JP2010515010A5 - - Google Patents

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Publication number
JP2010515010A5
JP2010515010A5 JP2009525721A JP2009525721A JP2010515010A5 JP 2010515010 A5 JP2010515010 A5 JP 2010515010A5 JP 2009525721 A JP2009525721 A JP 2009525721A JP 2009525721 A JP2009525721 A JP 2009525721A JP 2010515010 A5 JP2010515010 A5 JP 2010515010A5
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JP
Japan
Prior art keywords
base
contact
substrate
carbon nanotube
metal
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JP2009525721A
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Japanese (ja)
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JP2010515010A (en
JP5139432B2 (en
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Publication date
Priority claimed from US11/466,039 external-priority patent/US7731503B2/en
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Publication of JP2010515010A publication Critical patent/JP2010515010A/en
Publication of JP2010515010A5 publication Critical patent/JP2010515010A5/ja
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Publication of JP5139432B2 publication Critical patent/JP5139432B2/en
Expired - Fee Related legal-status Critical Current
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Claims (10)

基板上に取り付けるよう構成され且つ配置される第１の部分を有し、前記基板に電気的に接続する相互接続エレメントと、
前記相互接続エレメントに取り付けられ、半導体デバイス上のパッドに接触するよう構成されるコンタクトエレメントと、を含み、
前記コンタクトエレメントは、前記相互接続エレメントに取り付けられる導電性のベースと、前記ベースの表面に連結され、前記ベースの表面から離れるように延在する複数のカーボンナノチューブと、を含むコンタクト構造。 An interconnect element having a first portion configured and arranged to be mounted on a substrate and electrically connected to the substrate;
Attached to said interconnection element comprises a contact element configured to contact the pads on the semiconductor device,
The contact element includes a conductive base attached to the interconnect element, and a plurality of carbon nanotubes coupled to a surface of the base and extending away from the surface of the base . 前記相互接続エレメントは、ワイヤを含む、請求項１に記載のコンタクト構造。 It said interconnection element comprises a wire, the contact structure of claim 1. 前記相互接続エレメントは、梁を含む、請求項１に記載のコンタクト構造。 It said interconnection element comprises a beam contact structure of claim 1. 前記コンタクトエレメントは、前記ベースの表面に配置され、前記複数のカーボンナノチューブ間に分散された複数の金属構造をさらに含み、
前記金属構造は、前記ベースから離れるように前記ベースの表面から延在する、請求項１に記載のコンタクト構造。 The contact element is arranged on the base surface, still seen including a plurality of metal structures that are distributed between the plurality of carbon nanotubes,
The contact structure of claim 1 , wherein the metal structure extends from a surface of the base away from the base . 前記複数の金属構造は、スパッタ金属である、請求項４に記載のコンタクト構造。 The contact structure according to claim 4 , wherein the plurality of metal structures are sputtered metals. 前記複数のカーボンナノチューブは、カーボンナノチューブフィルムであり、The plurality of carbon nanotubes are carbon nanotube films,
前記カーボンナノチューブフィルムの前記ベース側の表面は、前記ベースの表面に配置され、The base-side surface of the carbon nanotube film is disposed on the surface of the base,
前記カーボンナノチューブフィルムの先端側の表面は、前記ベースの表面から離れて配置され、The front surface of the carbon nanotube film is disposed away from the surface of the base,
金属層は、前記カーボンナノチューブフィルムの先端側の表面に配置される、請求項１に記載のコンタクト構造。The contact structure according to claim 1, wherein the metal layer is disposed on a surface on a tip side of the carbon nanotube film. 前記コンタクトエレメントは、前記カーボンナノチューブフィルム内の穴と、前記カーボンナノチューブフィルム内の前記穴に配置される金属と、をさらに含む請求項６に記載のコンタクト構造。The contact structure according to claim 6, wherein the contact element further includes a hole in the carbon nanotube film and a metal disposed in the hole in the carbon nanotube film. 前記金属は、前記ベースの表面に配置され、前記カーボンナノチューブフィルムの先端側の表面に延在する、請求項７に記載のコンタクト構造。The contact structure according to claim 7, wherein the metal is disposed on a surface of the base and extends to a surface on a front end side of the carbon nanotube film. コンタクトパッドを有する半導体デバイスを試験するプローブカードアセンブリであって、
基板と、
前記基板上に取り付けられ、前記基板から延在する複数の相互接続エレメントと、
各相互接続エレメントと前記基板内の導体との間に形成される電気接続と、
前記基板から離れて配置され、各相互接続エレメントに電気的に接続されるコンタクトエレメントと、を含み、
前記コンタクトエレメントは、前記相互接続エレメントの１つに取り付けられる導電性のベースと、前記ベースの表面に連結され、前記ベースの表面から離れるように延在する複数のカーボンナノチューブと、を含む、プローブカードアセンブリ。 A probe card assembly for testing a semiconductor device having a contact pad, comprising:
A substrate,
Mounted on said substrate, a plurality of interconnected elements that the substrate or al extending,
An electrical connection formed between each interconnect element and a conductor in the substrate;
A contact element disposed away from the substrate and electrically connected to each interconnect element ,
The contact element includes a conductive base attached to one of the interconnect elements, and a plurality of carbon nanotubes coupled to a surface of the base and extending away from the surface of the base Card assembly. 表面を有する導電性のベースと、
前記ベースの表面に取り付けられ、前記ベースの表面から離れるように延在する複数のカーボンナノチューブと、
前記ベースの表面に取り付けられ、前記複数のカーボンナノチューブ間で分散される複数の金属構造と、を含み、
前記金属構造は、前記ベースから離れるように前記ベースの表面から延在する、コンタクト構造。 A conductive base having a surface ;
A plurality of carbon nanotubes attached to the surface of the base and extending away from the surface of the base ;
A plurality of metal structures attached to a surface of the base and dispersed among the plurality of carbon nanotubes ;
The contact structure , wherein the metal structure extends from a surface of the base away from the base .
JP2009525721A 2006-08-21 2007-08-21 Carbon nanotube contact structure Expired - Fee Related JP5139432B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/466,039 2006-08-21
US11/466,039 US7731503B2 (en) 2006-08-21 2006-08-21 Carbon nanotube contact structures
PCT/US2007/076345 WO2008024726A2 (en) 2006-08-21 2007-08-21 Carbon nanotube contact structures

Publications (3)

Publication Number Publication Date
JP2010515010A JP2010515010A (en) 2010-05-06
JP2010515010A5 true JP2010515010A5 (en) 2010-10-07
JP5139432B2 JP5139432B2 (en) 2013-02-06

Family

ID=39107572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009525721A Expired - Fee Related JP5139432B2 (en) 2006-08-21 2007-08-21 Carbon nanotube contact structure

Country Status (8)

Country Link
US (1) US7731503B2 (en)
EP (1) EP2059977A2 (en)
JP (1) JP5139432B2 (en)
KR (1) KR20090050082A (en)
CN (1) CN101652901A (en)
SG (1) SG177999A1 (en)
TW (1) TWI429581B (en)
WO (1) WO2008024726A2 (en)

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