JP2010043957A - Probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card which can smoothly move a contact unit vertically with respect to a main substrate and suppress the horizontal movement of the contact unit. <P>SOLUTION: The probe card includes the main substrate 2, the contact unit 3 formed with a contact probe 31, and two or more leaf springs 4 which support the contact unit 3 in a vertically movable manner under the main substrate 2. One end of the leaf spring 4 is fixed to the lower surface of the main substrate 2, while the other end thereof is fixed to the periphery of the contact unit 3, thereby supporting the contact unit 3. Using that the leaf spring 4 is difficult to displace in the width direction, the horizontal movement of the contact unit 3 is suppressed, allowing it to move only in the vertical direction. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a probe card, and more particularly to an improvement of a probe card used when inspecting electrical characteristics of an inspection object such as a device formed on a semiconductor wafer.

  The probe card is an electrical connection means for taking out an electrical signal of the electrode pad by bringing a contact probe (contact probe) into contact with the electrode pad of the semiconductor integrated circuit. A probe card generally uses a multilayer wiring board, and a plurality of contact probes are arranged on one surface of the multilayer wiring board in accordance with the number and pitch of electrode pads. An electrical signal input from the contact probe is guided through the wiring of the multilayer wiring board to external terminals arranged at predetermined intervals on the multilayer wiring board.

  When using this probe card to inspect the electrical characteristics of a device on a semiconductor wafer, the probe card is attached to the probe device, and the electrical signal of the external terminal of the probe card can be taken out of the probe device. Make a good connection. An electric signal can be taken out by pressing the contact probe against the electrode pad.

  In order to achieve good conduction between the contact probe and the electrode pad, not only the contact probe is brought into contact with the electrode pad, but also the contact probe is applied to the electrode pad by applying a predetermined needle pressure that presses the electrode pad to the contact probe. It is necessary to keep it pressed. In particular, when there are slight differences in height between the plurality of electrode pads, an operation (overdrive) is performed in which the contact probes are pressed against the electrode pads until all the contact probes contact the electrode pads.

  The present applicant has proposed a probe card disclosed in Patent Document 1 in order to perform the overdrive. The probe card disclosed in Patent Document 1 includes a main board, a contact unit including a contact board on which a contact probe is formed, and a stopper that supports the contact unit so as to be movable up and down with respect to the main board. . The probe card is configured to suspend the contact unit from the main board by receiving the contact unit with a stopper. Furthermore, the contact unit is attached with a load member so that a predetermined load is applied to the contact probe during overdrive.

  According to such a configuration, when the contact probe is lowered toward the inspection object together with the main board, the contact unit is separated from the stopper when the main board is further lowered after the contact probe is brought into contact with the inspection object. Each contact probe is substantially overweighted only with the weight of the contact unit.

  By the way, semiconductor devices have been highly integrated due to a significant improvement in microfabrication accuracy due to advances in photolithography technology and the like. As a result, the number of electrode pads with respect to the chip area of a semiconductor device has increased dramatically. Recently, more than 1,000 electrode pads have been arranged on a semiconductor chip of several millimeters square at a narrow pitch. . In order to perform an electrical characteristic test on such a semiconductor chip, a probe card in which contact probes are arranged at the same pitch as the electrode pads is required.

  Therefore, as the electrode pads of the inspection object are narrowed, the contact probes are also formed with a narrow pitch and smaller. Therefore, the maximum overdrive amount that can be applied to the contact probe during overdrive is also decreasing.

  However, when a load (needle pressure) is applied to the contact probe in contact with the object to be inspected due to the weight of the contact unit, the allowable maximum needle pressure is reached with a slight overdrive amount. As described above, when the allowable maximum needle pressure is reached with a small overdrive amount, it becomes very difficult to control the needle pressure of a small contact probe corresponding to the narrow pitch by the overdrive amount.

  Therefore, as shown in FIG. 6, the applicant of the present application supports the contact unit C including the contact probe B so as to be movable up and down by a stopper E fixed to the main substrate D, and the upper surface of the contact unit C and the main substrate. A probe card A having a structure in which a plurality of coil springs F are arranged between the lower surface of D is proposed.

  Further, the probe card A is provided with a plate-like spring receiver G for receiving the end of the coil spring F on the main board D side, and a spring adjusting screw H is brought into contact with the back surface (upper surface) of the spring receiver G. I am doing so. The spring adjusting screw H is screwed into a screw hole K formed through a reinforcing plate J fixed to the upper surface of the main board D. Since the contact unit C is received by the stopper E, the urging force of the coil spring F with respect to the contact unit C is adjusted by adjusting the pushing amount of the spring adjusting screw H with respect to the spring receiver G. Thus, by adjusting the urging force of the coil spring F, the load (needle pressure) applied to the contact probe B during overdrive can be adjusted.

  In the probe card A having such a configuration, the contact probe can be obtained by both the weight of the contact unit C and the elastic force of the coil spring F and the elastic force of the contact probe B without attaching a load member to the contact unit C. Needle pressure can be applied to B. By configuring the probe card A in such a configuration, the weight of the contact unit C is set so that the necessary minimum needle pressure is not reached only by the weight of the contact unit C, and the elastic force of the coil spring F and the contact probe B It is possible to set so as to reach the maximum allowable needle pressure with a predetermined overdrive amount by both elastic forces.

  As a result, by controlling the needle pressure of the contact probe B with the elastic force of the coil spring F and the elastic force of the contact probe B, it is possible to increase the amount of overdrive until the maximum allowable needle pressure is reached. Even with a contact probe, it is easy to control the needle pressure during overdrive by the amount of overdrive.

JP 2007-51906 A

  By the way, in the probe card A shown in FIG. 6, the stopper E is provided in a ring plate-like support member E1 that contacts the lower surface of the plate-like guide member M constituting the contact unit C, and in a through hole provided in the support member E1. The fixing screw E2 is inserted through and has a flange portion at one end, and a spacer E3 fitted to the fixing screw E2. A guide hole in which the fixing screw E2 is inserted into the through hole from the lower surface side of the support member E1, the spacer E3 is fitted to the fixing screw E2 protruding from the support member E1, and the fixing screw E2 is formed in the guide member M together with the spacer E3. Insert through M1. Then, by fixing the fixing screw E2 to the main board D in this state, the support member E1 is fixed in a state where a predetermined interval is maintained by the spacer E3, and the guide member M of the contact unit C is further supported by the support member E1. It will be in the state received by E1.

  Thus, the contact unit C is configured to move up and down along the fixing screw E2 of the stopper E. In order to smoothly move the contact unit C up and down, the inner diameter of the guide hole M1 of the guide member M is made larger than the outer diameter of the spacer E3, and a predetermined clearance is provided between the spacer E3 and the guide hole M1. Provided.

  However, since there is a clearance between the spacer E3 and the guide hole M1, when the contact unit C moves up and down, the contact unit C may move in the horizontal direction within the clearance.

  The present invention has been made in view of the above circumstances, and a probe card having a support member that elastically supports a contact unit so as to be movable up and down with respect to a main substrate and can suppress horizontal movement of the contact unit. The purpose is to provide.

  A probe card according to a first aspect of the present invention includes a main board, a contact unit in which a plurality of contact probes are formed, and two or more leaf springs that support the contact unit in a vertically movable manner below the main board. The leaf spring is configured such that one end of the leaf spring is fixed to the lower surface side of the main board and the other end is fixed to the peripheral portion of the contact unit to support the contact unit.

  According to the probe card of the present invention, at the time of non-inspection, the leaf spring can support the contact unit below the main board with a predetermined space between the lower surface of the main board, At the time of inspection, the leaf spring is elastically deformed so as to bend in a direction perpendicular to the plate surface, so that the contact unit can be smoothly moved only in the vertical direction, and the movement in the horizontal direction can be suppressed. Electrical characteristic inspection can be performed.

  Specifically, at the time of non-inspection, the contact unit is supported below the main board via the leaf spring with a predetermined distance from the lower surface of the main board. During overdrive during inspection, the contact probe comes into pressure contact with the object to be inspected, and the contact unit tends to move toward the main board. At this time, a free surface not fixed to the contact unit and the main board in the leaf spring is curved in a direction perpendicular to the plate surface, and the contact unit can smoothly move upward. it can.

  Further, since the flat portions of both ends of the plate spring are fixed to the main board and the contact unit, the plate spring has a length direction of the plate spring from the one end to the other end. It is difficult to deform in the width direction orthogonal to the length direction. Therefore, during overdrive, the free surface of the leaf spring is not easily deformed in the width direction of the leaf spring in the horizontal direction, so that the contact unit is supported on the main board by the leaf spring. Therefore, the movement in the vertical direction is performed smoothly, and the movement in the horizontal direction is suppressed. Therefore, the contact probe is unlikely to be detached from the inspection target area of the inspection target.

  In the probe card according to the second aspect of the present invention, in addition to the above-described configuration, the leaf spring is constituted by a pair of leaf springs arranged to face each other with the contact unit interposed therebetween. By arranging the pair of leaf springs to face each other in this way, the contact unit can be supported in parallel with the lower surface of the main board, and the vertical movement of the contact unit during overdrive can be achieved. It can be performed smoothly, and at least the movement of the leaf spring in the width direction can be suppressed.

  In the probe card according to the third aspect of the present invention, in addition to the above-described configuration, the leaf spring is constituted by three or more leaf springs arranged so that the width directions cross each other. By arranging three or more leaf springs so that the width directions intersect with each other in this way, the movement of the leaf springs in the width direction can be suppressed by the respective leaf springs. Movement is suppressed. Therefore, the contact unit is restrained from moving in the horizontal direction, and can move smoothly in the vertical direction of the contact unit during overdrive. Therefore, the contact probe is disengaged from the inspection object area of the inspection object. Can be prevented.

  In the probe card according to a fourth aspect of the present invention, in addition to the above configuration, the leaf spring is composed of two pairs of leaf springs arranged to face each other with the contact unit interposed therebetween, and the width direction of the pair of leaf springs Is configured to intersect with the width direction of the other pair of leaf springs. Thus, the pair of leaf springs can prevent the contact unit from moving in the width direction (first width direction) of the pair of leaf springs in the horizontal direction, and the other pair of leaf springs The contact unit can be prevented from moving in the width direction (second width direction) of the other pair of leaf springs in a direction intersecting the first width direction. Therefore, since the contact unit is restrained from moving in two different directions in the horizontal direction, the contact probe can always be brought into contact with the inspection target region of the inspection target. In addition, since the two pairs of leaf springs are arranged to face each other with the contact unit interposed therebetween, the contact unit is supported on the main board so as to be substantially parallel to the lower surface of the main board. Can do. As described above, according to the probe card of the present invention, the contact unit can be supported so as to be substantially parallel to the lower surface of the main substrate, and the contact unit can be smoothly moved in the vertical direction during overdrive. Since the movement in all directions in the horizontal direction can be satisfactorily suppressed, the electrical characteristic inspection can be reliably performed.

  According to the probe card of the present invention, at the time of non-inspection, the contact unit is surely provided below the main board so as to have a predetermined distance between the lower surface of the main board by the two or more leaf springs. At the time of inspection, the leaf spring is elastically deformed so as to bend in a direction perpendicular to the plate surface, the contact unit is smoothly moved only in the vertical direction, and the movement in the horizontal direction is suppressed, Good electrical property inspection can be performed.

Embodiment 1.
Hereinafter, a first embodiment of a probe card according to the present invention will be described with reference to the drawings. FIG. 1 is an external view showing an example of a probe card 1 according to an embodiment of the present invention, and shows a view from below. FIG. 2 shows a schematic cross-sectional view of the probe card 1. FIG. 3 shows a schematic overall perspective view of the probe card 1 in a state before the flexible substrate is connected. In FIG. 3, the contact probe is omitted.

  As shown in FIG. 2, the probe card 1 includes a main board 2 and a contact unit 3 that is supported so as to be movable up and down with respect to the main board 2 and has a plurality of contact probes 31. The contact unit 3 is supported by a leaf spring 4 fixed to the main board 2 so as to be movable up and down with respect to the main board 2.

  As shown in FIG. 1, the main board 2 is a disk-shaped printed board, and has an external terminal 21 for performing signal input / output with a tester device. In the present embodiment, a multilayer printed circuit board mainly composed of glass epoxy is used as the main board 2. The main substrate 2 is a substrate that is detachably attached to the probe device and supports the contact unit 3. Many external terminals 21 are formed on the peripheral edge of the main board 2. The upper surface of the main substrate 2 is screwed to the entire lower surface of the reinforcing plate 5, and the main substrate 2 and the reinforcing plate 5 are integrated.

  The contact unit 3 is arranged below the main board 2 and supported by the main board 2 so as to be movable up and down via a leaf spring 4 fixed to the main board 2. The contact unit 3 includes a contact substrate 32 on which a large number of contact probes 31 are formed, a backing plate 33 bonded to the upper surface of the contact substrate 32, and a leaf spring fixing plate 34 bonded to the upper surface of the backing plate 33. I have.

  In the present embodiment, the contact substrate 32 is rectangular, and a large number of contact probes 31 are formed on the lower surface, and a wiring pattern is formed. The wiring pattern is formed by wiring patterns of a power supply line, a ground line, and a signal line. In the present embodiment, the contact probe 31 is constituted by a metal needle formed by electroforming. Further, in the present embodiment, a large number of contact probes 31 are arranged in two rows at the center of the lower surface of the contact substrate 32.

  The backing plate 33 is a rectangular metal plate having a plane area larger than the plane area of the contact substrate 32, the lower surface is joined to the entire upper surface of the contact substrate 32, and the entire upper surface is the lower surface of the leaf spring fixing plate 34. It is joined with.

  A large number of electrode pads that are electrically connected to the contact probe 31 are provided on the periphery of the contact substrate 32. The electrode pads on the contact substrate 32 are bonded to the electrode pads provided at one end of the flexible substrate 6 by wires.

  Since the other end of the flexible substrate 6 is connected to the main substrate 2, the main substrate 2 and the contact substrate 32 are electrically connected. The flexible substrate 6 is connected to the main substrate 2 and the backing plate 33 with a gently curved surface so as to change according to the vertical movement of the contact unit 3.

  The flexible substrate 6 is an assembly of conductive wires that electrically connect the main substrate 2 and the contact substrate 32, and a wiring pattern is formed on a thin insulating substrate having flexibility. Here, a film substrate having a shape in which the main substrate 2 side is branched into three is used, and at the end of each branch portion, as shown in FIG. 1, the connector 23 of the main substrate 2 can be attached and detached. Each connector 61 to be engaged is provided. In this embodiment, the flexible substrate 6 uses a flexible printed circuit board (FPC) in which a wiring pattern is printed on a flexible film mainly composed of polyimide. In the schematic cross-sectional view shown in FIG. 2, the flexible substrate 6 is directly connected to the main substrate 2.

  The leaf spring fixing plate 34 is formed of a rectangular metal having a larger flat area than the flat area of the backing plate 33. The leaf spring fixing plate 34 is disposed to face the main board 2. The plate spring fixing plate 34 is fixed to the plate spring 4 at the lower surface of the portion protruding from the backing plate 33.

  The leaf spring 4 has bent portions at two upper and lower portions, an upper fixing portion 41 having a surface parallel to the lower surface of the main substrate 2, a lower fixing portion 42 having a surface parallel to the upper fixing portion 41, and The upper fixing part 41 and the lower fixing part 42 are connected to each other, and an elastic deformation part 43 extending in the vertical direction is provided. The upper fixing portion 41 and the lower fixing portion 42 are formed so that their surfaces face each other. In the present embodiment, as shown in FIG. 3, four leaf springs 4 are used, which are respectively arranged at the edge central portions of the four sides of the rectangular leaf spring fixing plate 34. That is, the two pairs of leaf springs 4 are arranged to face each other with the leaf spring fixing plate 34 interposed therebetween.

  The upper fixing portion 41 of the leaf spring 4 is configured such that its upper surface is fixed to the lower surface of the main board 2, and the lower fixing portion 42 is fixed to the lower surface of the plate spring fixing plate 34 of the contact unit 3. It is like that. Therefore, the plate spring fixing plate 34 is disposed between the upper fixed portion 41 and the lower fixed portion 42 of the plate spring 4 and is supported by the plate spring 4.

  In the present embodiment, the outer peripheral edge of the lower surface of the plate spring fixing plate 34 is fixed to the lower fixing portion 42 of the plate spring 4 in a state where the contact substrate 32, the backing plate 33 and the plate spring fixing plate 34 are joined. The As described above, the leaf spring 4 has a predetermined gap 9 between the lower surface of the main substrate 2 and the upper surface of the leaf spring fixing plate 34 when not inspected, and the contact substrate 32 of the contact unit 3. The contact unit 3 is supported in a state of being suspended from the main substrate 2 so that the lower surface thereof is parallel to the lower surface of the main substrate 2.

  At the time of inspection, the inspection object moves upward, so that the contact probe 31 contacts the inspection object. Further, overdrive is performed to bring the contact probe 31 into pressure contact with the inspection object. At this time, since the lower fixing portion 42 of the plate spring 4 is fixed to the plate spring fixing plate 34, when the contact probe 31 is pushed upward by the inspection object by overdrive, the elastic deformation of the plate spring 4 is performed. As shown by the phantom line (two-dot broken line) in FIG. 2, the portion 43 is curved to the side opposite to the side where the leaf spring fixing plate 34 is disposed, and the contact unit 3 moves toward the main board 2. .

  In the present embodiment, the contact probe 31 is urged toward the inspection object side by the elastic force of the leaf spring 4 during overdrive, so that the contact probe 31 is inspected by overdrive. When pressed against the needle spring, the needle pressure gradually increases due to the elastic force of the leaf spring 4. As a result, the probe card 1 can easily control the amount of overdrive, and the contact probe 31 is not easily damaged.

  Further, in the present embodiment, the four leaf springs 4 are arranged at substantially equal intervals on the peripheral portion of the contact unit 3 so that the two pairs of leaf springs 4 are arranged to face each other with the contact unit 3 interposed therebetween. It is in the state. In this way, since the two pairs of leaf springs 4 are arranged to face each other with the contact unit 3 interposed therebetween, the adjacent leaf springs 4 are perpendicular to each other in the width direction (arrow x direction shown in FIG. 3). Since the leaf spring 4 is not easily displaced in the width direction, the movement of the contact unit 3 in the horizontal direction can be effectively suppressed. Note that the width direction of the leaf spring 4 (the direction of the arrow x shown in FIG. 3) is the length from the one end fixed to the main board 2 to the other end fixed to the leaf spring fixing plate 34. When the direction is taken, it means a direction orthogonal to the length direction.

  That is, the plate spring 4 is hard to be deformed in the width direction because the planar portions of the upper fixed portion 41 and the lower fixed portion 42 at both ends are fixed to the main substrate 2 and the plate spring fixing plate 34. Accordingly, during overdrive, the elastic deformation portion 43 of the leaf spring 4 is difficult to deform in the width direction of the leaf spring in the horizontal direction, so that the contact unit 3 supported by the leaf spring 4 moves in the vertical direction. Is performed smoothly, and movement in the horizontal direction is suppressed.

  In particular, in the present embodiment, the contact unit 3 is supported by four leaf springs 4, and one of the two pairs of leaf springs 4 can prevent movement in the X direction in the horizontal direction. The leaf spring 4 can prevent movement in the Y direction perpendicular to the X direction. As a result, the contact unit 3 is allowed to move only in the vertical direction and is prevented from moving in the horizontal direction, so that the contact probe 31 can be reliably brought into contact with the electrode pad as the inspection object even if overdrive is performed. It is possible to perform electrical property inspection reliably.

  In the present embodiment, the leaf springs 4 are arranged one by one at the edge of each of the four sides of the leaf spring fixing plate 34. Two leaf springs 4 may be arranged on each side of the side edge.

  Further, the leaf spring 4 may be formed in a Z shape so that the upper fixing portion 41 and the lower fixing portion 42 do not face each other. In this case, the upper fixing portion 41 is disposed in a state extending to the opposite side with respect to the contact unit 3, the upper surface of the upper fixing portion 41 is fixed to the main board 2, and the plate spring is formed on the upper surface of the lower fixing portion 42. The lower surface of the fixed plate 34 is supported.

Embodiment 2. FIG.
In the first embodiment, the probe card is configured such that the contact unit is supported by the leaf spring and the needle probe is applied to the contact probe by the elastic force of the leaf spring. In the present embodiment, the leaf spring 4 is mainly used to support the contact unit 3, and the coil spring 74 is disposed between the contact unit 3 and the main substrate 2, so that the coil spring 74 causes the contact probe 31 to be contacted. The needle pressure is applied.

  In the present embodiment, the main board 2, the contact unit 3 disposed below the main board 2, the reinforcing plate 5 bonded to the upper surface of the main board 2, the main board 2 and the contact unit 3 are electrically connected. And a flexible substrate 6 to be connected. Similarly to the first embodiment, the contact unit 3 also includes a contact substrate 32 provided with a contact probe 31, a backing plate 33, and a leaf spring fixing plate 34. The contact unit 3 has the same configuration as that of the first embodiment except that a circular recess 34a that presses the coil spring 74 is formed on the upper surface of the plate spring fixing plate 34. Description is omitted.

  In the present embodiment, the main board 2 is substantially the same in shape and size as in the first embodiment, and as shown in FIG. 4, the through hole 24 through which the spring receiving position adjusting screw 71 is inserted at the center. Is formed. The reinforcing plate 5 joined to the upper surface of the main board 2 is also substantially the same in shape and size as in the first embodiment, but a spring receiving position adjusting screw 71 is screwed into the center as shown in FIG. A screw hole 51 is formed therethrough. The centers of the screw hole 51 and the through hole 24 of the main board 2 are concentric.

  The entire upper surface of a ring or a rectangular plate-shaped spring receiving and holding plate 72 having an opening 72 a formed in the center is joined to the lower surface of the main substrate 2 and integrated with the main substrate 2. A disc-shaped coil spring receiver 73 is accommodated in the opening 72a of the spring receiver holding plate 72 so as to be movable up and down.

  The contact unit 3 is supported by the main board 2 so as to be movable up and down via a leaf spring 4 fixed to the leaf spring fixing plate 34. The leaf spring 4 has the same shape as that of the first embodiment, and has an upper fixing portion 41, a lower fixing portion 42, and an elastic deformation portion 43.

  The leaf spring fixing plate 34 is made of a rectangular plate member, and a plurality of circular recesses 34 a with which the end portions of the coil springs 74 are in pressure contact are formed in the center portion of the upper surface facing the main substrate 2. One of these circular recesses 34a is formed at the center of the leaf spring fixing plate 34, and a plurality of circular recesses 34a are formed evenly in the circumferential direction around the circular recess 34a at the center.

  The coil spring receiver 73 is made of a circular or rectangular plate-like member, and a circular recess 73a for receiving one of the coil springs 74 is formed at the center of the surface (lower surface) facing the plate spring fixing plate 34. A plurality of circular recesses 73a are formed around the circular recess 73a so as to face the circular recesses 34a formed in the leaf spring fixing plate 34.

  A spring receiving position adjusting screw 71 is screwed into the screw hole 51 formed in the reinforcing plate 5. The tip end surface of the spring receiving position adjusting screw 71 is in contact with the center of the upper surface of the coil spring receiving 73 facing the main board 2. The spring receiver position adjusting screw 71 is formed with a thread on substantially the entire length in the longitudinal direction of the shaft portion, and has a flat tip surface. The tip surface is brought into contact with the coil spring receiver 73.

  Then, the contact substrate 32, the backing plate 33, and the leaf spring fixing plate 34 are joined together to constitute the contact unit 3. Next, the lower fixing portion 42 of the leaf spring 4 is fixed to the leaf spring fixing plate 34, and the disc-shaped coil spring receiver 73 is disposed in the opening 72 a of the spring receiver holding plate 72. Then, a coil spring 74 is disposed between the circular recess 73a of the coil spring receiver 73 and the circular recess 34a of the leaf spring fixing plate 34, and the upper fixing portion 41 of the leaf spring 4 is fixed to the main board 2 to thereby make contact. The unit 3 is supported on the main board 2 via the leaf spring 4.

  In this manner, after the contact unit 3 is fixed to the main board 2 by the leaf spring 4 in a state where the coil spring 74 is disposed between the contact unit 3 and the main board 2, the spring receiving position adjusting screw 71 is attached to the reinforcing plate 5. Then, the screw hole 51 is tightened from the upper surface. Then, the through hole 24 of the main board 2 is inserted, and the tip end surface of the spring receiving position adjusting screw 71 is pressed against the center of the upper surface of the coil spring receiving 73.

  Further, by tightening the spring receiving position adjusting screw 71, the coil spring receiver 73 moves toward the contact unit 3 in the opening 72a against the elastic force of the coil spring 74. A coil spring 74 sandwiched between the coil spring receiver 73 and the plate spring fixing plate 34 urges the contact unit 3 by its repulsive force. In this way, the distance between the lower surface of the coil spring receiver 73 and the upper surface of the leaf spring fixing plate 34 is adjusted, and the spring receiver position adjusting screw 71 is moved until the repulsive force of the coil spring 74 becomes a predetermined biasing force. The screw is tightened with respect to the receptacle 73.

  In this embodiment, the coil spring 74 is used to control the needle pressure of the contact probe 31. Therefore, the leaf spring 4 is formed so as to have a small plate thickness and a wide width, and the coil spring. The elastic force in the vertical direction is weakened to the extent that the urging force against the contact unit 3 due to the repulsive force of 74 is not hindered, and is not displaced in the horizontal direction. By forming the leaf spring 4 in this way, a predetermined load (needle pressure) can be applied to the contact probe 31 during overdrive by biasing the contact unit 3 mainly by the coil spring 74. In addition, these leaf springs 4 suppress the movement of the contact unit 3 in the horizontal direction, and the contact unit 3 can be smoothly moved up and down.

  In the present embodiment, the contact probe 31 is pressed by the inspection object by raising the inspection object, bringing the contact probe 31 of the contact unit 3 into contact with the inspection object, and further overdriving. At this time, the coil spring 74 is compressed by the coil spring receiver 73 and further compressed by the main board 2 and the contact unit 3, and at the same time, the elastic deformation portion 43 of the leaf spring 4 is curved. Therefore, the contact unit 3 moves upward.

  Since the contact probe 31 is biased toward the inspection object side by the elastic force of the coil spring 74 and the elastic force of the leaf spring 4 during overdrive, the contact probe 31 is pressed against the inspection object. At this time, the needle pressure of the contact probe 31 gradually increases, and the contact probe 31 is less likely to be damaged. In addition, by adjusting the screwing amount of the spring receiving position adjusting screw 71 into the screw hole 51, the contact probe 31 is not damaged, and all the contact probes 31 can be brought into contact with the inspection object. The biasing force by the coil spring 74 can be adjusted.

Embodiment 3.
In the present embodiment, as shown in FIG. 5, the leaf spring fixing plate 34 and the main substrate 2 are elastically contacted between the plate spring fixing plate 34 and the main substrate 2 of the contact unit 3. The probe card 1 is provided with an interposer 8 as an intermediate member that electrically connects the spring fixing plate 34 and the main board 2.

  The present embodiment also includes a main board 2, a contact unit 3 disposed below the main board 2, and a reinforcing plate 5 joined to the upper surface of the main board 2. The contact unit 3 includes a contact substrate 32 provided with a contact probe 31 and a leaf spring fixing plate 34. Electrical connection between the main board 2 and the contact unit 3 is performed using an interposer 8.

  In the present embodiment, the main substrate 2 has the same shape and size as the first embodiment, but as shown in FIG. 5, a plurality of terminal electrodes 25 are formed at the center of the lower surface. . Since the reinforcing plate 5 and the contact substrate 32 of the contact unit 3 are the same as those in the first embodiment, they are denoted by the same reference numerals and description thereof is omitted.

  The leaf spring fixing plate 34 has a rectangular shape with a larger plane area than the contact substrate 32, and a plurality of terminal electrodes 34 b corresponding to the terminal electrodes 25 of the main substrate 2 are formed on the upper surface. In the present embodiment, the entire upper surface of the contact substrate 32 is bonded to the lower surface of the leaf spring fixing plate 34. The lower contactor 83 of the interposer 8 is in contact with these terminal electrodes 34b. The leaf spring fixing plate 34 is formed with a wiring pattern that is electrically connected to the terminal electrode 34b. This wiring pattern is electrically connected to the corresponding contact probe 31 via the wiring pattern formed on the contact substrate 32. Yes.

  In the present embodiment, an interposer 8 is provided between the main board 2 and the leaf spring fixing plate 34. As shown in FIG. 5, the interposer 8 is elastically deformable, for example, provided with a connector support substrate 81 made of ceramic and a terminal electrode 25 provided on the main substrate 2 on the upper surface of the connector support substrate 81. A plurality of upper contacts 82 and a plurality of elastically deformable lower contacts 83 provided on the lower surface of the connector support substrate 81 so as to correspond to the terminal electrodes 34b of the leaf spring fixing plate 34. Further, the interposer 8 is formed with a plurality of through holes (not shown) in the outer peripheral edge portion of the connector support substrate 81 and provided with guide pins 84 on the lower surface of the main substrate 2. By inserting the guide pins 84 through the holes, the connector support substrate 81 does not move in the horizontal direction but moves only in the vertical direction.

  The upper contact 82 of the interposer 8 extends upward from the connector support substrate 81, and each tip is in electrical contact with the terminal electrode 25 of the main substrate 2. Further, the lower contactor 83 of the interposer 8 extends downward from the connector support substrate 81, and the respective tips thereof are in electrical contact with the terminal electrodes 34 b formed on the leaf spring fixing plate 34. Each of the contacts 82 and 83 is formed in a pin shape so as to be elastically deformable by an elastic metal, and further, a bent portion is formed at an intermediate portion in the longitudinal direction of the pin. These contactors 82 and 83 electrically connect the contact substrate 32 and the main substrate 2.

  The contact unit 3 is supported by the main board 2 so as to be movable up and down via a leaf spring 4 fixed to the leaf spring fixing plate 34. The leaf spring 4 has an upper fixing portion 41, a lower fixing portion 42, and an elastic deformation portion 43, and is formed in a Z shape so that the upper fixing portion 41 and the lower fixing portion 42 do not face each other. Yes. The upper fixing portion 41 is arranged so that the tip is directed to the opposite side with respect to the contact unit 3, and the upper surface of the upper fixing portion 41 is fixed to the main substrate 2, and the plate spring is formed on the upper surface of the lower fixing portion 42. The lower surface of the fixed plate 34 is supported.

  Then, the contact substrate 32 and the leaf spring fixing plate 34 are joined to constitute the contact unit 3, and the lower fixing portion 42 of the leaf spring 4 is fixed to the leaf spring fixing plate 34. Further, the interposer 8 is arranged on the lower side of the main board 2 by inserting the guide pins 84 through the through holes of the connector support board 81. Then, by arranging the contact unit 3 so that the terminal electrode 34b of the leaf spring fixing plate 34 contacts the lower contactor 83 of the interposer 8, and fixing the upper fixing portion 41 of the leaf spring 4 to the main board 2, The contact unit 3 is supported by the main board 2 via the leaf spring 4. In this manner, the contact unit 3 is fixed to the main board 2 via the leaf spring 4 in a state where the interposer 8 is disposed between the contact unit 3 and the main board 2.

  In the present embodiment, needle pressure is applied to the contact probe 31 using the interposer 8 and the leaf spring 4. Therefore, in this embodiment, the contact probe 31 is pressed down by the inspection object by raising the inspection object, bringing the contact probe 31 of the contact unit 3 into contact with the inspection object, and further overdriving. . At this time, the upper contact 82 and the lower contact 83 of the interposer 8 are elastically deformed, and at the same time, the elastic deformation portion 43 of the leaf spring 4 is bent and elastically deformed, so that the contact unit 3 moves upward.

  Also in the present embodiment, since the contact unit 3 is supported by the four leaf springs 4, the vertical movement is smoothly performed during overdrive, and the horizontal movement is suppressed.

  Furthermore, since the contact probe 31 is biased toward the inspection object side by the elastic force of the interposer 8 and the elastic force of the leaf spring 4 during overdrive, the contact probe 31 is pressed against the inspection object. As time passes, the needle pressure of the contact probe 31 gradually increases, and the contact probe 31 is less likely to break.

  Further, in each of the above embodiments, a leaf spring is used as a member for supporting the contact unit, and the shape thereof is a shape having a bent portion that is bent at two right and left positions, but the shape of the leaf spring of the present invention. Is not limited to this. For example, a curved leaf spring can be used. In this case, the flat portion on one end side of the arc can be fixed to the main substrate, and the flat portion on the other end can be fixed to the contact unit.

  Furthermore, in each said embodiment, although 4 leaf | plate springs were used, the number of leaf | plate springs is not limited to this. The probe card of this invention should just have two or more leaf | plate springs. For example, even when the planar shape of the contact unit is not a rectangle but a circle, a regular triangle, a regular pentagon, or a regular hexagon, the movement of the contact unit in the horizontal direction can be satisfactorily suppressed.

  Specifically, in the case of a contact unit having a circular planar shape, three or more leaf springs are arranged in each contact unit at equal intervals in the circumferential direction according to the size of the circle. When three leaf springs are arranged at equal intervals in the circumferential direction, since the width directions of all the leaf springs are different, movement in any horizontal direction can be suppressed even with a circular contact unit. In the case of a polygon, by arranging leaf springs at the corners and at the center of each side, the width direction of at least two leaf springs will be different, and movement in all horizontal directions will be possible. Can be suppressed.

  For example, when the planar shape of the contact unit is rectangular, leaf springs may be arranged on two adjacent sides. Even when the leaf springs are arranged in this way, the width directions of the leaf springs intersect each other, so that movement in two different horizontal directions can be suppressed.

  In the above embodiments, the contact probe 31 is formed by electroforming, but the contact probe is not limited to this. For example, a so-called cantilever type probe having a sharpened tip of a leaf spring-like metal can be used. Further, the contact probes 31 are not limited to those arranged in two rows on the contact substrate 32. Further, the cross-sectional shape of the leaf spring may be various shapes such as a U-shape, and for example, a Z-shape or a Σ-shape can be applied to the present invention without any limitation.

It is the external view which showed an example of the probe card 1 by Embodiment 1 of this invention, and has shown the figure seen from the downward direction. 1 shows a schematic cross-sectional view of a probe card 1 according to Embodiment 1 of the present invention. 1 shows a schematic perspective view of a probe card 1 according to Embodiment 1 of the present invention. The schematic sectional drawing of the probe card 1 by Embodiment 2 of this invention is shown. The schematic sectional drawing of the probe card 1 by Embodiment 3 of this invention is shown. The schematic sectional drawing of the conventional probe card is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Probe card 2 Main board 21 External terminal 22 Opening part 23 Connector 24 Through-hole 25 Terminal electrode 3 Contact unit 31 Contact probe 32 Contact board 33 Backing plate 34 Leaf spring fixing plate 34a Circular recessed part 34b Terminal electrode 4 Leaf spring 41 Upper fixed part 42 Lower fixing portion 43 Elastic deformation portion 5 Reinforcing plate 51 Screw hole 6 Flexible substrate 61 Connector 71 Spring receiving position adjusting screw 72 Spring receiving holding plate 72a Opening 73 Coil spring receiving 73a Circular recess 74 Coil spring 8 Interposer 81 Connector support substrate 82 Upper contact 83 Lower contact 84 Guide pin 9 Clearance

Claims (4)

A main board,
A contact unit in which a plurality of contact probes are formed;
Two or more leaf springs that support the contact unit in a vertically movable manner below the main board,
One end of the leaf spring is fixed to the lower surface side of the main board, and the other end is fixed to a peripheral portion of the contact unit.   2. The probe card according to claim 1, wherein the leaf spring is composed of a pair of leaf springs arranged to face each other with the contact unit interposed therebetween.   2. The probe card according to claim 1, wherein the leaf spring is composed of three or more leaf springs arranged so that the width direction intersects with each other.   The leaf spring is composed of two pairs of leaf springs arranged opposite to each other with the contact unit interposed therebetween, and the width direction of one pair of leaf springs intersects the width direction of another pair of leaf springs. The probe card according to claim 1 or 2, wherein

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