KR101199016B1 - Probe card for led inspection - Google Patents

Abstract

PURPOSE: A probe card for inspecting an LED is provided to simultaneously inspect a plurality of LED chips by inspecting the LED in a wafer level. CONSTITUTION: A needle block includes a first plate(11), a needle pin, and a second plate(14). An upper tip groove passes through the first plate. An upper tip(12a) of the needle pin passes through the upper tip groove. A probe substrate(40) is connected to the lower side of the needle block. A third plate(20) is located on the lower side of the needle block to support the needle block. A guide ring(30) controls a space between the needle block and the probe substrate.

Description

Probe card for LED inspection {PROBE CARD FOR LED INSPECTION}

The present invention relates to a probe card for LED (LED) inspection, and more particularly to a probe card for LED inspection that can test a large area of the electrical performance (DC) of the LED.

LED (Light Emitting Diode) is a kind of light emitting device using a semiconductor that converts electricity into light, also referred to as a light emitting diode (Luminescent diode).

Such LEDs are manufactured through an epi process (EPI), a chip process (Fabrication), and a package process (Package), etc., and undergoes a process of testing the LEDs in the chip process and the package process or later. In the test process, the LEDs which are not normally operated are excluded, and the LEDs which are normally operated are classified and classified according to their performance.

In the test process for checking the LED, there is a step of checking the electrical performance of the LED, and the step of checking the light emitting performance of the LED.

A probe card for a conventional LED inspection will be described with reference to FIGS. 1 and 2.

1 is a perspective view illustrating a probe card according to the prior art, and FIG. 2 is a state diagram schematically illustrating an LED chip inspection process using the probe card according to FIG. 1.

The conventional probe card 100 includes a terminal portion 102 provided on one side on the probe substrate 101, a probe pin 103 connected to the terminal portion 102, and a probe tip 104 connected to the probe pin 104. It includes. A circular opening is provided in the center portion of the probe substrate 101, and a pair of probe tips 104 protrude downward from the opening.

The pair of probe tips 104 is in contact with the electrodes of the LED chip C on the prober chuck located below the probe substrate 100, thereby providing electrical or light emitting performance of the LED chip C. Will be examined.

However, according to the conventional inspection method using the probe card 100, since the inspection is performed in units of LED chips, a plurality of LED chips could not be inspected at the same time. This resulted in inefficiency that takes a long time to inspect. In addition, since one probe card is installed for each prober device, a plurality of prober devices are required accordingly to inspect a plurality of LED chips. This required a large work space and increased the need for maintenance.

The present invention is to solve the above-mentioned problems of the prior art, an object of the present invention is to provide an LED inspection probe card that can test a large area of the electrical performance (DC) of the LED.

According to an embodiment of the present invention for achieving the above object, a needle block (needle block) is provided with a plurality of needle pin (needle pin) protruding the top tip of the needle pin, Probe substrate (probe substrate) connected to the lower side, the plurality of needle pin is provided with an LED inspection probe card, characterized in that the contact (LED) in the wafer (wafer) state.

According to an embodiment of the present invention, the needle block may include a first plate having an upper tip groove through which an upper tip of the needle pin passes, and an inner space connected to a lower side of the first plate to form an inner space. It may include a second plate provided with a bottom tip groove through which the bottom tip of the.

According to an embodiment of the present invention, the first plate and the second plate may further include a thick film elastic body that is penetrated through the bottom tip of the needle pin.

According to one embodiment of the present invention, the thick film elastic body may be made of polyimide (PI).

According to an embodiment of the present invention, one or more of a third plate or a guide ring may be further provided between the second plate and the probe substrate.

According to an embodiment of the present invention, one or more of a cover or a stiffener may be further provided below the probe substrate.

According to an embodiment of the present invention, the needle pin may be a cobra pin.

According to one embodiment of the present invention, the needle pin may be made of beryllium copper (BeCu).

According to one embodiment of the invention, the lower tip of the needle pin, can be fixedly connected through the wire and the pad for the internal contact of the probe substrate.

According to one embodiment of the invention, further comprising a wire block (wire block) located below the needle block, the lower tip of the needle pin is detachably connected to the internal wiring of the wire block, the wire The internal wiring of the block may be fixedly connected through the wire and the pad for internal contact of the probe substrate.

According to the embodiment of the present invention, it is possible to provide an LED inspection probe card capable of inspecting a large area of the electrical performance (DC) of the LED. In addition, according to an embodiment of the present invention, it is possible to provide a probe card for LED inspection with a precise position adjustment of the needle tip, a small amount of scrub. In addition, according to an embodiment of the present invention, it is possible to provide an LED inspection probe card that the inspection time is reduced and the post-process is simplified to increase productivity.

In addition, according to an embodiment of the present invention, it is possible to provide an LED inspection probe card having a low electrical resistance and the electrical connection from the needle tip to the probe substrate.

In addition, according to an embodiment of the present invention, it is possible to provide an LED inspection probe card that can be maintained and replaced in the unit of a needle block.

The effects of the present invention are not limited to the above-described effects, but should be understood to include all effects deduced from the configuration of the invention described in the detailed description or claims of the present invention.

1 is a perspective view showing a probe card according to the prior art.
FIG. 2 is a state diagram schematically illustrating a process of testing an LED chip using a probe card according to FIG. 1.
3 is a perspective view showing a probe card according to an embodiment of the present invention.
4 is a plan view of the probe card according to FIG. 3.
5 is an exploded perspective view of the probe card according to FIG. 3.
6 is a perspective view illustrating a needle block of the probe card according to FIG. 3.
FIG. 7 is a schematic cross-sectional view of a needle block of the probe card of FIG. 3.
8 is a schematic cross-sectional view of a solder probe card according to an embodiment of the present invention.
9 is a schematic cross-sectional view of a contact type probe card according to an embodiment of the present invention.
10 is a state diagram schematically illustrating an LED wafer inspection process using the probe card according to FIG. 3.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "electrically connected" with another part in between . Also, when an element is referred to as "comprising ", it means that it can include other elements as well, without departing from the other elements unless specifically stated otherwise.

First, a configuration of a probe card according to an embodiment of the present invention will be described with reference to FIGS. 3 to 7.

Figure 3 is a perspective view of a probe card according to an embodiment of the present invention, Figure 4 is a plan view of the probe card according to Figure 3, Figure 5 is an exploded perspective view of the probe card according to Figure 3, Figure 6 is a probe according to Figure 3 7 is a perspective view illustrating a needle block of a card, and FIG. 7 is a schematic cross-sectional view illustrating a configuration of a needle block of a probe card according to FIG. 3.

Probe card 1 according to an embodiment of the present invention, the needle block 10 is provided with a plurality of needle pins 12 and the tip 12a of the needle pin 12 protrudes, and the needle And a probe substrate 40 connected to the lower side of the block 10. These plurality of needle pins 12 are in contact with the LED in the wafer state. Here, the LED in the "wafer" state refers to a state before the LED wafer is cut into chips and separated into pieces, and the LED chip is fixed by fixing the LED wafer to a blue tape or the like and then going through a scribing or cutting process. It also includes a state where they are integrated.

Referring to FIG. 5, the needle block 10 may include a first plate 11, a needle pin 12, a thick film elastic body 13, and a second plate 14.

The first plate 11 is positioned at the top of the probe card 1 and may be a thin rectangular parallelepiped member. As illustrated in FIG. 6, a plurality of coupling holes for coupling with the second plate 14 may be formed on the surface of the first plate 11.

In addition, the first plate 11 may be provided with an upper tip groove 11a penetrating up and down (see FIG. 7). The upper tip 12a of the needle pin 12 penetrates through the upper tip groove 11a, and thus the upper tip 12a of the needle pin 12 may protrude upward from the needle block 10.

The needle pin 12 serves as a pad in contact with the LED's electrodes for LED inspection. The needle pin 12 includes an upper tip 12a inserted into the first plate 11 and a lower tip 12b inserted into the second plate 14.

A plurality of needle pins 12 are provided, thereby enabling LED inspection of a plurality of wafer chips. For example, as shown in FIG. 6, the needle pins 12 may be arranged in eight horizontally and four vertically, so that a total of 32 may be provided. Therefore, LEDs can be inspected on a wafer basis, which greatly reduces inspection time. Reduced inspection time simplifies post-processing and increases productivity. In addition, a relatively small number of prober equipment is required, which makes the work space compact, and also reduces the need for maintenance of the prober.

Meanwhile, the needle pin 12 may be formed in various layouts, thereby enabling large area inspection of various substrates such as an LED wafer and a logic IC.

Needle pin 12 may be formed in the form of a cobra pin (cobra pin) as shown in FIG. That is, the second plate 14 into which the upper tip groove 11a of the first plate 11 into which the upper tip 12a of the needle pin 12 is inserted and the lower tip 12b of the needle pin 12 are inserted The position of the bottom tip grooves 14a of the are in different positions in plan view. With this shape, the needle pin 12 has an inherent elasticity, and thus, when the probe card 1 contacts the LED wafer, the amount of scrub even when the prober chuck over-drives the prober chuck. Will be less.

The needle pin 12 may be formed of beryllium copper (BeCu). Beryllium copper is particularly useful for LED inspection because of its excellent electrical and physical properties. The needle pin 12 made of copper beryllium is formed in the fine hole of the upper tip groove 11a of the first plate 11, the lower tip groove 14a of the second plate 14, and the thick film elastic body 13 to be described later. It can be combined through flexible. By such a coupling structure, the position adjustment (alignment) of the needle pin 12 is made accurately, and the amount of scrub is reduced during the LED inspection. On the other hand, the surface of the needle pin 12 made of copper beryllium can be Au coated, and after coating Ti on beryllium copper (BeCu), it is also possible to coat Au thereon.

The thick film elastic body 13 may be positioned between the first plate 11 and the second plate 14 and may penetrate the lower tip 12b of the needle pin 12. That is, the thick film elastic body 13 is provided with fine holes corresponding to the needle pin 12. The fine holes can be formed, for example, by laser processing or the like.

The thick film elastic body 13 may be made of, for example, polyimide (PI), so that the thick film elastic body 13 has an inherent elastic force, and sufficiently fixes the lower tip 12b of the needle pin 12. In addition, even when the probe card 1 is used for a long time, cracks can be prevented from occurring between the fine holes formed in the thick film elastic body 13.

The second plate 14 is connected to the lower side of the first plate 11 to form the inner space S. The second plate 14 is provided with a lower tip groove 14a through which the lower tip 12b of the needle pin 12 penetrates. A plurality of coupling holes for coupling with the first plate 11 may be formed on the surface of the second plate 14.

The lower side of the needle block 10 may be provided with a third plate 20 for supporting the needle block 10 (see FIG. 5). The third plate 20 may be provided with a plurality of coupling holes for coupling the needle block 10 and the probe substrate 40. In addition, a wire for electrically connecting the lower tip 12b of the needle pin 12 inserted in the lower surface of the second plate 14 to the probe substrate 40 may pass through the center portion of the third plate 20. In order to be able to do so, an opening may be provided.

The guide ring 30 may be provided below the third plate 20. The guide ring 30 adjusts the distance between the needle block 10 and the probe substrate 40 to determine the overall height of the probe card 1. An opening is provided in the center portion of the guide ring 30.

The probe substrate 40 may be, for example, a printed circuit board (PCB). An internal wiring 41 may be provided inside the probe substrate 40, and a terminal 42 for connecting to an external device may be provided. One side of the internal wiring 41 of the probe substrate 40 may be connected to the internal contact pad 41a to be electrically connected to the needle pin 12, and the other side of the internal wiring 41 may be the external contact pad 41b. ) May be electrically connected to an external device (see FIGS. 8 and 9).

A cover and a stiffener 60 may be provided below the probe substrate 40. The stiffener 60 is a member that gives rigidity to the probe card 1. The cover may be composed of, for example, the first cover 50 and the second cover 70, or alternatively, may be formed as an integral cover.

Next, the wiring structure of the probe card according to the embodiment of the present invention will be described in more detail with reference to FIGS. 8 and 9. For reference, the wiring structure of the probe card shown in FIG. 8 will be referred to as a solder type, and the wiring structure of the probe card shown in FIG. 9 will be referred to as a contact type.

8 is a cross-sectional view schematically showing a solder type probe card according to an embodiment of the present invention, Figure 9 is a schematic cross-sectional view showing a contact type probe card according to an embodiment of the present invention. Here, in the probe card 1 according to the above-described embodiment, the configuration of the thick film elastic body 13, the guide ring 30, the first and second covers 50 and 70, the stiffener 60, and the like will be omitted. .

As shown in FIG. 8, the lower tip 12b of the needle pin 12 is penetrated through the second plate 14, and the lower tip 12b of the penetrated needle pin 12 is connected to the wire 80. Can be connected with one side. The point P at which the lower tip 12b of the needle pin 12 and the wire 80 contact each other is soldered. The other side of the wire 80 is connected to the pad 41a for internal contact of the probe substrate 40. The internal contact pad 41a is connected to the external contact pad 41b through the internal wiring 41, and the external contact pad 41b is connected to the external device.

As described above, according to the solder type probe card 1, the lower tip 12b of the needle pin 12 is fixedly connected to the pad 41a for internal contact of the probe substrate 40. That is, the needle pin 12 has a wiring structure in which the needle pin 12 is directly connected to the probe substrate 40. Therefore, the electrical connection is secure and the electrical resistance is low.

Alternatively, as shown in FIG. 9, a wire block 90 may be provided between the second plate 14 and the probe substrate 40. The internal wiring 91 is provided inside the wire block 90. The lower tip 12b of the needle pin 12 penetrates through the second plate 14, and the lower tip 12b of the penetrated needle pin 12 has an upper surface of the internal wiring 91 of the wire block 90. And detachably connected. In other words, the needle block 10 and the wire block 90 has a structure that can be contacted and separated from each other. On the other hand, the internal wiring 91 of the wire block 90 is solder-connected with the pad 41a for the internal contact of the probe substrate 40 through a separate wire 80.

As described above, according to the contact type probe card 1, the lower tip 12b of the needle pin 12 is detachably connected to the internal wiring 91 of the wire block 90, and the The internal wiring 91 is fixedly connected to the pad 41a for internal contact of the probe substrate 40 through the wire 80. Therefore, maintenance is possible in the unit of needle block, and it is also possible to replace only the needle block if necessary.

Next, an LED wafer inspection process using a probe substrate according to an embodiment of the present invention will be described with reference to FIG. 10.

As shown in FIG. 10, the probe card 1 is disposed to face the LED wafer W with the top tip 12a of the needle pin 12 facing downward. The LED wafer W is mounted on a prober chuck 2.

In this state, the probe card 1 is moved relatively to the LED wafer W side, and the tip tip 12a of the needle pin 12 is slightly smaller than the position where it starts to contact the electrode (pad) on the LED wafer W. Move further to maintain sufficient contact pressure. In this state, the current is applied to the LED wafer W by applying a current to the probe card 1 to inspect the electrical characteristics.

By inspecting the LEDs at the wafer level in this way, multiple LED chips can be inspected simultaneously.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

1: probe card 10: needle block
11: first plate 12: needle pin
13: thick film elastomer 14: second plate
20: third plate 30: guide ring
40: probe substrate 50: first cover
60: stiffener 70: second cover

Claims (10)

A plurality of needle pins (needle pin) is provided, the needle block (needle block) protruding the top tip of the needle pin,
A probe substrate connected to a lower side of the needle block,
The plurality of needle pins are in contact with an LED in a wafer state,
The plurality of needle pins are made of copper beryllium (BeCu), the surface of the needle pin is coated with Au,
The lower tip of the needle pin is a probe test probe card, characterized in that the fixed connection through the wire and the pad for the internal contact of the probe substrate. The method of claim 1,
The needle block,
A first plate provided with an upper tip groove through which the upper tip of the needle pin passes;
And a second plate connected to a lower side of the first plate to form an inner space and having a lower tip groove through which the lower tip of the needle pin passes. The method of claim 2,
And a thick film elastic body disposed between the first plate and the second plate and through which a lower tip of the needle pin penetrates. The method of claim 3,
The thick film elastic body is an LED inspection probe card, characterized in that made of polyimide (PI). The method of claim 2,
One or more of the third plate or the guide ring is further provided between the second plate and the probe substrate. The method of claim 1,
LED inspection probe card, characterized in that one or more of the cover or stiffener is further provided on the lower side of the probe substrate. The method of claim 1,
The needle pin is a probe card for an LED test, characterized in that the cobra pin (cobra pin). delete delete A plurality of needle pins (needle pin) is provided, the needle block (needle block) protruding the top tip of the needle pin,
A probe substrate connected to the lower side of the needle block; And
Including a wire block (wire block) located below the needle block,
The plurality of needle pins are in contact with an LED in a wafer state,
The plurality of needle pins are made of copper beryllium (BeCu), the surface of the needle pin is coated with Au,
The lower tip of the needle pin is detachably connected to the internal wires of the wire block, and the internal wires of the wire block are fixedly connected to the internal contact pad of the probe substrate through a wire. Card.

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