KR101591501B1

KR101591501B1 - Contact ratio improved contact pin

Info

Publication number: KR101591501B1
Application number: KR1020140130435A
Authority: KR
Inventors: 전진국; 박성규
Original assignee: 주식회사 오킨스전자
Priority date: 2014-09-29
Filing date: 2014-09-29
Publication date: 2016-02-04

Abstract

The present invention relates to a contact pin having an improved contact ratio. More specifically, the contact pin comprises a contact pin body and a connection block. The contact pin body is arranged with a fine pitch. The connection block is configured to be integrated with one end of the contact pin body in order to touch and be coupled to a printed circuit board (PCB) pad for testing. In addition, a size of the connection block is wider than the width of the connect pin body to increase a range of a connection area with the pad. According to the present invention, as a size of the connection area is increased between the contact pin and the pad, the contact pin can guarantee smooth electrical connection, improve test accuracy through solid connection, and enhance reliability by enhancing durability.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a contact ratio improved contact pin,

More particularly, the present invention relates to a contact pin, and more particularly, it relates to a contact pin which improves the bonding area of a pad and a contact pin of a test PCB, And a contact ratio of the contact pin is improved.

In general, many semiconductor integrated circuits fabricated on a semiconductor wafer are first subjected to an electrical test whether or not they are manufactured according to specifications before they are separated into individual chips.

In this electrical test, a probe assembly such as a probe guard having a plurality of probes connected to the electrodes of an object to be inspected, which is a semiconductor integrated circuit, that is, an electrical connecting device is used, and the test subject is connected to the tester through an electrical connecting device.

A plurality of probes (hereinafter, referred to as contact pins) are provided on a substrate to test a test subject, as disclosed in Japanese Patent No. 10-1153288.

Here, the plurality of contact pins are joined to the substrate by welding, and the end portions of the contact pins to be bonded to the substrate are formed to have equal widths and are welded.

However, as the edges of the contact pins are rounded, it is difficult to keep very small contact pins in a straight state during welding, and even when welding, the area of contact with the substrate is small and the defect occurrence rate is increased, .

In order to solve this problem, DIP type contactor is used.

The DIP method, which is a method of inserting a pin through a via hole and connecting it by soldering, is excellent in electrical characteristics and rigidity. However, a via hole process for connecting a pin to a PCB at a fine pitch contactor has reached the limit, There is a desperate need for an alternate technique for such hole machining.

On the other hand, the contact has a clear difference in the technique according to the pitch of the contact pin. It is a matter of course that a contact having a fine pitch has a low bonding force at a bonding portion with the substrate, .

Accordingly, it is an object of the present invention to provide a technique for increasing a welding precision and a life span by increasing the welding area, firmly bonding the contact pin to the substrate, and maintaining a stable electrical connection state between the contact pin and the substrate at a fine pitch. Development is urgently required.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a contact pin body, By providing a junction block to improve the junction area, it is possible to increase the junction area of the contact pin and the pad, thereby making it possible to connect not only the electrical connection but also the connection firmly, thereby improving the test accuracy, The present invention provides a contact pin having a contact ratio that can be increased.

According to an aspect of the present invention, there is provided a contact pin comprising: a contact pin body arranged at a fine pitch; and a contact pin body integrally formed on an end of the contact pin body so as to contact and bond to the pad of the test PCB, And a bonding block for improving the bonding area with the pad.

Preferably, the junction block has an upper surface connected to an end of the contact pin body, and an end of the contact pin body integrally formed at a center portion of the upper surface so that both side ends thereof are located outside the corresponding side surface of the contact pin body. Respectively.

The contact block has an upper surface connected to an end of the contact pin body and an end of the contact pin body integrally formed at one side of the upper surface so that the other side is located outside the corresponding side of the contact pin body, Respectively.

Further, the bottom surface of the joint block is further formed with a joint groove formed with the center portion being most recessed.

The joining recesses are formed to be inclined downward from the central portion toward both end portions.

In addition, the joining recesses are formed with a constant arc from the central portion toward both end portions.

The upper surface is formed in the same shape as the lower surface formed by the joining grooves and formed at regular intervals.

As described above, according to the contact pin of the present invention having improved contact ratio, it is possible to increase the junction area of the contact pin and the pad, thereby making it possible to securely connect not only the electrical connection but also the test precision, So that the reliability can be improved.

1 is a view showing a contact pin with improved contact ratio according to the present invention,
2 is a view showing another embodiment of a contact pin with improved contact ratio according to the present invention,
FIG. 3 is a view showing a state in which a junction groove is further formed in the contact pin with improved contact ratio according to the present invention,
4 is a view showing another embodiment of the joint groove according to the present invention,
5 is a view showing still another embodiment of a joint block according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

It should be noted that the present invention is not limited to the scope of the present invention but is only illustrative and various modifications are possible within the scope of the present invention.

2 is a view showing another embodiment of a contact pin with improved contact ratio according to the present invention, and Fig. 3 is a cross-sectional view of a contact pin according to the present invention, 4 is a view showing another embodiment of the joint groove according to the present invention, and FIG. 5 is a sectional view showing another embodiment of the joint block according to the present invention. Fig.

As shown in the figure, the contact pins 10 having an improved contact ratio include a contact pin body 100 and a joint block 200.

The contact block body 100 is arranged to be in contact with the semiconductor device for testing and arranged at a fine pitch and the bonding block 200 is mounted on the pad 30 of the test PCB 20 To contact and bond.

The joint block 200 is integrally formed at the end of the contact pin body 100 and is formed to have a width larger than the width of the contact pin body 100 to improve the contact area with the pad 30.

Here, the improvement of the bonding area with the pad 30 means that the bonding area is increased as the bonding block 200 and the pad 30 are bonded by the weld.

Thus, not only the electrical connection but also the bonding can be firmly performed, thereby improving the test accuracy, lifetime, and reliability.

The junction block 200 is connected to an end of the contact pin body 100 and the end of the contact pin body 100 is integrally formed at a central portion of the upper surface 202 so that both side surfaces 206, Both end portions are protruded so as to be located on the outer side of the corresponding side of the main body 100.

As shown in FIG. 2, the joint block 200 'of another embodiment has an upper surface 202' connected to the end of the contact pin body 100, and an end of the contact pin body 100 is connected to the upper surface 202 ' And the other end is protruded so that the other side surface 208 is positioned outside the corresponding side of the contact pin body 100. [

The contact pin body 100 may be integrally formed at the other end of the upper surface 202 so that one end of the contact pin body 100 protrudes outwardly from the corresponding side of the contact pin body 100 .

3, the bottom surfaces 204 and 204 'of the joint blocks 200 and 200' are further formed with a joint groove 300 having the center portion of the joint recesses 300 most concaved. As shown in FIG.

3 shows a state in which the bonding groove 300 is formed in the bonding block 200 of the embodiment and the welding area of the bonding groove 300 can be increased so that the pad 30 of the PCB for testing 20, Can be increased.

In one embodiment of such a joining groove 300, the joining groove 300 is formed so as to be inclined downward from the central portion toward the both end portions.

In another embodiment, as shown in FIG. 4, the joint groove 300 'may be formed with a constant arc from the central portion toward both end portions.

As shown in FIG. 5, both side ends of the joint blocks 200 and 200 'of the respective embodiments may be formed to have a downward slope or a downward slope toward the both sides from the center.

This also increases the bonding area between the contact pins 10 and the pads 30 by the welded portion 40, thereby providing stable electrical connection and a strong bonding force.

The top surfaces of the bonding blocks 200 and 200 'of these embodiments are preferably formed in the same shape as the bottom surface formed by the bonding grooves 300 and 300' and formed at equal intervals.

10: contact pin 20: PCB
30: pad 40: welded portion
100: contact pin body 200, 200 ': joint block
300, 300 ': joint groove

Claims

A contact pin body arranged at a fine pitch; And
And a junction block formed integrally with an end of the contact pin body so as to be in contact with and bonded to a pad of the test PCB and having a width larger than a width of the contact pin body to improve a bonding area with the pad,
In the bonding block,
Wherein the contact pin body is integrally formed at an upper end of the contact pin body so that the contact pin body is protruded from both ends of the contact pin body,
And a lower surface of the joint block,
Wherein a contact groove is formed in the central portion of the contact pin.

A contact pin body arranged at a fine pitch; And
And a junction block formed integrally with an end of the contact pin body so as to be in contact with and bonded to a pad of the test PCB and having a width larger than a width of the contact pin body to improve a bonding area with the pad,
In the bonding block,
And the other end of the contact pin body is protruded so that the other end of the contact pin body is located on the outer side of the corresponding side of the contact pin body,
And a lower surface of the joint block,
Wherein a contact groove is formed in the central portion of the contact pin.

3. The semiconductor device according to claim 1 or 2,
And the contact pins are formed to be inclined downward from the central portion toward both end portions.

delete

The apparatus of claim 3,
Wherein the contact pins are formed in the same shape as the lower surface formed by the bonding grooves and are formed at regular intervals.

3. The semiconductor device according to claim 1 or 2,
Wherein the contact pins are formed with a predetermined distance from the central portion to both side ends thereof.

7. The method of claim 6,
Wherein the contact pins are formed in the same shape as the lower surface formed by the bonding grooves and are formed at regular intervals.