CN100357903C - Detest apparatus and detest method - Google Patents

Detest apparatus and detest method Download PDF

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Publication number
CN100357903C
CN100357903C CNB2004100321776A CN200410032177A CN100357903C CN 100357903 C CN100357903 C CN 100357903C CN B2004100321776 A CNB2004100321776 A CN B2004100321776A CN 200410032177 A CN200410032177 A CN 200410032177A CN 100357903 C CN100357903 C CN 100357903C
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CN
China
Prior art keywords
socket
electrically connected
test
proving installation
circuit
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Expired - Fee Related
Application number
CNB2004100321776A
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Chinese (zh)
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CN1677358A (en
Inventor
江润成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pegatron Corp
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Asustek Computer Inc
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Publication date
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Priority to CNB2004100321776A priority Critical patent/CN100357903C/en
Publication of CN1677358A publication Critical patent/CN1677358A/en
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Publication of CN100357903C publication Critical patent/CN100357903C/en
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Abstract

The present invention provides a testing device which is used for testing whether an electronic element is exactly connected with a circuit board. The present invention comprises an adaptor board, at least one connecting line and at least one circuit testing board, wherein the adaptor board is provided with at least one adaptor element, and the adaptor element is electrically connected with the electronic element; the first end of the connecting line is electrically connected with the adaptor board; the circuit testing board is electrically connected with the second end of the connecting line; the circuit testing board also comprises at least one testing contact, and the testing contact is electrically connected with the adaptor element; additionally, the present invention also provides a testing method for testing whether the electronic element is exactly connected with the circuit board. When the known electronic elements are tested, the testing device and the testing method of the present invention solve the problems that when a testing unit and the adapter board are tested, the adapter board and the testing unit are damaged caused by big pressure because the pin number of chips is increased.

Description

The method of proving installation and connection proving installation
Technical field
The present invention is about the method for a kind of proving installation and connection proving installation, especially has a circuit test plate, the test contacts of socket can be transferred on the circuit test plate and test, whether correctly be electrically connected in the method for the proving installation and the connection proving installation of computer main frame panel to confirm socket.
Background technology
Whether general computer main frame panel needs in process of production through a series of test procedure, serve as normal with each function of authenticating computer motherboard.
In the process of test central processing unit CPU socket, known technology is at each time test procedure, after all socket need cpu chip being inserted in before beginning test and finishing test cpu chip is pulled away socket, if Plug Action accidentally, tends to cause stitch on the cpu chip by bending or fracture.
Afterwards, when testing, produced the situation of a large amount of losses, substituted cpu chip with a chip card extender usually, to test in order to reduce cpu chip.Card extender then has electrically conduct a little identical with cpu chip, and then the switching pin of chip card extender is inserted on the CPU socket.Thus, in test procedure, being plugged repeatedly just becomes card extender but not cpu chip in CPU socket.
As shown in Figure 1, CPU socket (socket) 11 welderings are located on the computer main frame panel 12, and CPU socket 11 has a plurality of first jacks 111.In the known technology, whether be electrically connected in computer main frame panel 12 exactly, utilize a card extender 13 to assist to test in order to test CPU socket 11.Have contact on the card extender 13, for example: a side of card extender 13 has switching pin 131, and its first jack 111 with CPU socket 11 is corresponding, and the opposite side of card extender 13 has second jack 132 that is communicated with the switching pin.
And test cell 14 has and second jack, 132 corresponding microprobes 141 (micro-probe), during test, microprobe 141 is inserted and is touched in second jack 132 of card extender 13, comes CPU socket 11 on the detection computations machine host plate 12 with this, and whether conducting is normal for its relevant effect.
But along with cpu chip pin number purpose increases, switching pin 131 on the card extender 13 and second jack, 132 numbers also increase thereupon.On fixing card extender 13 areas, the aperture of second jack 132 is also more and more trickle.This makes when testing; it is excessive to insert the pressure touch in the microprobe 141 of second jack 132; regular meeting causes fracture phenomenon in second jack 132 of the elongated syringe needle of microprobe 141; not only test cell 14 is impaired; even CPU socket 11 and card extender 13 also can come to harm; make the process of test to carry out smoothly, also reduced the serviceable life of card extender 13.
In addition, contact on the known card extender 13, also can make the form of electric contact mat (Pad), the electric contact mat of card extender 13 1 sides contacts with the shell fragment of CPU socket 11, and the electric contact mat of the opposite side of card extender 13, then can be used as the contact that contacts with the microprobe 141 of test cell 14, and the electric contact mat conducting each other of card extender 13 both sides.Yet card extender 13 with electric contact mat, owing to will contact just with shell fragment and can test, therefore when test, still need to apply sizable pressure, electric contact mat is closely contacted with shell fragment, but thus, then cause CPU socket 11 and card extender 13 stressed excessive again easily, and then cause breakage.
Because the problems referred to above, the inventor urgently thinks a kind of stitch number that can solve because of cpu chip to be increased, and makes CPU socket test difficult " method of proving installation and connection proving installation ".
Summary of the invention
Because above-mentioned problem, purpose of the present invention provides a kind of proving installation and connects the method for proving installation, especially has a circuit test plate, the test contacts of this socket is transferred on the circuit test plate and tests, and whether correctly is electrically connected in the method for the proving installation and the connection proving installation of computer main frame panel to confirm socket.
For reaching above-mentioned purpose, according to proving installation of the present invention, test a socket and whether accurately be connected in a circuit board, comprise a card extender, at least one conductive connecting line and at least one circuit test plate.Wherein, card extender has at least one switching element, and switching element and socket are electrically connected; One first end and the card extender of conductive connecting line are electrically connected; One second end of circuit test plate and conductive connecting line is electrically connected, and the circuit test plate more comprises at least one test contacts, and test contacts and switching element are electrically connected.
For reaching above-mentioned purpose, the method of connection proving installation of the present invention, test a socket and whether accurately be connected in a circuit board, comprise a card extender and socket are electrically connected, one first end of a conductive connecting line is electrically connected in card extender, conductive connecting line one second end and be electrically connected in a circuit test plate and a test cell and this circuit test plate and be electrically connected.
From the above, the method of proving installation of the present invention and connection proving installation, has at least one circuit test plate, can will be electrically connected in the test contacts of the card extender of socket, utilize being electrically connected of conductive connecting line, be transferred on the circuit test plate, directly on the circuit test plate, whether test jack correctly is electrically connected in computer main frame panel in order to test cell.Compared to the prior art, the method of proving installation of the present invention and connection proving installation, when having improved known socket test, can be because the stitch number of chip increases, make when test cell and card extender are tested that pressure is too big and make card extender and the impaired problem of test cell.Because the method for proving installation of the present invention and connection proving installation with the test contacts on the card extender, is transferred at least one circuit test plate and is tested.Therefore, under the too many situation of the contact that socket need be tested, can utilize conductive connecting line to test respectively at the circuit test plate more than two.In addition, the circuit test plate more can be arranged on the support frame, and support frame is striden and is located on the socket, and therefore, test cell can directly be tested the circuit test plate in the top, position of original socket, can not occupy the space of other socket.
Description of drawings
The synoptic diagram of the proving installation of the CPU socket that Fig. 1 is known;
The synoptic diagram of Fig. 2 proving installation of the present invention;
The synoptic diagram of Fig. 3 card extender of the present invention, conductive connecting line and circuit test plate;
Another synoptic diagram of Fig. 4 card extender of the present invention, conductive connecting line and circuit test plate;
The synoptic diagram of Fig. 5 socket of the present invention and circuit test plate;
Another synoptic diagram of Fig. 6 proving installation of the present invention;
The process flow diagram of the method for Fig. 7 connection proving installation of the present invention; And
Another process flow diagram of the method for Fig. 8 connection proving installation of the present invention.
Symbol description among the figure:
11 CPU sockets
111 first jacks
12 computer main frame panels
13 card extenders
131 switching pin
132 second jacks
14 test cells
141 microprobes
2 proving installations
21 sockets
211 shell fragments
212 lids
213 pedestals
214 handles
Cover gab on 215
22 circuit boards
23 card extenders
231 switching elements
24 conductive connecting lines
241 first ends
242 second ends
25 circuit test plates
251 first surfaces
252 test contacts
253 second surfaces
26 supporting frames
261 openings
27 test cells
28 monitoring means
A conductive connecting line of P1 and a card extender are electrically connected program
A conductive connecting line of P2 and a circuit test plate are electrically connected program
P3 card extender and socket are electrically connected program
P4 test cell and circuit test plate are electrically connected program
S30 socket and card extender fixing step
S31 circuit test plate positioning step
Embodiment
For making content of the present invention easier to understand,, the preferred embodiment of the method for proving installation of the present invention and connection proving installation is described hereinafter with reference to relevant drawings.
Please refer to Fig. 2 to Fig. 6, so that a preferred embodiment of proving installation 2 of the present invention to be described.
As shown in Figure 2, proving installation 2 is tested a socket 21 and whether accurately is connected in a circuit board 22, and proving installation 2 comprises a card extender 23, at least one conductive connecting line 24 and at least one circuit test plate 25.
Among Fig. 2, socket 21 is connected in circuit board 22, and socket 21 can be a socket (Socket), and socket 21 is an example with the CPU socket in the mobile computer in the present embodiment.In the present embodiment, socket 21 has plural shell fragment 211.
As Fig. 3 and shown in Figure 2, card extender 23 has at least one switching element 231, and switching element 231 is electrically connected with socket 21.In the present embodiment, card extender 23 comes test jack 21 whether accurately to be connected in circuit board 22 in order to replace chip.So card extender 23 has the firing point identical with chip, can be electrically connected with socket 21.
Wherein, at least a portion of switching element 231 is the conductive region that is exposed to card extender 23, and in the present embodiment, the two ends of switching element 231 are all electric contact mat (pad), and the shell fragment 211 of an end and socket is in contact with one another, and the other end is connected with conductive connecting line 24.Certainly, an end of switching element 231 also can be switching pin or the probe that protrudes from card extender 23, and this end inserts socket 21.In addition, an end of switching element 231 also can be a via, is in contact with one another with the shell fragment 211 with socket 21 protrusions.
Please refer to Fig. 4, one first end 241 and the card extender 23 of conductive connecting line 24 are electrically connected, and conductive connecting line 24 be a flexible circuit (Flexible print circuit, FPC) or an electronics line.And flexible circuit a kind ofly has height reliability and a flexual P.e.c. with what mylar or poly-imines were that base material is made.One second end 242 of conductive connecting line 24 is electrically connected with a first surface 251 of circuit test plate 25.
Please refer to Fig. 3 again, circuit test plate 25 has a test contacts 252 at least, and test contacts 252 is one to be exposed to a conductive region of circuit test plate 25.Test contacts 252 is positioned at a second surface 253 of circuit test plate 25, and the first surface 251 of circuit test plate 25 and second surface 253 are relative and establish, and test contacts 252 is electrically connected with switching element 231.
The socket 21 of present embodiment as shown in Figure 5, is fixed in circuit board 22, and socket 21 has more a lid 212, a pedestal 213, leader 214, reaches cover gab 215 on.
Card extender 23 is placed on the shell fragment 211 of socket 21, make socket 21 be connected, and socket 21 has with switching element 231 and is electrically connected with card extender 23.When socket 21 with after card extender 23 is connected, cover lid 212, and utilize handle 214 that lid 212 is fastened on pedestal 213, then card extender 23 is fixed in socket 21.
As shown in Figure 6, in the present embodiment, proving installation 2 more comprises a supporting frame 26, and supporting frame 26 is crossed over sockets 21 and in being arranged at circuit board 22.Supporting frame 26 has an opening 261, and 24 of conductive connecting lines that are connected in card extender 23 are connected with circuit test plate 25 via opening 261, and circuit test plate 25 is positioned on the supporting frame 26.Therefore, supporting frame 26 support circuit test boards 25 make circuit test plate 25 be positioned at the top of socket 21, and the second surface 253 that circuit test plate 25 has a test contacts 252 up, in order to the carrying out of testing procedure.
In the present embodiment, more comprise an at least one test cell 27 and a monitoring means 28, test cell 27 is electrically connected with monitoring means 28.When wanting test jack 21 whether accurately to be connected in circuit board 22, test cell 27 is electrically connected with test contacts 252, and with the monitoring means 28 that test cell 27 is electrically connected, promptly can confirm the state that is electrically connected of socket 21, whether normal with circuit board 22 conductings.
Then, please refer to Fig. 3 to Fig. 8, with the preferred embodiment of method that connection proving installation of the present invention is described.
As shown in Figure 7, comply with the method for the connection proving installation of preferred embodiment of the present invention, test a socket and whether accurately be connected in a circuit board.The method that connects proving installation comprises conductive connecting line and a card extender and is electrically connected program P1, conductive connecting line and a circuit test plate and is electrically connected program P2, card extender and socket and is electrically connected program P3 and test cell and circuit test plate and is electrically connected program P4.
Socket is connected in circuit board, and socket can be a socket (Socket), and socket is an example with the CPU socket in the mobile computer in the present embodiment.
Be electrically connected among the program P1 in as shown in Figure 7 a conductive connecting line and a card extender, one first end 241 of conductive connecting line 24 is electrically connected in card extender 23 (as shown in Figure 4).Conductive connecting line 24 be a flexible circuit (Flexible print circuit, FPC) or an electronics line.In the present embodiment, conductive connecting line 24 is the electronics line, utilizes the mode of welding that first end 241 of conductive connecting line 24 is connected with test contacts on the card extender 23.
As Fig. 3 and shown in Figure 2, card extender 23 has at least one switching element 231, and switching element 231 is electrically connected with socket 21.Wherein, at least a portion of switching element 231 is a conductive region that is exposed to card extender 23, and in the present embodiment, switching element 231 is an electric contact mat (pad) pad, is in contact with one another with the shell fragment 211 with socket.Certainly, an end of switching element 231 also can be switching pin or the probe that protrudes from card extender 23, and this end inserts socket 21.In addition, an end of switching element 231 also can be a via, is in contact with one another with the shell fragment 211 with socket 21 protrusions.
Be electrically connected among the program P2 in as shown in Figure 7 a conductive connecting line and a circuit test plate, one second end 242 of conductive connecting line 24 is electrically connected in a circuit test plate 25.Please refer to Fig. 4, circuit test plate 25 is electrically connected in one second end 242 of a first surface 251 with conductive connecting line 24.
Please refer to Fig. 3, circuit test plate 25 more comprises at least one test contacts 252, and test contacts 252 is one to be exposed to a conductive region of circuit test plate 25.Test contacts 252 is positioned at circuit test plate 25 1 second surfaces 253, and the first surface 251 of circuit test plate 25 and second surface 253 are relative and establish, and test contacts 252 is electrically connected with switching element 231.
Be electrically connected among the program P3 in as shown in Figure 7 card extender and socket, as shown in Figure 2, place by card extender 23 on the shell fragment 211 of socket 21, card extender 23 is electrically connected with socket 21.Switching element 231 also is electrically connected with socket 21 simultaneously.After having finished card extender and socket and being electrically connected program P3, then circuit test plate 25 also is electrically connected with socket 21, and test cell and the circuit test plate that then carry out as shown in Figure 7 this moment are electrically connected program P4.
As shown in Figure 8, the method for connection proving installation of the present invention more can comprise a socket and card extender fixing step S30.Please refer to Fig. 5, socket 21 is fixed in circuit board 22, and socket 21 has a lid 212, a pedestal 213, leader 214, reaches cover gab 215 on.Be connected in the conductive connecting line 24 of card extender 23, pass the last cover gab 215 on the lid 212, just lid 212 is covered, utilize handle 214 to withhold pedestal 213 again, to finish socket and card extender fixing step S30.
The method of connection proving installation of the present invention more can comprise as shown in Figure 8 a circuit test plate positioning step S31, as shown in Figure 6, to pass cover gab 215, and connect the circuit test of conductive connecting line 24 plate 25 is arranged, be positioned a supporting frame 26.
As shown in Figure 6, supporting frame 26 is crossed over sockets 21 and in being arranged at circuit board 22.Supporting frame 26 has an opening 261, and 24 of conductive connecting lines that are connected in card extender 23 are connected with circuit test plate 25 via opening 261, and circuit test plate 25 is positioned on the supporting frame 26.Therefore, supporting frame 26 support circuit test boards 25 make circuit test plate 25 be positioned at the top of socket 21, the second surface 253 that has a test contacts 252 in order to circuit test plate 25 up, in order to the carrying out of test.
Be electrically connected P4 in the program in a test cell and circuit test plate, test cell 27 is being electrically connected a monitoring means 28.In the time will confirming whether socket 21 accurately is connected in circuit board 22, test cell 27 is electrically connected with test contacts 252, and with the monitoring means 28 that test cell 27 is electrically connected, promptly can confirm the state that is electrically connected of socket 21, whether normal with circuit board 22 conductings.
In sum, the method of proving installation of the present invention provided by the present invention and connection proving installation, has at least one circuit test plate, can be electrically connected in the test contacts of socket and card extender, utilize being electrically connected of conductive connecting line, electrical signal is transferred on the circuit test plate, in order to test cell directly on the circuit test plate test jack whether correctly be electrically connected in computer main frame panel.Compared to the prior art, the method of proving installation of the present invention and connection proving installation, when having improved known socket test, can be because the stitch number of socket increases, it for example is chip with high density and high pin number, make when test cell is tested that it is too big that probe is the pressure that is subjected to, and cause test cell or the impaired problem of socket.Because the method for proving installation of the present invention and connection proving installation with test contacts, is transferred at least one circuit test plate.Test cell then carries out socket is tested on the circuit test plate.That is to say that the too many situation of the contact that need test at socket is next can utilize conductive connecting line that test contacts is derived, and increases the quantity of circuit test plate, with reduce test probe the pressure that can run into.Thus, can not make that then test cell or socket are impaired, can save the material cost of test cell.In addition, the circuit test plate more can be arranged on the support frame, and support frame is striden and is located on the socket, and therefore, test cell can directly be tested the circuit test plate in the top, position of original socket, can not occupy the space of other socket.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the described claim its equivalent modifications of carrying out or change.

Claims (9)

1. a proving installation is tested a socket and whether accurately is connected in a circuit board, comprises:
One card extender, it has at least one switching element, and this switching element and this socket are electrically connected;
At least one conductive connecting line, the switching element of one first end and this card extender is electrically connected; And
At least one circuit test plate, it has at least one test contacts, and described test contacts is electrically connected with one second end of this conductive connecting line, and this test contacts is electrically connected by this conductive connecting line and this switching element.
2. proving installation as claimed in claim 1, wherein at least a portion of this switching element is a conductive region that is exposed to this card extender.
3. proving installation as claimed in claim 1, wherein at least a portion of this switching element protrudes from this card extender, and at least a portion of this switching element is inserted this socket.
4. proving installation as claimed in claim 1, wherein this test contacts is at least one conductive region that is exposed to this circuit test plate.
5. proving installation as claimed in claim 4, wherein this proving installation more comprises an at least one test cell and a monitoring means, this test cell and this monitoring means are electrically connected, and when this test cell and this test contacts were electrically connected, this monitoring means was confirmed the state that is electrically connected of this socket.
6. proving installation as claimed in claim 1, wherein this conductive connecting line is a flexible circuit or an electronics line.
7. proving installation as claimed in claim 1 more comprises a supporting frame, and this circuit test plate is arranged at this supporting frame.
8. proving installation as claimed in claim 7, wherein this supporting frame is striden and is located at this socket.
9. method that connects proving installation, this proving installation is used to test a socket and whether accurately is connected in a circuit board, comprises:
One first end of one conductive connecting line is electrically connected to a card extender;
One second end of this conductive connecting line is electrically connected to a circuit test plate;
This card extender and this socket are electrically connected; And
One test cell and this circuit test plate are electrically connected.
CNB2004100321776A 2004-04-01 2004-04-01 Detest apparatus and detest method Expired - Fee Related CN100357903C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2004100321776A CN100357903C (en) 2004-04-01 2004-04-01 Detest apparatus and detest method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2004100321776A CN100357903C (en) 2004-04-01 2004-04-01 Detest apparatus and detest method

Publications (2)

Publication Number Publication Date
CN1677358A CN1677358A (en) 2005-10-05
CN100357903C true CN100357903C (en) 2007-12-26

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CNB2004100321776A Expired - Fee Related CN100357903C (en) 2004-04-01 2004-04-01 Detest apparatus and detest method

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101430354B (en) * 2007-11-08 2011-01-05 环旭电子股份有限公司 Test method and apparatus for pin element
CN108808285B (en) * 2017-05-05 2022-04-01 富顶精密组件(深圳)有限公司 Electrical connector assembly
CN107942233A (en) * 2017-12-05 2018-04-20 徐州大工电子科技有限公司 A kind of gauge of grouping circuits panel products to its veneer selective enumeration method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000026681A1 (en) * 1998-11-02 2000-05-11 Atg Test Systems Gmbh & Co. Kg Device for testing printed boards
CN2480854Y (en) * 2001-04-28 2002-03-06 华硕电脑股份有限公司 Thin type CD driver circuit board tester
CN2493943Y (en) * 2001-07-23 2002-05-29 吴志成 Tester structure for printed circuit board
CN2524372Y (en) * 2002-02-01 2002-12-04 威盛电子股份有限公司 Chip tester

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000026681A1 (en) * 1998-11-02 2000-05-11 Atg Test Systems Gmbh & Co. Kg Device for testing printed boards
CN2480854Y (en) * 2001-04-28 2002-03-06 华硕电脑股份有限公司 Thin type CD driver circuit board tester
CN2493943Y (en) * 2001-07-23 2002-05-29 吴志成 Tester structure for printed circuit board
CN2524372Y (en) * 2002-02-01 2002-12-04 威盛电子股份有限公司 Chip tester

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Owner name: HESHUO JOINT SCIENCE AND TECHNOLOGY CO., LTD.

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Patentee before: Huashuo Computer Co., Ltd.

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