KR101465399B1 - Vertical blade type multi probe card - Google Patents

Abstract

The present invention relates to a multi-type probe card and, more specifically, to a multi-type probe card capable of testing a plurality of devices simultaneously by the lower part of a plurality blade-type needles passes through a guide film, mounted in a connection terminal of an interface board, and exposed to the outside by passing the needles through a wafer which is formed with a plurality of through grooves. According to the present invention, it is possible to easily fix the needles in a PCB and to prevent a damage to the needle by effectively absorbing the pressure applied to the needle.

Description

Multi-type probe card {VERTICAL BLADE TYPE MULTI PROBE CARD}

The present invention relates to a multi-type probe card, and more particularly, to a multi-type probe card in which a lower portion of a plurality of blade type needles is passed through a guide film to be seated on a connection terminal of an interface board, To thereby allow a plurality of devices to be tested at the same time.

The probe card is a test device for checking whether a semiconductor device or a circuit board is short-circuited. The probe card has a cantilever equipped with a needle that directly contacts an element to be inspected to exchange electrical signals.

1 is a side view showing a structure of a conventional probe inspection apparatus.

The probe inspection apparatus 500 includes a frame 400 having a slot 410 in which the multi-probe card unit 100 and the multi-probe card unit 100 are inserted, and a chuck 200 for transferring the wafer 300 do. One or more multi-probe card units 100 are mounted in the slots 410 formed in the frame 400 of the probe inspection apparatus 500. Probe card unit 100 is fixed to a predetermined position by being inserted into slot 410 and probes 110 and pads (not shown) are contacted by movement of wafer 300 placed on chuck 200.

The wafer 300 is carried on a wafer transfer robot (not shown) for the EDS inspection process and transferred to the probe inspection apparatus 500. The wafer 300 taken out of the wafer transfer robot and charged in the probe inspection apparatus 500 is loaded on the chuck 200 and is raised and lowered to a predetermined position.

Referring to FIG. 1, a probe card 120 is provided, and probes 110 are formed on both sides thereof. When the wafer 300 placed on the chuck 200 moves close to the probe card 120, the pad on the wafer 300 and the probe 110 of the multi-probe card unit 100 are brought into contact with each other,

However, the probe card 120 of the related art is provided with a plurality of probes 110, but more specifically, the probes 110 are fixed to the probe card 120 in a certain manner. In order to electrically transmit signals, A description is not provided.

Generally, the probe card 120 is manufactured by bonding a sharp probe 110 to a substrate such as a PCB. When the pressure applied to the probe 110 is not absorbed, the probe 110 is bent or broken There is a problem.

Also, since the method of aligning the probe 110 in a fixed position is not easy, there is a problem that the probe 110 is not brought into contact with the element at an accurate position.

KR 10-2008-0105644 A

In order to solve the above-described problems, the present invention provides a method of mounting a blade-type needle through a groove on a guide film, placing a wafer having a through-hole formed thereon, The present invention provides a multi-type probe card.

The present invention also relates to a method of manufacturing a multi-type connector, which is capable of flexibly bending a lower portion of a blade-type needle, which is in the form of a thin film, so that the pressure applied to the needle placed on the connector terminal of the interface board can be absorbed by elasticity And to provide a probe card.

Further, according to the present invention, there is provided a multi-type probe for accurately positioning a needle by visually confirming a position where two holes are aligned by forming alignment holes at positions corresponding to a lower guide film and an upper wafer, It is intended to provide a card.

The present invention, which is devised to solve the above-described problems, is a probe card that enables a plurality of semiconductor elements 20 to be simultaneously inspected using a plurality of needles 610, wherein a first connection terminal 602a is formed on the surface A PCB 602; An interface board block 604 attached to an upper surface of the PCB 602; An interface board 606 installed on the upper surface of the interface board block 604, a second connection terminal 606a formed on the surface edge, and a needle connection terminal 606b formed on the surface of the interface board 606; A film attached to an upper surface of the interface board 606, the guide film 608 having a plurality of needle insertion grooves 608a penetrating the surface thereof; A needle block 612 provided on the upper surface of the interface board 606 and having a step formed at an upper edge of the center opening; A wafer 614 seated at the upper edge of the needle block 612 and having a plurality of through grooves 614a through which the needle 610 passes from bottom to top; A lower portion of the needle 610 penetrates through the needle insertion groove 608a and contacts the needle connection terminal 606b and the upper portion of the needle 610 is exposed through the through hole 614a and is exposed above the wafer 614, and; And a wire 616 for electrically connecting the first connection terminal 602a and the second connection terminal 606a.

The needle 610, made of a thin metal sheet, has a body 610a in the middle; An elastic body 610b which is formed in the lower side of the body 610a to be laterally split and absorbs pressure while being inserted into the needle insertion groove 608a; And a contact portion 610c formed on the body 610a and exposed to the surface of the wafer 614 and contacting the semiconductor element 20. [

The first through hole 608b formed in the guide film 608 and the second through hole 614b formed in the wafer 614 are formed at positions vertically corresponding to each other.

The second connection terminal 606a and the needle connection terminal 606b are electrically connected by an internal connection terminal 606c passing through the inner layer of the interface board 606. [

According to the present invention, a plurality of needles can be easily fixed to the PCB, and the pressure applied to the needles can be effectively absorbed, thereby preventing damage to the needles.

In addition, it has a simple assembly structure, which makes it easy to maintain or modify.

In addition, according to the design of the needle, it is possible to adjust the pin pressure for a plurality of elements, and it is possible to test for a long time by the stable pin pressure of the needle.

1 is a side view showing the structure of a conventional probe inspection apparatus.
2 is a perspective view illustrating the structure of a probe card according to an embodiment of the present invention;
3 is an exploded perspective view showing a state in which internal components are separated;
4 is a perspective view showing a method of placing a needle on a guide film.
5 is a side view showing a state in which a needle is seated in a needle insertion groove;
6 is a side view showing a state in which a needle is fixed to a wafer.
7 is a plan view showing a method of aligning the positions of the wafer and the guide film.
8 is a side view showing a state in which a device is inspected by a probe card;

Hereinafter, a "multi-type probe card" (hereinafter referred to as "probe card") according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 2 is a perspective view showing a structure of a probe card according to an embodiment of the present invention, FIG. 3 is an exploded perspective view showing a state in which internal components are separated, FIG. 4 is a perspective view showing a method of seating a needle on a guide film, 5 is a side view showing a state in which the needle is seated in the needle insertion groove, and Fig. 6 is a side view showing a state in which the needle is fixed to the wafer.

The probe card 600 of the present invention is configured to fix a plurality of needles 610 to one PCB 602 to inspect a plurality of semiconductor devices simultaneously.

A first connection terminal 602a is pattern-printed on the upper surface of the main PCB 602 to transmit an electrical signal to the needle 610 or the needle 610 to be transmitted to a separate inspection apparatus.

An interface board block 604 is attached to the upper surface of the PCB 602. The interface board block 604 is in the form of a relatively flat rectangular parallelepiped, and an opening may be formed in the middle.

An interface board 606 is provided on the upper surface of the interface board block 604. The interface board 606 receives an electrical signal from the PCB 602 and transfers the electrical signal to the needle 610. The interface board 606 is formed into a plate shape so that the needle 610 can be seated and fixed. A second connection terminal 606a is formed on a surface edge of the interface board 606. The first connection terminal 602a and the second connection terminal 606a are electrically connected by a wire 616. [

A needle connection terminal 606b is formed in the center of the surface of the interface board 606. [ The needle connection terminals 606b are formed in numbers and positions corresponding to the number and positions of the plurality of needles 610 to be described later.

The second connection terminal 606a and the needle connection terminal 606b are electrically connected to each other. To this end, the interface board 606 is provided with an internal connection terminal 606c. The internal connection terminal 606c penetrates the inner layer of the interface board 606 and connects the second connection terminal 606a and the needle connection terminal 606b.

A guide film 608 is seated on the upper surface of the interface board 606. The guide film 608 is a thin film for fixing the position of the needle 610, and a plurality of needle insertion grooves 608a are formed on the surface of the guide film 608, through which the needle 610 passes. An elastic body 610b formed at the lower portion of the needle 610 is inserted into the needle insertion groove 608a. As shown in Fig. 5, the elastic body 610b is a leg-like bent portion which is divided into right and left, and penetrates the needle insertion groove 608a and contacts the needle connection terminal 606b located thereunder. By this contact pressure, the two leg-like elastic bodies 610b are slightly slid to the center. At this time, the pressure applied to the needle 610 is absorbed by the elastic body 610b to prevent the needle 610 from being damaged or bent.

The needle 610 applied to the present invention is made of a metal sheet in the form of a thin film, and is generally made of nickel or copper having high electrical conductivity.

5, the needle 610 is formed of a body 610a having a relatively wide width at its center, and an elastic body 610b is formed at a lower side of the body 610a. The upper end of the body 610a is made of a sharp contact portion 610c. The contact portion 610c is in contact with the semiconductor element to exchange electrical signals.

Since the contact portion 610c must be in contact with the semiconductor element precisely, it is preferable to make the contact portion 610c taper toward the distal end. However, since it is the part that receives the greatest force due to contact, it is made of a material having high electric conductivity (such as molybdenum) while maintaining the strength.

A needle block 612 is provided on the upper surface of the interface board 606. The needle block 612 has a flat rectangular parallelepiped shape, and an opening is formed in the center. Further, the upper edge of the center opening of the needle block 612 is formed with a concave step. The wafer 614 is seated in the step.

The wafer 614 is a position fixing plate having a through groove 614a through which the needle 610 is inserted. The number of the through holes 614a corresponding to the number of the needles 610 is formed. As shown in Fig. 6, the needle 610 is installed through the through-hole 614a from the lower side to the upper side. The inner diameter of the through groove 614a is made smaller than the width of the body 610a of the needle 610 and made larger than the width of the contact portion 610c of the distal end. Therefore, only the contact portion 610c is exposed above the through-hole 614a.

An interface board block 604, an interface board 606, a guide film 608, a needle block 612, and a wafer 614 are sequentially assembled on a PCB 602. Each component can be fixed with a bolt, an adhesive, or the like.

The guide film 608 and the wafer 614 are provided with needle insertion grooves 608a and through grooves 614a at numbers and positions corresponding to the number and positions of the needles 610, respectively. The needle insertion groove 608a is made to penetrate the surface of the guide film 608 and the through groove 614a is made to penetrate the wafer 614. [ Preferably, the needle insertion groove 608a and the penetration groove 614a are formed so as to correspond to the position of the semiconductor element to be inspected.

The needle connection terminals 606b on the surface of the interface board 606, the needle insertion grooves 608a on the guide film 608 and the through grooves 614a on the wafer 614 are all arranged in the same position. Therefore, one needle 610 penetrates through the needle insertion groove 608a and the penetration groove 614a, while the lower side contacts the needle connection terminal 606b, and the upper side protrudes above the wafer 614.

The guide film 608 is attached onto the interface board 606. Electrical signals are transmitted directly from the needle 610 to the interface board 606.

FIG. 7 is a plan view showing a method of aligning the positions of the wafer and the guide film, and FIG. 8 is a side view showing a state in which a probe card is used to inspect the device.

A first through hole 608b and a second through hole 614b for alignment are formed in the guide film 608 and the wafer 614, respectively. The first through hole 608b of the guide film 608 and the second through hole 614b of the wafer 614 are formed at positions vertically corresponding to each other. Therefore, when the probe card 600 is visually inspected from the upper side of the probe card 600, the two through holes 608b and 614b are overlapped. The administrator can confirm whether the guide film 608 and the wafer 614 are aligned by confirming whether the two through holes 608b and 614b overlap and appear as one circle.

In particular, one of the two through holes 608b and 614b may be formed as a circle, and the other one may be formed as a circle formed by a groove or a projection around the periphery, so that the alignment state can be more easily confirmed.

In the present invention, the second through-hole 614b on the upper side has a plurality of grooves formed around the circular shape, and the first through-hole 608b on the lower side has a circular shape. As shown in Fig. 7, when the first through hole 608b is seen as a circular shape shifted to one side through the second through hole 614b, it is not aligned (in case of (a)), (In case of (b)).

As shown in FIG. 8, a plurality of semiconductor devices 20 formed on the substrate 10 can be simultaneously inspected using the finally assembled probe card 600.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, As will be understood by those skilled in the art. Therefore, it should be understood that the above-described embodiments are to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.

10: semiconductor substrate 20: element
600: Probe card 602: PCB
604: Interface board block 606: Interface board
608: guide film 610: needle
612: Needle block 614: Wafer
616: Wire

Claims (4)

A probe card that enables a plurality of semiconductor elements (20) to be simultaneously inspected using a plurality of needles (610)
A PCB 602 on which a first connection terminal 602a is formed;
An interface board block 604 attached to an upper surface of the PCB 602;
An interface board 606 installed on the upper surface of the interface board block 604, a second connection terminal 606a formed on the surface edge, and a needle connection terminal 606b formed on the surface of the interface board 606;
A film attached to an upper surface of the interface board 606, the guide film 608 having a plurality of needle insertion grooves 608a penetrating the surface thereof;
A needle block 612 provided on the upper surface of the interface board 606 and having a step formed at an upper edge of the center opening;
A wafer 614 seated at the upper edge of the needle block 612 and having a plurality of through grooves 614a through which the needle 610 passes from bottom to top;
A lower portion of the needle 610 penetrates through the needle insertion groove 608a and contacts the needle connection terminal 606b and the upper portion of the needle 610 is exposed through the through hole 614a and is exposed above the wafer 614. [ and;
And a wire (616) electrically connecting the first connection terminal (602a) and the second connection terminal (606a). The method according to claim 1,
The needle 610, made of a thin metal sheet,
A middle body 610a;
An elastic body 610b which is formed in the lower side of the body 610a to be laterally split and absorbs pressure while being inserted into the needle insertion groove 608a;
And a contact portion (610c) formed on the body (610a) and exposed to the surface of the wafer (614) and contacting the semiconductor element (20). 3. The method of claim 2,
The first through hole 608b formed in the guide film 608 and the second through hole 614b formed in the wafer 614 are formed at positions corresponding vertically to each other. Probe card. 3. The method of claim 2,
Wherein the second connection terminal (606a) and the needle connection terminal (606b) are electrically connected by an internal connection terminal (606c) passing through an inner layer of the interface board (606).

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