六、發明說明： 【發明所屬之技術領域】 本發明係關於一種在進行 板等之電子零件的導通狀態檢t體積體電路或液晶面 該電子零件之電極或端子接5作特性檢查之際’與 觸探針及探針單元。 行電信號的傳收送之接 【先前技術】 以往 〇 〇 在進行半導體積體電 的導通狀態檢查或動作触料以晶面板輯查對象 與輸出檢查用信號之信號處理=際’為了謀求檢查對象 用收容複數個導電性接_/之間之電性連接，係使 中，隨著近年來半導體積體電^^元。在探針單元 微細化之進展，#由 或液晶面板之咼積體化、 小化探針間之間距（P減）予以窄 小化，而亦可應用於經高積體 p ;丁乍 術已日錢步（參照例如專利_仙化之檢查對象的技 以將接觸探針間之間距予心1 ^ 有-種關於線(wire)型接:小化之技術而言’已知 針係具備可依據來自外部之：曹針之技術’該線型接觸探 (參照例如專利文獻i及2)。敌重而屈曲(buc遍幻之彈性 揭示有-種藉由預先折彎而彎曲，在專利文獻1中，係 端部產生射之技術。 巾央部㈣簧作用在兩 -種在與檢查對象接觸之下二，_示有 出檢查用錄之配祕板2。置卡扣部，藉此在與輸 技術。 …板連接之上端雜常地產生荷重之 321797 3 201035558 [先前技術文獻] [專利文獻] [專利文獻1]日本特公昭6〇_34786號公報 [專利文獻2]日本特開·7_ιη972號公報 【發明内容】 [發明所欲解決之課題] 人馱ί所記載之技術中，若接觸 端。Ρ未與檢查對象之電極接觸，則上端部與配^ 之接觸荷㈣不會產生，因此檢查時要反覆進行 配線基板之接觸及離開。因此，容易產生接 嘴部與 都田旦他饨m t Λ 在上述專利文^所記載之技術中，若接 未與檢查對象夕帝> ^ . . 欠 部 部因長期使用而磨損，而於檢查時二獲G =气上、 的狀態，而有無法穩定進行檢查的問題。 《钱嘀 在 % 變 此外，在上述專利文獻2所記載之技術中 上下兩端部共用接觸探針之彈料用，因此下 ^ 查對象接觸時施加於上端部之荷重之方向或大=輿 化’而上端部每#檢查時就會滑動於配線基板之^會 面。因此’與上述專利文獻1所記载之技術相同，f的表 生接觸探針之上端部因長期使用而磨損，而於檢杳^易產 <賴的㈣，而有無法穩定進行檢查 女 本發明係有鑑於上述問題而研創者， 磚。 種可長期進行敎檢查之接觸探針及探針單元。、供-[解決課題之手段] 為了解決上述問題而達成目的，本發 探針，係與在兩端不同之二個電路構造分襲觸， 321797 4 201035558 二個電路構造予以電性連接之導電性接觸探 •具備：第1接觸部，呈-端尖銳狀之柱狀 /、寺徵為 從前述第1接觸部之另一端沿著前述第屈曲部， ,,. 、禾i钱觸部之長声方 向大致呈柱狀延伸，且藉由來自外部之荷重而產生彈= ο 曲’·連接部，從與前述彈性屈曲部所延伸之方向之端部， 即與連接於前述第〗接觸部之端部不同之端部沿著前述延 伸之方向呈柱狀而延伸；臂部，從前述連接部之端部朝與 該連接部所延伸之方向不同之方向延伸，且依據從外部施 加之荷重而產生彈性變形；及第2接觸部，從前逑臂部= 與則述彈性屈曲部所延伸之方向大致平行且遠離前迷第1 接觸部之方向突出’且前端呈尖銳狀。 〇 此外，本發明之接觸探針在上述發明中，前述臂部係 在將則述彈性屈曲部作為前述連接部之下方時呈朝下凸出 的形狀；前述第2接觸部係以前述臂部中與前述連接部之 邊界為開始端而設於前述臂部之終端附近。 此外，本發明之接觸探針在上述發明中，前述臂 接^述彈性屈曲部作為前述連接部之下方時呈從前述連 作前述第2接觸部係在將前 之終端附近。 作為開始端時設於前迷臂部 曲部::含上述發明中，彈性屈 前迷臂部所延伸之_^^向之寬度的剖面，係呈在 此外，本發明之接觸探針在上述發明中，前述臂部係 321797 5 201035558 在將前述彈性屈曲部作為前述連接部之下方時呈朝上凸出 的形狀；前述第2接觸部係設於前述臂部之上端附近。 此外，本發明之接觸探針在上述發明中，前述臂部係 呈板狀，其在朝與前述連接部所延伸之方向正交之方向延 伸，且具有沿著該延伸之方向形成於大致中央部之開缝 (slit);前述第2接觸部係在將前述彈性屈曲部作為前述 連接部之下方時設於前述開縫之上方。 此外，本發明之接觸探針在上述發明中，前述彈性屈 曲部之包含前述臂部所延伸之方向之寬度的剖面，係呈在 與前述臂部所延伸之側相反側凹陷之形狀。 此外，本發明之接觸探針在上述發明中，復具備第3 接觸部，其係經由前述臂部之與前述連接部連接之端部而 沿著前述連接部所延伸之方向突出，且前端呈尖銳狀；前 述臂部係在將前述彈性屈曲部作為前述連接部之下方時呈 朝下凸出的形狀；前述第2接觸部係設於前述臂部之終端 附近。 此外，本發明之接觸探針在上述發明中，前述第3接 觸部之前端係位於比前述第2接觸部之前端更上方之處。 此外，本發明之接觸探針在上述發明中，通過前述第 1接觸部之呈尖銳狀之一端且與前述彈性屈曲部所延伸之 方向平行之平面，係與通過與前述彈性屈曲部所延伸之方 向正交之方向之前述彈性屈曲部之最小寬度之中點且與前 述彈性屈曲部所延伸之方向平行之平面為不同。 此外，本發明提供一種探針單元，其係具備：上述任 6 321797 201035558 固接觸探針;複數個第4座㈤-)， 有稷數個供前述連接部插通並且收容 持孔；及第2架座，呈女力如，_ ^ 第2保射I。 第1接觸部插通之6. EMBODIMENT OF THE INVENTION: TECHNICAL FIELD The present invention relates to a state in which an electronic component of a board or the like is inspected for a state in which the electrode or terminal of the electronic component is subjected to characteristic inspection. Touch probe and probe unit. Transmission and reception of the electric power signal [Prior Art] In the past, the conduction state check or the operation of the semiconductor integrated circuit was performed. The signal processing of the crystal panel and the output inspection signal was performed. The object is electrically connected between a plurality of conductive contacts _/, and the semiconductor is integrated with the semiconductor in recent years. In the progress of the miniaturization of the probe unit, # is narrowed by the condensed body of the liquid crystal panel and the distance between the probes (P minus), and can also be applied to the high-product p; The Japanese money step (refer to the technique of the inspection object of the patent _ 仙化, for example, to connect the distance between the probes to the center of the heart 1 ^ There is a kind of wire type connection: the technology of the small needle 'known needle system It is available from the outside: the technique of Cao needle's linear contact probe (see, for example, Patent Documents i and 2). The enemy's weight is flexed (the elasticity of the buc illusion reveals that the type is bent by pre-bending, in the patent In the literature 1, the end of the system produces the technique of shooting. The central part of the towel (four) spring acts in two kinds under the contact with the inspection object, and the _ shows the matching board 2 for checking the record. 321 797 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 KAI-7_ιη972 STATEMENT [Summary of the Invention] [The subject to be solved by the invention] The technology described by the person 驮ί If the contact end is not in contact with the electrode of the inspection object, the contact between the upper end portion and the matching electrode (4) does not occur, so the contact and separation of the wiring substrate are repeated during the inspection. Therefore, the nozzle portion and the Tada are likely to be generated. Once he 饨 Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ In addition, in the technique described in the above-mentioned Patent Document 2, the upper and lower ends of the technique are used for the elastic material of the contact probe, so that the object is touched when the object is touched. The direction of the load at the upper end portion is larger than that of the upper end portion, and the upper end portion is slid to the surface of the wiring substrate every # inspected. Therefore, the same as the technique described in the above Patent Document 1, the epigenetic contact probe of f The upper end of the needle is worn out due to long-term use, and the inspection is easy to produce < (4), and it is impossible to carry out the inspection stably. The present invention has been developed in view of the above problems, and the brick can be examined for a long time. Contact probe And the probe unit. - [Means for solving the problem] In order to solve the above problems and achieve the purpose, the probe is separated from the two circuit structures at the two ends, 321797 4 201035558 Conductive contact with electrical connection: The first contact portion has a columnar shape with a sharp end, and the temple sign is from the other end of the first contact portion along the first flexion portion, , , , , The long sound direction of the i-touch portion extends substantially in the shape of a column, and the load is generated by the load from the outside, and the connection portion is formed from the end portion extending in the direction of the elastic buckling portion, that is, connected to An end portion of the end portion of the contact portion extends in a column shape along the extending direction; the arm portion extends from an end portion of the connecting portion in a direction different from a direction in which the connecting portion extends, and The second contact portion is elastically deformed from the externally applied load; and the front end arm portion is substantially parallel to the direction in which the elastic buckling portion extends and protrudes away from the front first contact portion, and the front end is sharp. . Further, in the contact probe of the present invention, the arm portion has a shape that protrudes downward when the elastic buckling portion is below the connecting portion, and the second contact portion is formed by the arm portion. The boundary between the middle portion and the connecting portion is a start end and is provided near the terminal end of the arm portion. Further, in the above-described invention, in the contact probe according to the present invention, when the elastic bending portion is connected as the lower side of the connecting portion, the second contact portion is connected to the vicinity of the preceding terminal. In the above-described invention, the cross section of the width of the arm portion of the elastic front arm is extended as in the above invention, and the contact probe of the present invention is In the invention, the arm portion 321797 5 201035558 has a shape that protrudes upward when the elastic buckling portion is below the connecting portion, and the second contact portion is provided near the upper end of the arm portion. Further, in the contact probe of the present invention, the arm portion has a plate shape extending in a direction orthogonal to a direction in which the connecting portion extends, and has a substantially central portion along the extending direction. a slit of the portion; the second contact portion is provided above the slit when the elastic buckling portion is below the connecting portion. Further, in the above-described contact probe of the present invention, the cross section of the elastic bending portion including the width in which the arm portion extends is formed to have a shape recessed on the side opposite to the side on which the arm portion extends. Further, in the above-described invention, the contact probe according to the present invention further includes a third contact portion which protrudes in a direction in which the connecting portion extends through an end portion of the arm portion that is connected to the connecting portion, and has a front end The arm portion has a shape that protrudes downward when the elastic buckling portion is below the connecting portion, and the second contact portion is provided near the end of the arm portion. Further, in the contact probe of the present invention, in the above invention, the front end of the third contact portion is located above the front end of the second contact portion. Further, in the above-described contact probe of the present invention, the first contact portion has a sharp end and a plane parallel to the direction in which the elastic buckling portion extends, and is extended by the elastic buckling portion. The midpoint of the minimum width of the elastic buckling portion in the direction orthogonal to the direction is different from the plane parallel to the direction in which the elastic buckling portion extends. Furthermore, the present invention provides a probe unit comprising: any of the above-mentioned 6 321 797 201035558 solid contact probes; a plurality of fourth seats (five)-), a plurality of the plurality of connection portions for inserting and accommodating the holes; 2 seats, as a woman, _ ^ 2nd insurance I. The first contact portion is inserted
[發明之功效J ο 依據本發明之接觸探針及探針單元，由於第 所^之荷重主要係施加於朝與第4觸部相同方向延; ^彈性屈曲部’另-方面第2接觸部所承受之荷重主^ 加加於朝與® 1接觸部或彈性屈曲部不同方向延伸之臂 】之=:第:接觸部所承受之荷重與第2接觸部所承 與一糊则2梅卩）翻讀固=反 :=針因為長期使用所造成之磨損，長期進 【實施方式】 Ο 「―以下，照附圖說明用以實施本發明之形態（以下 貫施形態」）。另外，圖式係為立 厚度與寬度之關係、各部分之厚度:比率; :=之=式彼此間當然亦包括彼此尺寸關係或“不 (實施形態1) 第1圖係為顯示本發明之實施形態1之探針單元之播 =二之探針單元1係在進行檢查半導 積體電路或液晶面板等檢查對象之配線圖案是否有短路 321797 7 201035558 或斷線之導通檢查、或對檢查對象輸入信號時之動 檢查之際’謀求檢查對象與產生輸出檢查用信號之信號處 理裝置之電性連接的裝置。具體而言，探針單幻係呈備. =導電性接觸探針2’兩端與分別設於檢查對象側及 “號處理裝置侧之電極或端子接觸；及探針架座3， 定圖案收容並保持複數個接觸探針2。 頂 第2圖係為顯示接觸探針2之構成之斜視圖。第 係為顯示接觸探針2及探針架座3之主要部 ^ 剖面圖。接觸探針2係具備：第】接觸部21，= 狀之角柱狀；彈性屈曲部22，從第i接觸部2ι 1 = :Γ21:長度方向(第2圖之Z軸方向)大致 ^柱狀延伸，域由來自外部之射而產生彈性屈曲. 連接部23 ’從與彈性屈曲部22所延伸之 a =:於第1接觸部之端部不同之端部沿著彈性 部朝4:=延而:伸;臂部24,從連接部23之端 軸方方向不同之方向（第2圖之X 轴方向）延伸，且可彈性變形；及第2接觸部 將 部24之與連接部23之邊界作為開始端時 ^與連接部23所延伸之方向平行之方:突=[Effect of the Invention J] According to the contact probe and the probe unit of the present invention, since the load of the first portion is mainly applied to the same direction as the fourth contact portion; ^ elastic buckling portion 'the other portion of the second contact portion The weight of the load is added to the arm extending in the direction different from the contact portion of the ® 1 or the elastic buckling portion. =: the load applied to the contact portion and the second contact portion are the same as the paste. ) Flip-reading solid=reverse:=The needle is worn due to long-term use, and the method is long-term. [Embodiment] ― "In the following, the embodiment for carrying out the invention (the following embodiment) will be described with reference to the drawings). In addition, the drawing is the relationship between the thickness and the width, the thickness of each part: the ratio; the formula of the == also of course includes the dimensional relationship of each other or "No (Embodiment 1). FIG. 1 shows the present invention. In the probe unit of the first embodiment, the probe unit 1 is used to check whether or not the wiring pattern of the inspection object such as the semiconductor system or the liquid crystal panel has a short circuit 321797 7 201035558 or the continuity check of the disconnection or the inspection. When the target input signal is checked, the device that is to be electrically connected to the signal processing device that generates the signal for output inspection is specifically requested. Specifically, the probe is phantom. = Conductive contact probe 2' The two ends are in contact with the electrodes or terminals respectively disposed on the inspection object side and the "number processing device side; and the probe holder 3, and the plurality of contact probes 2 are housed and held in a predetermined pattern. Top Fig. 2 is a perspective view showing the configuration of the contact probe 2. The first is a cross-sectional view showing the main portion of the contact probe 2 and the probe holder 3. The contact probe 2 includes a first contact portion 21 and a columnar shape of the shape of the shape, and the elastic buckling portion 22 is substantially columnar from the ith contact portion 2ι 1 = :Γ21: the longitudinal direction (the Z-axis direction of Fig. 2). The extension, the domain is elastically buckling by the shot from the outside. The connecting portion 23' extends from the elastically flexed portion 22 with a = at the end of the end of the first contact portion along the elastic portion toward the 4:= extension And: the arm portion 24 extends from a direction different from the axial direction of the connecting portion 23 (the X-axis direction of FIG. 2) and is elastically deformable; and the second contact portion portion 24 and the connecting portion 23 When the boundary is the starting end, the side parallel to the direction in which the connecting portion 23 extends:
^尖銳狀。接觸探針2係具有以臂部以為 L^ Sharp. The contact probe 2 has an arm portion as L
子狀的外觀形狀。 -遣之大致L 度的:面第，3=^ 狀。此外，如第⑽拼- 側凹^成圓弧狀之形 如第3圖所不，通過彈性屈曲部22之乂轴方向 321797 8 201035558 之，度中最小寬度（第丨接觸部21之柱狀部分在χ轴 .與最=寬度R之差為最大的寬度）之中點]^且與Ζ轴; 行之平® Pl，係與通過第1接觸部21之呈尖銳狀之 L且與z軸平行之平面p2為不同，平面&係位於 P2更遠離臂部24之處。 权十面 臂部24係呈以彈性屈曲部22為連接部23之下 ❿ 朝下凸的圓弧狀，且若經由第2接觸部2 5從外部施加 則產生彈性變形。 里 具有以上構成之接觸探針2係藉由鎳合金 =。另外’在形成接觸探針2之際，藉由_二所 觸产針Prs)加卫及料組合來形成亦細。此外，以接 (t t㈣而言，亦可❹銅、鐵（不鏽鋼）、鶴 (_蛛〇、鈹（berylIlum)系之合金等來形成。鶴 為之板寬度(第2圖之y軸方向之寬度)係 〇 2軸加 外’接觸探針2之長度方向（第2圖之 軸方向）之長度係為5mm左右。 弧之徑方向之厚度係為】 〇 24令之® 為-例。 左右。另外，此尺寸僅係 探針架座3係具有：拓# 針2之連接部„ * 狀之$ 1架座31 ’插通接觸探 與第1架持臂部24;板狀之第2架座32， 部Η;二個架=::T觸〜1接觸 架座W及第2架座32。第 刀別挾持並固定第1 之表面係彼此平行。 〃座31之表面與第2架座32 321797 9 201035558 第4圖係為從第〗架座31之上方觀看探針架座3之 平面圖。第1架座31係具有複數個第！保持孔州，該第 1保持孔311係分別具有L字剖面形狀，用以供連接部幻 插通並且收容臂部24。第1保持孔3U係具有：大徑部 311a’具有L字狀之剖面，用以載置並收容呈圓弧狀之臂 P 4之底面’及小徑部311b，用以供連接部μ插通。在 形成第1保持孔311之際，係於藉由鑽孔（細）加工等 形成作為小徑部3Ub之貫通孔之後，配合臂冑24之形狀 藉由施行鑽柱坑（_ter bGring)加工而形成大徑部 3山。複數㈣〗保持孔311係大徑部仙之長度方向彼 此平行而呈行（column)狀。第！保持孔3ιι之間距係5〇 至150㈣左右。另夕卜，亦可藉由黏合具有大徑部3Ua之 板狀構件與具有小徑部3Ub之板狀構件而實_ i架座 31 ° 第2架座32係具有呈圓柱狀之複數個第2保持孔 32卜該第2保持孔321係分別供第1接觸部21插通。第 2保持孔321之直徑係與第〗保持孔3ιι之小徑部遍之 細目等。第2保持孔321之位置係與第〗保持孔扣之 ^以311b之位置對應而形成為行狀。如此—來，複數個 ^保祕叫之小徑部3nb)即與複數個第2保持孔 之任-者在上下方向連通，而使此連通之第 孔 311與第2保持孔321之組件保持接觸探針2。 及第mm %、34係用以失持與第1保持孔311 保持孔321並排為行狀之方向正交之方向之第！架 321797 10 201035558 座31及第2架座32之端面’且固 U疋並支撐此夾持之端面。 具有以上構成之採針架座3係使 ㈤处）或氮化矽（哪4)等 U1画na) w： ^ ^ ^ ά' 是』膠樹脂等絕緣 性材枓而形成。另外，以探針架座3之原材料”，亦可 錯由緣被膜來塗覆（coating)金屬等導電性材料的表面。 另外，=圖所示之接觸探針2之配置圖案僅係為一 例。亦即，探針架座3之配線圖案係依據檢查對象之電極 Ο Ο 或端子之配線圖絲決定者，可適當實施設計變更。 第5圖係為顯示對具有以上構成之探針單元i安裝配 線基板20G而對第2接觸部25施加荷重之狀態圖。第$ 圖所示之配線基板係為在由聚酿亞胺（)所 構成之薄膜（sheet)狀之基材之—方表面，形成有由錄等 所構成之多數條配線及連接用之電極者。在將配線基板 雇蚊於探針架座3之際，係於進行對位而使對應之電 極201與第2接觸部25接觸之後，藉由與探針架座3相同 材料所構成之固定構件300及第丨架座31來夾持配線基板 200並以螺固等方式來固定。如此—來，若將配線基板 200固定於探針架座3，即對於接觸探針2施加預定的荷 重。另外，亦可在配線基板200與第】架座31之間適當設 置間隔件（spacer)。 在第5圖中’臂部24係依據藉由與電極2〇1之接觸 所產生之荷重而產生彈性變形，且呈較無荷重時些微擴展 的圓弧狀。此外，由於臂部24係因承受荷重而如第5圖繞 著順時針方向些微旋轉，因此第丨接觸部21及連接部23 321797 11 201035558 分別與第2保持孔321及第1保持孔311抵接。結果，彈 性屈曲部22係在兩端部承受朝向第5圖之X轴之正的方向 之力，而使中央部朝x軸負的方向撓曲。此時，由於彈性 屈曲部22係呈在臂部24所延狀側_之形狀，因 容易撓曲。 第6圖係為顯示從第5圖所示之狀態藉由使半導體積 體電路100之電極101與第i接觸部21接觸而進行半導體 積體電路100之檢查之狀態圖。如第6圖所示，彈性屈曲 部22係依據來自半導體積體電路100之荷重進—步撓曲。 產生此撓曲之際’第1接觸部21係使半導體積體電路'00 朝x轴方向滑動。因此，在電極101被氧化膜 斤覆蓋、或5物附著於電極101之表面時， 膜或污物去除。 乳化 在，、且裝4木針單7C i之際，係以使彼此對應 =3U與第2保持孔切連通之方式將第i架座31盥^ 架座324層於厚度方向。接下來，以第！接觸部2;、為前 定第1保持孔3U及第2保持孔321貫通 ;:於r一並予以收容。之後，使第2架座二 :第，，且進行第2架座31及第2架座32之彼： 針架座較構件33、34予以固定，藉此即完成探 依據以上所說明之本發明之實施形態！，由於接 觸部21所承受之荷重主錢施加於難第1接觸部 321797 12 201035558 同方向延伸之彈性屈曲部22 ,另一方面，第2接觸部25 . 所承文之荷重主要係施加於朝與第1接觸部21或彈性屈曲 部22不同之方向延伸之臂部24，因此可使第t接觸部21 所承受之荷重與第2接觸部25所承受之荷重分離。因此， 可藉由在進行檢查之際使配線基板2〇〇之電極2〇1與第2 接觸部25接觸之狀態下使荷重固定化，而防止接觸探針2 因長期使用所造成之磨損’而可長期進行穩定的檢查。The appearance of the child shape. - The generality of the degree of L: face, 3 = ^ shape. Further, as in the case of the (10th)-stitching-indentation-shaped arc-shaped shape as shown in FIG. 3, the minimum width of the first-order contact portion 21 (the columnar shape of the second contact portion 21) is obtained by the axial direction 321797 8 201035558 of the elastic buckling portion 22. The part is in the middle of the χ axis. The width of the difference between the maximum width and the width R is the largest and the Ζ axis is the same as the Ζ axis; the line is flat and P1 is the sharp L and the z passing through the first contact portion 21 The plane p2 in which the axes are parallel is different, and the plane & is located farther from the arm 24 than P2. The arm portion 24 is formed in an arc shape in which the elastic buckling portion 22 is convex downward from the connecting portion 23, and is elastically deformed when applied from the outside via the second contact portion 25. The contact probe 2 having the above configuration is made of nickel alloy =. In addition, when the contact probe 2 is formed, the combination of the material and the material is formed by the combination of the two needles. In addition, in the case of t t (four), it can also be formed by copper, iron (stainless steel), crane (_ spider, berylIlum) alloy, etc. The width of the board is the y-axis direction of Figure 2 Width 2) The length of the contact probe 2 (the direction of the axis of Fig. 2) is about 5 mm. The thickness of the arc in the radial direction is 〇24 Order® is an example. In addition, this size is only for the probe holder 3 system: the connection portion of the extension # needle 2 „ * shape of the holder 1 ' insertion 31 contact and the first holder arm portion 24; 2 stands 32, part Η; two frames =:: T touch ~ 1 contact stand W and second stand 32. The first knives hold and fix the first surface is parallel to each other. 2 pedestal 32 321797 9 201035558 Fig. 4 is a plan view of the probe holder 3 viewed from above the pedestal holder 31. The first pedestal 31 has a plurality of apos; holding hole states, and the first holding hole 311 Each of the first holding holes 3U has a L-shaped cross section for placing and receiving the L-shaped cross-sectional shape for the connection portion to be inserted and received. The bottom surface ' and the small diameter portion 311b of the arc-shaped arm P 4 are for inserting the connection portion μ. When the first holding hole 311 is formed, it is formed by drilling (thin) processing or the like as a small diameter. After the through hole of the 3Ub portion, the shape of the arm armature 24 is processed by the drill string pit (_ter bGring) to form the large-diameter portion 3 mountain. The plurality (4) holds the hole 311 in the longitudinal direction of the large-diameter portion. In the form of a column, the distance between the holding holes 3ι is about 5 to 150 (four). Alternatively, the plate-like member having the large-diameter portion 3Ua and the plate-like member having the small-diameter portion 3Ub may be bonded. _ i pedestal 31 ° The second pedestal 32 has a plurality of second holding holes 32 in a cylindrical shape, and the second holding holes 321 are respectively inserted into the first contact portions 21. The diameter of the second holding holes 321 is The position of the second holding hole 321 is formed in a line shape corresponding to the position of the first holding hole 311b. Thus, the plurality of pieces are protected. The small diameter portion 3nb) is connected to the plurality of second holding holes in the vertical direction, and the first hole 311 is connected. The probe 2 is held in contact with the assembly of the second holding hole 321 and the first frame 321797 10 201035558 is used for the direction in which the first holding hole 311 holds the hole 321 in a line-like direction. The end faces of the seats 31 and the second frame 32 are fixed and support the end faces of the clamps. The needle holder base 3 having the above configuration is such that (5) or U1 (which is 4), etc. w: ^ ^ ^ ά' is formed by insulating material such as rubber resin. Further, the surface of the conductive material such as metal may be coated with a film by the edge film by the material of the probe holder 3. Further, the arrangement pattern of the contact probe 2 shown in Fig. is only an example. That is, the wiring pattern of the probe holder 3 is determined according to the electrode Ο of the inspection target or the wiring pattern of the terminal, and the design change can be appropriately performed. Fig. 5 is a view showing the probe unit having the above configuration i A state diagram in which a load is applied to the second contact portion 25 by mounting the wiring board 20G. The wiring board shown in Fig. $ is a surface of a substrate in the form of a sheet made of polyacrylamide. A plurality of wires and electrodes for connection are formed by recording, etc. When the wiring substrate is wound on the probe holder 3, the corresponding electrode 201 and the second contact portion are aligned. After the contact, the wiring board 200 is held by the fixing member 300 and the yoke holder 31 which are made of the same material as the probe holder 3, and is fixed by screwing or the like. Thus, if the wiring board 200 is to be used Fixed to the probe holder 3, that is, applied to the contact probe 2 Further, a spacer may be appropriately provided between the wiring substrate 200 and the first holder 31. In Fig. 5, the 'arm portion 24 is generated by contact with the electrode 2〇1. The load is elastically deformed and has a slightly expanded arc shape when there is no load. Further, since the arm portion 24 is slightly rotated in the clockwise direction as shown in FIG. 5 due to the load, the second contact portion 21 and The connection portion 23 321797 11 201035558 abuts against the second holding hole 321 and the first holding hole 311. As a result, the elastic buckling portion 22 receives the force in the positive direction toward the X-axis of the fifth figure at both end portions, thereby The central portion is deflected in a direction opposite to the x-axis. At this time, since the elastic buckling portion 22 has a shape which is formed on the side of the arm portion 24, it is easily deflected. Fig. 6 is a view shown in Fig. 5. The state of the semiconductor integrated circuit 100 is checked by bringing the electrode 101 of the semiconductor integrated circuit 100 into contact with the i-th contact portion 21. As shown in Fig. 6, the elastic buckling portion 22 is based on the semiconductor integrated body. The load of the circuit 100 is progressively in the step of flexing. The contact portion 21 slides the semiconductor integrated circuit '00 in the x-axis direction. Therefore, when the electrode 101 is covered with the oxide film or the five objects adhere to the surface of the electrode 101, the film or the dirt is removed. When the 4 wood needles 7C i are mounted, the ith mounts 31 are placed in the thickness direction so that the corresponding 3B and the second holding holes are in communication with each other. Next, the first contact is made. The second holder 31 and the second holder 31 are inserted in the first holding hole 3U and the second holding hole 321; and then the second holder 2: the second holder 31 and the second holder 31 are provided. The other of the pedestals 32: The needle holders are fixed relative to the members 33, 34, thereby completing the exploration according to the embodiment of the invention described above! The load on the contact portion 21 is applied to the elastically bent portion 22 extending in the same direction as the first contact portion 321797 12 201035558, and the second contact portion 25 on the other hand. Since the arm portion 24 extending in a direction different from the first contact portion 21 or the elastic buckling portion 22 can separate the load received by the t-th contact portion 21 from the load applied to the second contact portion 25. Therefore, the load can be fixed while the electrode 2〇1 of the wiring board 2 is in contact with the second contact portion 25 at the time of inspection, and the wear of the contact probe 2 due to long-term use can be prevented. It can be used for stable inspections for a long time.
▲，外，依據本實施形態1，由於通過第1接觸部21 2之2=== f爾（°ffset)㈣過彈性屈曲部 之繞曲方向中點Ml，因此可控制從外部施加荷重時 此外’依據本實施來能，屯 針2之排列方向一、，’、、 而可谷易使接. 架座3。再者，由於f且易於將接觸探針2安裝於. 〇架座3,因此卸除亦較容^接，針2,不需分解: 的組裝，且可欵率 、 此，可容易進行單元, (實施形態2) ( &進仃單元化後之維修。 第7圖係為顯干太旅叩 成圖。第7圖所示之接觸探=實施形態2之接觸探針: 之第1接觸部21、彈性屈:4係具有分別與接觸探: 部25對應之第4觸部41=V連接部23及第W 及第2接觸部45， 彈性屈曲部42、連接部▲, in addition, according to the first embodiment, since the second contact portion 21 2 is 2 ===f (°ffset) (four) passes through the midpoint of the winding direction of the elastic buckling portion M1, it is possible to control when the load is applied from the outside. In addition, according to the present embodiment, the arrangement direction of the needles 2 is one, ', and the other can be connected. Furthermore, since it is easy to mount the contact probe 2 to the truss holder 3, the removal is also easier, and the needle 2 does not need to be disassembled: the assembly rate is high, and the unit can be easily performed. (Embodiment 2) (& repair after unitization. Figure 7 is a diagram of the sturdy sturdy slab. The contact probe shown in Fig. 7 = the contact probe of the second embodiment: the first The contact portion 21 and the elastic bending portion 4 have a fourth contact portion 41 corresponding to the contact detecting portion 25, a V connecting portion 23, and a W and a second contact portion 45, and an elastic buckling portion 42 and a connecting portion.
性屈曲部42為連接部4;之有下1 部44,該臂部W 而從連接部43朝斜上方 321797 13 201035558 斜而料之形狀。接觸探針4係具有以臂部44為底邊之大 致L子狀之外觀形狀。 彈性屈曲部42之包含第7圖之χ轴方向之寬度 面係呈在臂部44戶斤延伸之側凹陷成圓弧狀之形狀。此夕卜°， 如第7圖所示，通過彈性屈曲部42之又轴方向之寬度 最小寬度(第1接觸部41之柱狀部分在X軸方向盥最大 度R之差為最大的寬度）之中點％而與ζ轴平行之平面 :3 ’係與通過第1接觸部41之呈尖銳狀之前端τ2而盥ζ 幸由平行之平面ρ4為不同，平 ” 臂部44之處。 千面匕係位於車父平面Ρ4更遠離 與連接部43之邊界料㈣，在終端附 一 2接觸σΜ5，若透過第2接觸部45從外部施加 何重則產生彈性變形。 具有以上構成之接觸探針4係使用與接觸探針2相同 之材料而形成。 貫/㈣’#、2之㈣單ι係具備：複數個接觸探針 ，及將複數個接觸探針4予以個職容之探針架座3。 第8圖係為顯示對本實施形態2之探 基板·而對第2接觸部45施加荷重之狀態圖= 圖中’臂部44係藉由從電極2〇1施加之荷重產生彈性變形 ^吏傾斜些微變小。隨著此彈性變形，第丨接觸部Μ及連 ^部43係分別與第2保持孔321及第i保持孔3ιι抿接。 '、、。果’彈性屈曲部42係在兩端部承受朝第8圖之χ轴之正 之方向的力，而使中央部朝χ軸之負之方向撓曲。 321797 14 201035558 在使半導體積體電路100之電極1〇1與第1接觸_ 接觸而進行檢查之際，彈性屈曲部42係與第6 觸探針2之彈性屈曲部22同樣成為更挽曲之形狀。 依據以上所說明之本發明之實施形態2，帛 W所承受之荷重主要係施加於朝與第〗接 : :?延:之彈性…，另-方面，第2接觸部： 又之何重主要係施㈣朝與第！接觸部41或 ο :不同，向延伸之臂部44，因此可使第i接觸部二二 又之何重與第2接觸部45所承受之荷重分離。因此 猎由在進行檢查之際使配線基板·之電極2〇ι 觸部45接觸之終τ使荷重固定化，而防止接觸 因長期使料造紅磨損，而可錢進行穩定的檢查。 /外，依據本實施形態2，由於通過第！接觸部Μ 之平面，係偏移成不通過彈性屈曲部^之最小 =度之h Μ2，因此可控制從外部施加荷重時之捷 挽曲:=針架座3所嫩^^ 此外’依據本實施形態2，與上述實施形態丨相同， t 單元化時的組裝，且可效率良好地進行單元化 之後的維修。 早70化 (實施形態3) 第9圖係為顯不本發明之音始其彡， 成圖。第9圖所之接觸探針之構 不接觸探針5係具備：第！接觸部 呈―銳狀之角柱狀；彈性屈曲部52，從第ι接觸部Μ 321797 15 201035558 之另一端沿著第1接觸 向）大致呈料狀延伸，H方向（第9圖之Z轴方 性屈曲；連接邻M ^ ^來自外部之荷重而產生彈 接。卩53，從與彈性屈曲 將彈性屈曲部52^==伸±;及臂部54，在 :::r 針 5==:= 面，係Hit 52之包含第9圖之x軸方向之寬度的剖 狀。、〜彳54戶斤延伸之侧相反側凹陷成圓弧狀之形 二痒’如第9圖所示，通過彈性屈曲部52之X軸方向 6：之：最小寬度(第1接觸部51之柱狀部分在X軸方 、°/、取大見度R之差為最大的寬度）之中點M3而盥2軸 面I5,係與通過第1接觸部51之呈尖銳狀之前 /、Z軸平行之平面p6為不同，平面匕係位於較平 面P6更接近臂部54之處。 臂部54所延伸方向之大致中央部係於上方最突出， 而於此突出之頂點附近設有第2接觸部55。臂部54若透 過第2接觸部55從外部施加荷重，則產生彈性變形。 具有以上構成之接觸探針5係使用與接觸探針2相同 之材料而形成。 本實施形態3之探針單元係具備：複數個接觸探針 及將複數個接觸探針5予以個別收容之探針架座3。 第10圖係為顯示對本實施形態3之探針單元安裝配 321797 16 201035558 線基板400而對第2接觸部55施加荷重之狀態圖。第1 〇 圖所示之配線基板400,其與信號處理電路連接之電極4〇1 之位置係與配線基板200之電極201不同。配線基板4〇〇 係為在由聚醯亞胺所構成之薄膜狀之基材之一方表面形成 有由錄等所構成之多數條配線及電極者。在將配線基板 400固定於探針架座3之際，係於進行對位而使對應之電 極401與第2接觸部55接觸之後，藉由固定構件300及第 1架座31夾持配線基板4〇〇，並以螺固方式來固定。如此 一來’若將配線基板4〇〇固定於探針架座3，即對於接觸 探針5施加預定的荷重。另外，亦可在配線基板400與第 1架座31之間適當設置間隔件。 如第10圖所示，臂部54係在藉由從配線基板400之 電極401施加之荷重產生彈性變形而延伸之方向些微擴 展。相對於此，第1接觸部51、彈性屈曲部52及連接部 53係僅在第9圖之X軸之負的方向些微移動，不會與第1 〇保持孔311接觸。因此，即使將配線基板400固定於探針 架座3 ’第1接觸部51、彈性屈曲部52及連接部53亦不 會變形。 第11圖係為顯示從第10圖所示之狀態藉由使半導體 積體電路100之電極101與第1接觸部51接觸而進行半導 體積體電路1〇〇之檢查之狀態圖。在第η圖中，由於彈性 屈曲部52係呈在臂部54所延伸之侧凹陷之形狀，因此依 據來自半導體積體電路100之荷重朝第11圖之X軸方向之 正方向撓曲。產生此撓曲之際，第1接觸部51係使半導體 17 321797 201035558 :=10。之電極1〇1|gx轴方向滑動 如由氧化騎覆蓋、或污物附著於電極iq ^極 可將此等氧域或污物去除。 表面時， 觸部賴明之本發明之實卿態3，由於第1接 同方向延伸又之何重主要係施加於朝與第1接觸部51相 所承受之荷===另-方面，第2接觸部” 部以同之方第口1接觸部51或彈性屈曲The bent portion 42 is a connecting portion 4; there is a lower portion 44 which is obliquely shaped from the connecting portion 43 toward the obliquely upper portion 321797 13 201035558. The contact probe 4 has an appearance of a substantially L-like shape with the arm portion 44 as a base. The width of the elastic buckling portion 42 including the y-axis direction of Fig. 7 is a shape that is recessed in an arc shape on the side where the arm portion 44 extends. Further, as shown in Fig. 7, the width of the elastically bent portion 42 in the axial direction is the smallest width (the difference between the maximum length R of the columnar portion of the first contact portion 41 in the X-axis direction is the maximum width). The plane of the midpoint % parallel to the ζ axis: the 3' system and the sharply shaped front end τ2 passing through the first contact portion 41 are different from the parallel plane ρ4, and the flat arm portion 44 is different. The face 匕 is located at the plane of the parent plane 更 4 and further away from the boundary material (4) of the connecting portion 43 , and is attached to the terminal 2 with a contact σ Μ 5 , and if it is applied from the outside through the second contact portion 45, elastic deformation occurs. The contact probe having the above configuration The 4 series is formed using the same material as the contact probe 2. The (4) 2, 2 (4) single ι system has: a plurality of contact probes, and a probe holder that holds a plurality of contact probes 4 Fig. 8 is a view showing a state in which a load is applied to the second contact portion 45 in the probe substrate of the second embodiment. Fig. 8 shows that the arm portion 44 is elastically deformed by the load applied from the electrode 2〇1. ^吏The tilt is slightly smaller. With this elastic deformation, the third contact portion and the connecting portion 43 The second elastic holding portion 321 and the i-th holding hole 3 are not connected to each other. ',. The negative direction of the yoke axis is deflected. 321797 14 201035558 When the electrode 1〇1 of the semiconductor integrated circuit 100 is brought into contact with the first contact _, the elasticity of the elastic buckling portion 42 and the sixth touch probe 2 is checked. The buckling portion 22 also has a more curved shape. According to the second embodiment of the present invention described above, the load applied to the 帛W is mainly applied to the yoke and the yoke: The second contact portion: the main contact system (4) is different from the first contact portion 41 or ο: the extending arm portion 44, so that the second contact portion can be made to be in contact with the second contact The load applied to the portion 45 is separated. Therefore, the load is fixed by the end of the contact between the electrode 2 of the wiring substrate 2 and the contact portion 45 at the time of inspection, and the contact is prevented from being worn by the material for a long time. The money is checked for stability. / In addition, according to the second embodiment, the level of the contact portion is , is offset to the minimum = degree h Μ 2 of the elastic buckling portion ^, so it can control the tapping when the load is applied from the outside: = the pin holder 3 is tender ^ ^ In addition, according to the second embodiment, In the above-described embodiment, the assembly is performed at the time of t-unitization, and the maintenance after the unitization can be performed efficiently. Early 70 (Embodiment 3) FIG. 9 is a diagram showing the sound of the present invention. The non-contact probe 5 of the contact probe shown in Fig. 9 is provided with: the first contact portion has a sharp-angled columnar shape; and the elastically bent portion 52 is from the other end of the first contact portion 321 797 15 201035558 The first contact direction extends substantially in the form of a material, and the H direction (the Z-axis of the Fig. 9 is buckling; the connection M ^ ^ is from the external load to cause the elastic joint.卩53, from the elastic buckling, the elastic buckling portion 52^==extension; and the arm portion 54, at the :::r pin 5==:= face, the Hit 52 includes the width of the x-axis direction of Fig. 9 The shape of the section. , 彳 54 斤 户 户 户 户 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 相反 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The columnar portion is at the point M3 between the X-axis, °/, and the width at which the difference in visibility R is the largest, and the 轴2-axis surface I5 is before the sharp portion through the first contact portion 51. The plane p6 in which the axes are parallel is different, and the plane 匕 is located closer to the arm 54 than the plane P6. The substantially central portion of the direction in which the arm portion 54 extends is most prominently above, and the second contact portion 55 is provided in the vicinity of the apex of the protrusion. When the arm portion 54 is applied with a load from the outside through the second contact portion 55, elastic deformation occurs. The contact probe 5 having the above configuration is formed using the same material as the contact probe 2. The probe unit of the third embodiment includes a plurality of contact probes and a probe holder 3 for individually accommodating a plurality of contact probes 5. Fig. 10 is a view showing a state in which a load is applied to the second contact portion 55 by attaching the 321797 16 201035558 wire substrate 400 to the probe unit of the third embodiment. In the wiring board 400 shown in Fig. 1, the position of the electrode 4〇1 connected to the signal processing circuit is different from that of the electrode 201 of the wiring board 200. The wiring board 4 is formed by forming a plurality of wirings and electrodes composed of recording or the like on one surface of a film-form substrate made of polyimide. When the wiring board 400 is fixed to the probe holder 3, the alignment electrode is brought into contact with the second contact portion 55, and the wiring substrate is sandwiched between the fixing member 300 and the first holder 31. 4〇〇, and fixed by screwing. As a result, when the wiring substrate 4 is fixed to the probe holder 3, a predetermined load is applied to the contact probe 5. Further, a spacer may be appropriately provided between the wiring substrate 400 and the first mount 31. As shown in Fig. 10, the arm portion 54 is slightly expanded in a direction in which the arm portion 54 is elastically deformed by the load applied from the electrode 401 of the wiring substrate 400. On the other hand, the first contact portion 51, the elastic buckling portion 52, and the connecting portion 53 are slightly moved only in the negative direction of the X-axis of Fig. 9, and are not in contact with the first cymbal holding hole 311. Therefore, even if the wiring board 400 is fixed to the probe holder 3', the first contact portion 51, the elastic buckling portion 52, and the connecting portion 53 are not deformed. Fig. 11 is a view showing a state in which the inspection of the semiconductor body circuit 1 is performed by bringing the electrode 101 of the semiconductor integrated circuit 100 into contact with the first contact portion 51 from the state shown in Fig. 10. In the figure n, since the elastic buckling portion 52 has a shape recessed on the side where the arm portion 54 extends, the load from the semiconductor integrated circuit 100 is deflected in the positive direction of the X-axis direction of Fig. 11 . When this deflection occurs, the first contact portion 51 is such that the semiconductor 17 321797 201035558 :=10. The electrode 1〇1|gx is sliding in the axial direction. This oxygen field or dirt can be removed by covering with an oxide ride or by adhering dirt to the electrode iq. In the case of the surface, the contact state of the invention is as follows: the weight of the first joint in the same direction is mainly applied to the load with the first contact portion 51 === another aspect, 2 contact portion" with the same side of the mouth 1 contact portion 51 or elastic buckling
所承受之荷重與第2接觸部 7可接觸部W 可藉由在進行檢查之二二文之何重分離。因此， Ή線基板彻之電極4G1與第2 二二==r，止接觸探針5 此外’依據本實施:：3可=行穩定的檢查。 之前端T3之平而，二 由於通過第1接觸部5! 寬度之中點Μ '糸偏移成不通過彈性屈曲部52之最小 向 '此:可可控制從外部施加荷重時之繞曲方 撓曲方向皆—致Γ針架座3所保持之複數個接觸探針5之 可容與增施形態1相同， 後之維修。且可效率良好地進行單元化 屈曲^1相在门本實施形態3中’亦可與接觸探針2之彈性 臂之咖探針之彈性屈曲部之形狀作成為在 侧凹陷成圓弧狀之形狀。 321797 18 201035558 構成圖第。12第圖丨:，示本發明之實施形態4之接 2圖所示之接觸探針ό係具有與接觸探針5 部％分另Γ對部鹿51、彈性屈曲部52、連接部53及第2接觸 63及第2接觸二之弟1接觸部61、彈性屈曲部62、連接部 延伸之方Α邛65，亚且具有呈板狀且朝與連接部63所 以臂邻64发不同的方向延伸之臂部⑷接觸探針6係具有 以相為底邊之大虹字狀之外觀形狀。 Ο ο 彈之包含第12圖之χ轴方向之寬度的剖 與臂部64所延伸之側相反側凹陷成圓弧狀之形 、。=外，如第12圖所示，通過彈性屈曲部Μ之X軸方 向之寬度之中最小寬度（第1接觸部61之柱狀部分在χ 軸方向與最大寬度R之差為最大的寬度）之中點％而與 ^由山平行之平面Ρ7,係與通過« 1接觸部61之呈尖銳狀之 剛端Τ4而與ζ軸平行之平面ρ8為不同，平面A係位於較 平面6更接近臂部64之處。 臂部64係呈板狀而從連接部63之上端部朝第u圖 之X軸方向之正的方向延伸。在臂部64之中央部，係形成 有沿著臂部64所延伸之方向所形成之開縫64a。此外，第 2接觸部65係設於開縫64a之上方亦即臂部料之大致中 央部之上端。 具有以上構成之接觸探針6係使用與接觸探針2相同 之材料而形成。 本實施形態4之探針單元係具備：複數個接觸探針 6，及將複數個接觸探針6予以個別收容之探針架座3 ^ 321797 19 201035558 第13圖係為顯示對本實施形態4之探針單元安裝配 線基板400而對第2接觸部65施加荷重之狀態圖。在第 13圖中，臂部64係藉由從配線基板400之電極4〇1施加 之荷重產生彈性變形，而使開縫64a之面積些微變小。另 外，即使將配線基板4〇〇固定於探針架座3，帛i接觸部 61、彈性屈曲部62及連接部63亦不會變形。 第14圖係為顯示從第13圖所示之狀態藉由使半導體 積體電路100之電極1〇1與第i接觸部61接觸而進行半導 體積體電路100之檢查之狀態圖。如第14圖所示，彈性屈 曲部62係依據來自半導體積體電路1〇〇之荷重朝第μ圖 之^軸方向之正方向撓曲。產生此挽曲之際，第i接觸部 61係使半導體積體電路1〇〇之電極101朝χ轴方向滑動。 因此’當電極ιοί由氧化膜所覆蓋、或污物附著於電極ι〇ι 之表面時，可將此等氧化膜或污物去除。 另外，在本實施形態4中，設於臂部64之開縫6乜 之位置或形狀並不限定於上述者，亦可在與第2接觸部& 之位置的關係予以適當變更。 依據以上所說明之本發明之實施形態4，由於第t接 觸部61所承受之荷重主要係施加於朝與第1接觸部61相 同之方向延伸之彈性屈曲部62，另—方面，第2接觸部Μ 所承受之荷重主要係施加於朝與第〗接觸部61或彈性屈曲 部62☆不同之方向延伸之臂部料，因此可使第i接觸部η :斤承文之何重與第2接觸部65所承受之荷重分離。因此， 可藉由在進行檢查之際使配線基板4〇〇之電極4〇1與第2 321797 20 201035558 接觸部65接觸之狀態下使荷重固定化，而防止接觸探針6 因長期使用所造成之磨損，而可長期進行穩定的檢查。 此外，依據本實施形態4，由於通過第1接觸部61 '之前端T4之平面，係偏移成不通過彈性屈曲部62之最小 寬度之中點Μ4，因此可控制從外部施加荷重時之撓曲方 向。因此，可使探針架座3所保持之複數個接觸探針6之 撓曲方向皆一致。 此外，依據本實施形態4，與上述實施形態1相同， 〇 可容易進行單元化時的組裝，且可效率良好地進行單元化 後之維修。 (實施形態5) 第15圖係為顯示本發明之實施形態5之接觸探針之 構成圖。第15圖所示之接觸探針7係具備：第1接觸部 71，呈一端尖銳狀之角柱狀；彈性屈曲部72，從第1接觸 部71之另一端沿著第1接觸部71之長度方向（第15圖之 ❹ ζ軸方向）呈角柱狀延伸，且藉由來自外部之荷重而產生 彈性屈曲；連接部73，從與彈性屈曲部72所延伸之方向 之端部、即與連接於第1接觸部71之端部不同之端部沿著 彈性屈曲部72所延伸之方向呈角柱狀而延伸；臂部74， 從連接部73之端部朝與連接部73所延伸之方向不响之方 向（第15圖之X軸方向）延伸，且可彈性變形；第2接觸 部75，在將臂部74之與連接部73之邊界作為開始端時設 於臂部74之終端，且朝與連接部73所延伸之方向平行之 方向突出，且前端呈尖銳狀；及第3接觸部76，透過與臂 21 321797 201035558 部74之連接部73連接之端部而沿著連接部73所延伸之方 向突出，且前端呈尖銳狀。接觸探針7係具有以臂部74 為底邊之大致L字狀的外觀形狀。 臂部74係呈以彈性屈曲部72為連接部73之下方而 朝下凸的圓弧狀，若透過第2接觸部75及第3接觸部76 從外部施加荷重則產生彈性變形。 第3接觸部76係具有與設於配線基板側之虛設 (dummy )電極接觸而承受荷重之功能，用以輔助彈性屈 曲部72之撓曲。第3接觸部76之前端係以彈性屈曲部72 為連接部73之下方而位於第2接觸部75之前端更上方之 處。 具有以上構成之接觸探針7係使用與接觸探針2相同 之材料而形成。 本實施形態5之探針單元係具備：複數個接觸探針 7 ;及將複數個接觸探針7予以個別收容之探針架座3。 第16圖係為顯示對本實施形態5之探針單元安裝配 線基板500而對第2接觸部75及第3接觸部76施加荷重 之狀態圖。第16圖所示之配線基板500係為在由聚醯亞胺 所構成之薄膜狀之基材之一方表面，形成有由鎳等所構成 之多數條配線及電極者，分別具有相同數量的電極501、 及虛設電極502，該電極501係經由配線與信號處理電路 連接，而該虛設電極502係不與信號處理電路連接而絕 緣。電極501係與第2接觸部75接觸，另一方面，虛設電 極502係與第3接觸部76接觸。在將配線基板500固定於 22 321797 201035558 探針架座3之際，係於進行對位而使電極5〇ι及虛設電極 ‘ 502分別與對應之第2接觸部75及第3接觸部％接觸之 後，藉由固定構件300及第i架座31夾持配線基板5〇〇， 並以螺固等方式固定。另外，亦可在配線基板與第【 架座31之間適當設置間隔件。 如第16圖所示，臂部74係藉由來自配線基板5〇〇之 荷重而產生彈性變形。產生此彈性變形之際，由於第3接 觸部76之前端之高度係較第2接觸部75之前端之高度 大因此首先第3接觸部76會與虛設電極5〇2接觸。藉由 此接觸’臂部74係在如第16圖所示—面繞著逆時針方向 些微旋轉一面變形之後，第2接觸部75會與電極501接 觸。因此，彈性屈曲部72係成為朝第16圖之叉軸之正方 向撓曲。如此，在本實施形態5中，由於係可藉由設置第 3接觸部76而控制彈性屈曲部72之撓曲，因此即使彈性 屈曲部72之形狀為柱狀，亦可容易朝所希望之方向挽曲。 〇 帛17圖係為從第16圖所示之狀態藉由使半導體積體 電路100之電極101與第！接觸部71接觸而進行半導體積 體電路100之檢查之狀態圖。在第17圖中，彈性屈曲部 72係依據來自半導體積體電路1〇〇之荷重而更為撓曲。產 生此撓曲之際，帛1接觸部71係使半導體積體電路ι〇〇 之電極ΗΠ朝X軸方向滑動。因此，當電極ι〇ι由氧化膜 所覆蓋、或污物附著於電極1〇1之表面時，可將此等氧化 膜或污物去除。 依據以上所說明之本發明之實施形態5，由於第ι接 321797 23 201035558 卩1所承文之荷重主要係施加於朝與 同之方向延伸之彈性屈曲部72,另—方1::相 所承香夕接觸部75 部72不π 施加於朝與第1接觸部71或彈性屈曲 所承典之/向延伸之臂部74 ’因此可使第1接觸部] 可藉^ 與第2接觸部75所承受之荷重分離。因此， 進仃核查之際使配線基板500之電極501與第2 邛75接觸之狀態下使荷重固定化，而防止 因長期使騎造权賴，Η㈣崎敎的檢^。針 —此外’依據本實施形態5，與上述實施形態〗相同， 行單元化時的組褒，且可效率良好地進行單元化 (其他實施形態） △至此雖已詳述實施形態！至5作為實施本發明之最佳 形態，惟本發明並不僅限於此等5個實施形態。例如，在 本發明中’可藉由觀接觸探針之臂部之長度或寬度、第 2接觸部之設置位置來適當變更臂部之彈簧常數。二外， 關於接觸探針之彈性屈曲部，亦可藉由調整其長度或形狀 來適當變更荷重-撓曲特性。 如此’本發明亦可包含未記載於此的各種實施形態 等，只要在不脫射請專利範圍所界定之技術思想範圍 内’均可施行各種設計變更等。 (產業上之可利用性） 综上所述，本發明之接觸探針及探針單元係適用於進 行半導體積舰路歧晶面㈣之電子零狀導通狀態檢 321797 24 201035558 查或動作特性檢查時。 【圖式簡單說明】 第1圖係為顯示本發明之實施形態1之探針單元之構 成之斜視圖。 第2圖係為顯示本發明之實施形態1之探針單元之構 成圖。 第3圖係為顯示本發明之實施形態1之接觸探針及探 針單元之主要部分構成之局部剖面圖。 ® 第4圖係為從第1架座之上方觀看探針架座之平面 圖。 第5圖係為顯示對本發明之實施形態1之探針單元安 裝配線基板之狀態圖。 第6圖係為顯示使用本發明之實施形態1之探針單元 進行檢查之狀態圖。 第7圖係為顯示本發明之實施形態2之接觸探針之構 ❹成圖。 第8圖係為顯示對本發明之實施形態2之探針單元安 裝配線基板之狀態圖。 第9圖係為顯示本發明之實施形態3之接觸探針之構 成圖。 第10圖係為顯示對本發明之實施形態3之探針單元 安裝配線基板之狀態圖。 第11圖係為顯示使用本發明之實施形態3之探針單 元進行檢查之狀態圖。 25 321797 201035558 構成圖。 第12圖係為顯 第13圖係為顯 示本發明之實施形態4之接觸探針之 示對本發明之實施形態4之探針單元 安裝配線基板之狀態 第14圖係為顯示使用本發明之實施形態4 元進行檢查之狀態圖。 之探針單 構成圖 第15圖係為顯示本發明之實施形態5之接觸探針之 第16圖係為顯示對本發明之實施形態5之探針單元 安裝配線基板之狀態圖。 第17圖係為顯示使用本發明之實施形態5之探針單 元進行檢查之狀態圖。 【主要元件符號說明】 探針單元 2、4、5、6、7 3 21 、 41 、 51 、 61 、 71 22、 42、52、62、72 23、 43、53、63、73 24、 44、54、64、74 25 、 45 、 55 、 65 、 75 31 32 33、34 接觸探針 探針架座 第1接觸部 彈性屈曲部 連接部 臂部 第2接觸部 第1架座 第2架座 架座固定構件 321797 26 201035558 64a 開缝 76 第3接觸部 100 半導體積體電路 101 、 201 、 401 、 501 電極 200 、 400 、 500 配線基板 300 固定構件 311 第1保持孔 311a 大徑部 311b 小徑部 321 第2保持孔 502 虛設電極 Ο 27 321797The load to be applied and the contact portion W of the second contact portion 7 can be separated by the second check. Therefore, the twisted wire substrate is completely covered with the electrode 4G1 and the second and second two==r, and the contact probe 5 is further mounted. According to the present embodiment: 3 can be used for stable inspection. The front end T3 is flat, and the second end is passed through the first contact portion 5! The width Μ '糸 is offset to the minimum direction that does not pass through the elastic buckling portion 52. This: Cocoa controls the winding of the winding when the load is applied from the outside. The direction of the curvature is the same as that of the plurality of contact probes 5 held by the needle holder 3, and the maintenance is the same as that of the addition form 1. Further, the unitized buckling can be performed efficiently. In the third embodiment, the shape of the elastic buckling portion of the elastic probe of the elastic arm of the contact probe 2 can be formed into an arc shape on the side. shape. 321797 18 201035558 constitutes the figure. 12图图: The contact probe system shown in the second embodiment of the fourth embodiment of the present invention has 5 parts of the contact probe, and the pair of deer 51, the elastic buckling portion 52, the connecting portion 53 and The second contact 63 and the second contact two-child 1 contact portion 61, the elastic buckling portion 62, and the flange 65 extending from the connecting portion have a plate shape and are different from the connecting portion 63 so that the arms are adjacent to each other. The extended arm portion (4) contact probe 6 has an appearance shape having a large rainbow-like shape with a bottom side. ο ο The shape of the bullet including the width in the x-axis direction of Fig. 12 is recessed in an arc shape on the side opposite to the side on which the arm portion 64 extends. In addition, as shown in Fig. 12, the minimum width among the widths of the elastic bending portion X in the X-axis direction (the width of the columnar portion of the first contact portion 61 in the χ-axis direction and the maximum width R is the largest width) The midpoint % is different from the plane Ρ7 parallel to the mountain, and is different from the plane ρ8 parallel to the ζ axis by the sharp end Τ 4 of the contact portion 61, and the plane A is located closer to the plane 6 Where the arm 64 is. The arm portion 64 has a plate shape and extends from the upper end portion of the connecting portion 63 in the positive direction of the X-axis direction of the u-th image. In the central portion of the arm portion 64, a slit 64a formed in a direction in which the arm portion 64 extends is formed. Further, the second contact portion 65 is provided above the slit 64a, that is, at the upper end portion of the substantially central portion of the arm material. The contact probe 6 having the above configuration is formed using the same material as that of the contact probe 2. The probe unit of the fourth embodiment includes a plurality of contact probes 6 and a probe holder holder for individually accommodating a plurality of contact probes 6 ^ 321797 19 201035558 Fig. 13 is a view showing the fourth embodiment A state diagram in which the probe unit mounts the wiring substrate 400 and applies a load to the second contact portion 65. In Fig. 13, the arm portion 64 is elastically deformed by the load applied from the electrode 4?1 of the wiring substrate 400, and the area of the slit 64a is slightly reduced. Further, even if the wiring board 4 is fixed to the probe holder 3, the 接触i contact portion 61, the elastic buckling portion 62, and the connecting portion 63 are not deformed. Fig. 14 is a view showing a state in which the inspection of the semiconductor body circuit 100 is performed by bringing the electrode 1〇1 of the semiconductor integrated circuit 100 into contact with the i-th contact portion 61 from the state shown in Fig. 13. As shown in Fig. 14, the elastic bending portion 62 is deflected in the positive direction of the axial direction of the μ-th diagram in accordance with the load from the semiconductor integrated circuit 1?. When the lead is made, the i-th contact portion 61 slides the electrode 101 of the semiconductor integrated circuit 1 in the z-axis direction. Therefore, when the electrode ιοί is covered by the oxide film or the dirt adheres to the surface of the electrode ι〇ι, the oxide film or the dirt can be removed. Further, in the fourth embodiment, the position or shape of the slit 6 设 provided in the arm portion 64 is not limited to the above, and the relationship with the position of the second contact portion & According to the fourth embodiment of the present invention described above, the load applied to the t-th contact portion 61 is mainly applied to the elastic buckling portion 62 extending in the same direction as the first contact portion 61, and the second contact is also applied. The load applied to the part 主要 is mainly applied to the arm material extending in a direction different from the first contact portion 61 or the elastic buckling portion ☆, so that the ith contact portion η: The load received by the contact portion 65 is separated. Therefore, the load can be fixed while the electrode 4〇1 of the wiring substrate 4 is in contact with the contact portion 65 of the second 321797 20 201035558 at the time of inspection, thereby preventing the contact probe 6 from being used for a long period of time. It is worn and can be stably inspected for a long time. Further, according to the fourth embodiment, since the plane passing through the front end T4 of the first contact portion 61' is shifted so as not to pass through the point Μ4 among the minimum widths of the elastic buckling portion 62, it is possible to control the deflection when the load is applied from the outside. The direction of the song. Therefore, the deflection directions of the plurality of contact probes 6 held by the probe holder 3 can be made uniform. Further, according to the fourth embodiment, as in the first embodiment, 〇 can be easily assembled in the unitization, and the unitized maintenance can be performed efficiently. (Fifth Embodiment) Fig. 15 is a view showing the configuration of a contact probe according to a fifth embodiment of the present invention. The contact probe 7 shown in Fig. 15 includes a first contact portion 71 having a sharp columnar shape at one end, and an elastic buckling portion 72 extending from the other end of the first contact portion 71 along the length of the first contact portion 71. The direction (Fig. 15 and the x-axis direction) extends in a columnar shape, and elastic buckling is generated by the load from the outside; the connecting portion 73 is connected from the end portion extending in the direction of the elastic buckling portion 72, that is, The end portions of the end portions of the first contact portion 71 extend in a corner column shape along the direction in which the elastic buckling portion 72 extends; the arm portion 74 does not ring in the direction from the end portion of the connecting portion 73 toward the connecting portion 73. The direction (the X-axis direction of FIG. 15) extends and is elastically deformable; and the second contact portion 75 is provided at the end of the arm portion 74 when the boundary between the arm portion 74 and the connecting portion 73 is used as the starting end, and Projecting in a direction parallel to the direction in which the connecting portion 73 extends, and having a sharp end, and the third contact portion 76 extending through the connecting portion 73 through the end portion connected to the connecting portion 73 of the arm 21 321797 201035558 portion 74 The direction is prominent and the front end is sharp. The contact probe 7 has an outer shape of a substantially L shape with the arm portion 74 as a base. The arm portion 74 has an arc shape that is convex downward when the elastic buckling portion 72 is below the connecting portion 73, and is elastically deformed when the second contact portion 75 and the third contact portion 76 are applied with a load from the outside. The third contact portion 76 has a function of receiving a load in contact with a dummy electrode provided on the wiring board side to assist the deflection of the elastic bending portion 72. The front end of the third contact portion 76 is located above the front end of the second contact portion 75 with the elastic buckling portion 72 being below the connecting portion 73. The contact probe 7 having the above configuration is formed using the same material as the contact probe 2. The probe unit of the fifth embodiment includes a plurality of contact probes 7 and a probe holder 3 for individually accommodating a plurality of contact probes 7. Fig. 16 is a view showing a state in which a load is applied to the second contact portion 75 and the third contact portion 76 by attaching the wiring board 500 to the probe unit of the fifth embodiment. The wiring board 500 shown in FIG. 16 is formed on one surface of a film-form substrate made of polyimide, and has a plurality of wirings and electrodes made of nickel or the like, and each has the same number of electrodes. 501, and a dummy electrode 502 connected to the signal processing circuit via a wiring, and the dummy electrode 502 is insulated from the signal processing circuit. The electrode 501 is in contact with the second contact portion 75, and the dummy electrode 502 is in contact with the third contact portion 76. When the wiring substrate 500 is fixed to the 22 321797 201035558 probe holder 3, the alignment is performed so that the electrode 5〇 and the dummy electrode '502 are in contact with the corresponding second contact portion 75 and the third contact portion, respectively. Thereafter, the wiring board 5 is sandwiched between the fixing member 300 and the i-th mount 31, and is fixed by screwing or the like. Further, a spacer may be appropriately provided between the wiring board and the [mounting base 31]. As shown in Fig. 16, the arm portion 74 is elastically deformed by the load from the wiring board 5〇〇. When this elastic deformation occurs, since the height of the front end of the third contact portion 76 is higher than the height of the front end of the second contact portion 75, the third contact portion 76 first comes into contact with the dummy electrode 5?2. By the contact 'arm portion 74' being deformed while rotating slightly in the counterclockwise direction as shown in Fig. 16, the second contact portion 75 comes into contact with the electrode 501. Therefore, the elastic buckling portion 72 is deflected in the positive direction of the fork shaft of Fig. 16. As described above, in the fifth embodiment, since the deflection of the elastic buckling portion 72 can be controlled by providing the third contact portion 76, even if the shape of the elastic buckling portion 72 is columnar, it is easy to move in the desired direction. Pull the song. The Fig. 17 is a state shown in Fig. 16 by making the electrode 101 of the semiconductor integrated circuit 100 and the first! A state diagram in which the contact portion 71 is in contact and the semiconductor integrated circuit 100 is inspected. In Fig. 17, the elastic buckling portion 72 is more flexed in accordance with the load from the semiconductor integrated circuit 1〇〇. When this deflection occurs, the 帛1 contact portion 71 slides the electrode ΗΠ of the semiconductor integrated circuit 〇〇 in the X-axis direction. Therefore, when the electrode ι〇ι is covered by the oxide film or the dirt adheres to the surface of the electrode 1〇1, the oxide film or the stain can be removed. According to the fifth embodiment of the present invention described above, since the load of the text of the first 321797 23 201035558 卩1 is mainly applied to the elastic buckling portion 72 extending in the same direction, the other side 1:: phase The fragrant contact portion 75 is not applied to the arm portion 74 that extends toward the first contact portion 71 or the elastic buckling portion. Therefore, the first contact portion can be used and the second contact portion 75 can be used. The load that is subjected to the separation. Therefore, when the electrode 501 of the wiring substrate 500 is brought into contact with the second cymbal 75, the load is fixed, and the right to ride is prevented, and the 四 (4) is rugged. According to the fifth embodiment, in the same manner as the above-described embodiment, the group is united and can be unitized efficiently (other embodiments). Δ Although the embodiment has been described in detail above! 5 is the best mode for carrying out the invention, but the invention is not limited to the five embodiments. For example, in the present invention, the spring constant of the arm portion can be appropriately changed by observing the length or width of the arm portion of the contact probe and the installation position of the second contact portion. Secondly, regarding the elastic buckling portion of the contact probe, the load-deflection property can be appropriately changed by adjusting the length or shape thereof. Thus, the present invention may include various embodiments and the like which are not described herein, and various design changes and the like may be made as long as they are within the scope of the technical idea defined by the patent scope. (Industrial Applicability) In summary, the contact probe and the probe unit of the present invention are suitable for performing an electronic zero-conduction state inspection of a semiconductor reservoir road surface (4). 321797 24 201035558 inspection or operation characteristic inspection Time. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the configuration of a probe unit according to a first embodiment of the present invention. Fig. 2 is a view showing the configuration of a probe unit according to the first embodiment of the present invention. Fig. 3 is a partial cross-sectional view showing the configuration of a main part of a contact probe and a probe unit according to the first embodiment of the present invention. ® Figure 4 is a plan view of the probe holder from above the first stand. Fig. 5 is a view showing a state in which the probe unit mounting board of the first embodiment of the present invention is mounted. Fig. 6 is a view showing a state in which the probe unit of the first embodiment of the present invention is inspected. Fig. 7 is a view showing the configuration of a contact probe according to a second embodiment of the present invention. Fig. 8 is a view showing a state in which the probe unit mounting board of the second embodiment of the present invention is mounted. Fig. 9 is a view showing the construction of a contact probe according to a third embodiment of the present invention. Fig. 10 is a view showing a state in which a wiring board is mounted on the probe unit of the third embodiment of the present invention. Fig. 11 is a view showing a state in which the probe unit of the third embodiment of the present invention is used for inspection. 25 321797 201035558 Composition diagram. Fig. 12 is a view showing a state in which a contact probe according to a fourth embodiment of the present invention is attached to a probe unit according to a fourth embodiment of the present invention. FIG. 14 is a view showing the use of the present invention. State diagram of the inspection of the form 4 yuan. Fig. 15 is a view showing a state in which a contact probe according to a fifth embodiment of the present invention is attached to a probe unit according to a fifth embodiment of the present invention. Fig. 17 is a view showing a state in which the probe unit of the fifth embodiment of the present invention is used for inspection. [Explanation of main component symbols] Probe units 2, 4, 5, 6, 7 3 21 , 41 , 51 , 61 , 71 22 , 42 , 52 , 62 , 72 23 , 43 , 53 , 63 , 73 24 , 44 , 54, 64, 74 25, 45, 55, 65, 75 31 32 33, 34 Contact probe probe holder 1st contact elastic flexion joint arm 2nd contact 1st mount 2nd mount Seat fixing member 321797 26 201035558 64a slit 76 third contact portion 100 semiconductor integrated circuit 101, 201, 401, 501 electrode 200, 400, 500 wiring board 300 fixing member 311 first holding hole 311a large diameter portion 311b small diameter portion 321 2nd holding hole 502 dummy electrode Ο 27 321797