contact portion 71 from the state illustrated in FIG. 16. In FIG. 17, the elastic buckling portion 72 is further bent according to the load from the semiconductor integrated circuit 100. When this bending occurs, the first contact portion 71 slides the electrode 101 of the semiconductor integrated circuit 100 in the x-axis direction. Therefore, when the electrode 101 is covered with an oxide film or dirt is attached to the surface of the electrode 101, the oxide film or dirt can be scraped off.

  According to the fifth embodiment of the present invention described above, the load received by the first contact portion 71 is mainly applied to the elastic buckling portion 72 extending in the same direction as the first contact portion 71, while the second contact portion 75 receives the load. Since the load is mainly applied to the arm portion 74 extending in a different direction from the first contact portion 71 and the elastic buckling portion 72, the load received by the first contact portion 71 and the load received by the second contact portion 75 can be separated. . Therefore, the wear of the contact probe 7 due to long-term use can be prevented by fixing the load in a state where the electrode 501 of the wiring board 500 is in contact with the second contact portion 75 during the inspection. A stable inspection can be performed.

  Further, according to the fifth embodiment, as in the first embodiment, the assembly when unitized can be easily performed, and the maintenance after the unitization can be performed efficiently.

(Other embodiments)
Up to this point, the first to fifth embodiments have been described in detail as the best mode for carrying out the present invention. However, the present invention should not be limited only by these five embodiments. For example, in the present invention, the spring constant of the arm portion can be appropriately changed by adjusting the length and width of the arm portion of the contact probe and the installation position of the second contact portion. Further, the load-deflection characteristics can be appropriately changed by adjusting the length and shape of the elastic buckling portion of the contact probe.

  Thus, the present invention can include various embodiments and the like not described herein, and various design changes and the like can be made without departing from the technical idea specified by the claims. It is possible to apply.

  The present invention is useful when conducting a conduction state inspection or an operation characteristic inspection in an electronic component such as a semiconductor integrated circuit or a liquid crystal panel.

It is a perspective view which shows the structure of the probe unit which concerns on Embodiment 1 of this invention. It is a figure which shows the structure of the contact probe which concerns on Embodiment 1 of this invention. It is a fragmentary sectional view which shows the structure of the principal part of the contact probe and probe unit which concern on Embodiment 1 of this invention. It is the top view which looked at the probe holder from the upper direction of the 1st holder. It is a figure which shows the state which attached the wiring board with respect to the probe unit which concerns on Embodiment 1 of this invention. It is a figure which shows the state which is inspecting using the probe unit which concerns on Embodiment 1 of this invention. It is a figure which shows the structure of the contact probe which concerns on Embodiment 2 of this invention. It is a figure which shows the state which attached the wiring board with respect to the probe unit which concerns on Embodiment 2 of this invention. It is a figure which shows the structure of the contact probe which concerns on Embodiment 3 of this invention. It is a figure which shows the state which attached the wiring board with respect to the probe unit which concerns on Embodiment 3 of this invention. It is a figure which shows the state which is inspecting using the probe unit which concerns on Embodiment 3 of this invention. It is a figure which shows the structure of the contact probe which concerns on Embodiment 4 of this invention. It is a figure which shows the state which attached the wiring board with respect to the probe unit which concerns on Embodiment 4 of this invention. It is a figure which shows the state which is inspecting using the probe unit which concerns on Embodiment 4 of this invention. It is a figure which shows the structure of the contact probe which concerns on Embodiment 5 of this invention. It is a figure which shows the state which attached the wiring board with respect to the probe unit which concerns on Embodiment 5 of this invention. It is a figure which shows the state which is inspecting using the probe unit which concerns on Embodiment 5 of this invention.

DESCRIPTION OF SYMBOLS 1 Probe unit 2, 4, 5, 6, 7 Contact probe 3 Probe holder 21, 41, 51, 61, 71 1st contact part 22, 42, 52, 62, 72 Elastic buckling part 23, 43, 53, 63 73, connection part 24, 44, 54, 64, 74 Arm part 25, 45, 55, 65, 75 Second contact part 31 First holder 32 Second holder 33, 34 Holder fixing member 64a Slit 76 Third contact part 100 Semiconductor integrated circuit 101, 201, 401, 501 Electrode 200, 400, 500 Wiring board 300 Fixing member 311 First holding hole 311a Large diameter part 311b Small diameter part 321 Second holding hole 502 Dummy electrode

Claims (11)

In a conductive contact probe that contacts two different circuit structures at both ends and electrically connects the two circuit structures,
A first contact portion having a columnar shape with one end sharpened;
An elastic buckling portion that extends from the other end of the first contact portion along the longitudinal direction of the first contact portion in a substantially columnar shape, and generates elastic buckling due to an external load;
A connecting portion extending in a column shape along the extending direction from an end portion in a direction in which the elastic buckling portion extends and different from an end portion connected to the first contact portion;
An arm that extends from the end of the connecting portion in a direction different from the direction in which the connecting portion extends and generates elastic deformation in response to a load applied from the outside;
A second contact portion that is substantially parallel to a direction in which the elastic buckling portion extends from the arm portion, protrudes in a direction away from the first contact portion, and has a sharpened tip.
A contact probe comprising: The arm is
The elastic buckling part has a downwardly convex shape as a lower part of the connection part,
The second contact portion is
The contact probe according to claim 1, wherein the contact probe is provided in the vicinity of a terminal end of the arm portion with a boundary between the arm portion and the connection portion as a starting end. The arm is
The elastic buckling portion has a shape extending obliquely upward from the connecting portion below the connecting portion,
The second contact portion is
The contact probe according to claim 1, wherein the contact probe is provided in a vicinity of a terminal end of the arm portion with a boundary between the arm portion and the connection portion as a starting end. The elastic buckling portion is
4. The contact probe according to claim 2, wherein a cross section including a width in a direction in which the arm portion extends has a hollow shape on a side where the arm portion extends. The arm is
The elastic buckling part is formed below the connection part to form a convex shape,
The second contact portion is
The contact probe according to claim 1, wherein the contact probe is provided near an upper end of the arm portion. The arm is
It has a plate-like shape and extends in a direction perpendicular to the direction in which the connecting portion extends, and has a slit formed in a substantially central portion along the extending direction.
The second contact portion is
The contact probe according to claim 1, wherein the elastic buckling portion is provided above the slit with the connecting portion being below. The elastic buckling portion is
The contact probe according to claim 5 or 6, wherein a cross section including a width in a direction in which the arm portion extends has a concave shape on a side opposite to the side on which the arm portion extends.   A plane parallel to a direction in which the elastic buckling portion extends through the sharpened end of the first contact portion, and a minimum width of the elastic buckling portion in a direction perpendicular to the direction in which the elastic buckling portion extends. The contact probe according to claim 4, wherein the contact probe is different from a plane that passes through a midpoint and is parallel to a direction in which the elastic buckling portion extends. A third contact part that protrudes along a direction in which the connection part extends through an end part connected to the connection part of the arm part, and has a sharpened tip;
The arm is
The elastic buckling part has a downwardly convex shape as a lower part of the connection part,
The second contact portion is
The contact probe according to claim 1, wherein the contact probe is provided near a terminal end of the arm portion.   The contact probe according to claim 9, wherein a tip end of the third contact portion is located above a tip end of the second contact portion. A plurality of contact probes according to any one of claims 1 to 10;
A plurality of first holders having a plurality of first holding holes for inserting the connecting portions and accommodating the arm portions;
A second holder having a plurality of second holding holes through which the first contact portion is inserted;
A probe unit comprising:

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