KR20160113492A - Flexible composite contact and test Socket using the same - Google Patents

Flexible composite contact and test Socket using the same Download PDF

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Publication number
KR20160113492A
KR20160113492A KR1020150039232A KR20150039232A KR20160113492A KR 20160113492 A KR20160113492 A KR 20160113492A KR 1020150039232 A KR1020150039232 A KR 1020150039232A KR 20150039232 A KR20150039232 A KR 20150039232A KR 20160113492 A KR20160113492 A KR 20160113492A
Authority
KR
South Korea
Prior art keywords
probe
semiconductor device
base
substrate body
flexible contact
Prior art date
Application number
KR1020150039232A
Other languages
Korean (ko)
Inventor
전진국
박성규
심재원
Original Assignee
주식회사 오킨스전자
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 오킨스전자 filed Critical 주식회사 오킨스전자
Priority to KR1020150039232A priority Critical patent/KR20160113492A/en
Publication of KR20160113492A publication Critical patent/KR20160113492A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture

Abstract

The present invention relates to a flexible contact composite and a test socket using the same and, more particularly, to a flexible contact composite that includes: a substrate body that is made of a flexible material; a first probe that is provided at the center of the substrate body and has a plurality of first connectors for connection with a semiconductor device to be tested; a second probe that is provided at an end of the substrate body and has a plurality of second connectors; and a plurality of wires formed on the substrate body to electrically connect the first connector of the first probe and the second connector of the second probe to each other. The composite according to the present invention has a flexible film form, thereby reducing manufacturing processes and costs. Further, a DUT board is included, and thus, a separate DUT board may not be manufactured, so that work efficiency may be improved. Elasticity may be maintained even under repeated tests, and thus, the reliability of a product may be improved.

Description

{Flexible contact contact and test socket using the same}

The present invention relates to a contact complex and a test socket. More particularly, the present invention relates to a contact complex and a test socket. More particularly, the present invention relates not only to maintaining a resilience in a repeated test but also to a DUT board, And a test socket using the same.

Generally, surface mount type semiconductor devices such as IC devices and IC devices are composed of LGA (Land Grid Array), BGA (Ball Grid Array), CSP (Chip Sized Package) type and the like, For example.

As one of these tests, for example, the burn-in test may be performed by applying a temperature and a voltage higher than normal operating conditions to the semiconductor device before the semiconductor device is applied to the electronic device as described above, It is checked whether or not.

In the conventional semiconductor device testing apparatus, as shown in FIG. 1, in order to verify the durability and reliability of a device in a test process, a semiconductor device is mounted on a test socket and is coupled to a device under test (DUT) board The test will be performed.

Such a burn-in socket comprises a base 1 having a central opening 1a as shown in Fig. 1; A cover (3) which is vertically movably coupled to the base (1) with the elastic member (2) interposed therebetween; A contact composite 4 inserted into the opening 1a of the base 1 and having a plurality of contact pins 4a; A latch (5) which moves to the open and support position in accordance with the upward and downward movement of the cover (3); And an adapter (6) mounted on the base and on which the semiconductor device (10) is placed.

For example, in the case of a burn-in test, a test is performed by electrically connecting to a test board at a high temperature of about 120 ° C. At this time, a test socket as shown in FIG. 1 is applied.

However, in the case of these conventional test sockets, the contact pins 4a are placed in the composite body to physically contact the lower DUT board and the connection terminals of the upper test device, so that the contact portions are easily worn by repetitive use, It is difficult to carry out a test with a signal transmission characteristic with a semiconductor device to be tested and the manufacturing of a contact complex also has to be complicated in several steps.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a semiconductor device having a substrate body made of a flexible material and a first probe having a plurality of first connection parts, A second probe having a second connection portion, and a plurality of wirings formed on the substrate body so as to electrically connect the first connection portion of the first probe and the second connection portion of the second probe, respectively, As the DUT board is included, it is possible to improve the working efficiency by omitting the manufacture of the separate use-purpose board and to maintain the elasticity even in the repeated test of the semiconductor device, thereby improving the reliability of the product And to provide a test socket using the same.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a substrate body made of a flexible material; a first probe provided at a central portion of the substrate body to have a plurality of first connection parts for connection with a semiconductor device to be tested; And a plurality of wires formed on the substrate main body to electrically connect the first connection portions of the first probe and the second connection portions of the second probe to each other, .

Preferably, the first probe is fabricated by a semiconductor wafer MEMS process.

And the second connection part of the second probe is a DUT board.

The flexible contact complex according to claim 1, wherein the base is located at the center so that the second probe is located at the end and the first probe is projected upward, and a base A latch which is moved to an open and support position in accordance with the upward and downward movement of the cover, an adapter mounted on the base and on which a semiconductor device is placed, and a connector provided between the first probe and the base, And an elastic portion for elastically supporting the lower side of the first probe, and the second probe is a DUT board.

The elastic portion is one of a rubber, a rubber, and a spring.

As described above, according to the flexible contact composite according to the present invention and the test socket using the flexible contact composite, the manufacturing process and cost can be reduced as compared with the conventional flexible contact type film, and a DUT board is included It is possible to improve the working efficiency and to maintain the elasticity even in the repeated test of the semiconductor device, which is a very useful and effective invention that can improve the reliability of the product.

1 is a view showing a conventional semiconductor device testing apparatus,
Figure 2 is a diagram of a flexible contact composite in accordance with the present invention,
Figure 3 is a front view of a flexible contact composite according to the present invention,
4 is a view showing a test socket using the flexible contact composite according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

It should be noted that the present invention is not limited to the scope of the present invention but is only illustrative and various modifications are possible within the scope of the present invention.

Figure 2 shows a flexible contact composite according to the present invention, Figure 3 shows a front view of a flexible contact composite according to the present invention, Figure 4 shows a test using a flexible contact composite according to the present invention Fig.

The flexible contact complex 100 includes a substrate body 110 and a first probe 120, a second probe 130, and a wiring 140, as shown in the figure.

The substrate main body 110 is made of a flexible material and is formed of a flexible film.

The first probe 120 is provided at a central portion of the substrate main body 110 to form a plurality of first connection portions 122 to be connected to the semiconductor device 10 to be tested.

The second probe 130 is formed with a plurality of second connection portions 132 provided at an end portion of the substrate main body 110.

A plurality of wires 140 are formed on the substrate main body 110 so as to electrically connect the first connection portions 122 of the first probe 120 and the second connection portions 132 of the second probe 130 .

Here, the first probe 120 is manufactured by a semiconductor wafer MEMS process, and the second connection part 132 of the second probe 130 is a DUT board.

Accordingly, the flexible contact complex 100 includes the function of a DUT board, and thus it is possible to omit the steps of manufacturing and installing a separate DUT board, thereby reducing work time and cost It can be done.

The test socket 200 using such a flexible contact composite 100 has a base 210 and a cover 220, a latch 230, an adapter 240 and an elastic portion 250 as shown in FIG. .

The base 210 is located at the center so that the second probe 130 is positioned at the end and the first probe 120 is projected upward.

The cover 220 is coupled to the base 210 so as to be movable up and down and the latch 230 is moved to the open and support position in accordance with the upward and downward movement of the cover 220.

The adapter 240 is mounted on the base 210 and the semiconductor device 10 is placed on the surface of the base 210. The elastic portion 250 is provided between the first probe 120 and the base 210 to test the semiconductor device 10 And elastically support the lower side of the first probe 120 at a time.

Here, since the second probe of the flexible contact complex 100 is a DUT board, a separate DUT board is unnecessary, thereby reducing the cost.

The elastic portion 250 may be formed of rubber, spring, or a combination of rubber, rubber, and spring.

10: Semiconductor device 100: Flexible contact complex
110: substrate body 120: first probe
130: second probe 140: wiring
200: Test socket 210: Base
220: cover 230: latch
240: adapter 250: elastic part

Claims (5)

A substrate body made of a flexible material;
A first probe provided at a central portion of the substrate main body and having a plurality of first connecting portions to be connected to a semiconductor device to be tested;
A second probe having a plurality of second connection portions provided at an end of the substrate main body; And
And a plurality of wires formed on the substrate body to electrically connect the first connection portion of the first probe and the second connection portion of the second probe, respectively.
The probe of claim 1, wherein the first probe comprises:
Wherein the flexible contact composite is produced by a semiconductor wafer MEMS process.
The probe of claim 1, wherein the second connection of the second probe comprises:
(DUT) board. ≪ RTI ID = 0.0 > 11. < / RTI >
12. A flexible contact composite of claim 1;
A base located at the center so that the second probe is located at the end and the first probe is projected upward;
A cover coupled to the base so as to be movable up and down;
A latch that is moved to an open and support position in accordance with the upward and downward movement of the cover;
An adapter mounted on the base and on which a semiconductor device is placed; And
And an elastic part provided between the first probe and the base to elastically support the lower side of the first probe when the semiconductor device is tested,
Wherein the second probe is a DUT board. ≪ RTI ID = 0.0 > 11. < / RTI >
5. The connector according to claim 4,
Characterized in that it is one of rubber, rubber, and spring.
KR1020150039232A 2015-03-20 2015-03-20 Flexible composite contact and test Socket using the same KR20160113492A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150039232A KR20160113492A (en) 2015-03-20 2015-03-20 Flexible composite contact and test Socket using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150039232A KR20160113492A (en) 2015-03-20 2015-03-20 Flexible composite contact and test Socket using the same

Publications (1)

Publication Number Publication Date
KR20160113492A true KR20160113492A (en) 2016-09-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150039232A KR20160113492A (en) 2015-03-20 2015-03-20 Flexible composite contact and test Socket using the same

Country Status (1)

Country Link
KR (1) KR20160113492A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210128776A (en) 2020-04-17 2021-10-27 부경대학교 산학협력단 Method for manufacturing composite material for semiconductor test socket having excellent heat dissipation and durability, and composite material manufactured thereby
KR20220005226A (en) 2020-07-06 2022-01-13 부경대학교 산학협력단 Method for manufacturing laminated material for semiconductor test socket having excellent heat dissipation and durability, and laminated material manufactured thereby
KR102446242B1 (en) * 2022-07-13 2022-09-21 강경훈 Test Socket for Testing Electronic Module Having a Flexible Terminal Protecting Structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210128776A (en) 2020-04-17 2021-10-27 부경대학교 산학협력단 Method for manufacturing composite material for semiconductor test socket having excellent heat dissipation and durability, and composite material manufactured thereby
KR20220005226A (en) 2020-07-06 2022-01-13 부경대학교 산학협력단 Method for manufacturing laminated material for semiconductor test socket having excellent heat dissipation and durability, and laminated material manufactured thereby
KR102446242B1 (en) * 2022-07-13 2022-09-21 강경훈 Test Socket for Testing Electronic Module Having a Flexible Terminal Protecting Structure

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Free format text: TRIAL NUMBER: 2017101000704; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20170213

Effective date: 20181123