CN217484381U

CN217484381U - Probe card

Info

Publication number: CN217484381U
Application number: CN202220072804.2U
Authority: CN
Inventors: 李龙
Original assignee: Yangtze Memory Technologies Co Ltd
Current assignee: Yangtze Memory Technologies Co Ltd
Priority date: 2022-01-12
Filing date: 2022-01-12
Publication date: 2022-09-23
Anticipated expiration: 2032-01-12

Abstract

The mother board comprises a first circuit board, wherein the mother board is detachably connected with the daughter board, and when the mother board is connected with the daughter board, the first circuit board is electrically connected with the second circuit board. According to the probe card, the probe part easy to damage is separated from other parts and respectively used as the daughter board and the master board, and the daughter board is replaced after the probe is damaged to realize maintenance of the probe card, so that the cost is reduced.

Description

Probe card

Technical Field

The utility model relates to a semiconductor test technical field, in particular to probe card.

Background

The semiconductor manufacturing process generally includes integrated circuit design, wafer fabrication, wafer test, wafer dicing, chip packaging, and finished chip test. Wafer testing can select functional chips from a wafer in advance, and wafer testing is mainly performed by using a dedicated tester, and a probe card with a plurality of probes is usually used in testing. The probe card is a test interface, and is mainly used for testing a bare chip, connecting a test machine and a chip through the probe card, transmitting signals and testing parameters of the chip. When testing, the probe on the probe card is directly contacted with the welding pad or the convex block on the chip to lead out the chip signal, and then the aim of automatic measurement is achieved by matching with the peripheral test instrument and software control.

The probe card is used as an important consumable part in a semiconductor development stage, when the probe card is used for testing a wafer, a needle point of the probe card is easily damaged, and if the needle point is damaged in use, the probe card needs to be sent back to a supplier for maintenance, however, the supplier generally needs to be in a different place, and the time from sending out the maintenance to sending back after the maintenance is carried out generally takes 4-7 days, so that the development progress of a product is seriously influenced, and the development cost is increased virtually. Therefore, when purchasing the probe card, two copies are generally purchased, one set of the probe card is reserved for standby, but the number and arrangement of the probes in the probe card are different for different research and development products, so that different probe cards are required, and the cost of the probe card is further increased.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, an object of the present invention is to provide a probe card, in which a probe portion that is easily damaged is separated from other portions to be used as a daughter board and a mother board, respectively, and the daughter board is replaced after the probe is damaged to implement maintenance of the probe card, thereby reducing cost.

According to an aspect of the present invention, there is provided a probe card, including master and subplate, the subplate includes the second circuit board, is located the probe frame and the probe of second circuit board first surface, the master includes the first circuit board, wherein, the master with the connection can be dismantled to the subplate, and during the connection, the first circuit board is connected with the second circuit board electricity.

Optionally, the first surface or the second surface of the second circuit board further includes a plurality of second pads, and the second pads are arranged along an edge of the second circuit board; the second surface or the first surface of the first circuit board further comprises a plurality of fourth bonding pads, and when the daughter board is connected with the master board, the second bonding pads are in one-to-one correspondence with the fourth bonding pads in position and are electrically connected with the fourth bonding pads.

Optionally, the fourth pad comprises a pogo pin, a conductive hemisphere.

Optionally, the second surface or the first surface of the first circuit board further includes a plurality of grooves, and the grooves are distributed along the edge of the fourth pad; the second circuit board further comprises a plurality of second through holes, screws are arranged in the second through holes, and when the daughter board is connected with the mother board, the screws penetrate through the second through holes and the grooves.

Optionally, the second surface or the first surface of the first circuit board further includes a plurality of positioning pins, and the positioning pins are distributed along an edge of the fourth pad; the second circuit board further comprises a plurality of third through holes, and when the daughter board is connected with the master board, the positioning pins penetrate through the third through holes to limit the position relation between the daughter board and the master board.

Optionally, the first surface of the second circuit board further includes a plurality of first pads, the first pads are arranged around the probe frame and fix one end of the probe, and the plurality of first pads are respectively in one-to-one correspondence with the plurality of second pads and electrically connected to the plurality of second pads.

Optionally, the first circuit board includes a first through hole thereon, and the through hole is configured to accommodate the probe frame when the first surface of the second circuit board is connected to the second surface of the first circuit board.

Optionally, the second surface of the first circuit board further includes a plurality of connectors, a plurality of third pads are formed at positions of the first surface of the first circuit board corresponding to the connectors, the plurality of third pads are electrically connected to the connectors, and the plurality of third pads further correspond to the plurality of fourth pads one to one and are electrically connected to the plurality of fourth pads.

Optionally, the second surface of the first circuit board further comprises a plurality of reinforcing ribs.

Optionally, the method further comprises: the safety cover, the safety cover is including the first portion that is connected, second part and block portion, and block portion connects the first portion with on at least one side of second part, block portion is under the block state, the first portion and the second portion of safety cover respectively with the both sides laminating of circuit board, a plurality of probes all are located in the safety cover.

The utility model provides a probe card, through the probe part with in the probe card separately the preparation with other parts, as the sub-version and the mother set of probe card respectively, after the probe of sub-version damages, only need to change the maintenance that sub-version just can realize the probe card, owing to only change sub-version to the cost of probe card has been reduced.

Furthermore, for different types of chips to be tested, testing can be realized by replacing different numbers and arrangement of the probe sub-plates, and the cost can be further reduced by adopting the probe card when the types of the chips to be tested are more because the template does not need to be replaced.

The utility model provides a probe card, sub version and master are realized fixedly through the screw, and are easy and simple to handle, owing to do not use connector element, consequently do not need paster and reflow soldering process, and the cost is lower.

The utility model provides a probe card still includes the safety cover for the protection probe does not receive the damage or reduces the damage.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

fig. 1a to 1c illustrate a bottom view, a top view and a side view of a probe card according to the prior art;

figure 2a shows a top view of a probe card according to a first embodiment of the present invention;

fig. 2b and 2c show side views of a probe card according to a first embodiment of the present invention;

figure 3a shows a top view of a master plate of a probe card according to a first embodiment of the invention;

fig. 3b and 3c show bottom and top views of a sub-version of a probe card according to a first embodiment of the present invention;

fig. 4 illustrates a side view showing a probe card according to a second embodiment of the present invention;

fig. 5a and 5b show a protective cover structure view of a probe card according to the present invention.

Detailed Description

Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by the same or similar reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, article, or apparatus that comprises the element.

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples.

Fig. 1a to 1c illustrate a probe card according to the related art in a bottom view, a top view, and a side view.

Referring to fig. 1a to 1c, the probe card 100 includes a circuit board 111 (printed circuit board), a probe frame 112 soldered on the circuit board 111, first pads 113 soldered around the probe frame 112, and a plurality of probes 114 distributed around the probe frame 112 and connected to the probe frame 112 and the first pads 113.

The structure of the probe card 100 can refer to the structure of the prior art, then the probes 114 are distributed on a first surface, for example, the surface a, of the circuit board 111, one ends of the probes 114 are soldered and fixed on the first surface of the circuit board 111 by the first pads 113, the plurality of first pads 113 around the probe frame 112 form at least one ring structure around the probe frame 112, the first pads 113 fixedly connect one ends of the probes 114, the other ends of the probes 114 are movably fixed by the probe frame 112, and one ends of the probes 114 fixed by the probe frame 112 contact with pads of the bare chip during testing.

A plurality of second bonding pads 115 are further formed on the first surface of the circuit board 111, and the plurality of second bonding pads 115 are distributed in an array form and are electrically connected to the first bonding pads 113 respectively.

A connector 116 and a rib 117 are provided on the second surface (surface B) of the circuit board 111, and the connector 116 is electrically connected to the second land 115 on the first surface of the circuit board 111 and can be connected to an external tester. The driving signal of the tester is received by the connector 116, and is transmitted to the die to be tested through the connector 116, the second pad 115, the first pad 113 and the probe 114.

The distribution of the probes 114 on the circuit board 111 is arranged along the probe frame 112, and only a part of the probes 114 is shown in fig. 1 a. Of course, the distribution of the probes 114 matches the type of actual probe card and the distribution of the pads of the die to be tested, and is merely an example.

In this embodiment, the connection points of the first bonding pads 113 are correspondingly connected with the connection points of the second bonding pads 115 in the connector 116 (not shown in the figure), and the connector 116 receives a driving signal from an external testing machine, and reaches the die to be tested through the second bonding pads 115, the first bonding pads 113 and the probes 114, so as to drive the die to be tested, thereby realizing the testing and data collection of the die to be tested. In the probe card shown in fig. 1a to 1c, if the probe 114 is damaged, the entire probe card 100 cannot be used any more and needs to be repaired, and if the spare probe card is also damaged, the entire development process is affected.

Figure 2a shows a top view of a master plate of a probe card according to a first embodiment of the invention;

fig. 2b and 2c show top and bottom views of a sub-version of a probe card according to a first embodiment of the present invention; figure 3a shows a top view of a probe card according to a first embodiment of the present invention;

fig. 3b and 3c show side views of a probe card according to a first embodiment of the present invention. Wherein the first surface is seen from the bottom view in the direction of arrow a in fig. 3B and the second surface is seen from the top view in the direction of arrow B.

Referring to fig. 2a to 2c, a probe card 200 of the present application includes a master 210 and a sub-plate 220, wherein, at a corresponding position of the master 210, there is an area detachably connected to the sub-plate 220.

In this embodiment, the motherboard 210 includes a first circuit board 211, a connector 216 on one side of the second surface (B) of the first circuit board 211, and a stiffener 217, wherein the connector 216 is used for connecting with a testing machine to obtain a test signal. On the other side of the second surface of the first circuit board 211, which is a region connected to the sub-board 220, includes a first through hole 214, and fourth pads 213 distributed around the first through hole 214, alignment pins 212 distributed around the first through hole 214, and a groove 215.

Further, on the first surface (a) of the master 210, a plurality of third pads (refer to fig. 1a) are formed at positions corresponding to the connectors 216, the third pads being electrically connected to the connectors.

In this embodiment, the fourth pad 213 is, for example, a pogo pin, a conductive hemisphere.

The sub-board 220 includes a second circuit board 224, a second via hole (not shown) and a third via hole 225 located at an edge of the second circuit board 224 and penetrating the second circuit board 224, and a probe frame 221 located on a first surface (a surface) of the second circuit board 224, a first pad 222 forming a ring around the probe frame 221, and a second pad 226 forming a ring around an edge of the second circuit board 224, as shown in fig. 2 b. Further, around the probe frame 221, a plurality of probes 227 are further included, and one end of each probe 227 is fixedly connected to the first pad 222, and the other end is movably connected to the probe frame.

The first pads 222 and the second pads 226 correspond to each other one by one and are electrically connected to each other, and the second and third vias 225 are located at positions that do not affect the electrical connection between the first pads 222 and the second pads 226. On the second surface (B) of the sub-plate 220, a screw 223 passes through the second through-hole, as shown in fig. 2 c.

Further, referring to fig. 3a to 3c, schematic diagrams and top views of the process of fixing the daughter board 220 and the master board 210 are shown. The first through hole 214 on the master 210 is at least used for accommodating a probe frame 221 on a first surface (a) of the sub-plate 220, and further, can be used for accommodating a first pad 222, so that after the sub-plate 220 is connected with the master 210, the first surface of the sub-plate 220 is located on a second surface of the master 210.

Specifically, the positions of the second through holes on the sub-plate 220 correspond to the positions of the grooves 215 on the master plate 210 one by one, the positions of the third through holes 225 on the sub-plate 220 correspond to the positions of the positioning pins 213 on the master plate 210 one by one, and the positions of the second pads 226 on the sub-plate 220 correspond to the positions of the fourth pads 213 on the master plate 210 one by one. In the process of connecting the sub-plate 220 with the master plate 210, the positioning pins 212 on the master plate 210 are first passed through the third through holes 225 of the sub-plate 220, and then the master plate 210 and the sub-plate 220 are fixed by using screws 223 in the second through holes of the sub-plate 220.

After the sub-plate 220 and the master plate 210 are connected, as shown in fig. 3a to 3c, the probe frame 221 and the probe 227 on the sub-plate 220 are both located in the first through hole 214 of the master plate 210, and the probe can be protected to a certain extent. In addition, the fourth pads 213 of the master 210 correspond to the second pads 226 of the daughter board 220 one by one, so that after the daughter board 220 is fixedly connected to the master 210, the fourth pads 213 are in contact with the second pads 226 to achieve electrical connection, and when the probe card 200 is used, the connector 216 obtains a test signal from a tester, and the test signal reaches the probes 227 through the third pads, the fourth pads 213, the second pads 226 and the first pads 222 corresponding to the connector 216, so as to achieve testing of the chip to be tested. Preferably, the fourth pad 213 uses a pogo pin, so that when the surface of the sub-plate 220 is not flat, the fourth pad 213 and the second pad 226 can be electrically connected.

In other embodiments, the shapes of the second circuit board 224 of the daughter board 220 and the first through hole 214 of the mother board 210 may also be circular, trapezoidal, and other shapes.

In addition, for different chips to be tested, the number and arrangement of the probes in the probe card to be adopted can be changed, in the application, different types of sub-versions can be manufactured according to different chips to be tested, and when testing is performed, the testing of the chips to be tested of different types can be realized only by replacing the sub-versions, so that the cost is saved, and the research and development progress is improved.

Fig. 4 illustrates a side view showing a probe card according to a second embodiment of the present invention. Compared with the first embodiment, the probe card master plate in the second embodiment has no first through holes.

Referring to fig. 4, on a first surface of the sub-plate 220, a probe frame 221, a plurality of probes 227, and a plurality of first pads are included, and on a second surface of the sub-plate 220, a plurality of second pads are formed, the first pads corresponding to the second pads one to one and connected to the second pads. Wherein one end of the plurality of probes 227 is connected to the first pad and the other end is connected to the probe frame.

A plurality of fourth pads corresponding to the second pads of the daughter board 220 one to one are formed on the first surface of the master 210, and after the daughter board 220 and the master 210 are detachably fixed by screws 223, the plurality of second pads on the second surface of the daughter board 220 correspond to and are electrically connected to the plurality of fourth pads on the first surface of the master 210 one to one, so that the transmission of electrical signals between the daughter board 220 and the master 210 is realized.

In other embodiments, the daughter board 220 may also be connected to the second surface of the master 210, and at this time, the fourth pads on the master 210 are located on the second surface of the master 210.

Fig. 5a and 5b show a protective cover structure view of a probe card according to the present invention. Among other things, the protective cover 234 serves to protect the probe from damage.

Referring to fig. 5a and 5b, the protective cover 230 includes a connection portion 234, first and

second portions

235 and 231, and a catching portion. The engaging portion includes an embedded portion 232 connected to one of the first portion 235 and the second portion 231, and an accommodating portion 233 connected to the other of the first portion 235 and the second portion 231, the embedded portion 232 is matched with the accommodating portion 233, and the embedded portion 232 is embedded in the accommodating portion 233 in the engaging state of the engaging portion.

When the protective cover 230 protects the probe card 100, the first portion 235 and the second portion 231 are respectively distributed on both sides of the circuit board 211, i.e., the first portion 235 and the second portion 231 are respectively in contact with both surfaces of the first circuit board 211, and the plurality of probes 227 are all located inside the protective cover 230 (see fig. 5 a).

The utility model provides a probe card is through separately making with the probe part in the probe card with other parts, as the sub version and the master of probe card respectively, after the probe of sub version damages, only needs to change the maintenance that sub version just can realize the probe card, owing to only change sub version to the cost of probe card has been reduced.

The utility model provides a probe card, sub version and mother set realize fixedly through the screw, and are easy and simple to handle, owing to do not use the connector element, consequently do not need paster and reflow soldering process, and the cost is lower.

In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and its various embodiments with various modifications as are suited to the particular use contemplated. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. The probe card is characterized by comprising a master plate and a daughter plate, wherein the daughter plate comprises a second circuit board, a probe frame and a probe, the probe frame and the probe are positioned on the first surface of the second circuit board, the master plate comprises a first circuit board, the master plate and the daughter plate are detachably connected, and when the master plate and the daughter plate are connected, the first circuit board is electrically connected with the second circuit board.

2. The probe card of claim 1, wherein the first surface or the second surface of the second circuit board further comprises a plurality of second pads, the second pads being arranged along an edge of the second circuit board;

the second surface or the first surface of the first circuit board further comprises a plurality of fourth bonding pads, and when the daughter board is connected with the master board, the second bonding pads are in one-to-one correspondence with and electrically connected with the fourth bonding pads.

3. The probe card of claim 2 wherein the fourth pad comprises a pogo pin, a conductive hemisphere.

4. The probe card of claim 2, further comprising a plurality of grooves on the second surface or the first surface of the first circuit board, the grooves being distributed along an edge of the fourth pad;

the second circuit board further comprises a plurality of second through holes, screws are arranged in the second through holes, and when the daughter board is connected with the mother board, the screws penetrate through the second through holes and the grooves.

5. The probe card of claim 4, further comprising a plurality of positioning pins on the second surface or the first surface of the first circuit board, the plurality of positioning pins being distributed along an edge of the fourth pad;

the second circuit board further comprises a plurality of third through holes, and when the daughter board is connected with the master board, the positioning pins penetrate through the third through holes to limit the position relation between the daughter board and the master board.

6. The probe card of claim 2, further comprising a plurality of first pads on the first surface of the second circuit board, the first pads being arranged around the probe frame and fixing one end of the probe, the plurality of first pads corresponding to and electrically connected to the plurality of second pads, respectively.

7. The probe card of claim 2, wherein the first circuit board includes a first through hole therein for receiving the probe frame when the first surface of the second circuit board is coupled to the second surface of the first circuit board.

8. The probe card of claim 2, wherein the second surface of the first circuit board further comprises a plurality of connectors, a plurality of third pads are formed on the first surface of the first circuit board at positions corresponding to the connectors, the plurality of third pads are electrically connected to the connectors, and the plurality of third pads are further in one-to-one correspondence with and electrically connected to the plurality of fourth pads, respectively.

9. The probe card of claim 8, wherein the second surface of the first circuit board further comprises a plurality of ribs.

10. The probe card of claim 1, further comprising: the safety cover, the safety cover is including the first portion that is connected, second portion and block portion, and block portion connects the first portion with on at least one side of second portion, block portion is under the block state, the first portion and the second portion of safety cover respectively with the both sides laminating of circuit board, a plurality of probes all are located in the safety cover.