JP2007279009A5 - - Google Patents

Claims (15)

A probe assembly for performing circuit inspection of a semiconductor chip comprising the following requirements:
Conductive part including a vertical probe formed on the resin film by etching the metal foil adhered on the resin film,
A plurality of resin film sheets that are stacked so that the vertical probes are stacked and the tip of the vertical probe is collectively contacted with the electrode pads of the semiconductor chip,
The conductive part including the vertical probe forms a parallelogram link mechanism having a parallel spring structure;
When etching the metal foil, a dummy part is formed without leaving a part other than the conductive part,
The dummy portion is a resin film reinforcing member,
A contactor assembly characterized by that.   The contactor according to claim 1, wherein the parallelogram link mechanism having the parallel spring structure is a cantilever structure having the vertical probe on one end side and extending in the horizontal direction with the other end side as a support portion. Assembly.   The contactor assembly according to claim 1, wherein the parallel spring is a link mechanism deformed by bending.   The contactor assembly according to claim 1, wherein an opening is provided in the resin film between the parallel springs. The contactor assembly according to claim 1, further comprising a terminal portion that is connected to the vertical probe via a link mechanism and a conductive portion and contacts a connection pad of a circuit board . 6. The contactor assembly according to claim 5, wherein the terminal portion is formed on each resin film such that when the resin films with probes are laminated, the respective arrangement positions are shifted at equal pitches . The contactor assembly according to claim 6, wherein the conductive portion in the vicinity of the terminal portion is provided with a curved portion . 6. The contactor assembly according to claim 5, wherein the link mechanism and the terminal portion are provided with a notch portion in the vicinity thereof to form a cantilever structure . Contact child assembly of claim 1, wherein the resin film surface, characterized in that filled an insulating adhesive between the conductive portion and the dummy portion. A contact assembly for performing circuit inspection of a semiconductor chip comprising the following requirements:
Conductive part including a vertical probe formed on the resin film by etching the metal foil adhered on the resin film,
Vertical probes are stacked, the set plurality of resin film sheet to the front end portion of the vertical probe by collectively contacted to collectively contact the electrode pad conductive semiconductor chips,
The conductive part including the vertical probe forms a parallelogram link mechanism having a parallel spring structure;
Parallel springs have a link structure inclined by the angle θ with respect to the horizontal direction, characterized by making it possible to vary the rubs of between pads located on the probe and the wafer by varying the angle θ contact probe assembly. A contact assembly for performing circuit inspection of a semiconductor chip comprising the following requirements:
Conductive part including a vertical probe formed on the resin film by etching the metal foil adhered on the resin film,
A plurality of resin film sheets that are stacked so that the vertical probes are stacked and the tip of the vertical probe is collectively contacted with the electrode pads of the semiconductor chip,
The conductive part including the vertical probe forms a parallelogram link mechanism having a parallel spring structure;
There is a positioning dummy near the vertical probe, and there is a connecting dummy between the vertical probe and the positioning dummy. The positioning dummy and the hole penetrating the film and one end of the connecting dummy are close to the vertical probe. contact probe assembly and positioning the dummy unit vertical probe and connecting the dummy portion you characterized by forming the same plane by there. Surface of the connecting dummy unit operates on the surface exactly the same plane of the vertical probe, the other contactor assembly, according to claim 11, characterized in that the force transmitted through the holes and the supporting rod will not occur Contactor assembly. One or a plurality of rows that further have conductive portions or conductive wirings having different lengths and support rods inserted into holes formed in the resin film, and that can be electrically connected to the electrodes of the circuit board that is roughly distributed. The contact assembly of claim 1 , wherein the contact assembly has vertical probes aligned with each other. 14. The contact assembly according to claim 13, wherein the vertical probes are arranged so as to be orthogonal to each other . The contactor assembly according to claim 14 , wherein one or more resin materials in an electrically insulating state and a fixing portion of a parallel spring are connected and fixed .