CN102495301B - Testing device and testing method of narrow interval pin headers on PCB (printed circuit board) - Google Patents
Testing device and testing method of narrow interval pin headers on PCB (printed circuit board) Download PDFInfo
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- CN102495301B CN102495301B CN201110359683.6A CN201110359683A CN102495301B CN 102495301 B CN102495301 B CN 102495301B CN 201110359683 A CN201110359683 A CN 201110359683A CN 102495301 B CN102495301 B CN 102495301B
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Abstract
The invention provides a testing device and a testing method of narrow interval pin headers on a PCB (printed circuit board). The testing device includes a pin bed, wherein a PCB positioning pin is arranged on the pin bed; a socket positioning frame corresponding to a socket is arranged on a face plate of the pin bed, and the plural pins are arranged in the socket; feeler pins corresponding to insert pins in the socket are arranged in the socket positioning frame; the two neighboring feeler pins are isolated through a feeler pin positioning frame; and the feeler pins are correspondingly connected with a testing circuit on the testing device. The invention can be used for testing the narrow interval pin headers, and overcomes the problem that the short circuit is caused by the contact of the two neighboring pins.
Description
[technical field]
The present invention relates to proving installation and the method for testing thereof of thin space row pin on a kind of pcb board.
[background technology]
In PCB test industry, there are a kind of test point rules of standard universal, four density and dual density, each test point must be connected with waiting test circuit.
Existing pcb board method of testing is all, by line, test circuit pin is directly welded on to test contact point, carries out test job, but present circuit board integrated level is more and more higher, and solder joint is more and more less, and density is more and more closeer.The arrangement space of pcb board is more and more less.Draw test point difficulty all the more.
Existing method of testing one is that probe directly inserts test point by drawing test point on plate, and the method can take area on valuable plate.Another method is directly to test pad with probe, but this method of testing can be destroyed quality of welding spot, causes labile factor.
Original method of testing and proving installation thereof are difficult to adapt to highdensity test, or because test spacing is when too near, needle guard easily bends, and causes burning device on pcb board.
[summary of the invention]
One of the technical problem to be solved in the present invention, is to provide the row of thin space on a kind of pcb board the proving installation of pin, and it can be used in the test of thin space row pin, and has overcome the problem that contact between adjacent two pins causes short circuit.
The present invention is achieved in that the proving installation of thin space row pin on a kind of pcb board, and it comprises a needle-bar, is provided with PCB register pin on described needle-bar, has a socket on described pcb board, has a plurality of contact pins in this socket; On the panel of described needle-bar, be provided with the socket posting corresponding with described socket, in described socket posting, be provided with the probe corresponding with contact pin in socket, isolated by probe positioning frame between adjacent two probes, described probe correspondence is connected in the switch card of needle-bar, while depressing PCB to be measured, corresponding probe and contact pin are all retracted in probe positioning frame, and adjacent two contact pins or probe can not be contacted.
Further, the top of described probe is set to the infundibulate corresponding with the shape size of contact pin.
Two of the technical problem to be solved in the present invention, is to provide a kind of method of testing of described proving installation, and it comprises the steps:
Step 1, carries out pre-determined bit by the socket posting of proving installation and the socket of PCB to be measured;
Step 2, the contact pin in socket enters in the infundibulate on proving installation middle probe top, makes contact pin and probe corresponding location one by one;
Step 3, continues to depress PCB to be measured, and corresponding probe and contact pin are all retracted in probe positioning frame, and adjacent two contact pins or probe can not be contacted, and now, can start to test.
The invention has the advantages that:
The present invention adopts socket posting, realize the Primary Location of probe and socket contact pin, the top of described probe is set to the infundibulate corresponding with the shape size of contact pin, make contact pin and corresponding probe correspondence one by one, the present invention has used probe positioning frame, probe and contact pin corresponding when test are all retracted in probe positioning frame, guarantee isolation completely between adjacent two pins, guarantee that adjacent probe does not contact, therefore the present invention is without drawing test point, can directly test thin space row pin, and prevent from burning device on pcb board.
[accompanying drawing explanation]
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the cross-sectional view of proving installation of the present invention.
Fig. 2 is the schematic flow sheet of the method for testing of proving installation of the present invention.
[embodiment]
Refer to shown in Fig. 1 to Fig. 2, embodiments of the invention are described in detail.
As Fig. 1, the proving installation of thin space row pin on a kind of pcb board of the present invention, it comprises a needle-bar 1, on described needle-bar 1, is provided with PCB register pin 2, has a socket 3 on described pcb board, has a plurality of contact pins 5 in this socket 3; On the panel of described needle-bar 1, be provided with the socket posting 4 corresponding with described socket 3, in described socket posting 4, be provided with the probe 6 corresponding with contact pin 5 in socket 3, the top of described probe 6 is set to the infundibulate corresponding with the shape size of contact pin 5.Isolated by probe positioning frame 7 between adjacent two probes 6, described probe 6 correspondences are connected in the test circuit on proving installation.
PCB8 to be measured is placed on needle-bar 1 panel, when starting test, PCB8 to be measured is pressed on needle-bar 1 panel closely, the elasticity of PCB register pin 2 is cancelled, now, contact pin 5 in socket 3 and probe 6 corresponding contact one by one in socket posting 4 on needle-bar 1, and probe 6 contacts with the test circuit on proving installation.Now, proving installation just can have been judged the electric property of this PCB8 to be measured.
In conjunction with Fig. 2, in test, by the pre-determined bit of socket posting 4, make the contact pin 5 in socket 3 reach Primary Location with probe 6; Because the top of described probe 6 is set to the infundibulate corresponding with the shape size of contact pin 5, contact pin 5 is entered in the infundibulate on corresponding probe 6 tops, therefore contact pin 5 and corresponding probe 6 can be corresponding one by one.When PCB8 to be measured is continued to depress, corresponding probe 6 and contact pin 5 are all retracted in probe positioning frame 7, thereby have guaranteed that adjacent two contact pins 5 or probe 6 can short circuits, impact test.
The present invention's test is applicable to the test of thin space row pin on pcb board, has the situation of mother daughter board connector for product itself, directly tests the contact pin of mother daughter board connector, realizes pcba Function detection.Such as the test of 1.27 spacing lead-in wires.
The above, only for preferred embodiment of the present invention, therefore can not limit according to this scope of the invention process, the equivalence of doing according to the scope of the claims of the present invention and description changes and modifies, and all should still belong in the scope that the present invention contains.
Claims (3)
1. a proving installation for thin space row pin on pcb board, it comprises a needle-bar, is provided with PCB register pin on described needle-bar; On described pcb board, there is a socket, in this socket, there are a plurality of contact pins; It is characterized in that: on the panel of described needle-bar, be provided with the socket posting corresponding with described socket, in described socket posting, be provided with the probe corresponding with contact pin in socket, isolated by probe positioning frame between adjacent two probes, described probe correspondence is connected in the test circuit on proving installation, while depressing PCB to be measured, corresponding probe and contact pin are all retracted in probe positioning frame, and adjacent two contact pins or probe can not be contacted.
2. the proving installation of thin space row pin on a kind of pcb board according to claim 1, its spy is: the top of described probe is set to the infundibulate corresponding with the shape size of contact pin.
3. a method of testing for proving installation as claimed in claim 2, is characterized in that: it comprises the steps:
Step 1, carries out pre-determined bit by the socket posting of proving installation and the socket of PCB to be measured;
Step 2, the contact pin in socket enters in the infundibulate on proving installation middle probe top, makes contact pin and probe corresponding location one by one;
Step 3, continues to depress PCB to be measured, and corresponding probe and contact pin are all retracted in probe positioning frame, and adjacent two contact pins or probe can not be contacted, and now, can start to test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110359683.6A CN102495301B (en) | 2011-11-14 | 2011-11-14 | Testing device and testing method of narrow interval pin headers on PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110359683.6A CN102495301B (en) | 2011-11-14 | 2011-11-14 | Testing device and testing method of narrow interval pin headers on PCB (printed circuit board) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102495301A CN102495301A (en) | 2012-06-13 |
| CN102495301B true CN102495301B (en) | 2014-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110359683.6A Active CN102495301B (en) | 2011-11-14 | 2011-11-14 | Testing device and testing method of narrow interval pin headers on PCB (printed circuit board) |
Country Status (1)
| Country | Link |
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| CN (1) | CN102495301B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106454678A (en) * | 2016-10-12 | 2017-02-22 | 中国计量大学 | Pin type microphone detecting device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6005405A (en) * | 1997-06-30 | 1999-12-21 | Hewlett Packard Company | Probe plate assembly for high-node-count circuit board test fixtures |
| EP1512978A2 (en) * | 1996-10-29 | 2005-03-09 | Agilent Technologies Inc. (a Delaware Corporation) | Loaded-board, guided-probe test fixture |
| CN101576571A (en) * | 2008-05-06 | 2009-11-11 | 深圳麦逊电子有限公司 | Density conversion method and density conversion device for PCB test machine |
| CN101685094A (en) * | 2008-09-25 | 2010-03-31 | 中国科学院半导体研究所 | Method of flexibly connecting microelectrode array with printed circuit board (PCB) |
| CN201576013U (en) * | 2009-11-19 | 2010-09-08 | 河北理工大学 | Flexible jack test board |
| CN201707357U (en) * | 2010-05-26 | 2011-01-12 | 深南电路有限公司 | PCB test clamp |
| CN202351345U (en) * | 2011-11-14 | 2012-07-25 | 福建联迪商用设备有限公司 | Testing device for fine-pitch arranged pins on PCB (Printed Circuit Board) |
-
2011
- 2011-11-14 CN CN201110359683.6A patent/CN102495301B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1512978A2 (en) * | 1996-10-29 | 2005-03-09 | Agilent Technologies Inc. (a Delaware Corporation) | Loaded-board, guided-probe test fixture |
| US6005405A (en) * | 1997-06-30 | 1999-12-21 | Hewlett Packard Company | Probe plate assembly for high-node-count circuit board test fixtures |
| CN101576571A (en) * | 2008-05-06 | 2009-11-11 | 深圳麦逊电子有限公司 | Density conversion method and density conversion device for PCB test machine |
| CN101685094A (en) * | 2008-09-25 | 2010-03-31 | 中国科学院半导体研究所 | Method of flexibly connecting microelectrode array with printed circuit board (PCB) |
| CN201576013U (en) * | 2009-11-19 | 2010-09-08 | 河北理工大学 | Flexible jack test board |
| CN201707357U (en) * | 2010-05-26 | 2011-01-12 | 深南电路有限公司 | PCB test clamp |
| CN202351345U (en) * | 2011-11-14 | 2012-07-25 | 福建联迪商用设备有限公司 | Testing device for fine-pitch arranged pins on PCB (Printed Circuit Board) |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102495301A (en) | 2012-06-13 |
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