JP2011112517A - Probe card and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card from which a probe substrate can be easily removed when a probe is repaired and to provide a method for manufacturing the same. <P>SOLUTION: The probe card includes the probe substrate 12 having a first surface in which contact probes 11 are formed and a second surface in which a resin layer 40b is formed, an ST substrate 20 opposed to the second surface of the probe substrate 12 with an interval, and three stud bumps 23 or more dotted and sandwiched between the probe substrate 12 and the ST substrate 20. With the stud bumps 23 pressed into contact with the resin layer 40b, the probe substrate 12 and the ST substrate 20 are fixed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a probe card and a manufacturing method thereof, and more particularly to a probe card to which a probe board on which a contact probe is formed and a wiring board are fixed, and a manufacturing method thereof.

  The manufacturing process of a semiconductor device includes an inspection process for inspecting electrical characteristics of an electronic circuit formed on an inspection substrate such as a semiconductor wafer. This electrical property inspection is performed using a tester device that inputs a test signal to an electronic circuit to be inspected and detects the response. Usually, a test signal output from a tester device is transmitted to an electronic circuit on an inspection board via a probe card. The probe card includes a large number of contact probes that contact a minute terminal electrode of an electronic circuit and transmit a test signal, and a wiring board that electrically connects the contact probes and the tester device.

  In general, in a probe card, a large number of contact probes and a large number of external terminals are formed on a common wiring board, and the corresponding contact probes and the external terminals are made conductive through a wiring pattern on the wiring board. The contact probe is a probe for making contact with the terminal electrode of the electronic circuit, and is arranged at the same pitch as the terminal electrode. On the other hand, the external terminals are input / output terminals for connecting the tester device, and are arranged at a wider pitch than the contact probes.

  In recent years, the degree of integration of electronic circuits has been improved by the advancement of microfabrication technology, and the arrangement of terminal electrodes tends to be narrowed. For this reason, for example, the contact probe is disposed on the probe substrate, while the external terminal is disposed on the main substrate larger than the probe substrate. In such a probe card, an ST (space transformer) substrate may be used to increase the wiring pitch between the probe substrate and the main substrate.

  Here, when a probe substrate in which a contact probe is formed only on one main surface is called a probe tile, the ST substrate is a wiring substrate common to a plurality of probe tiles. Each probe tile is fixed to the ST board in a manner that matches the electronic circuit on the inspection board, and the contact probe and the external terminal are made conductive by wire bonding the terminal electrode on the probe tile and the terminal electrode on the ST board. I am letting. Usually, each probe tile is fixed to the ST substrate using an adhesive sheet cut into a shape and size matched to the probe substrate.

  In the conventional probe card as described above, when the defective probe tile is removed and the ST substrate is repaired, the adhesive remains on the ST substrate, which makes it difficult to reuse the ST substrate. Further, since the probe tile is firmly fixed to the ST substrate by the adhesive sheet, there is a problem that it is difficult to remove the probe tile.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a probe card capable of reusing a wiring board to which a probe board is fixed and a method for manufacturing the same. In particular, it is an object of the present invention to provide a probe card and a method of manufacturing the same that can prevent the adhesive from remaining on the wiring board when the probe board is removed after the probe board is easily peeled off from the wiring board. Yes.

  A probe card according to a first aspect of the present invention includes a probe substrate having a contact probe formed on a first surface and a resin layer formed on a second surface, and a wiring substrate facing the second surface of the probe substrate with a space therebetween. And three or more interspersed bumps sandwiched between the probe substrate and the wiring substrate. The probe substrate and the wiring substrate are fixed in a state where the bumps are pressed against the resin layer.

  According to such a configuration, since the wiring substrate is opposed to the second surface of the probe substrate on which the resin layer is formed, the adhesive is placed on the wiring substrate when the probe substrate is removed from the wiring substrate. It can suppress remaining. Further, since the adhesive force is reduced by the gaps between the scattered bumps, the probe substrate can be easily peeled off as compared with the case where the probe substrate is directly bonded to the wiring substrate. Furthermore, since the probe board can be peeled from the wiring board by pushing a predetermined member into the gaps between the scattered bumps, it is possible to improve work efficiency when removing the probe board from the wiring board.

  In addition to the above configuration, the probe card according to the second aspect of the present invention is configured such that a metal film is formed on the wiring board, and the bump is a metal bump bonded to the metal film. According to such a configuration, since the bumps fixed on the wiring board can be easily removed, it is possible to improve work efficiency when the wiring board is reused.

  In the probe card according to the third aspect of the present invention, in addition to the above configuration, a terminal electrode is formed on the wiring board outside the mounting area of the probe board, and the contact probe is bonded by the terminal electrode and a wire. Configured to be

  According to a fourth aspect of the present invention, there is provided a probe card manufacturing method comprising: forming a contact probe on a first surface of a probe substrate; forming an adhesive layer on a second surface of the probe substrate; and wiring three or more bumps. And fixing the probe board to the wiring board in a state where the probe board and the wiring board are brought close to each other and the bumps are pressed against the adhesive layer. The

  According to the probe card and the method of manufacturing the same according to the present invention, the wiring board is opposed to the second surface of the probe board on which the resin layer is formed, so that the adhesive is removed when the probe board is removed from the wiring board. Can be prevented from remaining on the wiring board. Therefore, the wiring board on which the probe board is fixed can be reused. Moreover, since the adhesive force is reduced by the gaps between the scattered bumps, the probe substrate can be easily peeled off.

It is the figure which showed an example of schematic structure of the probe card by embodiment of this invention, and the probe card 100 to which the several probe tile 10 was fixed is shown. It is the top view which showed the structural example in the principal part of the probe card 100 of FIG. 1, and the probe tile 10 on the ST board | substrate 20 is shown. FIG. 2 is an exploded perspective view showing an example of a method for manufacturing the probe card 100 of FIG. 1, in which a process of fixing the probe tile 10 to the ST substrate 20 is shown. It is sectional drawing which showed the structural example in the principal part of the probe card 100 of FIG. 1, and the cut surface by the vertical surface of the ST board | substrate 20 to which the probe tile 10 was fixed is shown. It is the figure which showed an example of the manufacturing method of the probe card 100 of FIG. 1, and the process of adjusting the height variation in a Z direction is shown. It is explanatory drawing which showed typically an example of the manufacturing method of the probe card 100 of FIG. 1, and the mode that the height variation by the curvature of the probe board | substrate 12 is corrected is shown. It is the figure which showed an example of the manufacturing method of the probe card 100 of FIG. 1, and the process of peeling the probe tile 10 from the ST board | substrate 20 using member A3 is shown. FIG. 2 is a diagram illustrating an example of a method for manufacturing the probe card 100 of FIG. 1, in which a process of fixing a stud bump 23 to a metal film 22 is illustrated. It is the figure which showed the structural example in the principal part of the probe card 100 of FIG. 1, and the other example of the bump formed on the ST board | substrate 20 is shown. FIG. 2 is a plan view showing a configuration example of a main part of the probe card 100 of FIG. 1, and shows another arrangement mode of stud bumps 23 formed on the metal film 22.

<Probe card>
1A and 1B are diagrams showing an example of a schematic configuration of a probe card according to an embodiment of the present invention. A probe card 100 in which a plurality of probe tiles 10 are fixed on an ST substrate 20 is shown. It is shown. FIG. 1A shows a state where the probe card 100 is viewed from below, and FIG. 1B shows a state where the probe card 100 is viewed from the horizontal direction.

  The probe card 100 is an inspection device used when inspecting the electrical characteristics of the electronic circuit on the inspection substrate, and includes a plurality of probe tiles 10, the ST substrate 20, and the main substrate 30. The main board 30 is a circular PCB (printed circuit board) that is detachably attached to a probe device (not shown), and is used for inputting / outputting signals to / from a tester device (not shown). The external terminal 31 is provided at the periphery.

  The probe tile 10 is a probe unit including a plurality of contact probes 11 and a probe substrate 12 on which one of the contact probes 11 is formed on one main surface. The probe tile 10 is fixed on the ST substrate 20 with the other main surface of the probe substrate 12 facing the ST substrate 20. Here, with respect to the probe substrate 12, the main surface on the side where the contact probe 11 is formed is referred to as a first surface, and the main surface on the opposite side is referred to as a second surface.

  Each contact probe 11 is a probe that is brought into contact with a minute electrode of the electronic circuit, and is arranged in alignment with the arrangement of the electrode of the electronic circuit. Each probe tile 10 is formed in association with one or more electronic circuits on a common inspection substrate, and is arranged on the ST substrate 20 so as to be separated from each other. In this example, vertically long rectangular probe tiles 10 are arranged in a matrix of 3 rows and 6 columns.

  The ST substrate 20 is a wiring substrate for increasing the wiring pitch between the probe tile 10 and the main substrate 30 or adjusting the height of the contact probe 11 from the main substrate 30. The ST substrate 20 is fixed on the main substrate 30 with the main surface opposite to the side on which the probe tile 10 is fixed facing the main substrate 30. Further, the ST substrate 20 has a horizontally-long rectangular shape whose size is smaller than that of the main substrate 30, and is arranged at the center of the main substrate 30.

  The probe card 100 is held horizontally by the probe device with the surface on which the contact probe 11 is disposed facing downward, and the tester device is connected. In this state, when the inspection board is approached from below and the contact probe 11 is brought into contact with the terminal electrode of the electronic circuit on the inspection board, a test signal is input / output between the tester device and the electronic circuit via the contact probe 11. be able to.

<Probe tile>
FIG. 2 is a plan view showing a configuration example of the main part of the probe card 100 of FIG. 1, in which the probe tile 10 on the ST substrate 20 is shown. The probe tile 10 includes a plurality of contact probes 11 and a probe substrate 12 to which these contact probes 11 are fixed, and is fixed on the ST substrate 20.

  The probe substrate 12 is a thin flat holding member to which the contact probe 11 is fixed, and a semiconductor substrate made of a semiconductor such as silicon or an insulating substrate made of an insulator such as ceramic is used. Formed on the first surface of the probe substrate 12 are a probe electrode 13 for joining the contact probe 11 and a terminal electrode 14 electrically connected to the probe electrode 13 through a wiring pattern. The contact probe 11 is, for example, a cantilever (cantilever) type probe in which a contact portion 11a to be brought into contact with an inspection object is formed at a tip portion.

  In this example, five contact probes 11 are arranged along the long side of the probe substrate 12. Each contact probe 11 is arranged in parallel with each other at a constant interval. Such an array of contact probes 11 is formed on the left and right long sides of the probe substrate 12, respectively.

  The probe electrode 13 and the terminal electrode 14 are formed for each contact probe 11, and the terminal electrode 14 is bonded to the terminal electrode 21 formed on the ST substrate 20 by a connection wire 15. The terminal electrode 21 is formed outside the region facing the probe substrate 12 and is electrically connected to the terminal electrode 14 via the connection wire 15. The terminal electrode 21 is electrically connected to the external terminal 31 of the main board 30 through a wiring pattern (not shown).

<Step of fixing probe tile>
FIG. 3 is an exploded perspective view showing an example of a method for manufacturing the probe card 100 of FIG. 1, and shows a process of fixing the probe tile 10 to the ST substrate 20. Here, the short side direction of the probe substrate 12 is called the X direction, the long side direction is called the Y direction, and the direction perpendicular to the ST substrate 20 is called the Z direction.

  On the first surface of the probe substrate 12, a cantilever type contact probe 11 is arranged. In the contact probe 11, a contact portion 11a is formed at one end of the beam portion 11b, and a base portion 11c is formed at the other end of the beam portion 11b. Each contact probe 11 is fixed to the probe substrate 12 by soldering the base portion 11 c to the probe electrode 13.

  As a method of forming the contact probe 11 on the probe substrate 12, a conductive layer is laminated on the probe substrate 12 in addition to the above-described method of bonding the contact probe 11 prepared in advance to the probe electrode 13 on the probe substrate 12. Thus, a method of forming the contact probe 11 is also conceivable.

  An adhesive layer is formed on the second surface of the probe substrate 12 by attaching the adhesive sheet 40. The adhesive sheet 40 is a film-like adhesive for fixing the probe substrate 12 to the ST substrate 20, for example, a high Tg material such as polyimide resin or polyamideimide resin, or a low linear expansion coefficient or cure shrinkage rate. A thermoplastic adhesive mainly composed of an insulating resin is used.

  In this example, the adhesive sheet 40 cut into the same shape and size as the probe substrate 12 is attached to the probe substrate 12, and an adhesive layer is formed on the entire second surface of the probe substrate 12. As a method of forming an adhesive layer on the probe substrate 12, in addition to the above method of attaching the adhesive sheet 40 cut into a desired shape and size to the probe substrate 12, a liquid adhesive may be used as the probe substrate 12 or ST. A method of applying and solidifying either of the substrates 20 is also conceivable.

  A terminal electrode 21, a metal film 22, and a stud bump 23 are formed on the ST substrate 20. The metal film 22 is a base film for forming a plurality of stud bumps 23, and is formed, for example, by depositing a metal such as gold or aluminum on the ST substrate 20 by sputtering.

  For example, the metal film 22 is formed in an attachment region 24 having the same shape and size as the probe substrate 12. In this example, the metal film 22 is formed for each probe tile 10, but the metal film 22 is formed across a plurality of probe tiles 10, or a plurality of metal films 22 are formed on one probe tile 10. It may be formed.

  The stud bump 23 is a metal bump made of a metal such as gold or aluminum, and is used as a support member for supporting the probe substrate 12. The stud bump 23 is a small piece whose one end on the probe substrate 12 side is thinner than the other end on the ST substrate 20 side, and the size of the stud bump 23 is, for example, a stud arranged in a scattered manner on the ST substrate 20. It is sufficiently smaller than the distance between the bumps 23. Specifically, the contact portion 23 a is configured to be pressed against the adhesive layer on the probe substrate 12, and the fixing portion 23 b that supports the contact portion 23 a and is fixed to the metal film 22.

  The cross-sectional shape perpendicular to the XY plane of the stud bump 23 is a T-shape in which the contact portion 23a protrudes in the Z direction from the center portion of the fixed portion 23b. The cross-sectional shape parallel to the XY plane is a circular shape having different outer diameters between the contact portion 23a and the fixing portion 23b.

  Three or more stud bumps 23 are disposed on the metal film 22. In this example, nine stud bumps 23 are arranged in a matrix of 3 rows and 3 columns. That is, for each side of the rectangular attachment region 24 on the ST substrate 20, the stud bumps 23 are formed at the end of the side and the central portion of the side and the central portion of the attachment region 24, respectively. The stud bumps 23 are fixed so as to be separated from each other.

  The probe tile 10 is fixed to the ST substrate 20 after the stud bumps 23 are formed. That is, the probe substrate 12 and the ST substrate 20 are brought close to each other while the probe substrate 12 on which the adhesive layer is formed by attaching the adhesive sheet 40 is opposed to the ST substrate 20, and the stud bump is applied to the adhesive layer on the probe substrate 12. By pressing 23, the probe tile 10 is fixed to the ST substrate 20.

  FIG. 4 is a cross-sectional view showing a configuration example of a main part of the probe card 100 of FIG. 1, and shows a cut surface by a vertical surface of the ST substrate 20 to which the probe tile 10 is fixed. The probe tile 10 is fixed to the ST substrate 20 by pressing the stud bump 23 formed on the metal film 22 against the adhesive layer 40 a formed on the probe substrate 12. The adhesive layer 40a is cured to become the resin layer 40b.

  By pressing the first surface of the probe substrate 12 evenly and bringing the probe substrate 12 closer to the ST substrate 20 from the Z direction while maintaining a state substantially parallel to the ST substrate 20, the contact portion 23a of the stud bump 23 is obtained. Pierces the adhesive layer 40 a and bites into contact with the second surface of the probe substrate 12.

  When the probe substrate 12 is fixed to the ST substrate 20 close to the ST substrate 20, the contact portion 23 a is deformed with respect to a part of the stud bumps 23 by applying a pressing force. By deforming the front end portion of the stud bump 23, it is possible to absorb warpage, distortion, and non-uniform thickness of the probe substrate 12.

  In the stud bump 23 of the present embodiment, the contact portion 23a on the probe substrate 12 side is made of a structure having a smaller cross section than the fixed portion 23b on the ST substrate 20 side, and therefore the contact portion 23a is compared to the fixed portion 23b. It is easy to deform. In addition, the deformed and pressed contact portion 23 a enhances the adhesive force between the probe substrate 12 and the stud bump 23. Therefore, the probe substrate 12 is bonded to the contact portion 23a of the stud bump 23 with an adhesive, and the ST substrate 20 is bonded to the fixing portion 23b of the stud bump 23 via the metal film 22. The probe substrate 12 and the ST substrate 20 are not peeled off during normal use.

  Further, the ST substrate 20 faces the second surface of the probe substrate 12 on which the resin layer 40b is formed with a space therebetween, and the probe tile 10 is in a state where the gap 50 is formed between the stud bumps 23 that are scattered. It is fixed to the ST substrate 20. Each stud bump 23 is sandwiched between the probe substrate 12 and the ST substrate 20.

  Since the holding force is reduced by the gap 50 between the stud bumps 23, the probe substrate 12 can be easily peeled from the ST substrate 20 as compared with the case where the probe substrate 12 is directly bonded to the ST substrate 20. In particular, by adjusting the number and size of the stud bumps 23, the contact area with the adhesive layer 40a can be changed, so that the holding force between the probe substrate 12 and the ST substrate 20 can be easily adjusted. Therefore, even if the size of the probe tile 10 is changed, the holding force can be made constant and can be easily peeled off.

  Further, the stud bump 23 is not completely crushed when the probe substrate 12 is fixed, and a gap 50 is formed between the adhesive layer 40 a and the metal film 22. By pushing a predetermined member into 50, the probe substrate 12 can be easily peeled off from the ST substrate 20.

  Here, the width of the stud bump 23, that is, the outer diameter of the fixing portion 23b is sufficiently smaller than the distance between the stud bumps 23 scattered, and the stud bump 23 and the adhesive layer 40a are close to a point contact. Contact with. When one point cannot be supported by one stud bump 23, a plurality of stud bumps 23 may be arranged in groups at one point.

<Process for adjusting height variation in Z direction>
FIG. 5 is a diagram illustrating an example of a method for manufacturing the probe card 100 of FIG. 1, and a process of adjusting the height variation in the Z direction using a variation adjusting member (such as a surface plate) A2 having a flat pressing surface. It is shown. When fixing the plurality of probe tiles 10 to the common ST substrate 20, the variation adjusting member A <b> 2 having a flat pressing surface is pressed against each probe tile 10.

  The ST substrate 20 is placed on a horizontal work table A1, and a plurality of contact members 16 for adjusting Z variation are formed in advance on the probe substrate 12 of each probe tile 10. Each contact member 16 is formed of a columnar body having the same height, and is disposed on the first surface of the probe substrate 12.

  The contact adjustment member A2 is pressed evenly, and the pressing surface is held horizontally while approaching the ST substrate 20 and the contact member 16 is brought into contact with the pressing surface. Variations in height in the Z direction can be corrected. The contact member 16 is removed after the probe tile 10 is fixed to the ST substrate 20.

  FIGS. 6A and 6B are explanatory views schematically showing an example of a method for manufacturing the probe card 100 of FIG. 1. The probe tile 10 in which the height variation is caused by the warp of the probe substrate 12 is shown. A state before being pressed against the ST substrate 20 and a state after being pressed are shown.

  FIG. 6A shows a state before the probe tile 10 is pressed against the ST substrate 20. When the probe substrate 12 is warped, distorted, or uneven in thickness, the contact probe 11 on the probe substrate 12 has a height variation in the Z direction.

  In this example, the lower surface of the left end portion of the probe substrate 12 warps downward due to the uneven thickness of the probe substrate 12. If such a probe tile 10 is bonded to the ST substrate 20 as it is, the height of the contact probe 11 in the probe tile 10 varies in the Z direction.

  In FIG. 6B, when the probe tile 10 is pressed against the ST substrate 20, a part of the stud bumps 23 is deformed so that the height variation due to the warp of the probe substrate 12 is corrected. It is shown. In this example, the tip end portion of the stud bump 23 facing the lower surface of the left end portion of the probe substrate 12 is deformed more than the others. That is, the uneven thickness of the probe substrate 12 is absorbed by the deformation amount of the stud bump 23.

  As a method of absorbing the height variation caused by the warp of the probe substrate 12 by the deformation of the stud bump 23, in addition to the method described above, the probe substrate 12 is attached to the ST substrate 20 so as to eliminate the height variation due to the warp. You may fix in the state inclined with respect to.

  When the probe substrate 12 is pressed against the ST substrate 20, the tip portions of some of the stud bumps 23 are deformed in this manner, so that the height of the contact probe 11 from the ST substrate 20 due to warpage of the probe substrate 12 is increased. This variation has been eliminated.

  The stud bump 23 may be elastically deformed reversibly when the probe substrate 12 is pressed. However, in order to control the height variation in the Z direction with high accuracy, the stud bump 23 is crushed by irreversible deformation. Things are desirable.

<Repair ST board>
FIGS. 7A and 7B are diagrams showing an example of a method for manufacturing the probe card 100 of FIG. 1, and a process of peeling the probe tile 10 from the ST substrate 20 using the member A3 is shown. . FIG. 7A shows a state in which the claw portion A4 of the member A3 is pushed into the gap 50 between the stud bumps 23 from the horizontal direction. FIG. 7B shows the probe tile 10 in which a part of the probe substrate 12 is peeled off from the ST substrate 20 when the claw portion A4 is pushed between the resin layer 40b and the metal film 22.

  Since the stud bump 23 and the adhesive layer 40a are bonded in a state close to point contact, the probe substrate 12 of the probe tile 10 can be easily peeled from the ST substrate 20. For example, the probe substrate 12 can be easily separated from the ST substrate 20 by using the member A3 provided with the wedge-shaped claw portion A4 having an inclined surface. That is, if the claw portion A4 of the member A3 is pushed into the gap 50 between the stud bumps 23 from the horizontal direction, the probe substrate 12 is guided upward by the inclined surface of the claw portion A4. Can be made. Therefore, since it can peel easily using such member A3, the working efficiency at the time of removing the probe board | substrate 12 from the ST board | substrate 20 can be improved.

  When removing the probe tile 10 and repairing the ST substrate 20, the probe bump 10 is peeled from the ST substrate 20, and then the stud bump 23 is removed from the metal film 22 to which the probe tile is fixed. Then, in order to attach a new probe tile 10, the stud bump 23 is formed again on the metal film 22.

  The new stud bump 23 does not need to be formed at the same position as the old stud bump before the probe tile 10 is peeled off, and may be disposed in the gap between the old stud bumps. When the new stud bump 23 is formed in the gap between the old stud bumps, the old stud bump need only be removed until the height in the Z direction is reduced to about half, without being completely removed.

<Stud bump>
8A to 8C are diagrams showing an example of a method for manufacturing the probe card 100 of FIG. 1, and a process of fixing the stud bump 23 to the metal film 22 is shown. FIG. 8A shows a step of forming the ball-shaped body by melting the tip of the metal wire, and FIG. 8B shows a step of fixing the ball-shaped body to the metal film 22. ing. FIG. 8C shows a step of cutting the metal wire fixed to the metal film.

  The stud bump 23 is formed in the attachment region 24 of the probe tile 10 (probe substrate 12) on the ST substrate 20 by using a bonding apparatus. In the attachment region 24, a metal film 22 made of a metal such as gold or aluminum is formed in advance. The stud bump 23 is formed on the metal film 22.

  First, a metal wire made of a metal such as gold or aluminum is heated and its tip is melted to form a minute ball-like body on the metal wire. For example, the tip portion of the metal wire is melted by using tip discharge generated by applying a voltage to the metal wire.

  Next, the ball-shaped body of metal wire is heated using ultrasonic vibration or the like, and the ball-shaped body is bonded and fixed to the metal film 22. Then, when the metal wire fixed to the metal film 22 is cut, the stud bump 23 constituted by the fixed portion 23b made of a ball-shaped body and the contact portion 23a made of a part of the metal wire is formed on the ST substrate 20. The step of fixing the stud bump 23 to the metal film 22 is completed. However, after cutting the metal wire, leveling using a capillary is performed as necessary in order to align the heights of the fixing portions 23b in the Z direction.

  Each stud bump 23 formed on the metal film 22 has an outer diameter B1 of the fixing portion 23b of about 20 to 100 μm, and a height B2 of the contact portion 23a in the Z direction of about 50 μm to 100 μm. When the 10 is fixed to the ST substrate 20, the pressing force is evenly applied. In the case of the stud bump 23 of FIG. 3, each stud bump 23 is arranged symmetrically with respect to a straight line parallel to the X direction and a straight line parallel to the Y direction through the center of the attachment region.

  According to the present embodiment, the stud bump 23 fixed on the ST substrate 20 is pressed against the adhesive layer 40a, and the probe substrate 12 is fixed to the ST substrate 20 with the gap 50 formed between the stud bumps 23. Therefore, it is possible to suppress the adhesive from remaining on the ST substrate 20 when the probe substrate 12 is detached from the ST substrate 20. Further, since the holding force is reduced by the gap 50 between the stud bumps 23, the probe substrate 12 can be easily peeled compared to the case where the probe substrate 12 is directly bonded to the ST substrate 20.

  Moreover, since the stud bumps 23 fixed on the ST substrate 20 can be easily removed, the working efficiency when the ST substrate 20 is reused can be improved. Further, when the probe substrate 12 is fixed to the ST substrate 20 by bringing the stud bump 23 into contact with the adhesive layer 40a, one end of the stud bump 23 is deformed, so that the probe substrate 12 is not warped, distorted, or thin. Uniformity can be absorbed. Therefore, even when the probe substrate 12 is warped, distorted, or uneven in thickness, it is possible to suppress variations in the height of the contact probe 11 from the ST substrate 20.

  In the present embodiment, the example in which the stud bump 23 including the contact portion 23a and the fixing portion 23b having different outer diameters is formed on the metal film 22 has been described. However, the present invention is not limited thereto. is not. For example, as long as one end on the probe substrate 12 side is thinner than the other end on the ST substrate 20 side, another shape may be used.

  FIGS. 9A to 9C are plan views showing a configuration example of the main part of the probe card 100 of FIG. 1, and other examples of bumps formed on the ST substrate 20 are shown. FIG. 9A shows a metal bump including a contact portion having a tapered surface with a constant inclination angle. This metal bump has a columnar fixed portion extending in the Z direction with an equal width, and a conical contact portion having a tapered surface whose outer diameter decreases at a constant rate as the height in the Z direction increases. And is composed of.

  FIG. 9B shows a metal bump made of a cone having a tapered surface with a larger inclination angle toward the tip. This metal bump is constituted by a cone having a tapered surface whose outer diameter decreases as the height in the Z direction increases.

  FIG. 9C shows a resin bump including a contact portion having a tapered surface with a constant inclination angle. This resin bump has a columnar fixed portion extending in the Z direction with a uniform width, and a conical contact portion having a tapered surface whose outer diameter decreases at a constant rate as the height in the Z direction increases. And is composed of.

  Such a resin bump is formed by applying a thermoplastic resin onto the ST substrate 20 using a dispenser and solidifying it. Metal bumps are formed on the metal film 22, whereas resin bumps are directly fixed on the ST substrate 20.

  In the present embodiment, an example in which the stud bumps 23 are arranged in a matrix of 3 rows and 3 columns has been described. However, the present invention is not limited to this, and the probe tile 10 is attached to the ST substrate 20. Other arrangement modes may be used as long as the arrangement is such that the pressing force is equally applied when fixing.

  FIGS. 10A to 10C are plan views showing a configuration example of the main part of the probe card 100 of FIG. 1, and other arrangements of the stud bumps 23 formed on the metal film 22 of the ST substrate 20. Embodiments are shown. FIG. 10A shows five stud bumps 23 formed in the vicinity of the four vertices of the rectangular metal film 22 and the central portion of the rectangular area.

  FIG. 10B shows six stud bumps 23 respectively formed at the end and center of the long side for the two long sides of the rectangular region. FIG. 10C shows six stud bumps 23 formed along the long sides of the two long sides of the rectangular region. The bump to be brought into contact with the adhesive layer 40a may be the stud bump 23 having such an arrangement.

DESCRIPTION OF SYMBOLS 10 Probe tile 11 Contact probe 11a Contact part 11b Beam part 11c Base part 12 Probe board 13 Probe electrode 14 Terminal electrode 15 Connection wire 16 Contact member 20 for Z variation adjustment ST board 21 Terminal electrode 22 Metal film 23 Stud bump 23a Contact portion 23b Fixing portion 24 Attachment region 30 Probe substrate 31 External terminal 40 Adhesive sheet 40a Adhesive layer 40b Resin layer 50 Air gap 100 Probe card

Claims (4)

A probe substrate having a contact probe formed on the first surface and a resin layer formed on the second surface;
A wiring board facing the second surface of the probe board with a space therebetween;
Comprising three or more interspersed bumps sandwiched between the probe board and the wiring board,
The probe card, wherein the probe board and the wiring board are fixed in a state where the bump is pressed against the resin layer. A metal film is formed on the wiring board,
The probe card according to claim 1, wherein the bump is a metal bump bonded to the metal film. The wiring board has a terminal electrode formed outside the mounting area of the probe board,
The probe card according to claim 1, wherein the contact probe is bonded to the terminal electrode by a wire. Forming a contact probe on the first surface of the probe substrate;
Forming an adhesive layer on the second surface of the probe substrate;
Fixing three or more bumps on the wiring board;
And a step of fixing the probe board to the wiring board in a state in which the probe board and the wiring board are brought close to each other and the bumps are pressed against the adhesive layer. .

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