JP2007116085A - Electronic component test apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component test apparatus which improves the reliability of electric contacts between an electronic component to be tested and a performance board. <P>SOLUTION: The electronic component test apparatus 1 includes: a test head 10 for testing an IC device formed on a wafer W; a probe card for electrically connecting the IC device to the test head 10; and a prober 70 for pressing the wafer W onto the probe card 50 in the case of executing the testing. The test head 10 has a presser unit 20a for pressing the surrounding of an opening 72 of the prober 70. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention is a test apparatus main body in which various electronic components (hereinafter, also referred to as IC devices) such as semiconductor integrated circuit elements formed on a wafer are pressed against a probe card and electrically connected to the probe card. The present invention relates to an electronic component testing apparatus for testing electrical characteristics of an IC device.

  In the manufacturing process of electronic components such as IC devices, an electronic component testing apparatus is used to test the performance and function of IC devices in a state of being built on a wafer or packaged.

  As an apparatus 1 ′ for testing the electrical characteristics of the IC device formed on the wafer W, as shown in FIG. 6, the probe needle 51 of the probe card 50 is brought into electrical contact with the electrode of the IC device, thereby Conventionally, a tester 25 is used to test the electrical characteristics of an IC device via 50 and the test head 10.

  In this apparatus 1 ′, the wafer W is raised by the transfer arm 73 of the prober 70 and pressed against the probe card 50 in order to bring the probe needle 51 and the electrode of the IC device into electrical contact. At this time, since the test head 10 is held by the rotating device 30, the weight of the test head 10 is not hung on the head plate 71 of the prober 70. For this reason, the pressing force of the transfer arm 73 is transmitted to the head plate 71 of the prober 70 via the probe card 50, the head plate 71 is bent upward, and the probe needle 51 and the IC device electrode May not be contacted accurately. In particular, as the number of probe needles mounted per probe card in recent years increases, the load (needle pressure) applied to the probe card tends to increase, and the bending that occurs in the head plate 71 of the prober 70 is increased. Tend to be larger.

  Furthermore, in order to improve the reliability of contact between the probe needle 51 and the electrode of the IC device, usually, after the probe needle 51 and the electrode of the IC device come into contact with each other, the transport arm 73 is further raised and over the probe card 50. I'm on the road. However, since the head plate 71 bends upward also during this overload, the overload cannot be made effective, and the reliability of the contact between the probe needle 51 and the electrode of the IC device cannot be ensured. In some cases, improvement cannot be achieved.

  An object of the present invention is to provide an electronic component testing apparatus capable of improving the reliability of electrical contact between an electronic device under test and a performance board.

  To achieve the above object, according to the present invention, a test apparatus main body for testing electrical characteristics of an electronic device under test, and a performance board for electrically connecting the electronic device under test and the test apparatus main body And an electronic component testing apparatus comprising: a pressing unit that presses the electronic device under test against the performance board in order to electrically connect the electronic device under test and the performance board; Is provided with an abutting means for abutting a periphery of an opening formed in the pressing means for attaching the performance board to the pressing means (refer to claim 1).

  In the present invention, when the electronic component test is performed, the contact means is brought into contact with the periphery of the opening of the pressing means. Thereby, it is possible to prevent the periphery of the opening of the pressing means from being bent due to the pressing of the pressing means, and it is possible to improve the reliability of electrical contact between the electronic device under test and the performance board.

  Moreover, even when the overload is applied to the performance board by the pressing means, it is possible to prevent the periphery of the opening of the pressing means from being bent, and the overload can be made effective. Further, the reliability of electrical contact between the electronic device under test and the performance board can be further improved.

Although not particularly limited in the above invention, the test apparatus main body preferably includes a pressing unit that presses the contact unit toward the periphery of the opening (see claim 2).

Although not particularly limited in the above invention, it is preferable that the pressing means presses the contact portion toward the periphery of the opening with a load of 490 [N] or more (see claim 3).

  In order to achieve the above object, according to the present invention, a test apparatus body for testing electrical characteristics of an electronic device under test, a top plate electrically connected to the test apparatus body, and the top plate A performance board electrically connected to the test device, and a pressing means for pressing the electronic device under test against the performance board in order to electrically connect the electronic device under test and the performance board. An electronic component testing apparatus comprising: the testing apparatus main body including urging means for urging the top plate in a direction opposite to the testing apparatus main body side, and the urging means includes the top There is provided an electronic component test apparatus for biasing a plate with a load of 490 [N] or more (see claim 4).

In the present invention, the load of the urging means provided in the test apparatus main body is 490 [N] or more in order to urge the top plate in the direction opposite to the test apparatus main body side. As a result, when carrying out the test of the electronic component, it is possible to prevent the periphery of the opening of the pressing means from being bent by pressing the periphery of the opening of the pressing means through the top plate by the biasing means. The reliability of electrical contact between the electronic component and the performance board can be improved.

  Although not particularly limited in the above invention, the electronic device under test is a semiconductor device formed on a wafer, and the performance board is a probe card having probe needles that are in electrical contact with the electrodes of the semiconductor device. Preferably, the pressing means is a prober capable of gripping and moving the wafer, and the abutting means abuts around an opening of a top plate of the prober (see claim 5). .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic cross-sectional view showing a configuration of an electronic component test apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing a connecting portion between a test head and a prober of the electronic component test apparatus according to an embodiment of the present invention. 3 is an enlarged cross-sectional view of the III part of FIG. 2, FIG. 4 is an enlarged cross-sectional view of the IV part of FIG. 2, and FIG. 5 is an enlarged cross-sectional view of another example of the IV part of FIG.

  The electronic component testing apparatus 1 according to the present embodiment is an apparatus for testing electrical characteristics of an IC device formed on a wafer W. As shown in FIGS. 1 and 2, the electronic component testing apparatus 1 includes a test head 10 electrically connected to a tester 25 for testing an IC device through a cable 26, an IC device on a wafer W, A probe card 50 for electrically connecting the test head 10 and a prober 70 for pressing the wafer W against the probe card 50 are provided.

  The test head 10 incorporates a plurality of pin cards (not shown) for exchanging signals with the IC device, and each pin card is electrically connected to the mother board 11 so as to be detachable. Further, the mother board 11 is electrically connected to the probe card 50 via the top plate 40. The pin card built in the test head 10 supplies, for example, a test signal based on the test pattern to the IC device, and compares the response signal output from the IC device based on the test signal with an expected value based on the expected value pattern. Thus, the quality of the IC device is determined.

  The test head 10 is held by the rotating device 30 so as to be rotatable relative to the prober 70. When the test of the IC device on the wafer W is performed, the test head 10 is rotated by the rotating device 30 and the test head 10 is mounted on the prober 70 (state shown by a solid line in FIG. 1). The device is tested for electrical operation.

  On the other hand, when the pin card (pin electronics) is inspected and / or the probe card 50 is replaced, the test head 10 is rotated 180 degrees relative to the prober 70 by the rotating device 30. The inspection / replacement operation is performed after converting to the state indicated by the two-dot chain line in FIG.

  As shown in FIG. 2, the probe card 50 is connected to the test head 10 via the top plate 40 and the mother board 11. The probe card 50 includes a probe needle 51 that is in electrical contact with an electrode of an IC device formed on the wafer W, a printed circuit board 52 on which the probe needle 51 is mounted, and the probe card 50 on the top plate 40 side. The connector 41 includes a number of connectors 53 for electrical connection to the connector 41 and a stiffener 54 for reinforcing the probe card 50. The probe card 50 in the present embodiment corresponds to an example of a performance board in the claims.

  The probe card 50 is supported by an annular holder 60 so that the probe needle 51 faces downward through the central opening 61. The holder 60 is supported by an annular adapter 65 while supporting the probe card 50, and the adapter 65 is supported by an opening 72 formed in the head plate 71 of the prober 70. The adapter 65 is for adapting the probe card 50 having a different size corresponding to the type of the wafer under test W and the shape of the test head 10 to the opening 72 of the prober 70. As shown in FIG. 2, the probe card 50 and the top plate 40 are mechanically engaged with each other by engaging a hook 42 provided on the lower surface of the top plate 40 and a hook 66 provided on the adapter 65. It is connected.

  Although not particularly illustrated, a plurality of connectors 41 are circumferentially arranged on the lower surface of the top plate 40. As shown in FIG. 2, a coaxial cable is connected to each connector 41. The coaxial cable is electrically connected to the pin card in the test head 10 via the mother board 11. The test head 10 and the probe card 50 are electrically connected by connecting the connector 41 of the top plate 40 and the connector 53 provided on the back surface of the probe card 50. As the connectors 41 and 53, for example, a ZIF (Zero Insertion Force) connector or the like can be used.

  As shown in FIG. 2, the motherboard 11 is provided with a floating unit 12 in order to ensure reproducibility of the connection positions of the top plate 40 and the probe card 50 in the XYZ directions. Although not particularly illustrated, about four floating units 12 are provided on the lower surface of the mother board 11 at substantially equal intervals along the circumferential direction so as to surround the probe card 50.

  As shown in FIG. 3, the floating unit 12 includes a contact portion 13 for contacting the upper surface of the top plate 40, a coil spring 14 for biasing the contact portion 13 downward, a contact portion 13 and a coil. And a cylindrical body 15 accommodating the spring 14.

  The contact portion 13 includes a convex portion 13a that protrudes downward, and an inclined surface 13b that is inclined so as to spread from the convex portion 13a.

  The cylinder 15 has an inner hole 15a that is opened by a lower opening 15b. The inner hole 15a includes an inclined portion 15b that is inclined so as to spread inward from the opening 15b, and a large-diameter portion 15c that has a larger inner diameter than the inclined portion 15b continuously from the inclined portion 15b. ing.

  The abutting portion 13 and the coil spring 14 are accommodated in the inner hole 15a of the cylindrical body 15 so that the convex portion 13a protrudes to the outside from the opening 15b. In the unloaded state, the contact portion 13 is pressed downward by the elastic force of the coil spring 14, and the inclined surface 13 b of the contact portion 13 contacts the inclined portion 15 c of the inner hole 15, so The relative movement of the contact portion 13 is restricted.

  On the other hand, when a load is applied to the contact portion 13 from the outside and the inclined surface 13b of the contact portion 13 is separated from the inclined portion 15c of the inner hole 15 and reaches the large diameter portion 13c, the contact portion 13 contacts the cylindrical body 15. The part 13 can be relatively moved along the XY directions.

  As shown in FIG. 2, the test head 10 in the present embodiment is provided with a pressing device 20 a for applying a load around the opening 72 of the head plate 71 of the prober 70 (in this embodiment, the adapter 65). . Although not particularly illustrated, about four pressing devices 20 a are provided on the upper surface of the test head 10 at substantially equal intervals along the circumferential direction so as to surround the probe card 50.

  As shown in detail in FIG. 4, the pressing device 20 a houses a contact member 21 a that contacts the adapter 65, a coil spring 22 that presses the contact member 21 a toward the prober 70, and the coil spring 22. It is comprised from the cylinder 23 and the supporting member 24 which is supporting the cylinder 23. FIG.

  The abutting member 21 a is made of, for example, a plate-like member, and is fixed to one end of the coil spring 22. The coil spring 22 is accommodated in the inner hole 23 a of the cylindrical body 23 with the other end fixed to the bottom of the inner hole 23 a of the cylindrical body 23. A male screw portion 23 b is formed on the upper outer peripheral surface of the cylindrical body 23. The support member 24 has an L shape with one end fixed to the test head 10, and a through hole 24a is formed at the other end. A female screw is formed on the inner peripheral surface of the through hole, and the male screw portion 23b of the cylindrical body 23 can be screwed together. The four pressing devices 20a provided in the test head 10 can press the adapter 65 with a load of 490 [N] or more, preferably 2000 [N] or more in total, by the elastic force of the coil spring 22 included in each. It is possible.

  As shown in FIG. 5, the pressing device for applying a load around the opening 72 of the head plate 71 may be a plunger-type pressing device 20b. As shown in FIG. 4, the pressing device 20b is spherical in that the contact member 21b is spherical and the periphery of the inner hole 23a of the cylindrical body 23 protrudes inward to form a protruding portion 23c. This is different from the pressing device 20a shown in FIG. In the no-load state, the contact member 21b is pressed downward by the elastic force of the coil spring 22 and is in contact with the protrusion 23c. In this state, a part of the contact member 21b protrudes from the cylindrical body 23 to the outside. Yes. Also in this case, the four pressing devices 20b provided in the test head 10 have a total load of 490 [N] or more, preferably 2000 [N] or more, due to the elastic force of the coil springs 22 provided in each. The adapter 65 can be pressed.

  The prober 70 can hold the wafer W by a vacuum chuck and has a transfer arm 73 that can move the held wafer W in the XYZ directions. It is possible to convey from inside to inside. During the test, the tester 25 is applied to the IC device formed on the wafer W in a state where the transfer arm 73 is pressed against the probe card 50 facing the prober 70 through the opening 72. The IC device is tested by inputting and outputting test signals via the test head 10.

  In the electronic component testing apparatus 1 according to the present embodiment, when the test head 10 is positioned on the prober 70 by the rotating device 30, the contact member 21a of the pressing device 20a is brought into contact with the adapter 65 of the prober 70, The weights of the test head 10 and the mother board 11 are hung on the head plate 71 of the prober 70. Thus, when the IC device is tested, it is possible to prevent the head plate 71 from being bent upward due to the pressing of the wafer W by the prober 70, and electrical contact between the IC device and the probe card 50 can be prevented. Reliability is improved.

  Further, even when overloading the probe card 50 by the transfer arm 73, it is possible to prevent the head plate 71 from being bent upward, so that the overload can be made effective and the IC device. The reliability of electrical contact between the probe card 50 and the probe card 50 can be further improved.

The embodiment described above is described in order to facilitate understanding of the present invention, and is not described in order to limit the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, the floating unit 12 usually has only a pressing force that can hold the top plate 40 (for example, about 390 [N]), but the pressing force of the floating unit 12 is preferably 490 [N] or more, preferably By setting 2000 to [N], the same effect as when the pressing devices 20a and 20b are provided can be obtained.

FIG. 1 is a schematic cross-sectional view showing a configuration of an electronic component testing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing a connection portion between a test head and a prober of the electronic component test apparatus according to the embodiment of the present invention. FIG. 3 is an enlarged cross-sectional view of a portion III in FIG. FIG. 4 is an enlarged cross-sectional view of a portion IV in FIG. FIG. 5 is an enlarged cross-sectional view of another example of the IV part of FIG. FIG. 6 is a schematic cross-sectional view showing a connecting portion between a test head and a prober of a conventional electronic component testing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic component test apparatus 10 ... Test head 11 ... Mother board 12 ... Floating unit 20a, 20b ... Pressing device 25 ... Tester 30 ... Rotating device 40 ... Top plate 50 ... Probe card 65 ... Adapter 70 ... Prober 71 ... Head plate 72 ... Opening W ... wafer

Claims (5)

A test apparatus body for testing the electrical characteristics of the electronic component under test;
A performance board for electrically connecting the electronic device under test and the test apparatus main body;
A pressing means for pressing the electronic device under test against the performance board in order to electrically connect the electronic device under test and the performance board;
The test apparatus main body includes an abutting means for abutting around an opening formed in the pressing means for attaching the performance board to the pressing means.   The electronic device test apparatus according to claim 1, wherein the test apparatus main body includes a pressing unit that presses the contact unit toward the periphery of the opening.   The electronic component testing apparatus according to claim 2, wherein the pressing unit presses the contact unit toward the periphery of the opening with a load of 490 [N] or more. A test apparatus body for testing the electrical characteristics of the electronic component under test;
A top plate electrically connected to the test apparatus body;
A performance board electrically connected to the test apparatus via the top plate;
A pressing means for pressing the electronic device under test against the performance board in order to electrically connect the electronic device under test and the performance board;
The test apparatus body includes an urging means for urging the top plate in a direction opposite to the test apparatus body side,
The biasing means is an electronic component testing apparatus that biases the top plate with a load of 490 [N] or more. The electronic device under test is a semiconductor device formed on a wafer,
The performance board is a probe card having a probe needle that electrically contacts an electrode of the semiconductor device,
The pressing means is a prober capable of gripping and moving the wafer,
The electronic component testing apparatus according to claim 1, wherein the abutting means abuts around an opening of a top plate of the prober.

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